Fairchild Semiconductor committed delivering highest level quality rel
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QUALITY
Fairchild Semiconductor committed delivering highest level quality reliability customers. Fairchild supplies components most demanding applications with guaranteed parametric limits spanning commercial, automotive, military temperature ranges. Diodes available from airchild Semiconductor forms. Standard parts identified with industrial commercial part number, have common prefixes tested specifications published Fairchild Semiconductor, JEDEC (Joint Electron Device Council), Proelectron, EIAJ (Electronic Industry Association Japan). Custom products tested marked customer specifications identified assigned "stamp-off" number. Customer specifications range from simplistic custom marking requirements complex additional parametric testing over wide range temperatures. Fairchild processes lots through 100% test, checking ensure parameters meet those required customer Fairchild Semiconductor datasheets. Quality assured through inline quality control systems augmented outgoing quality control inspection. Lots sampled tested specifications outgoing quality assurance prior shipment. programs utilized Fairchild ensure product reliability: Reliability Qualification Program products changes manufacturing processes, locations materials. Reliability Audit Program ensures Fairchild Semiconductor's goal continuous improvement applies existing products.
Reliability Qualification Program
standard procedure developed place defining reliability requirements product qualification. Tests used indicated Table scope includes products, products from manufacturing facilities, changes manufacturing locations, major engineering changes existing products. Major changes include, limited product either device design, package design, technology assembly location assembly subcontractor, vendor, product transfer site Major process changes wafer fabrication process, manufacturing assembly process Package change package design such mold compound formulation Lead frames change material composition, design, trim form process layout recipe wafer fabrication (i.e., mask), epitaxy layer location fabrication site, wafer vendor
December 2000, Rev.
Tests *Autoclave (ACLV) High Temperature Reverse Bias (HTRB) *Temperature Humidity Bias (THBT) Temperature Cycle (TMCL) Life (ACOL) Life (DCOL) **Zener Life (ZOPL)
Conditions PSIG, 121°C 150°C, rated 85°C -65°C +150°C 28°C, rated Average Forward Current 25°C, Device Rated Power 125°C, Device Rated Power
Timepoints (48) Hours 168, 500, 1000 Hours 168, 500, 1000 Hours 100, Cycles (100, 200) 168, 500, 1000 Hours 168, 500, 1000 Hours 168, 500, 1000 Hours
Sample Size (45) (76) (45) (45)
Products produced Puchon, Korea manufacturing facility Plastic Packages Only Zeners Only Table RELIABILITY REQUIREMENTS POWER DEVICE SEMICONDUCTOR DEVICES
Figure RELIABILTY ASSURANCE AUDIT PROGRAM TEST FLOW
Reliability Audit Program
Existing Products evaluated routine basis insure reliability performance products delivered customers. audit programs place meet customer reliability performance requirements. These Fast Reaction Program Long Term Audit Program. Both programs generic family basis. refers evaluating products 48-168hr reliability stress tests while refers continued stress testing products 1000hrs equivalent duration. Tests used listed Table Examples generic families would include: Package iterations wherein manufacturing process common die. Type topography (overlay, non-overlay, MOS, etc.) class devices using same type starting substrate, similar process flows, similar junction depths concentration gradients, target BV's, etc. time, there least iteration each generic family designation production undergoing long term reliability testing. Criteria includes pre- postcomparisons parametric distribution shifts addition limits.
function vendor's Quality Control monitor degree success reducing number faulty components that escape detection. does this testing outgoing parts sampled basis. Acceptable Quality Level (AQL) determines stringency sampling. decreases, becomes more difficult parts escape detection, thus quality shipped parts increases. concept reliability, other hand, refers well part that initially good will withstand environment. Reliability measured percentage parts that fail given time period.
QUALITY IMPROVEMENT
When purchasing component system, expected that each item delivered been thoroughly tested will perform according datasheet detailed specifications. Additional programs implemented improve quality. effective, program must only reduce escapes also tailored specifically detect remove types residual defects that predicated process line monitor control data. proper analysis application this data primary objective Fairchild. With emphasis "ship-to-stock" programs need measure quality levels ppm's, Fairchild Semiconductor taken leadership role on-going effort strive "zero defects." Benefits derived result this increased emphasis includes following: Escapes caused mishandling reduced significantly. Residual thermo-mechanical defects detected during normal room temperature testing high temperature buy-off removed. Anomalous high temperature parametric effects that have been created during wafer fabrication subsequent manufacturing removed. 0.05% guaranteed standard commercial grade product.
RELIABILITY VIS-A-VIS QUALITY
words "reliability" "quality" often used interchangeably, though they connote identical facets product's merit. However, reliability quality different, discrete component users must understand essential difference between concepts properly evaluate various vendors' programs product integrity. concept quality gives information about population faulty components among good components, generally relates number faulty components that arrive user's facility. Viewed another way, quality instead relate number faulty components that escape detection component vendor's facility.
RELIABILITY THROUGH DESIGN
With increased component density modern electronic products come increased concern with component failures such products. Virtually equipment manufacturers thoroughly exercise their products before shipment. This designed simulate, closely possible, field operating conditions. high failure rate discrete components this level dramatically increase manufacturing costs. most important factor affecting component's reliability construction; i.e., materials used method which they fabricated assembled.
TEST DESCRIPTIONS
following tests frequently used screening, acceptance evaluation semiconductor devices. Steady State Operating Life (SSOL DCOL) purpose this test evaluate stability expose defects resulting from manufacturing aberrations that manifested time stress-dependent failures. Conditions: JESD22-A108 105°C Ambient Intermittent Operating Life (IOPL PRCL ACOL) Sometimes referred "power cycle test." purpose this test same Operating Life. Additionally, this test checks integrity both wire bonds means cyclic thermal stressing. Conditions: MIL-STD-750 High Temperature Storage Life (HTSL) purpose this test expose time/ temperature failure mechanisms evaluate long-term storage stability. Conditions: JESD22-A103 150°C, bias applied High Temperature Reverse Bias (HTRB) purpose this test determine sensitivity product mobile contamination related failure mechanisms. Conditions: JESD22-A108 150°C, rated Temperature Humidity Bias (THBT) purpose this test evaluate moisture resistance non-hermetic components. addition voltage bias accelerates corrosive effect after moisture penetration taken place. With time, this catastrophically destructive test. Conditions: JESD22-A101 85°C,
ON-GOING RELIABILITY IMPROVEMENT PROGRAM
Transistor reliability improvement Fairchild Semiconductor continuous program. Implementation program field reliability improvement requires knowledge field ambient electrical environments their influence device performance. Fairchild's broad experience commercial reliability programs development extensive in-house reliability monitoring program that permits monitor device performance under combinations following stresses: Thermal Thermo-Mechanical Mechanical Voltage Humidity
data generated these monitors continually ranked analyzed determine appropriate corrective action necessary failure mechanisms noted. Rigorous analysis data that routinely generated critical stages fabrication manufacturing process integrated into corrective actions loop. This continuous cycle testing, analysis corrective action assures continued improvement transistor field reliability.
Autoclave (ACLV) purpose this test evaluate moisture resistance non-hermetic components under pressure/temperature conditions. Conditions: JESD22-A102 121°C, atmosphere psig) Temperature Cycle Air-to-Air (TMCL) purpose this test evaluate ability device withstand both exposure extreme temperatures transition between temperature extremes, expose excessive thermal mismatch between materials.
Conditions: JESD22-A104 -65°C 150°C, minutes dwell time each temperature Terminal Strength purpose this test evaluate ability device terminals withstand lead forming tension associated with component installation into circuit. Conditions: JESD22-102 Solderability purpose this test determine solderability device terminals. Conditions: JESD22-105
GLOSSARY QUALITY RELIABILITY TERMS
Acceptance Quality Level (AQL) measure quality which given will accepted most time. This usually established probability acceptance equal 95%. Acceptance Number (Ac) largest number defectives inspection sample under consideration that will permit acceptance lot. Average Outgoing Quality (AOQ) average quality outgoing product after 100% screening rejected lots. This usually measured parts million (PPM) Average Outgoing Quality Limit (AOQL) maximum average outgoing quality that possible given sampling plan. Defect deviation device that does conform specified requirements. Defective device which contains more defects. Double Sampling Sampling inspection which inspection first sample leads decision accept, reject, take second sample. inspection second sample, when required, always leads decision accept reject. Failure inability device perform specified function within previouslyestablished limits. Failure Rate statistical probability failure occurring within stated period time. failure rate semiconductor devices generally given percent thousand hours. Infant Mortality Premature failures occurring failure rate substantially greater than that observed during subsequent life prior wear-out.
group devices from which samples drawn inspected determine compliance with acceptance criteria (inspection lot). Tolerance Percent Defective (LTPD) measure quality which given will rejected most time. single sampling concept that statistically ensures rejection lots having greater percent defective than specified LPTD. Mean Time Between Failures (MTBF) average number total unit operating hours after device failed that would occur before next device failure would expected occur. Operating Characteristic Curve curve) graph probability acceptance (for given sampling plan) function quality process average quality, whichever applicable. Percent Defective number defective devices divided total number devices that lot, multiplied 100. Probability Acceptance (Pa) fractional probability that will accepted, usually expressed decimal. Process Average Quality expected quality product from given process, usually estimated from first sample results previous inspection lots. Quality measure degree which product conforms specification workmanship requirements. Rejection Number (Re) smallest number defectives inspection sample under consideration that will prevent acceptance lot. Reliability measure performance product over specified period time.
Sample more devices selected random from inspection represent that acceptance purposes. Sampling Plan specific plan which defines sample size criteria accepting rejecting lot. Screening Tests Tests employing nondestructive environmental, electrical, thermal and/or mechanical stresses, purpose identifying anomalous devices. Single Sampling Sampling inspection which decision accept reject reached after inspection single sample. Wearout Failures Those failures which occur result normal deterioration processes. 100% Inspection Inspection every device, which each device accepted rejected individually characteristic concerned.
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