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QUALITY MANAGEMENT PLAN
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
These Drawings Specifications Property Intersil Corporation shall used, reproduced copied without Written Permission
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SECTION
INTRODUCTION
SCOPE This document Intersil "Quality Management (QM) Plan" which required program defined MIL-PRF-38535. contents describe operating systems procedures used Intersil Corporation Division meet requirements program. Intersil Corporation Division manufacturing operations Palm Bay, Florida, Findlay, Ohio Kuala Lumpur, Malaysia. Intersil Corporation fully certified manufacturer Product Assurance Levels
Class Class designed specific applications. Intersil does claim Class same Class Intersil Reliability information available Intersil site. http://rel.intesil.com Intersil Class Hard application devices fully tested guaranteed total dose specified drawing. CLASS TECHNOLOGIES TECHNOLOGY GROUPS TECHNOLOGY BA02 HFSTDB CM05 MGR-CMOS CM10 SSAJI4-RH CM13 MGCMOS-RH CM16 AVLSI-R CM17 SOS5 CM21 CM24 TSOS4 CM25 RH-SIGATE AUTHORIZATION MAINTENANCE Plan will maintained under configuration control. specification reviewed distributed external customers. documents manually distributed externally will placed under change control. External customers access current revision manual Intersil site Revisions initiated Intersil employees with approval Intersil Technical Review Board (TRB). Intersil Division Coordinator responsible insuring that Plan implemented maintained current MIL-PRF-38535 requirements.
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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HARD PRODUCT DEVELOPMENT INTRODUCTION Product design radiation specific application active this time. Product introductions radiation hardened product will based characterization hard product that been previously introduced Military Commercial Market. Should Intersil decide introduce newly developed radiation hardened products, necessary actions will taken certify design tools, devices models fabrication processes. Appendix MILPRF-38535 will used guideline further certification. CONTENT Plan documented sections appendixes Introduction General (Non Technology Specific) Technology Specific Quality Systems Reference Appendix DSCC Certification Appendix RAD. Hard Assurance Appendix Ship Ahead Qualification format used this plan based plan outline MIL-PRF-38535. Reference made throughout plan Quality Manuals Palm Bay, Findlay Malaysia operations. Specification references Quality Manual found Section 4.0. Sections written general nature. Reference made each these sections Intersil internal specifications which provide details operations.
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
These Drawings Specifications Property Intersil Corporation shall used, reproduced copied without Written Permission
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TABLE CONTENTS INTERSIL QUALITY MANAGEMENT PLAN MANUAL SECTION 2.2.1 2.2.2 2.2.3 2.2.4 2.2.5 2.2.6 2.2.7 2.2.8 2.2.9 2.2.10 INTRODUCTION GENERAL (NON TECHNOLOGY SPECIFIC) INDEX CERTIFIED BASELINE DOCUMENTS CONVERSION CUSTOMER REQUIREMENTS DEVICE SPECIFICATION REQUIREMENTS CONTROLLED DESIGN PROCEDURES TOOLS MASK GENERATION PROCEDURE WAFER FABRICATION ASSEMBLY CAPABILITIES BASELINE MASK, WAFER FABRICATION, ASSEMBLY, TEST FLOWS LISTING COVERAGE SEC, TCV, PROCESS MONITOR PROGRAMS INCOMING INSPECTION VENDOR PROCUREMENT PROCEDURES SCREENING TECHNOLOGY CONFORMANCE INSPECTION (TCI) PROCEDURES MARKING REWORK FUNCTIONAL ORGANIZATION CHART CHANGE CONTROL PROGRAM FAILURE ANALYSIS PROGRAM SELF AUDIT PROGRAM OPERATING PROCEDURES YIELD/QUALITY IMPROVEMENT PROGRAM PROGRAM LIST TEST METHODS SUITABILITY CALIBRATION RETENTION QUALIFICATION TRAINING CLEANLINESS ATMOSPHERIC CONTROLS ELECTROSTATIC DISCHARGE SENSITIVITY (ESD) PROGRAM CERTIFICATION TEST PLAN QUALIFICATION TEST PLAN CORRECTIVE ACTION PLAN THIRD PARTY ACTIVITIES TECHNOLOGY SPECIFIC INTERSIL ELECTRONIC DATA BASE SYSTEMS TECHNOLOGY FLOW REFERENCE SITE QUALITY MANUALS DSCC CERTIFICATION LETTER HARDNESS ASSURANCE SHIP AHEAD TITLE MIL-PRF-38535 PARA REF. 3.3.1A 3.4.3.1.A 3.3.1B 3.4.3.1.B 3.3.1B.13.4.3.1.B.1 3.3.1.B.2 3.4.3.1.B.2 3.3.1.B.33.4.3.1.B.3 3.3.1.B.4 3.4.3.1.B.4 3.3.1B.5 3.4.3.1.B.5 3.3.1B.6 3.4.3.1.B.6 3.3.1B.7 3.4.3.1.B.7 3.3.1B.83.4.3.1.B.8 3.3.1B.9 3.4.3.1.B.9 3.3.1B.10 3.4.3.1.B.10
2.2.11 2.2.12 2.10 2.11 2.12 2.13 2.14 2.15 2.16 2.17 2.18 2.19 Appendix Appendix Appendix
3.3.1.B.11 3.3.1 3.3.1 3.3.1 3.3.1 3.3.1 3.3.1 3.3.1 3.3.1 3.3.1 3.3.1 3.3.1 3.3.1 3.3.1 3.3.1 3.3.1 3.3.1 3.3.D 3.3.1.R 3.3.1 3.3.1
SECTION
GENERAL
GENERAL (NON-TECHNOLOGY SPECIFIC)
Specification Type: DOCS Specification Number :999015 Issue Page
Title: QUALITY MANAGEMENT PLAN
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Section this manual written describe general (non-technology specific) systems/requirements Intersil Plan. These systems/requirements establish "Quality System" which used product types, regardless technology type.
SECTION
GENERAL
INDEX CERTIFIED BASELINE DOCUMENTS
Intersil documentation system includes index specifications used program.
CONTENTS INDEX
Document Control index specifications includes; specification number, specification title latest revision specifications.
INDEX AVAILABILITY
listing specification series critical program contained section herein. indexes Intersil specifications available on-line report management distribution system indexes containing specifications used make-up program will available time validation thus will considered certified baseline. complete database program resides Intersil electronic HUB, SOAR Document Control systems.
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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SECTION 2.2. CONVERSION CUSTOMER REQUIREMENTS
GENERAL Conversion customer requirements Intersil processes specifications utilizes contract review system order entry procedures. These procedures used Marketing Customer Engineering department review Customer Control Drawings (SCD), Statement Work (SOW) Purchase Orders (P.O.) translate customers requirements into Intersil internal processing procedures. These review systems supported Design Engineering, Product Engineering Manufacturing Operations Quality Assurance. PROCEDURES INITIAL DOCUMENT REVIEW FIGURE 2.2A primary sources customer requirements SCD, SOW, P.O. Marketing Manager (MM) will initiate Drawing Review Request (DRR). customer will sent Customer Engineer. compared standard flows and, where necessary, exceptions noted. These exceptions negotiated between MM/or Sale Representative customer until acceptance mutually achieved. Confirmation customer acceptance modification included permanent record file. REVIEW ORDER ENTRY customer generated P.O. entered into P.O. database. standard flow product, sent order entry. custom flow product, reviewed Customer Engineering, Engineering Manufacturing. discrepancies resolved prepared order entry. CONTRACT REVIEW contract review system ensures: contract been reviewed There method verify that requirements met. There provisions processing contract changes There method prepare internal specifications which reflect customer requirements.
QUALITY SUPPORT DOCUMENTS
240114 999017 990032 998002 999003 Customer Documentation Review Specification Generation System Product Options Order Entry Military Contract Review Procedures Marketing Sales
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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SECTION 2.2.1
GENERAL
DEVICE SPECIFICATION REQUIREMENTS
Device specifications written products reflect requirements MIL-PRF-38535. These device specifications either controlled DSCC part Intersil internal document control program.
DEVICE SPECIFICATION REQUIREMENTS
Both specifications controlled DSCC those controlled internally Intersil contain following information. Scope Applicable Documents Requirements Quality Assurance Provisions Packaging Special Requirements Intersil uses MIL-HDBK-780 (Standardized Military Drawing) guideline prepare these specifications.
QUALITY SUPPORT DOCUMENTS
240XXX 54XXXX 55XXXX 87XXXX 9QXXXX 999021 Slash Sheet Drawing Specifications Specifications Specifications Specifications Flow Specification Generation
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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SECTION 2.2.2
GENERAL
CONTROLLED DESIGN PROCEDURES TOOLS
Intersil Chip Design methodology draws proven integrated tools that permit designer migrate design concept from objective specification functional description functional circuits. (Applying Concurrent Teams Product Market), basis Design Procedures. Intersil Fastrack Design System provides basis design tools. tools support simulation, performance analysis, physical layout, layout verification, testability.
CONTROLLED DESIGN PROCEDURES TOOLS
program designed optimize P(Product Market) cycle times improve success rate product developments. formalized procedure provides guidelines methodology product development, product planning, product definition, market introduction. procedures include formal reviews strategic points within development cycle ensure consistency areas circuit development. Appropriate documentation retained Quality records. Intersil Design System world class design system which contains tool sets Analog, Mixed Signal, Power, Communication, Digital designs. Intersil Design System uses defined core tools front design, layout, physical design verification. addition core design tools, Intersil Design Systems tightly integrated with high performance Intersil tools populated with advanced Intersil processes/libraries.
QUALITY SUPPORT DOCUMENTS
ACT-XXX 54XXXX 87XXXX 55XXXX ACT-D01 ACT-V01 ACT-R01 DGEN-XXX Training Spec Specifications Specifications Specifications Design/Development Verification Design Design Release General Support
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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SECTION 2.2.3
GENERAL
PHOTOMASK SUBCONTRACTED
Photomasks used Wafer forming operations transfer patterns various levels design onto photoresist coated wafer. photomask will purchased through approved subcontractor.
QUALITY SUPPORT DOCUMENTS
Mask Fabrication procedures documented specification controlled supplier. mask ordered conformance with requirements specified purchase specification 210825-AlignRite.
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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SECTION 2.2.4
BASELINE GENERAL
WAFER FABRICATION ASSEMBLY CAPABILITIES
Records information related wafer fabrication assembly capabilities covered Intersil program System
SYSTEM
Each device type assigned program will designated HUB. Attached each these device types package technology used. Wafer Process package capabilities listed below. total listing applicable process flow specification numbers included Section 3.1A. Qualified Wafer Fabrication Process Technologies listed HUB.
WAFER CAPABILITIES
Reference section list Process Technologies.
ASSEMBLY CAPABILITIES
HERMITIC
PACKAGE TYPES CERDIP CERPACK SIDE BRAZE METAL CANS FLATPACKS CERQUADS LEAD FINISHES SOLDER (SnPb) (63/37% TIN/LEAD) GOLD (>99.7%) ATTACH MATERIAL SILVER GLASS 67-73% EUTECTIC GOLD (>99.7%) SILVER POLYMER (79.5-80.5 SILVER EPOXY (79% SOLDER (95% Pb/5%
PLASTICS
PACKAGE TYPES MQFP LEAD FINISHES SOLDER 80/20TIN/LEAD) ATTACH MATERIAL SILVER EPOXY (>79%
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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SECTION 2.2.5
GENERAL
MASK, WAFER FABRICATION, ASSEMBLY TEST FLOWS
Each product fabricated Intersil produced accordance with series "traveler/flow" specifications. traveler/flow describes sequence processes references appropriate unit process specification which describes each process executed. "Traveler/flows" written material fabrication, mask fabrication, wafer fabrication, assembly, test, post test processing. Wafer process wafer level testing defined Section 2.2.9 Screening.
MASK, WAFER FABRICATION, ASSEMBLY TEST FLOWS
operations process flows used fabricate, assemble, test, monitor product will have appropriate work instructions. These work instructions will include, where appropriate, samples, drawings, detailed operational instructions ensure quality levels maintained. Through specified procedures, designated support personnel, team members, management responsible for, have authority update work instructions insure process test procedures conform expected practices optimum quality systems. applicable personnel jointly responsible ensuring current work instructions available. Software control responsibility department manages, administers, and/or uses software. Procedures used govern critical software documented internal process specifications.
QUALITY SUPPORT DOCUMENTS
Product with corresponding flows/travelers controlled electronic database "HUB". Generic flows Design, Wafer Fabrication, Assembly, Test follows:
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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Product Flow
DESIGN Somerville Findlay
Class CLASS CLASS Assembly Palm
Test Palm
DESIGN Palm
MASK Palm
FAB59
Palm
DESIGN
FAB54
Palm
Class Class Plastics Assembly Malaysia
Test Malaysia
Subcontractors Mitel Jarfalla Sweden Intersil approved subcontractor Design, Mask Generation, Wafer operations AMKOR Philipinas Intersil approved subcontractor Class plastic package assembly
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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BASIC DESIGN FLOW
APPROVED BUSINESS IMPLEMENTATION PLAN
DESIGN DEVELOPMENT PHASE
PRODUCT ELECTRICAL/ PHYSICAL DESIGN FORMAL REVIEW APPROVAL DESIGN RELEASE
MANUFACTURING DEVELOPMENT/DOCUMENTATION
MATERIAL PRODUCTION VERIFICATION PRODUCT RELEASE PRODUCT PERFORMANCE MANUFACTURABILITY RELIABILITY
MAINTENANCE PHASE
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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WAFER FABRICATION FLOW
SILICON STORES
MATERIAL STARTS
DIFFUSION/IMPLANT
PHOTO MASK/ETCH
POLY-SI
GRIND/POLISH
PRODUCTS WAFER BONDED WAFER WAFER
CONTINUED
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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WAFER FABRICATION FLOW Continued
*DIFFUSION/IMPLANT (device formation)
Option
Trench Fill Planer Polish
*PHOTO LITHOGRAPHY (Mask Etch)
*METALLIZATION
Options/Combination Aluminum Nichrome Poly Options/Combination Nitride Silox
*GLASSIVATION DIELECTRICS
PARAMETRIC MONITOR
Option
*BACKSIDE OPERATIONS
OPTION PROBE ELECTRICAL PROBE Options Test Temp.
SHIP ASSEMBLY SITE
Technologies/Products defined specific flow (traveler). unit process contained flow evaluated specific measurements such Diffusion/Implant Deposited Films Photo Resist Junction Depth -Film Thickness Critical Dimension Sheet Resistivities Refractive Index Resist Thickness Oxide Thickness Film Composition Etch Rates Implant Dose Calibration Resistivity Grind/Polish Thickness
NOTE: Changes process evaluations approved 999004.
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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WAFER SORT CLASS Q,V,
Optional required controled specific flows/travelers defined current best practice
RECEIVE DIE/WAFERS PAPERWORK
Note: referred "Pellet" Kuala Lumpur Facility.
DIE/WAFER STORES ATTACH WAFER SAW/DIE INSPECT TRAVELER
SEPARATION
PEEL
100% THRU TAPE- SILICON,
SORT/CLEAN
MANUAL/AUTO, PICK HARD SAMPLES PCKED REQUIRED (TOTAL DOSE RADIATION TESTING LEVEL SPECIFIED DRAWING) SAMPLES REQUIRED CLASS CONDITION CLASS CONDITION CLASS CONDITION ALTERNATE STANDARD PRODUCT MODIFIED COND. STANDARD PRODUCT MODIFIED COND CLASS MODIFIED CONDITION DETAILS CLASS VISUAL 233750 AVAILABLE
INSPECTION (HIGH POWER)
QUALITY INSPECT/ MONITOR
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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WAFER SORT CLASS Q,V, continued
Optional required controled specific flows/travelers defined current best practice
QUALITY INSPECT/MONITOR
SALES
INTERNAL ASSEMBLY TRANSFER ASSEMBLEY APPLICABLE GROUP V/Q/N/T PROCESSING
ASSEMBLE SAMPLE APPLICABLE GROUP QUALIFICATION TESTING TEST
FIRST LEVEL PACK
PRODUCT DISTRIBUTION CENTER PACK SHIP
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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ASSEMBLY FLOW HERMETIC Class
Options applicable controled specific flows/travelers defined current best practice Mil-STD-750 Test methods used Hard Power Product processed from attach through seal operations centrifuge. process Mil-PRF.19500 DSCC certifed process Power Products.
ATTACH ASSEMBLY TRAVELER FRAME ATTACH
L.R. FRAME SINK CERDIPS ONLY
WAFER REQUIRED)
ATTACH
GOLD EUTECTIC EPOXY SILVER GLASS SILVER POLYMER SOLDER (95% pb/5%
SHEAR PULL QUALITY ATTACH MONITOR
CLEAN/N2 BLOW-OFF (Optional)
WIRE BOND
BOND PULL MONITOR DESTRUCTIVE BOND PULL
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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ASSEMBLY FLOW HERMETIC Class CONTINUED
NON-DESTRUCT BOND PULL REQUIRED)
100% WIRES PULLED CLASS WHEN SPECIFIED APPLICABLE CLASS HARD POWER
CLEAN/N2 BLOW-OFF (Optional)
PRESEAL INSPECTION (HIGH POWER)
CLASS "V"/COND CLASS "Q"/COND CLASS ALTERNATE STD. PRODUCT MODIFIED STD. PRODUCT MODIFIED CLASS HARD POWER Mil-STD-750
QUALITY PRESEAL MONITOR (HIGH POWER)
CONTINUED
APPLICABLE VISUAL INSPECTION CLASS
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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ASSEMBLY FLOW HERMETIC CLASS CONTINUED
COAT
CONNOISSEUR COAT !AAXX CLASSIFIED PRODUCT REQUIRED
SEAL
FURNACE GLASS SEAL CERDIPS, CERPAKS, QUADS FURNACE SOLDER SEAL GOLD/TIN COMBO LIDS RESISTANCE WELD NICKEL LIDS METAL CANS SEAM WELD NICKEL LIDS, NICKEL/GOLD LIDS, FLATPACKS, LCC, SIDE BRAZE DIPS,
FINE LEAK TEST
HARD POWER MOUNTAINTOP ONLY
POWER TRANSFER PALM
BACKSIDE SIDE BRAND
TRACEABILITY CODE
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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ASSEMBLY FLOW HERMETIC CLASS (CONTINUED) TEMPERATURE CYCLE
APPLICABLE CLASS K.L. ASSEMBLED SILVER GLASS ATTACH CERDIP PRODUCT
CENTRIFUGE
APPLICABLE CLASS K.L. ASSEMBLED SILVER GLASS ATTACH CERDIP PRODUCT
PIND TEST REQUIRED)
CLASS CUSTOMER REQUIREMENTS
Sequence events below vary
FINE LEAK TEST
GROSS LEAK
Applicable Class Class "Palm Bay" Solder Seal Packages Hard Power Applicable K.L. Seam Weld product
FRAME REMOVAL REQUIRED)
MANUAL TRIMMING AUTO TRIMMING
TUBE CARIER LOAD
QUALITY MONITOR OPTIONAL
VISUAL INSPECTION -SAMPLE
SHIP TEST
EXTERNAL VISUAL SAMPLE DATA REVIEW
CONTINUED
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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ASSEMBLY FLOW HERMETIC CLASS (CONTINUED) (RETURNED ASSEMBLY FROM TEST) LEAD FINISH Required)
SOLDER CERDIPS, CERPAKS, SIDEBRAZE DIPS, METAL CANS, FLATPACKS, LCC, REQUIRED) GOLD- SIDEBRAZE DIPS, FLATPACKS, LCC, PGA, CERPAKS, METAL CANS PERFORMED AFTER BURN-IN ELECTRICAL TEST
FINE LEAK
APPLICABLE PALM SOLDER SEAL PACKAGES
GROSS LEAK
APPLICABLE PALM SOLDER SEAL PACKAGES
QUALITY MONITOR (OPTIONAL)
EXTERNAL VISUAL DATA REVIEW
RESHIP TEST
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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ASSEMBLY FLOW HERMETIC CLASS
Optional applicable controlled specific flows/travelers defined current best practice. Monitors same criteria manufacturing operations Class Hard Power products will follow Class Flow attach through package seal operations
ATTACH ASSEMBLY TRAVELER
ATTACH
GOLD EUTECTIC SILVER POLYMER Silver Glass Silver Epoxy (Not current future builds)
QUALITY ATTACH MONITOR
SHEAR PULL
CLEAN/N2 BLOW-OFF (Optional)
WIRE BOND
BOND PULL MONITOR DESTRUCTIVE BOND PULL
CONTINUED
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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ASSEMBLY FLOW HERMETIC CLASS (CONTINUED) CLEAN/N2 BLOW-OFF (Optional)
PRESEAL INSPECTION (HIGH POWER)
CLASS VISUAL 233750 (MODIFIED CONDITION TEST METHOD 2010) NOTE: INSPECTION DETAILS WILL MADE AVAILABLE UPON REQUEST
QUALITY PRESEAL MONITOR (HIGH POWER)
SOLDER SEAL
FURNACE SOLDER SEAL GOLD/TIN COMBO
BACKSIDE BRAND
TRACEABILITY CODE
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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ASSEMBLY HERMETIC FLOW CLASS (CONTINUED)
NOTE: Sequence events below vary
FINE LEAK SAMPLE TEST
FRAME REMOVAL REQUIRED)
MANUAL TRIMMING AUTO TRIMMING
TUBE/CARRIER LOAD
QUALITY MONITOR (OPTIONAL)
SHIP TEST
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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ASSEMBLY FLOW CLASS PLASTICS
OPTIONAL APPLICABLE CONTROLED SPECIFIC FLOWS/ TRAVELERS DEFINED CURRENT BEST PRACTICE
WAFER MOUNT/SAW
VISUAL MONITOR
QUALITY INSPECT
(OPTIONAL MONITOR/GATE)
PELLET MOUNT/DIE ATTACH CURE
VISUAL MONITOR QUALITY MONITOR (OPTIONAL)
WIRE BOND
BOND PULL MONITOR BALL SHEAR MONITOR (OPTIONAL)
QUALITY PREMOLD MONITOR
APPLICABLE VISUAL INSPECTION
MOLDING
VISUAL MONITOR X-RAY (OPTIONAL)
DEFLASH Flow Option Completed After Brand) (Mechanical/Chemical)
VISUAL MONITOR
CONTINUED
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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ASSEMBLY FLOW CLASS PLASTICS (CONTINUED) BRAND
VISUAL MONITOR TRACEABILITY CODE REQUIRED
POST MOLD CURE
TEMPERATURE CYCLE (Optional)
SOLDER PLATE (SOIC)
THICKNESS MONITOR
P-DIP
VISUAL MONITOR
BRAND (OPTIONAL) BRAND (OPTIONAL)
VISUAL MONITOR VISUAL MONITOR
REMOVAL/ LEAD FORM/CLIP LOAD
VISUAL MONITOR
SOLDER
VISUAL MONITOR SOLDERABILITY TEST MONITOR
CONTINUED
TRIM/FORM/ DERAIL LOAD
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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ASSEMBLY FLOW CLASS PLASTICS (CONTINUED)
SOLDER PLATE (SOIC)
THICKNESS MONITOR
P-DIP
VISUAL MONITOR
QUALITY INSPECTION (OPTIONAL MONITOR/GATE)
TRANSFER TEST
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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TEST OPERATIONS FLOW CLASS
OPTIONS. Applicable" controlled specific flows/travelers defined special customer requirements current best commercial practices.
FORM
100% ELECTRIC TEST (Optional) Notes
BURN-IN APPLICABLE)
BURN-IN CONDITIONS STATIC DYNAMIC, DEFINED APPLICABLE DETAIL DRAWING, INCLUDED PART SPECIFIC FLOW (See Note Note
POST BURN-IN ELECTRICAL (See Notes APPLY APPLICABLE OPTIONAL ELECTRICAL TEST MONITOR/ ALTERNATE GROUP DEFINED PRODUCT SPECIFIC TRAVELER
SOLDER APPLICABLE)
VISUAL SOLDERABILITY MONITOR
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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TEST OPERATIONS FLOW CLASS B/Q, CONTINUED BRAND
FLOW DEPENDENT BRAND COMPLETED PRIOR BURN-IN.
FINAL ELECTRICAL TEST APPLICABLE DEVICE SPECIFICATION
NOTE ELECTRIC TEST MONITOR (ALTERNATE GROUP applicable
QUALITY (TCI) TESTING APPLICABLE)
HERMETIC APPLICABLE GROUPS TESTING REFERENCE Section 2.10 /2.2.10 PLASTICS -MATRIX MONITOR, REFERENCE Section 2.10 /2.2.10
VISUAL/MECHANICAL
FINAL ACCEPTANCE
PACK SHIP
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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NOTES
NOTE
100% product will receive minimum electrical test insertion manufacturing flow. Typical test temperatures are:
MINIMUM MAXIMUM 125°C GRADE Commercial Industrial Military
NOTE
NOTE
Typical burn-in, when specified, hours 125° Class hours 125°C Class Standard time/temperature regression tables product flow shall used when applicable. Burn-In required Class product
NOTE
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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TEST OPERATION FLOW CLASS OPTIONS. Applicable" controlled specific flows/travelers defined current best practices.
FORM
100% ELECTRIC TEST
(Optional Flow Dependent)
BURN-IN
BURN-IN CONDITIONS e.g. STATIC DYNAMIC, DEFINED HARRIS PART SPECIFIC APPLICABLE DETAIL DRAWING,160 HOURS, 125°C HOURS PART SPECIFIC FLOW OPTIONAL POST BURN-IN ELECTRICAL (Room/low/high) FLOW DEPENDENT -BRAND COMPLETED PRIOR BURN-IN
BRAND
VISUAL MECHANICAL (SAMPLE)
FINAL ACCEPTANCE
QUALITY TESTING APPLICABLE)
APPLICABLE GROUPS B,C.D TESTING REFERENCE SECTION 2.2.10
PACK SHIP
INCLUDE SILVER EPOXY ATTACH INVENTORY
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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SECTION 2.2.6
GENERAL
LISTING COVERAGE
Intersil maintains electronic database which lists part types their corresponding technologies package/assembly technologies.
LISTING COVERAGE SYSTEM
Intersil maintains listing part types their corresponding technologies package/assembly technologies Intersil "SOAR" "HUB" database systems. section listing product technologies offered Intersil DSCC Certification memo included Appendix
QUALITY SUPPORT DOCUMENTS
999017 Database Requirements
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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SECTION 2.2.7
GENERAL
PM/TCV/SEC PROGRAM
Intersil Process Monitor (PM), Technology Characterization Vehicle (TCV) designed each technology. used obtain electrical physical data product being fabricated purpose process control, scrap/continue processing decisions database design model verification. used characterize technology's susceptibility wear-out reliability failure mechanisms such Electromigration, TDDB, etc. Standard Evaluation Circuits (SEC)s actual device selected Technology Conformance Testing) testing special design qualification circuit. used surrogate purposes testing vehicle various yield improvement projects hard evaluations. Reference para list SEC's PM's TCV's technology. SEC's will identified during initial technology design phase. product lines will identify requirement onset design phase. Technologies that have started design phase prior July 1994 qualified program surrogate. qualification requirement will identified internal process procedures.
PROCESS MONITORS PROGRAM
Process Monitors designed measuring wafer level electrical parameters every wafer manufactured. PM's part Wafer Acceptance Testing consistent with Intersil standards high quality reliability. This electrical data used feedback Wafer Fab, provides pass/fail data relative wafers continuing processing, provides database design verify device models. Structures also available assessment radiation effects, monitoring oxide charge trapping, other tests.
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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TECHNOLOGY CHARACTERIZATION VEHICLE PROGRAM
contains structures necessary fully characterize each process technology each following "wear-out" mechanisms: Electromigration carrier aging Time dependent dielectric break down Ohmic contact degradation designs structures worst case design ground rules. Each fully processed through glassivation. structures exist fully independent mask part SEC. During initial Reliability qualification each technology, structures stressed failure statistically characterized. Once production, "wear-out" mechanisms monitored each critical node list. addition design ground rules modified, necessary, provide guard bands guaranteeing sufficient life times.
STANDARD EVALUATION CIRCUIT PROGRAM
each technology either product specially designed circuit. used surrogate demonstrate process reliability technology (Technology Conformance Inspection) testing. SEC's selected from standard products specially designed basis worst case design rules level complexity. environment, utilizes relevant radiation hardness assurance design rules.
QUALITY SUPPORT DOCUMENTS
230415 Reliability Qualification Specification
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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SECTION 2.2.8
GENERAL
INCOMING INSPECTION VENDOR CONTROL PROCEDURES
Engineering, Purchasing, Manufacturing Quality Assurance have established system insure that purchased materials conform specified requirements.
INCOMING INSPECTION VENDOR CONTROL SYSTEM
Reference made sections regarding "Purchasing Receiving Inspection" appropriate Quality Manual referenced Section
QUALITY SUPPORT DOCUMENTS
Reference included sections regarding "Purchasing Receiving Inspection" appropriate Quality Manual referenced Section
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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SECTION 2.2.9
GENERAL
SCREENING
integrated circuits shall subjected pass screening tests specified Screening Tables that follow.(Reference Class Figure 2.2.9 Class Figure 2.2.9B, Figure 2.2.9C Class Class Figure 2.2.9D screening test eliminated modified when reliability data justifies change. qualifying activity will notified such changes. .Approval from qualifying activity required Class product. Reference Appendix para MIL-PRF-38535)
MICROCIRCUIT SCREENING
Screening performed accordance with wafer fab, assembly test travelers. These travelers reference process specifications required perform appropriate screening tests.
QUALITY SUPPORT DOCUMENTS
233XXX 240111-XXX 40H-721-010-016 230473 Quality Procedures Test Inspection Procedures Palm K.L. Quality Conformance Testing Matrix Monitor (Class
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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Screening Tables
Class Figure 2.2.9A
Screen
Wafer acceptance Internal visual Temperature cycling Constant acceleration Serialization Inspection Interim (pre burn-in) electrical parameters Burn-in test Interim (post burn-in) electrical parameters Percent Defective Allowable (PDA) calculation Seal Fine Gross
MIL-STD-883 test method
Sample electrical 2010 SOS/SCD Compliant Grandfathered material 1010 applicable K.L. assembled cerdip silver glass attached product 2001 applicable K.L. assembled cerdip silver glass attached product accordance with device procurement specification 1019 Level specified accordance with device procurement specification 1015 accordance with device procurement specification lots required device procurement specification 1014 Gross leak testing will performed solder seal packages assembled Palm Gross leak testing will performed metal cans solder seal packages assembled K.L. 2009
External visual
Class Figure 2.2.9B
Screen
Wafer Acceptance
MIL-STD-883 test method TRB/DSCC approved alternate test method
electrical inspections, thickness measurements standard Class monitor program. 2010 Condition modified 233750 (Intersil internal specification available upon request 1019 level specified accordance with device procurement specification 1015 accordance with device procurement specification 1014 devices assembled solder seal packages fine leak seal test will performed after seal operation. test will performed after lead shearing/clipping between final electrical testing external visual inspection operation. Gross leak testing will performed solder seal packages Time restrictions between mount seal apply 2009
Internal Visual Inspection Interim Burn-in Electrical Parameters Burn-in Final Electrical Test Seal (Fine leak test Sample)
External Visual
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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Class Figure 2.2.9
Screen
Wafer Acceptance Internal Visual Final Electrical Test
MIL-STD-883 test method TRB/DSCC approved alternate test method
Sample electrical Monitor Intersil Commercial Visual Criteria accordance with device procurement specification Minimum maximum rated temperature testing will through test guard bands sampling Sample Intersil Plastic Package Visual Criteria
External Visual
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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Class Figure 2.2.9
Screen
Wafer Acceptance
MIL-STD-883 test method TRB/DSCC approved alternate test method
5007 Plus Electrical samples *DSCC approved acceptance criteria Note step coverage Note Test optimization. Note reinspect previously qualified material. Note Inspection Certification Requirements Note Sampling product form Note Alternate UHF2CMOS UHF2 BICMOS Technologies 2023 Approved Alternate (Not applicable Hard power 2010 SOS/SCD Compliant Grandfathered material Reference Section Special AV/SI criteria 1010 2001 2020 accordance with device procurement specifications (DSCC approved formation allows weeks Seal Window) 2012 accordance with device procurement specification 1015 accordance with device procurement specification 1015 accordance with device procurement specification lots required device procurement specification accordance with device procurement specification 1014 devices assembled solder seal packages Palm Facility fine leak seal test will performed after centrifuge operation. test will performed after lead shearing/clipping between final electrical testing external visual inspection operation. Gross leak testing will performed solder seal packages assembled Palm Bay. Time restrictions between mount seal apply 2009
Nondestructive Bond Pull Internal Visual Temp Cycle Constant Acceleration PIND Serialization
Radiographic Inspection Interim Burn-in Electrical Parameters Burn-in Interim (Post Burn-in) Electrical Parameters Reverse Bias Burn-in Interim (Post Burn-in) Electrical Parameters Calculation Final Electrical Test Seal (Fine Gross)
External Visual
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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NOTE Product that does meet step coverage requirements MIL-STD-883, Method 2018 will evaluated minimum metal thickness requirements using following criteria: Current density A/CM2 Electromigration rules applicable technology minimum thickness 2000 angstroms mechanical integrity thickest metal requirement calculated meet appropriate metal thickness will used acceptance criteria step coverage. NOTE Reference Section Special AVSLI acceptance criteria moly. NOTE metal wafer Test Method 5007 acceptance using high vacuum, load lock metallization systems, product processed through metal deposition under continuous vacuum will considered wafer testing wafer acceptance NOTE monitor gate oxide Test Method 5007 gate oxide Class devices will monitored most stringent condition defined test Method 5007 frequency specified internal Intersil process specification. NOTE following sample plan will used reinspect document step coverage results product inventory previously qualified full sample test requirements affect time original SEM. Product Wafer Form random wafers will selected inspected requirements Intersil Plan 999015. Product Form total from each wafer will randomly selected inspected requirements Intersil Plan 999015. NOTE Class Inspection Certification will preformed initially reinstatement after decertification specified Intersil specification 880012, when reports reviewed, approved signed engineering. NOTE Sampling product form rare occasions scribed, sorted loaded into trays without selecting sample specific wafer quadrants. these occasions following alternate sample selection procedure will used. material Review Board that includes CORE members Wafer will review product history, process technology characteristics, etc. approve alternate sample plan case case basis. practice transferring uninked from wafer into trays start wafer place electrical good units sequential order working from left right across wafer loading tray left right until transfer complete. Wafer identity maintained tray. Operators will randomly select wafers from inspection. individual will selected follows: Divide number trays each selected wafer four. resulting whole number select trays sampled. Example: Wafer selected inspection total trays (12÷4=3) Sample from trays NOTE Alternate acceptance method UHF2 CMOS UHF2 BI-CMOS Technologies
planar process eliminates oxide steps that generate metal step coverage issues that traditionally screened using Test Method 2018 inspection criteria. Five positions each wafer electrically tested verify metal integrity including step coverage. failure test site metal integrity from five sites tested will reject wafer.
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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SECTION 2.2.10
GENERAL
TECHNOLOGY CONFORMANCE INSPECTION (TCI) PROCEDURES
testing performed periodic basis assure that quality reliability requirements product being met. testing includes applicable groups inspections Class Class Class product. Class product testing Matrix Monitor program
TECHNOLOGY CONFORMANCE INSPECTION (TCI) PROCEDURES
Notes from DSCC approved test optimization implementation applicable Class V,Q, product unless stated specific class manufacturing location.
Class
Sample sizes, MIL-STD-883 test methods, test method sequence, etc. group testing documented compliance with MIL-PRF-38535 unless test optimization been implemented defined notes following Class table. Inspection definitions also documented internal specifications Requirements Vehicle Group testing Actual Device Group testing Actual Device Group testing Actual Device Group testing Actual Device Group testing Actual Device Group performed required level drawing
Class Class test results used approved reference when available minimum Class endpoint subgroup testing will same Class Sample frequency Group Monthly seal date, attach, package group Group once every Fab. Quarters microcircuit group Group Every weeks production assembly site, seal date attach Requirements Vehicle Group testing Actual Device Group testing Actual Device Group testing Actual Device Group testing (Reference Actual Device level testing requirements)
Class Figure 2.2.10
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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Class
Sample sizes, MIL-STD-883 test methods, test method sequence, etc. group testing documented compliance with MIL-PRF-38535 unless test optimization been implemented defined notes following this table. Inspection definitions also documented internal specifications Requirements Vehicle Group testing Actual Device Group testing Actual Device Group testing Actual Device Group testing Actual Device Group testing Actual Device Group performed required Level drawing
Note Group DSCC approved Best Practice
Inspection windows will maintained attach. Intersil will maintain total four package families consisting nine package groups Package families window groups follows: CERDIP 3-groups Multilayer 1-group 2-groups CERPACK/CERQUAD 3-groups Wire Dimension will window factor point electricals will room temperature electrical test only Lead finish will window grouping factor Critical members will review root cause Group failures Product containment additional testing will determined based data analysis product reliability considerations.
Note Group Approved Test Optimization
attach material will factor maintaining Group windows. Class Life Test results used approved reference lesser Hermetic grade when from same diffusion lot.
Note Note
Group Approved Test Optimization
Bond strength testing required part Group Test subgroups
Group Approved Test Optimization
Group testing room, high, temperature testing device specific product tested Palm Facility. Actual product controlled system. Product additions must approved
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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Class Matrix Monitor
Tests completed technology package configuration. Class shipment occur passing Matrix monitor must have been completed product with date code within months date code product being shipped Reference specification 230473 additional sampling frequency, test duration sample size test condition information Tests managed processed reliability K.L. and/or Palm Bay. Matrix TEST HTOL HAST AUTOCLAVE LIQUID THERMAN SHOCK Matrix TEST HTOL AUTOCLAVE STORAGE LIFE TEMPERATURE CYCLE Matrix TEST SOLDERABILITY BRAND PERMANENCY TERMINAL STRENGTH PHYSICAL DIMENSIONS FLAMMABILITY TEST METHOD REFERENCE JESD A108 JESD -A101 JESD -A102 JESD -A103 MIL-STD-883, TM-1010, COND.C TEST METHOD REFERENCE JESD -A108 JESD -A105 JESD -A102 MIL-STD-883, TM-1011, COND.
TEST METHOD REFERENCE MIL-STD-883, TM-2003 MIL-STD-883, TM-2015 MIL-STD-883, TM-2004 MIL-STD-883, TM-2016 UL-94,VO
QUALITY SUPPORT DOCUMENTS
240111-XXX 40H-721-010-001 863009 40H-721-052-039 40H-721-052-037 230473 QML,QCI Inspection Procedures (Domestic) QML, Group Inspection Procedure (K.L.) QML, Group Inspection Procedure (K.L.) QML, Group Inspection Procedure (K.L.) QML, Group Inspection Procedure (K.L.) Plastic, Product Monitor
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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SECTION 2.2.11
GENERAL
MARKING
Marking microcircuits shall accordance with detail specification drawing shall legible, complete meet resistance solvents requirements MIL-STD-883, Method 2015.
MARKING
marking each microcircuit shall specified traveler shall include: index point (Part Identification Number) "QML" certification mark Manufacturers identification Country origin Date code Special marking Electrostatic Discharge Sensitivity identifier brand elements stated will specified traveler, electronic media. Container marking shall include marking requirements stated above with exception index point serialization.
QUALITY SUPPORT DOCUMENTS
999017 597002 427-200-001 427-200-002 System Brand Specification Palm Branding Specification (K.L) Branding Specification (K.L)
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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SECTION 2.2.12
GENERAL
REWORK
Rework reprocessing devices part thereof through manufacturing operation shall documented accordance with internal procedures performed subsequent next manufacturing operation.
REWORK
Rework documentation materials fab, wafer fab, assembly test clearly specified internal procedures. Operations that allow reworks compliance with MIL-PRF-38535 Mil-PRF-19500 Hard Power assembly operations. Documented processes procedures included Intersil Specification System.
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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SECTION FUNCTIONAL ORGANIZATION CHART
GENERAL
organizational chart Intersil Corporation found Figure 2.3.A. various TRB's report dotted line both Quality organization well Customer Assurance organization. organizational chart Intersil Division organization Section "TRB Operating Procedures". Additional organization charts Findlay, Palm Malaysia operations found "Quality Manuals" referenced Section
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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Controlled Document
,17(56,/ 0$18)$&785,1* 25*$1,=$7,21
Company President
Three Business Units Three Business Units
Finance Human Resources Legal Contracts Operations Planning
Public Relations Public Relations
Manufacturing Manufacturing Operations Operations
Engineering Engineering
Business Unit Business Unit
Production Control Operations Wafer Level Electrical Assembly Test Quality Productivity Facilities Support Purchasing Finance Env./Health/Safety
Tech Development Reliability Package/Assembly Dev. Design Systems Design Product Human Resources Factory Subcontractor Control
Marketing Sales Business Dev.
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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SECTION CHANGE CONTROL PROGRAM
GENERAL
changes Intersil program that could potentially have effect quality, reliability, performance, interchangeability resulting microcircuits shall evaluated approved members technical review board.
CHANGE CLASSIFICATION
changes critical Intersil program defined appendix "Guidelines Change Classification" Intersil Corporation specification 999004 'Change Notification Policy Procedure'
CHANGE PROCEDURES
Intersil change control procedure described Intersil specification 999004 'Change Notification Policy Procedure'
QUALITY SUPPORT DOCUMENTS
999004 230187 40F-700-1-6 40H-721-050-001 Change Notification Policy Procedure Specification Control Procedures (Document Control) Findlay Document Control System Malaysia Document Control System
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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CHANGE CONTROL PROGRAM FLOW
INITIATED
*FUNCTIONAL MEMBER PLANT CHANGE COORDINATOR REVIEWS MAJOR/MINOR CHANGE
MAJOR CHANGE 999004
PROCESS STANDARD DOC. CONTROL PROCEDURE
FUNCTIONAL MEMBER APPROVAL SUBMIT
CHANGE DOCUMENTED? ADEQUATE SUPPORTING DATA? REQUIRED QUAL COMPLETE?
RETURN ORIGINATOR
DATA EVALUATION APPROVAL DSCC NOTIFICATION APPROVAL REQUIRED DOCUMENT CONTROL FINAL PROCESSING
AREA FUNCTIONAL MEMBER WITH SPECIFIC PROCESSING EXPERTISE 999004 KNOWLEDGE SUBJECT BEING CHANGED
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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SECTION FAILURE ANALYSIS PROGRAM
GENERAL
Intersil established failure analysis program which analyzes failures from wide variety sources determining root cause failure that meaningful corrective action subsequent continuous improvement obtained. failure analysis procedures have been established accordance with MIL-STD-883, Method 5003.
FAILURE ANALYSIS PROGRAM
responsibility Failure Analysis Laboratory provide technical capabilities, equipment personnel, necessary support in-depth failure analysis Intersil Corporation products. analysis encompasses isolation identification failure modes/failure mechanisms, writing comprehensive technical report assignment appropriate corrective actions. Development capabilities failure analysis also extends into research vital understanding basic physics failure. Failure analysis performed method enhancing product quality reliability determining corrective actions. Failure analysis final crucial step used isolate potential reliability problems that have occurred during reliability stressing. Accurate analysis results imperative assessing effective corrective actions. ensure integrity analysis, correlation failure mechanism initial electrical failure essential throughout failure analysis flow. general failure analysis procedure (see figure 2.5.A) been established accordance with current revision MIL-STD-883, Method 5003. analysis procedure designed premise that each step should provide information failure without destroying information obtained from subsequent steps. exact steps used analysis determined laboratory personnel contain data, failure analyst's notes, formal Product Analysis Report Failure Analysis Report. Failure Analysis Laboratory performs analysis required internally Intersil Corporation externally customers described Figure 2.5.B.
QUALITY SUPPORT DOCUMENTS
230354 Compliant Failure Analysis
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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Failure Verification
External Inspection
Failure Analysis Flow (Non-Destructive)
Final Leak Test
Gross Leak Test Special Tests Electrical Analysis Failure Mode Predictions Select Analysis Path
Failure Analysis Flow (Destructive)
Deencapsulation Process Data Internal Visual Inspection Research Data Chemical Tests Physical Tests
Internal Electrical Probe
Cross Section
Circuit History
Analysis
Analysis Report
Figure 2.5.A
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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Reliability Engineering Evaluations Development Problems
Internal Reliability Program
(TCI) Qualification Testing
Special Prod. Eng. Reliability Evaluations
Customer Returns
Production Problems
Product Engineering
Product Engineering
Failed Devices
Failure Analysis
Formal Procedure
Diagnostic Technique Development
Support Analysis
Failure Analysis Report Distribution Corrective Active
Figure 2.6.B
FAILURE FLOW
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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SECTION SELF AUDIT PROGRAM
GENERAL
internal quality audit essential element quality system. Regular audits performed ensure conformance overall quality system, specified process procedures, specific customer requirements. Review audit results identifies opportunities continuous quality improvements.
SELF AUDIT PROGRAM
Reference made "Internal Audit System" section appropriate Quality Manual found Section
QUALITY SUPPORT DOCUMENTS
Reference made "Internal Audit System" section appropriate Quality Manual reference Section
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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SECTION OPERATING PROCEDURES
GENERAL
Intersil established division wide organization which responsible development maintenance Quality Management (QM) Plan, maintenance certified/qualified processes, process change control, reliability data analysis, failure analysis, corrective actions, microcircuit procedures, qualification status technology reporting status DSCC.
SYSTEM
"Intersil" division wide function representing world wide operations. operations located Kuala Lumpur (K.L.), Malaysia, Findlay, Ohio, Palm Bay, Florida. reporting structure shown Figure 2.7A. Each facility active organization which accountable activities their location. Chairperson(s) Malaysia Findlay TRB's members absentia Palm included distribution meeting minutes. members represent operations from Design through product shipment. Design Center Palm facility only design active facility products. Issues related products initially designed Research Triangle Park facility Raleigh N.C. (RTP) North Branch N.J. facilities communicated through product engineering representatives. Each member responsible keeping management current TRB/QML activities. Palm reviews approves Shore Subcontractor Major Change. Intersil Division Coordinator active member Palm Business Steering Committee. sites communicate activities Division Coordinator coordination requirements between sites DSCC. Business direction division wide organization provided business Steering Committee located Palm Bay.
DSCC REPORTING REQUIREMENTS
Intersil Division coordinator will notify DSCC real time basis Intersil major changes product business activities. report(s) include following applicable topics: Field Return Summary Applicable Continuous Improvement Activities Major Change Design, Wafer Processing, Assembly, Test Facilities Status Newly Qualified Packages/Product Third Party Activities applicable, presentation communicated qualifying activity outlining status technologies, product/packaging offerings, future trends strategic business plans. Examples activities that covered follows:
Title: QUALITY MANAGEMENT PLAN
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GUIDELINES STATUS REPORT OVERALL PROGRAM
Report major elements program such following: Design update introduction tools, processes etc. Test facilities update (including offshore facilities) Continuous improvement program update Assembly facility (including offshore facilities -newly qualified packages-any processes, major changes current processes Wafer Fab-any processes, major changes current processes Self Audit program (including offshore facilities) elimination test proposal milestones problems Field returns program update Results ongoing quality/reliability testing program goals, lessons learned Wafer Assembly Success Activities
PRODUCT TECHNOLOGIES
Certification qualification plan SEC/TCV strategy (preliminary results available) Design upgrades needed, (IE: design tools Wafer status technology Assembly -package characterization results
QUALITY SUPPORT DOCUMENTS
999009 999004 40F-701-1-15 40H-721-050-027 Palm "Technical Level" Rules Regulations Division Major Change Power Findlay Technical Review Board Procedure Malaysia Technical Review Board Procedure
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FINDLAY
MALAYSIA
PALM
INTERSIL SECTOR BUSINESS STEERING COMMITTEE
INTERSIL MULTI-SITE COORDINATOR (MEMBER P.B. TRB)
INTERSIL MARKETING
DSCC
Title: QUALITY MANAGEMENT PLAN
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SECTION YIELD/QUALITY IMPROVEMENT PROGRAM
GENERAL
entire Intersil division operates policy continuous improvement through extensive employee involvement. this Intersil established employee involvement teams (EIT's), system involvement programs (SIP's), self directed work teams (SDWT's), each which responsible continuous improvement using variety "problem solving" techniques.
YIELD/QUALITY IMPROVEMENT PROGRAM
Intersil established principles which guide quality improvement efforts. These principles customer focus, continuous improvement, employee involvement, supplier partnerships highest standards conduct, ethics integrity. Each these principles contributes overall quality improvement. Both hourly salaried employees involved EIT's, SIP's and/or SDWT's. Members various teams trained "team techniques" "problem solving" methods accordance with training program available their facility. heart continuous improvement efforts corrective action system. Reference made "Corrective Action" section appropriate Quality manual found Section
QUALITY SUPPORT DOCUMENTS
Reference made "Corrective Action" section appropriate Quality Manual found Section
Title: QUALITY MANAGEMENT PLAN
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SECTION PROGRAM
GENERAL
Organized activity Intersil Corporation began 1982 since matured into culture that embraces "way doing business". Statistical Process Control significant tool used achieve goal, meet exceed internal external customer expectation", providing continuous improvements quality, value, delivery products services. designated critical processes compliant requirements.
SYSTEM CONTROL
Reference made "Statistical Process Control" section appropriate Quality Manual referenced Section 4.0.
QUALITY SUPPORT DOCUMENTS
Reference made "Statistical Process Control" section appropriate Quality Manual found Section
SECTION 2.10 LIST TEST METHODS SUITABILITY
GENERAL
Reference SECTION 2.2.10 Tables Technology Conformance Test requirements Class Testing completed MIL-STD-883 Method 5004/5005 and/or defined approved test optimization conditions documented Section 2.2.10 event Intersil test equipment capacity restraints, approve DSCC approved test lab. Division Coordinator will notify DSCC temporary alternate site listed here-in
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TABLE 2.10
LIST TEST METHODS LOCATIONS SUITABILITY List Suitability Basic Test Method Condition
Palm Bay, Florida TEST Wafer Acceptance Non-Destruct Bond-Pull Internal Visual Temperature Cycling Constant Acceleration Particle Impact Noise Detection Seal (Fine Gross) Electrical Test Parameters Burn-In Test Radiography External Visual METHOD 5007 2018 2023 2010 1010 2001 2020 1014 Applicable Device Specification 1015 2012 2009
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List Test Methods Suitability Table 2.10A (continued)
Palm Bay, Florida TEST Electrical Test Parameters Physical Dimensions Internal Wafer Vapor Content Resistance Solvents Internal Visual DPA( Destruct Physical Analysis) Bond Strength Solderability Lead Integrity Seal (Fine Gross Leak Test) Torque Constant Acceleration Steady State Life Test Moisture Resistance Salt Atmosphere Thermal Shock Mechanical Shock Vibration, Variable Frequency Adhesion Lead Finish Shear Steady State Total Dose Irradiation Temperature Cycling Glassivation Layer Integrity Terminal Capacitance Electrostatic Discharge Sensitivity METHOD Applicable Device Specification 2016 1018 2015 2013 2011 2003 2004 1014 2024 2001 1005 1004 1009 1011 2002 2007 2025 2019/2027 1019 1010 2021 3021 3015
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List Test Methods Suitability Table 2.10A (continued)
Kuala Lumpur, Malaysia Test Internal Visual Temperature Cycle Constant Acceleration Seal (Fine Gross) Electrical Test Parameters External Visual Method 2010 1010 2001 1014 Applicable Device Specification 2029
Kuala Lumpur, Malaysia Test Electrical Test Parameters Physical Dimensions Resistance Solvents Internal Visual Bond Strength Solderability Lead Integrity Seal (Fine Gross) Torque Constant Acceleration Steady State Life Test Moisture Resist Salt Atmosphere Thermal Shock Mechanical Shock Vibration Variable Frequency Adhesion Lead Finish
Method Applicable Device Specification 2016 2015 2013 2011 2003 2004 1014 2024 2001 1005 1004 1009 1011 2002 2007 2025
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List Test Methods Suitability Table 2.10A (continued
Subcontractor, Kuala Lumpur, Malaysia Trio-Tech: TEST Steady State Life Test Burn-In Subcontractor, Kuala Lumpur, Malaysia KESM Industries TEST Steady State Life Test Burn-In Findlay, Ohio Facility TEST Wafer Acceptance METHOD 5007 2018 METHOD 1005 1015 METHOD 1005 1015
Kuala Lumpur, Malaysia Facility Palm Bay, Florida Facility Matrix Monitor testing Class Plastic Packaged product defined Section 2.2.10 Actual test site will determined capacity capability time test. Assembly Palm (RAD HARD Power I.C.) TEST Seal (Fine Leak) Mil-STD-750 METHOD 1071 Condition
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SECTION 2.11CALIBRATION
GENERAL
Calibration Laboratory functions integral part Intersil Corporation Total Quality Management (TQM) program. Written procedures outlining overall system requirements specific equipment calibration maintained each facility. designated inspection measuring, test equipment used throughout facility identified controlled known state calibration.
CALIBRATION SYSTE
Reference made "Inspection, Measuring Test Equipment Calibration" section appropriate Quality Manual reference Section 4.0.
QUALITY SUPPORT DOCUMENTS
Reference made "Inspection, Measuring Test Equipment Calibration" section appropriate Quality Manual reference Section 4.0.
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SECTION 2.12 RETENTION QUALIFICATION
GENERAL
Intersil defined internal process requirements maintain qualification status once initial qualification been completed. Intersil established criteria which complied compliance this criteria results removal product process from listing DSCC.
RETENTION QUALIFICATION SYSTEM
Intersil specification defining qualification retention requirements also defines addresses issues line shutdown removal. following list reasons removal from listing Qualifying Agency: product does meet quality, reliability performance requirements MILPRF-38535 Intersil unable implement corrective action plan defined this document. microcircuit offered under contract does meet device procurement specification requirements. Intersil terminated technology which qualified. Intersil requests name associated product removed from list. more conditions under which certification qualification granted have been violated. Intersil failed notify qualifying activity change procedures, processes, etc., accordance with change control procedures MIL-PRF-38535. Intersil's name appears "Consolidated List Debarred, Ineligible Suspended Contractors". Intersil complied with requirement retention qualification, stated internal specification. Intersil failed provide certified statement, when microcircuits supplied under contract direct indirect Government use, that such microcircuits have been tested requirements MIL-PRF-38535.
QUALITY SUPPORT DOCUMENTS
240111 40H-721-052-037 40H-721-052-039 Qualification Procedures Group Procedures K.L. Group Procedures K.L.
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SECTION 2.13 TRAINING
GENERAL
Training element overall quality system. system designed provide Intersil employees with necessary skills knowledge perform tasks highly technical environment. Training Department, Human Resources Department Manufacturing Department have responsibility authority identify implement effective training programs personnel. Employee development training opportunities include, limited to,: financial support advanced education employee growth training through corporate-wide center training development. Services provided technical administrative training development.
TRAINING
Reference made "Training" section appropriate Quality Manual reference Section
QUALITY SUPPORT DOCUMENTS
Reference made "Training" section appropriate Quality Manual reference Section 4.0.
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SECTION 2.14 CLEANLINESS ATMOSPHERIC CONTROLS
GENERAL
Specifications which define cleanliness atmospheric controls variety process areas have been established order build product highest quality reliability.
CLEANLINESS ATMOSPHERIC CONTROLS
Unique cleanliness atmospheric controls required fabricate integrated circuits. Intersil established required specifications which define requirements wafer assembly areas. Clean room standards have been developed minimize product contamination during processing. addition, temperature humidity limits defined critical process storage areas monitored accordingly.
QUALITY SUPPORT DOCUMENTS
420915 427129 242211 233151-T 710055 501043 40F-601-3-1 40F-601-3-4 841100 233151-A Clean Room Procedures (Fab Clean Room Procedures (Fab Environmental Control Test Environmental Control Mask Probe Clean Room Procedures (Findlay Wafer Fab) Clean Room Procedures (Findlay Circuit Probe) Clean Room Procedures (Malaysia) Environmental Monitor Assembly
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SECTION 2.15 PROGRAM
GENERAL
order preclude damage product, Intersil established program handling product areas starting with separation through final product shipment including shipment customers.
PROGRAM
Intersil program established using MIL-HDBK-263 MIL-STD-1686 guide. system includes areas beginning with separation continuing through final product shipment including shipment customers. Specifications have been generated which define static-free work stations, ionization, guns details proper handling, packaging storage procedures. applicable Intersil Manufacturing Support personnel receive training.
QUALITY SUPPORT DOCUMENTS
233403 40H-311-200-008 40F-601-3-8 Procedures (Palm Bay) Procedures (Malaysia) Procedures (Findlay)
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SECTION 2.16 CERTIFICATION TEST PLAN
GENERAL
Intersil Corporation Division manufacturing operations Palm Bay, Florida, Findlay, Ohio, Kuala Lumpur, Malaysia. Intersil manufactures large variety parts using many technology flows. Intersil transitioned parts into "Transitional QML" option obtained status existing technologies. This section describes general (non-technology specific) certification test plan technologies. Specific technology flow certification test plans will written required basis.
CERTIFICATION TEST PLAN
Certification Test Plan Products. Process/Product capability demonstration. Intersil Quality internal validation. Qualifying activity management technology validation. Demonstration manufacturing control offshore operations. Certification Test Plan Technology formal certification test plan will approved each technology flow certified. This plan will include: Milestone charts outlining tests used certify processes. Tests accomplished TCV, SEC, TCI. parts, evaluation plan
QUALITY SUPPORT DOCUMENTS
230415 Reliability Qualification
Title: QUALITY MANAGEMENT PLAN
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DSCC CERTFICATION VALIDATION
Title: QUALITY MANAGEMENT PLAN
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SECTION 2.17
QUALIFICATION TEST PLAN
GENERAL Intersil Corporation Division manufacturing operations Palm Bay, Florida, Findlay, Ohio Kuala Lumpur, Malaysia. Intersil manufactures large variety parts using many technology flows. Intersil transitioned parts into "Transitional QML" option obtained status existing technologies. This section describes general (non-technology specific) certification test plan technologies. Specific technology flow certification test plans will written required basis.
QUALIFICATION TEST PLAN
Qualification Test Plan Products/Technologies order obtain qualification specific technology flow, following requirements must met: Demonstration circuits will designed fabricated using technology flow qualified. format specifications (see MIL-HDBK-780) will generated demonstration circuits. demonstration circuits will assembled, tested, screened submitted qualification testing. Figure 2.16.A. Qualification Test Report Products/Technologies qualification test plan report will generated submitted formal acceptance. This plan subsequent report will typically include: test flow test limits test coverage test sampling techniques traceability records technology flow format specifications determined demonstration vehicles milestone charts
QUALITY SUPPORT DOCUMENTS
230415 Reliability Qualification Specification 230479 Technology Characterization Vehicles Section this document additional information
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SECTION 2.18 CORRECTIVE ACTION
GENERAL
quality system provides effective corrective action program which involves investigating root cause problem taking measures prevent recurrence.
CORRECTIVE ACTION
Reference made "Corrective Action" section appropriate Quality Manual found Section
QUALITY SUPPORT DOCUMENTS
Reference made "Corrective Action" section appropriate Quality Manual referenced Section 4.0.
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SECTION 2.19 THIRD PARTY ACTIVITIES
GENERAL
Intersil exercises option third party sources product design, wafer foundry, assembly test operations. selected operation completed part total third party.
THIRD PARTY
third party suppliers approved Intersil team insure that effective quality system been implemented supplier. Standard operating procedures used supplier generate finished product/test will assessed Intersil personnel. Assessment tools include limited review process monitor program, physical assessment quality systems, finished product evaluations. Team members include applicable representatives from Quality, Reliability, Product, Production Engineering. When scope third party operation includes processes material, required members will review approve assessment plans final data prior product being processed applications. facility will added plan. Intersil personnel will generate procurement specification each third party supplier detailing product/services quality requirements necessary compliance. details specification will negotiated approved third party supplier required Intersil personnel. major changes, defined 999004, will presented applicable approval.
QUALITY SUPPORT DOCUMENTS
210XXX 710-010-XX XXXXXXX 40F-400-0-0 710-010-XX 210805 449-816-003-X 449-800-001 Procurement Specifications Malaysia Monitor Burn-In-Houses Specific series identified with each purchase product services Findlay Supplier/Subcontractor Malaysia Subcontractor Monitor Mitel Wafer Foundry Baseline Manufacturing Specification Subcontractor Reliability Quality Requirements Subcontracted Assembly
Title: QUALITY MANAGEMENT PLAN
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SECTION TECHNOLOGY SPECIFIC
GENERAL
This section Intersil Plan provides description following database systems used control internal Intersil specifications used fabricate each part type every technology. list critical process/product internal specifications Technology Grouping guidelines list technologies
Title: QUALITY MANAGEMENT PLAN
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SECTION INTERSIL ELECTRONIC DATA BASE SYSTEM
GENERAL
listing parts produced Intersil Corporation found Intersil Electronic Database System. using database, reports generated provide following information each part type: Marketing (Military) Part Number Intersil marketing part number Product Description technology name/flow Process location (Design Center through Product Ship) Starting Substrate material procurement specification Base Wafer Mask Number Flow/Traveler numbers (Wafer Fab/Assembly/Test/QCI) Wafer product parameter specification number applicable) Bonding diagram specification number Package procurement specification number Package code traveler number addition, Intersil Document Control electronic data base system capable providing listing following series specifications: (see Figure 3.1.A)
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FIGURE 3.1A LIST CRITICAL PROCESS/PRODUCT SPECIFICATIONS
10-0216 10-0528-1 10-0553 10-0565-02 10-0594-01 10-0596-01 10-0597 10-0598-01 10-0599 10-0605-01 10-0607-01 10-0608 10-0628-01 10-0628-04 10-0630 10-0639-10 10-0640 10-0658 10-161-1 10-595 10-606 10-629 12-0257 12-1410 211003-005 211003-006 211004-001 211005-001 211005-002 211006-001 211006-002 211009-001 211009-002 211009-003 211010-001 211011-004 211011-005 211011-066 211021-002 211021-004 211023-001 211023-003 211023-004 211024-001 211025-001 211026-001 211026-011 211029-001 211030-001 211031-002 211031-003 211051-002 211051-005 211051-006 211053-003 211053-004 211053-006 211053-007 211054-001 211054-002 211055-002 211055-011 211056-002 211056-003 211056-004 211057-001 211059-004 211059-005 211059-006 211060-001 211061-044 211071-002 211071-005 211073-003 211073-004 211073-005 211074-001 211074-002 211075-001 211075-002 211076-002 211076-003 211077-001 211079-002 211080-001 211080-003 211080-004 211201-004 211201-005 211201-006 211202-001 211202-002 211202-003
ASSEMBLY MATERIAL HERMETIC 211202-006 211602-015 211202-010 211602-016 211204-001 211602-020 211207-005 211602-022 211207-007 211602-027 211208-001 211602-028 211208-002 211602-033 211208-011 211602-043 211211-001 211602-048 211303-007 211602-049 211303-008 211622-001 211303-009 211622-002 211652-002 211303-010 211652-004 211306-008 211652-005 211306-011 211652-006 211306-012 211653-003 211306-013 211653-004 211308-004 211653-006 211309-004 211658-001 211309-005 211402-004 211701211402-005 211703211707211402-007 211721211402-010 211731211403-002 211732211403-003 211403-004 211761-021 211403-006 211761-023 211403-007 211761-029 211407-003 211762-002 211407-005 211762-003 211408-004 211762-004 211408-018 211762-005 211480-004 211769-003 211601-001 211770-001 211601-006 211770-005 211601-007 211774-012 211601-013 211786-012 211601-016 211786-013 211601-020 211786-014 211601-041 211788-002 211601-042 211788-006 211601-088 211788-017 211602-003 211788-037 211602-010 211788-043 211602-013 211788-045
211789-001 211789-002 211789-009 211791-001 211791-002 211791-022 211801-003 211801-004 211802-002 211802-003 211802-004 211802-006 211803-001 211803-002 211803-003 211803-004 211803-005 211803-006 211803-007 211804-001 211804-002 211805-001 211805-002 211805-004 211807-001 211808-002 211808-003 211808-004 211809-001 211809-003 211810-009 211810-012 216019-031
411-DF218C 411-DF264A 411-DF362E 411-DF363D 412-AM506A 416-HR17353 JM210801
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MATERIAL DOCUMENTS MELBOURNE 210006-001 210032-001 210032-002 210032-004 210032-010 210032-011 210032-012 210032-013 210062-XXX 210147-001 210163210164-003 210166-001 210176-001 210177-002 210193210209-001 210215-001 210215-001A 210216-001 210216-002 210285-001 210285-001A 210285-001C 210285-001G 210285-002A 210285-002C 210285-002E 210285-002G 210285-018 210307210350-XXX 210367-001 210369-001 210412210414210426-XXX 210501-XXX 210550-014 210583210589-002 210614210641-001 210651-001 210688210799-XXX 211550-003 211550-005 211550-013 211550-014
ASSEMBLY MATERIAL PLASTIC 2119XX 210389 210332 210605 420-7077-23 420-6762-46 WIRE 420-6762-45 WIRE 40H-311-001-011 MOLDING 40H-311-001-014 420-6821-SOLDER 210389-005A EPOXY 210389-005B EPOXY 420-6483-MOUNT EPOXY 40H-731-040 LEAD 418-NRXXXXX LEAD 449-816-003X (Subcontractor)
ASSEMBLY MATERIAL POWER 420-6502-20 418-NR064AX 411-DF742 412-AM969B 416-HR262A
FINDLAY
Title: QUALITY MANAGEMENT PLAN
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PROCESS DOCUMENTS-(FLOWS/TRAVELERS- OPERATIONS) FLOWS/TRAVELERS MELBOURNE FLOW 310326 311003 311017 311022 311026 311030 311035 311039 311055 311071 311076 311085 311086 311045 311301 311304 311305 311327 311330 311331 311333 311334 311335 311336 311341 311343 311344 311346D 311093A Name SAJI SSAJI SSAJI SAJI SSAJI SIGATE SSAJI SAJI SAJI AVLSI HBC10 LCMOS BHFP BVHF HFH1B HIJFET HFSTDB STDL1N HFSTDB STDL1N HFSTDB HFSTDB HFSTDB HFSTDB HVTDLM UHF2/CMOS FINDLAY FLOW 210-1100MMZ 210-11.5MMZ 210-3SC-40Z 210-3SC-60TZ 210-3SC-11Z 210-3SC-50AZ 210-3SC-51 210-3SC-62TZ 210-3SC-53Z 210-3SC-21Z 210-3SC-42 210-3SC-61TZ 210-2100MMS 210-22.2MMS 210-9LT 210-9LTBC 210-72MSW 210-72EMPSWZ 210-7QMOSW 212-BIMOS-4T 212-LSI-4T 212-LSI-4C 211-601TZ 211-603DZ/T 211-607DZ 210-83M/WZ 210-83B 210-83AMT/W 210-3SC61JT 210-3SC60JT 210-3SC-20Z Name MG_CMOS MG_CMOS MGTF MGHV MGFF MGLF MGDE MGHV MGDE MGLV MGTF MGHV MG_CMOS MG_CMOS SOS_LT SOS_LT CMOS CMOS CMOS BIMOS-4 BIMOS-4 BIMOS-4 BL-TF BL-TF BL-TF CMOS CMOS CMOS MGHV MGHV MGHV
650198-001 WORLD WIDE DESIGN SYSTEM -XXX-XXX
Title: QUALITY MANAGEMENT PLAN
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PROCESS DOCUMENT FAB/ASSEMBLY/TEST MELBOURNE 201XXX-PACKAGE VISUAL 205XXX-ASSEMBLY 206XXX-DV -PROCESS ASY. 230XXX-QUALITY SUPPORT 233XXX-QUALITY SUPPORT 235XXX-INCOMING 235XXX-RECEIVING MATERIAL 236XXX-INCOMING 240XXX-QUALITY SUPPORT 280XXX-BLDG-04 420XXX-BLDG-59WAF 427XXX-BLDG-54W 501XXX-BLDG-PROBE 503XXX-TEST-58 508XXX-TEST 510XXX-TEST-58 519XXX-TEST-51 597XXX-TEST-51 710XXX-MASK OPERATIONS 811XXX-TEST SUPPORT PROCESS DOCUMENTS FINDLAY 40F-211-XX 456-211-XX 484-211-XX 489-211-XX 458-211-XX SUBCONTRACTOR WAFER Assembly 449-816-003-XX 210807 40C-311-101-XXX 425-718-036-XXX
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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PROCESS DOCUMENTS FLOWS/TRAVELERS -TEST ASSEMBLY OPERATION PROCESS SUPPORT DOCUMENTS OFFSHORE 233XXX-QUALITY SUPPORT 40H-311-010-XXX 40H-311-207-XXX 40H-721-010-XXX 40H-904-001-077 40H-904-XXX-XXX 549XXX 811XXX 841XXX 843XXX 849XXX 851XXX 852XXX 862XXX *40H-311-000-XXX *40H-311-001-XXX *40H-311-212-XXX *40H-721-014-XXX *40H-721-053-010 *40H-731-XXX *843XXX *864XXX *866XXX 230473 RELIABILITY MONITOR SYSTEM240111 REFERENCE 40H-311-200-008 40H-311-203-XXX 40H-721-010-001 TEST ACCEPT 40H-721-010-016 CONFORMANCE TESTING 40H-721-050-001 40H-721-050-026 40H-721-050-202 40H-721-052-037 GROUP 40H-721-052-039 GROUP 40H-721-053-005 40H-721-054-001 40H-721-200-017 863002 VISUAL/MECH. INSPECT 863009 CONFORMANCE INSPECT
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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TRAVELERS/FLOWS ASSEMBLY OFF-SHORE HERMETIC 840001 840014 840017 840024 840037 840038 840039 PLASTICS 40H-311-001-000 40H-311-001-023 40H-311-001-026 40H-311-010-000 40H-311-010-020 TRAVELERS/FLOWS ASSEMBLY SUBCONTRACTORS PLASTICS 449-816-003x
TRAVELERS /FLOWS ASSEMBLY DOMESTIC HERMETIC 352651 352652 352653 352671 352672 352673 352693 352694 352695-XX 362692-XXX 352610-XXX 352620-XXX 352630-XXX 352631-XXX 352632-XXX 352641-XXX 352642-XXX 352643-XXX 352644-XXX 352645-XXX 352652-XXX 352654-XX 352661-XXX 352662-XXX 352663-XXX 352664-XXX 352674-XXX 352675-XXX 352691-XXX
TRAVELERS/FLOWS TEST DOMESTIC/OFFSHORE HERMETIC 40H-311-052-054 40H-3110552-050 40H-721-050-005 40H-721-050-006 40H-721-050-017 54XXXX 87XXXX 989-XXXX 9QXXXX ITSXXXX POWER 352681-XXXX 352682-XXXX 352683-XXXX
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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SECTION TECHNOLOGY FLOW
3.2.1 GENERAL
Intersil Corporation produces multitude parts from wide variety technologies. These parts designed manufactured various locations throughout world. purposes this plan, technology flow defined manufacturing line which includes design, mask making, material fabrication, wafer fabrication, assembly/packaging test. Each product family unique combination elements manufacturing line which form "technology flow".
3.2.2 INTERSIL TECHNOLOGY FLOWS
technology flows each Intersil product families found accessing Intersil Electronic Databases. Figure 3.2A provides listing manufacturing/design locations that used Intersil produce products. Each technology flow unique combination various location/fabrication sites found Figure 3.2A.
Title: QUALITY MANAGEMENT PLAN
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3.2.3 INTERSIL TECHNOLOGY GROUPING GUIDELINES
following guidelines will used identify appropriate technology grouping each product identify TCV, circuits within group. Products must have same isolation type junction isolation dielectric isolation LOCOS local oxide REOX recessed oxide bonded wafer oxide isolation silicon sapphire Have same basic device structures technology NPN/PNP (Bipolar) channel FET's (CMOS) P/Nch FET's Bipolar NPN/PNPs (Bi-CMOS) Have same basic layout ground rules Minimum feature size Same number metal levels Have similar application voltage Have same gate material Poly Aluminum Have same location FNDLY MITEL Must contain number transistors largest (for Digital) Represents functionality process (for Analog) major circuit elements Fully functional circuit Product designed ground rules technology tested Hard Assurance required sufficient volume that should readily available testing product selected subteam must reached consensus that product yields reliable other products process will yield reliable. When subteam reached consensus product selection product listing will presented approval. Once approved table Section Plan that list SEC's, PM's TCV's technology will formally changed through (Engineering Change Notice).
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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Mitel Jarfalla Sweden
Palm Bay, Florida
North Branch, N.J.
Findlay, Ohio
Kuala Lumpur, Malaysia
North Carolina
Amkor Anam Philippines, Inc. Metro Manila, Philippines
DESIGN MASK WAFER Findlay Mitel ASSEMBLY TEST
(Plastic Only)
NOTE: DESIGN ACTIVE PRODUCT CURRENTLY DESIGNED NORTH BRANCH FACILITY. Mitel Facility currently designing manufacturing wafers. Inventory stock from this facility. FIGURE 3.2A
Title: QUALITY MANAGEMENT PLAN
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Section
General: following list SEC, PM's TCV's technology(from Table dated April 1998)
LIST SEC's, PM's TCV's
Technology Group BA02 Technology LINEAR HFHIB HFSTDB LOCATION
CM01
CMOS2
HA2520 TA03844H01 1440 1700 HA-5020 TA50001H01 1520 1640 HA-5127 TA03773H01 1650 2650 HA-5320 TA50374H01 2340 3870 HCT574 13604 1960 2240 HCT573 TA13616 2030 1630 HC373 TA11605 2000 2060 HCT181 TA13725 2360 1970
TA3841 TA3772 TA3842 TA3772 TA3882 TA3772
Transitioned Process (See Note
11462
Transitioned Process (See Note
FNDLY
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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XP0366X XP0366X Transitioned Process (See Note LOCATION FNDLY
Technology Group CM02
Technology MGDE
ICL7667 TA07667B X=1930 Y=2010 ICM7555 TA07555B X=1220 Y=1220 HIN232 TA51672A X=3175 Y=2110 ICL7109 TA07109A X=3430 Y=3100 06235A 2130 2690 ICL7662 TA07662XX X=2160 Y=2790 CD4015 TA10482 2690 3880 CD40110 TA06830 2590 3680 CD40192 TA10215 2110 2770 CD4094 TA06602 2290 2510
MGFF
MGTF MGLF
MGLV
CM03
MGHV
XP0364 XP0364
Transitioned Process (See Note
FNDLY
CM04
MG_CMOS
10916
Transitioned Process (See Note
FNDLY
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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10916 Transitioned Process (See Note LOCATION FNDLY
Technology Group CM05
Technology MGR_CMOS
CD4015 TA10482 2690 3880 CD40110 TA06830 2590 3680
CM08
BIMOS-4
BA04
HVTCOM
BA08
(DLM) HFStdB (DLM) HFSB
CD40192 TA10215 2110 2770 CD4094 TA06602 2290 2510 7170 07170 4060 3000 HA2640 TA50548 2360 1720
XP0365
Transitioned Process (See Note Transitioned Process (See Note Transitioned Process (See Note Transitioned Process (See Note
FNDLY
BA09
ACTUAL PRODUCT BEING SUPPLIED ACTUAL PRODUCT BEING SUPPLIED
03226
BA10
ALPS
UNKNOWN
Transitioned Process (See Note
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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00309 00823 01223
Technology Group
CM09
Technology
SAJI SSAJI
HM1-6617 01952A01 3550 5890 HM1-80C86 TA03584B01 6330 7390 HM1-80C88 TA03694B01 6330 7390 HM1-6514 TA01297C01 3460 4250 HM1-6504 TA01298A01 3450 4280 ACTUAL PRODUCT BEING SUPPLIED
Transitioned Process (See Note
LOCATION
CM10
SSAJI4RH
CM12
LCMOS
HI1-0546 01697H01 4030 2130 HI1-0547 01697H02 4030 2130 HI1-0506 TA01709H01 3270 2050 HI1-0507 TA01709H02 3270 2050
3004 3189 1794 3150 3327 1507 3750 3121 3534
Transitioned Process(See Note
Transitioned Process (See Note
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
Specification Number :999015 Issue Page
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10916
Technology Group
CM13
Technology
MGCMOS-RH
ACTUAL PRODUCT BEING SUPPLIED ACTUAL PRODUCT BEING SUPPLIED
Transitioned Process (See Note Transitioned Process (See Note
LOCATION
CM21
SOSLT
CM23
CMOS3AMT
CD74ACT245M TA14130C X=2540 Y=2200
13474 14394 14494 13353 13474 TA13086B used projection aligned process TA13086C used stepper aligned process
FNDLY
Transitioned Process (See Note
FNDLY
CM14
SIGATE HVSIGATE
CD74AC139M TA13114A X=3160 Y=1700 CD74AC706M TA13152A X=2540 Y=2200 DG408 TA50841A01 1800 3320 HI-201HS TA50013 2440 2860 DG-441 50840A01 1780 2760 HI524 TA50306A02 2250 3720 HI516 TA50306A01 2250 3720
03927 3772 50388
Transitioned Process (See Note
Title: QUALITY MANAGEMENT PLAN
Specification Type: DOCS
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TA50552A Transitioned Process (See Note LOCATION
Technology Group CM15
Technology SAJI5/6
HM1-65642 50551J01 7030 7760 HM1-656162 TA01875J01 4370 5100 HM1-6516 TA03139J01 4740 5070 80C286 TA50004J01 7200 7260 HSP43220 TA03979J01 8840 8870 HSP48410 TA50397J01 8380 7130 ACTUAL PRODUCT BEING SUPPLIED HFA1100 TA50070A01 1130 1600 HFA5251 TA50627A01 2670 1730 HFA3600 TA50950A01 1700 Y=1780
CM19
03352M 51122A
Transitioned Process (See Note
CM24
TSOS4
BA01
FACILITY FURTHER PROBE REQUIREMENTS 50538
Transitioned Process (See Note
50539 50102
Title: QUALITY MANAGEMENT PLAN
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