235°C Solder Reflow Profile TSOP Package Family (All assembly sit

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235°C Solder Reflow Profile TSOP Package Family (All assembly sit

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Cypress Semiconductor Reflow Qualification Report
235°C Solder Reflow Profile TSOP Package Family
(All assembly sites these packages)
CYPRESS TECHNICAL CONTACT QUALIFICATION DATA:
Russell Reliability Director (408) 432-7069
Rene Rodgers Staff Reliability Engineer (408)943-2732
Cypress Semiconductor Package: 235°C Solder Reflow Profile, TSOP Package Family Assembly: Philippines CSPI-R /ASE Taiwan
QTP# 99344, Page November, 2000
MAJOR PACKAGE INFORMATION USED THIS QUALIFICATION Package Designation: Package Outline, Type, Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Oxygen Rating Index: Lead Frame Designation: Lead Frame Material: Lead Finish, Composition Thickness: Backside Preparation Method/Metallization: Separation Method: Attach Supplier: Attach Material: Bond Diagram Designation Wire Bond Method: Wire Material/Size: Thermal Resistance Theta °C/W: Package Cross Section Yes/No: Assembly Process Flow: Name/Location Assembly (prime) facility: ZS444N 44-lead Thin Small Outline Package (TSOP Hitachi 9200 UL94 >28% Copper Solder Plated 90%Sn, 10%Pb Wafer Ablestik Ablestik 8361H 10-03049 Thermosonic Gold, 1.0mil Various (3IR-Reflow, 235°C+5, -0°C) 11-20007M Cypress Philippines (CSPI-R)
ELECTRICAL TEST FINISH DESCRIPTION Test Location: Fault Coverage: Cypress Philippines (CSPI-R) 100%
Note: Please contact Cypress Representative other packages availability
Cypress Semiconductor Package: 235°C Solder Reflow Profile, TSOP Package Family Assembly: Philippines CSPI-R /ASE Taiwan
QTP# 99344, Page November, 2000
MAJOR PACKAGE INFORMATION USED THIS QUALIFICATION Package Designation: Package Outline, Type, Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Oxygen Rating Index: Lead Frame Designation: Lead Frame Material: Lead Finish, Composition Thickness: Backside Preparation Method/Metallization: Separation Method: Attach Supplier: Attach Material: Bond Diagram Designation Wire Bond Method: Wire Material/Size: Thermal Resistance Theta °C/W: Package Cross Section Yes/No: Assembly Process Flow: Name/Location Assembly (prime) facility: Z32RN 32-lead Thin Small Outline Package Sumitomo EME7351 UL94 >28% Copper Solder Plated 85%Sn, 15%Pb Wafer Ablestik Ablestik 8361H 10-03372 Thermosonic Gold, 1.0mil Various (3IR-Reflow, 235°C+5, -0°C) 49-10029M Anam Korea (KOREA-GQ)
ELECTRICAL TEST FINISH DESCRIPTION Test Location: Fault Coverage: Anam Korea (KOREA-GQ) 100%
Note: Please contact Cypress Representative other packages availability
Cypress Semiconductor Package: 235°C Solder Reflow Profile, TSOP Package Family Assembly: Philippines CSPI-R /ASE Taiwan
QTP# 99344, Page November, 2000
MAJOR PACKAGE INFORMATION USED THIS QUALIFICATION Package Designation: Package Outline, Type, Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Oxygen Rating Index: Lead Frame Designation: Lead Frame Material: Lead Finish, Composition Thickness: Backside Preparation Method/Metallization: Separation Method: Attach Supplier: Attach Material: Bond Diagram Designation Wire Bond Method: Wire Material/Size: Thermal Resistance Theta °C/W: Package Cross Section Yes/No: Assembly Process Flow: Name/Location Assembly (prime) facility: Z28R2 28-lead Thin Small Outline Package Sumitomo EME7351 UL94 >28% Copper Solder Plated 85%Sn, 15%Pb Wafer Ablestik Ablestik 8361H 10-03401 Thermosonic Gold, 1.0mil Various (3IR-Reflow, 235°C+5, -0°C) 11-20007M Cypress Philippines (CSPI-R)
ELECTRICAL TEST FINISH DESCRIPTION Test Location: Fault Coverage: Cypress Philippines (CSPI-R) 100%
Note: Please contact Cypress Representative other packages availability
Cypress Semiconductor Package: 235°C Solder Reflow Profile, TSOP Package Family Assembly: Philippines CSPI-R /ASE Taiwan
RELIABILITY TESTS PERFORMED SPECIFICATIONREQUIREMENT
QTP# 99344, Page November, 2000
Stress/Test Temperature Cycle
Test Condition (Temp/Bias) MIL-STD-883C, Method 1010, Condition -65°C 150°C Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60%RH+3IR-Reflow, 235°C+5, 130°C/5.5V/85%RH Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60%RH+3IR-Reflow, 235°C+5, Cypress Spec 25-000104
Result
High Accelerated Saturation Test
Acoustic Microscopy
Cypress Semiconductor Package: 235°C Solder Reflow Profile, TSOP Package Family Assembly: Philippines CSPI-R /ASE Taiwan
QTP# 99344, Page November, 2000
Reliability Test Data
Device
STRESS:
99344
Failure Mechanism
ACOUSTIC-MSL3 4824437 4824437 4837596 4837596 4924091 4924091
Assy
Assy Duration Samp
CY7C1021-ZSC CY7C1021-ZSC CY62128-ZC CY62128-ZC CY7C199-ZC CY7C199-ZC STRESS:
619810471 619810471 619919886Q 619919886Q 619920628 619920628
CSPI-R CSPI-R TAIWN-G TAIWN-G CSPI-R CSPI-R
COMP COMP COMP COMP COMP COMP
HI-ACCEL SATURATION TEST (130C, 85%RH, 5.5V), COND 30C/60%RH 4824437 4837596 4924091 619810471 619919886 619920628 CSPI-R TAIWN-G CSPI-R
CY7C1021-ZSC CY62128-ZC CY7C199-ZC STRESS:
COND. -65C 150C, PRECONDITION 30C/60%RH (MSL3) 4824437 4837596 4924091 619810471 619919886Q 619920628 CSPI-R TAIWN-G CSPI-R
CY7C1021-ZSC CY62128-ZC CY7C199-ZC

235°C Solder Reflow Profile TSOP Package Family (All assembly sit

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