Sumitomo 7320 Mold Compound, MSL3 DCD-Thin Quad Flat Pack, (TQFP) Taiw
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Cypress Semiconductor Mold Compound Qualification Report
Sumitomo 7320 Mold Compound, MSL3 DCD-Thin Quad Flat Pack, (TQFP) Taiwan
CYPRESS TECHNICAL CONTACT QUALIFICATION DATA:
Russell Reliability Director (408) 432-7069
Rene Rodgers Staff Reliability Engineer (408)943-2732
Cypress Semiconductor Package: Thin Quad Flat Pack (TQFP) Molding Compound: Sumitomo 7320 Assembly: Taiwan TAIWN-G)
002403 Page January, 2001
PRODUCT QUALIFICATION HISTORY Qual Report 000303 002403 Description Qualification Purpose
Qualify 7320 Molding Compound, 160-lead TQFP Package TAIWN-G CPLD Qualify 7320 Molding Compound, TQFP Package TAIWN-G DCD-
Date Comp.
Cypress Semiconductor Package: Thin Quad Flat Pack (TQFP) Molding Compound: Sumitomo 7320 Assembly: Taiwan TAIWN-G)
002403 Page January, 2001
MAJOR PACKAGE INFORMATION USED THIS QUALIFICATION Package Designation: Package Outline, Type, Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Oxygen Rating Index: Lead Frame Designation: Lead Frame Material: Lead Finish, Composition Thickness: Backside Preparation Method/Metallization: Separation Method: Attach Supplier: Attach Material: Bond Diagram Designation Wire Bond Method: Wire Material/Size: Thermal Resistance Theta °C/W: Package Cross Section Yes/No: Assembly Process Flow: Name/Location Assembly (prime) facility: A100A 100-pin Thin Quad Flat Pack (TQFP) Sumitomo 7320 UL94 >28% Copper 85%Sn, 15%Pb Wafer Ablestik Ablestik 8361 10-03379 Thermosonic Gold/ 1.3mil 60°C/W 49-41006M Taiwan (TAIWN-G)
ELECTRICAL TEST FINISH DESCRIPTION Test Location: Fault Coverage: Taiwan (TAIWN-G) 100%
Note: Please contact Cypress Representative other packages availability.
Cypress Semiconductor Package: Thin Quad Flat Pack (TQFP) Molding Compound: Sumitomo 7320 Assembly: Taiwan TAIWN-G)
002403 Page January, 2001
MAJOR PACKAGE INFORMATION USED THIS QUALIFICATION Package Designation: Package Outline, Type, Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Oxygen Rating Index: Lead Frame Designation: Lead Frame Material: Lead Finish, Composition Thickness: Backside Preparation Method/Metallization: Separation Method: Attach Supplier: Attach Material: Bond Diagram Designation Wire Bond Method: Wire Material/Size: Thermal Resistance Theta °C/W: Package Cross Section Yes/No: Assembly Process Flow: Name/Location Assembly (prime) facility: A128B 128-pin Thin Quad Flat Pack (TQFP) Sumitomo 7320 UL94 >28% Copper 85%Sn, 15%Pb Wafer Ablestik Ablestik 8361 10-03587 Thermosonic Gold/ 1.0mil 45°C/W 49-41006M Taiwan (TAIWN-G)
ELECTRICAL TEST FINISH DESCRIPTION Test Location: Fault Coverage: Taiwan (TAIWN-G) 100%
Note: Please contact Cypress Representative other packages availability.
Cypress Semiconductor Package: Thin Quad Flat Pack (TQFP) Molding Compound: Sumitomo 7320 Assembly: Taiwan TAIWN-G)
002403 Page January, 2001
MAJOR PACKAGE INFORMATION USED THIS QUALIFICATION Package Designation: Package Outline, Type, Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Oxygen Rating Index: Lead Frame Designation: Lead Frame Material: Lead Finish, Composition Thickness: Backside Preparation Method/Metallization: Separation Method: Attach Supplier: Attach Material: Bond Diagram Designation Wire Bond Method: Wire Material/Size: Thermal Resistance Theta °C/W: Package Cross Section Yes/No: Assembly Process Flow: Name/Location Assembly (prime) facility: A144G 144-pin Thin Quad Flat Pack (TQFP) Sumitomo 7320 UL94 >28% Copper 85%Sn, 15%Pb Wafer Ablestik Ablestik 8361 10-03561 Thermosonic Gold/ 1.3mil 42°C/W 49-41006M Taiwan (TAIWN-G)
ELECTRICAL TEST FINISH DESCRIPTION Test Location: Fault Coverage: Taiwan (TAIWN-G) 100%
Note: Please contact Cypress Representative other packages availability.
Cypress Semiconductor Package: Thin Quad Flat Pack (TQFP) Molding Compound: Sumitomo 7320 Assembly: Taiwan TAIWN-G)
RELIABILITY TESTS PERFORMED SPECIFICATION REQUIREMENT
002403 Page January, 2001
Stress/Test High Accelerated Saturation Test
Test Condition (Temp/Bias) Bias 5.5V, 130°C, 85%RH (002403/000303) Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60%RH MIL-STD-883C, Method 1010, Condition -65°C 150°C Precondition: JESD22 Moisture Sensitivity Level (002403/000303) Hrs., 85°C/85%RH 165C, bias (000303) Cypress Spec 25-00014 (000303) Cypress Spec. 25-00104 (002403/000303) Cypress Spec 12-00292 (000303)
Result
Temperature Cycle
High Temperature Storage Thermal Shock Acoustic Microscopy, Level X-Ray
Cypress Semiconductor Package: Thin Quad Flat Pack (TQFP) Molding Compound: Sumitomo 7320 Assembly: Taiwan TAIWN-G)
002403 Page January, 2001
Reliability Test Data
Device
STRESS:
002403
Failure Mechanism
ACOUSTIC MSL3
Assy
Assy Duration Samp
CY7C09579V-AC CY7C09379-AC CY7C43684-AC STRESS:
4003220 4004331 4946059
610019982 610019671 610019983
TAIWN-G TAIWN-G TAIWN-G
COMP COMP COMP
HI-ACCEL SATURATION TEST (130C, 85%RH, 5.5V)PRE COND 30C/60%RH 4003220 4004331 4946059 610019982 610019671 610019983 TAIWN-G TAIWN-G TAIWN-G 128H 128H 128H
CY7C09579V-AC CY7C09379-AC CY7C43684-AC STRESS:
CONDITION -65C 150C, COND. 30C/60% (MSL3) 4003220 4003220 4003220 4004331 4004331 4004331 4946059 4946059 4946059 610019982 610019982 610019982 610019671 610019671 610019671 610019983 610019983 610019983 TAIWN-G TAIWN-G TAIWN-G TAIWN-G TAIWN-G TAIWN-G TAIWN-G TAIWN-G TAIWN-G 1000 1000 1000
CY7C09579V-AC CY7C09579V-AC CY7C09579V-AC CY7C09379-AC CY7C09379-AC CY7C09379-AC CY7C43684-AC CY7C43684-AC CY7C43684-AC
Cypress Semiconductor Package: Thin Quad Flat Pack (TQFP) Molding Compound: Sumitomo 7320 Assembly: Taiwan TAIWN-G)
002403 Page January, 2001
Reliability Test Data
Device
STRESS:
000303
Failure Mechanism
ACOUSTIC
Assy
Assy Duration Samp
CY7C375I-AC CY7C375I-AC CY7C375I-AC STRESS:
2901582 2902720 2902720
619909347 619909600 619909601
TAIWN-G TAIWN-G TAIWN-G
COMP COMP COMP
HI-ACCEL SATURATION TEST (130C, 85%RH, 5.5V)PRE COND 30C/60%RH 2902720 619909600 TAIWN-G
CY7C375I-AC STRESS:
HIGH TEMP STORAGE, PLASTIC, 165C
CY7C375I-AC STRESS:
2901582
619909347
TAIWN-G
CONDITION -65C 150C, COND. 30C/60% (MSL3)
CY7C375I-AC CY7C375I-AC CY7C375I-AC CY7C375I-AC CY7C375I-AC CY7C375I-AC CY7C375I-AC CY7C375I-AC CY7C375I-AC STRESS:
2901582 2901582 2901582 2902720 2902720 2902720 2902720 2902720 2902720
619909347 619909347 619909347 619909600 619909600 619909600 619909601 619909601 619909601
TAIWN-G TAIWN-G TAIWN-G TAIWN-G TAIWN-G TAIWN-G TAIWN-G TAIWN-G TAIWN-G
1000 1000 1000
THERMAL SHOCK, CONDITION (150C, -55C)
CY7C375I-AC CY7C375I-AC STRESS:
2901582 2901582
619909347 619909347
TAIWN-G TAIWN-G
X-RAY (EXAMPLE: LOOKING WIRE-SWEEP)
CY7C375I-AC
2901582
619909347
TAIWN-G
COMP
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