LZ34B1B LZ34B1B 1/4-type (4.5 solid-state color image sensor that

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LZ34B1B LZ34B1B 1/4-type (4.5 solid-state color image sensor that

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LZ34B1B
LZ34B1B
LZ34B1B 1/4-type (4.5 solid-state color image sensor that consists photodiodes CMOS (Complementary Metal Oxide Semiconductor) devices. sensor further includes timing generator (TG), correlated double sampling (CDS) circuit, auto gain control (AGC) circuit analog-to-digital converter (ADC) circuit. With approximately pixels (703 horizontal vertical), sensor provides stable digital color image with extremely power consumption.
1/4-type Color CMOS Image Sensor with Pixels
CONNECTIONS
36-PIN
SIGOUT REFIN
VIEW
SIGIN
LOAD
BIAS2
SCLK
CLP1
CLP2
BIAS1 AGCOUT AGND AVDD STBY
FEATURES
Progressive scan Square pixel Compatible with standard Number image pixels Number optical black pixels Horizontal front rear Vertical front rear Pixel pitch primary color mosaic filters Image inversion function (horizontally and/or vertically) Available types power save mode circuits become power-off with serial data circuits become power-off with STBY Monitoring mode Analog output 8-bit digital output Variable gain control Variable electronic focal plane shutter (1/15 Single +2.8 power supply Package 36-pin LCC* (N-LCC036-S425B)
AGND
AVDD
DGND
(N-LCC036-S425B)
DVDD
absence confirmation device specification sheets, SHARP takes responsibility defects that occur equipment using SHARP devices shown catalogs, data books, etc. Contact SHARP order obtain latest device specification sheets before using SHARP device.
PRECAUTIONS
Refer "PRECAUTIONS CMOS IMAGE SENSORS".
Leadless Chip Carrier
LZ34B1B
BLOCK DIAGRAM
DATA CONTROL 8-BIT
ANALOG VIDEO
CMOS IMAGE SENSOR
8-BIT
DIGITAL VIDEO
LZ34B1B
SYMBOL BIAS1 AGCOUT AGND AVDD STBY AGND AVDD DGND DVDD SCLK LOAD CLP2 CLP1 Analog Analog Analog Analog Analog Analog Analog Digital Analog Analog Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital DESCRIPTION Analog bias voltage image sensor output Analog ground Analog power supply Offset bias voltage output Bottom reference voltage reference voltage Standby control mode* Analog ground Analog power supply Digital ground Digital power supply Clock input oscillator (12.27 MHz) Clock output oscillator
signal output
signal output signal output signal output signal output
signal output (MSB) Clock output (6.135 MHz) Horizontal drive pulse input Vertical drive pulse input Control data input (AGC gain, offset, shutter control,
Digital Digital Digital
Digital Analog Analog Analog Analog Analog Analog
SIGOUT SIGIN
BIAS2
REFIN
Standby mode functions High level Standby mode (all circuits power-off), level open Normal mode (all circuits active)
image inversion, etc.) Shift clock data Load pulse data input Analog bias voltage clamp circuit Analog bias voltage clamp circuit Analog image signal output Analog image signal input Analog bias voltage image sensor Reference voltage analog input connection
signal output (LSB) signal output
connection
LZ34B1B
ABSOLUTE MAXIMUM RATINGS
PARAMETER Power supply voltage Input signal voltage Storage temperature SYMBOL TSTG RATING -0.3 +4.6
UNIT
-0.3
RECOMMENDED OPERATING CONDITIONS
PARAMETER Power supply voltage Operating temperature Oscillation frequency Digital input voltage Analog input voltage Analog bias voltage Normal mode Monitoring mode level HIGH level SYMBOL TOPR 0.8VDD (Connect through capacitor) (Connect MIN. TYP. 12.27 0.2VDD MAX. UNIT NOTE
NOTES
Applied input pins STBY, SDI, SCLK LOAD. Applied input pins SIGIN REFIN. connect directly. Applied pins BIAS1, BIAS2, OFS, ADL, ADH, CLP1 CLP2. connect directly.
through capacitor)
LZ34B1B
CHARACTERISTICS (1/15 progressive scan readout mode)
+25°C, Operating conditions typical values specified "RECOMMENDED OPERATING CONDITIONS". Color temperature light source cut-off filter (CM-500, 1mmt) used.) Measurement point Analog image signal output (pin No.32), before circuit converter.
PARAMETER Standard output voltage Photo response non-uniformity Saturation output voltage Dark output voltage Sensitivity (Green channel) Supply current Standby current Vertical line fixed pattern noise SYMBOL PRNU VSAT VDARK IVDD ISTBY VFPN MIN. TYP. MAX. UNIT NOTE
NOTES
average output voltage signal under uniform illumination. standard exposure conditions defined when image area divided into segments under standard exposure conditions. Each segment's voltage average output voltage pixels within segment. PRNU defined (Vmax Vmin)/VO, where Vmax Vmin maximum minimum values each segment's voltage respectively. image area divided into segments. Each segment's voltage average output voltage pixels within segment. VSAT minimum segment's voltage under times exposure standard exposure conditions. difference between average output voltage image area that area, under nonexposure conditions.
average output voltage signal when light source with reflector imaged lens Total current analog digital power supplies, dark standard load conditions. Total current power supply standby mode. (Pin No.9 (STBY) fixed level other input pins fixed level level.) mean horizontal line signal <bi> obtained adding horizontal line signals <aij> vertically dividing them line number. <xi> deviation center pixel from average successive pixels <bi>. VFPN maximum absolute value <xi>.
mVp-p
LZ34B1B
PIXEL STRUCTURE
OPTICAL BLACK PIXELS)
OPTICAL BLACK PIXELS)
OPTICAL BLACK PIXELS)
OPTICAL BLACK PIXELS)
493)
COLOR FILTER ARRAY
(655, 493)
(655,
LZ34B1B
TIMING CHART
[Normal Mode]
HORIZONTAL PULSE TIMING
ADOUT (D0-D7)
Normal
655OBOB
Mirror
ADOUT (D0-D7)
Normal
OBOB
Mirror
rising edge pulse must between rising edges (1). falling edge pulse must between rising edges (78) (79).
PHASE RELATIONS BETWEEN DIGITAL OUTPUT (ADOUT) CLOCK (CLK)
ADOUT (D0-D7)
SYMBOL MIN.
Shutter
TYP. MAX. UNIT
Offset
VERTICAL PULSE TIMING
SDI, SCLK, LOAD Forbidden Period
ADOUT (D0-D7)
Normal
Mirror
rising edge falling edge pulse must high period pulses.
SERIAL DATA TIMING (SDI, SCLK, LOAD)
Fixed Gain
SCLK LOAD
Data taken rising edge SCLK. Clock frequency SCLK should less than that CLK. insert SDI, SCLK LOAD pulses between 28H* 29H*. Refer "VERTICAL PULSE TIMING". Refer "SERIAL DATA INPUTS" contents serial data from D37. means ordinal number pulse.
LZ34B1B
[Monitoring Mode]
HORIZONTAL PULSE TIMING
ADOUT (D0-D7)
Normal
655OB
Mirror
ADOUT (D0-D7)
Normal
Mirror
rising edge pulse must between rising edges (1). falling edge pulse must between rising edges (78) (79).
PHASE RELATIONS BETWEEN DIGITAL OUTPUT (ADOUT) CLOCK (CLK)
ADOUT (D0-D7)
SYMBOL MIN.
Shutter
TYP. MAX. UNIT
Offset
VERTICAL PULSE TIMING
SDI, SCLK, LOAD Forbidden Period
ADOUT (D0-D7)
Normal
Mirror
rising edge falling edge pulse must high period pulses.
SERIAL DATA TIMING (SDI, SCLK, LOAD)
Fixed Gain
SCLK LOAD
Data taken rising edge SCLK. Clock frequency SCLK should less than that CLK. insert SDI, SCLK LOAD pulses between 15H* 16H*. Refer "VERTICAL PULSE TIMING". Refer "SERIAL DATA INPUTS" contents serial data from D37. means ordinal number pulse.
LZ34B1B
SERIAL DATA INPUTS
DATA MAX2 (MSB) MAX1 MAX0 (LSB) OFS7 (MSB) OFS6 OFS5 OFS4 OFS3 OFS2 OFS1 OFS0 (LSB) SHT9 (MSB) SHT8 SHT7 SHT6 SHT5 SHT4 SHT3 SHT2 SHT1 SHT0 (LSB) MIRH MIRV NAME AGC6 (MSB) AGC5 AGC4 AGC3 AGC2 AGC1 AGC0 (LSB) Selection fixed gain Offset level control (0.9 Auto gain control FUNCTION
Shutter speed control
SAD2 (MSB) SAD1 SAD0 (LSB) LPMD1 LPMD0
(Normal mode Exposure time 1/525 frame period.) (Monitoring mode Exposure time 1/262 frame period.)
Horizontal mirror inversion image, Normal image Vertical mirror inversion image, Normal image Monitoring mode, Normal mode Phase selection clock D32/D33/D34 L/L/L -30° D32/D33/D34 L/H/L Power save mode D35/D36 Normal mode D32/D33/D34 L/L/H -15° D32/D33/D34 L/H/H +15° D35/D36
D35/D36 D35/D36 Inhibited mode Inhibited mode, Normal mode
used. (Fix level.)
LZ34B1B
Setting Auto Gain Control
gain code represents approximately 0.156 Nominal gain values typical codes shown below.
AUTO GAIN CONTROL (dB)
Setting Fixed Gain
FIXED GAIN (dB)
gain code represents
LZ34B1B
Setting Offset Level
offset code represents approximately 0.002 Nominal offset values typical codes shown below.
OFFSET LEVEL
Setting Shutter Speed
shutter speed code represents where pulse period. Shutter speed values typical codes shown below normal mode, monitoring mode mode.
SHUTTER SPEED (Exposure Time Unit Normal Monitoring
Setting Driving Modes
FUNCTION Normal mode Monitoring mode
Insert capacitors more than between AVDD AGND between DVDD DGND. Capacitors whose values shown must
(6.135 MHz)
Oscillator (12.27 MHz) DVDD DGNG AVDD AGND Digital Power Supply
AVDD BIAS1 AGND AGCOUT
SCLK LOAD CLP2 CLP1 SIGOUT SIGIN BIAS2 REFIN
EXAMPLE OPERATION CIRCUIT
LZ34B1B
(TOP VIEW)
STBY
Analog Power Supply
LZ34B1B
LZ34B1B
PACKAGE OUTLINES (N-LCC036-S425B)
Center effective imaging area 9.8±0.1(2) 10.8±0.1 6.05±0.075 0.65 Index mark 0.5±0.35 Center die. Center 1.9±0.2 1.2±0.12 R0.4TYP. 0.6TYP. 1.27TYP. 0.7TYP. 0.4TYP. R0.15TYP.
(Unit
0.5±0.35 5.4±0.075
P-1.0TYP.
0.1TYP.
Refractive Refractiva index 1.05±0.1
0.7±0.1
;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;
0.04
Rotation error 1.5°MAX. Effective imaging area) Lid' size)
Glass
0.85±0.1
Package
0.04
CMOS
LZ34B1B
PRECAUTIONS CMOS IMAGE SENSORS Package Breakage
order prevent package from being broken, observe following instructions CMOS image sensor precise optical component package material ceramic. Therefore, Take care drop device when mounting, handling, transporting. Avoid giving shock package. Especially when pins fixed socket circuit board, small shock could break package more easily than when package isn't fixed. When mounting package housing, sure that package bent. bent package forced into place between hard plate like, package broken. damage breakage occurs surface glass cap, characteristics could deteriorate. Therefore, glass cap. give shock large enough cause distortion. scrub scratch glass surface. Even soft cloth applicator, dry, could cause flaws scratch glass.
When directly handling device with fingers, hold part without pins touch pin. avoid generating static electricity, scrub glass surface with cloth plastic. attach tape labels. clean glass surface with dustcleaning tape. When storing transporting device, container conductive material.
Dust Contamination
Dust contamination glass surface could deteriorate output characteristics cause scar. order minimize dust contamination glass surface, take following precautions Handle CMOS image sensor clean environment such cleaned booth. (The cleanliness level should possible, class least.) touch glass surface with fingers. dust contamination gets glass surface, following cleaning method recommended Dust from static electricity should blown with ionized blower. antielectrostatic measures, however, ground pins device before blowing dust. contamination glass surface should wiped with clean applicator soaked isopropyl alcohol. Wipe slowly gently direction only. Frequently replace applicator same applicator clean more than device. Note most cases, dust contamination unavoidable, even before device first used. therefore, recommended that above procedures should taken wipe dust contamination before using device.
Electrostatic Damage
compared with general MOS-LSI, CMOS image sensor lower ESD. Therefore, take following antistatic measures when handling CMOS image sensor Always discharge static electricity grounding human body instrument used. ground human body, provide resistance about between human body ground safe side.
LZ34B1B
Other
Soldering should manually performed within seconds 400°C maximum soldering iron. Avoid using storing CMOS image sensor high temperature high humidity precise optical component. give mechanical shock CMOS image sensor. expose device strong light. color device, long exposure strong light will fade color color filters.

LZ34B1B LZ34B1B 1/4-type (4.5 solid-state color image sensor that

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