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TL16C552AM 5962-9755001QXA TL16C552A Dual Asynchronous Communicat
Top Searches for this datasheetSGYV037 -July 1997 TL16C552AM 5962-9755001QXA TL16C552A Dual Asynchronous Communications Element with FIFO HIGHLIGHTS TL16C552A enhanced dual channel version popular TL16C550 asynchronous communications element (ACE). device serves serial input/output interfaces simultaneously microcomputer microprocessor-based systems. Each channel performs serial-to-parallel conversion data characters received from peripheral devices modems parallel-to-serial conversion data characters transmitted CPU. complete status each channel dual read time during functional operation CPU. information obtained includes type condition transfer operations being performed error conditions. addition dual communications interface capabilities, TL16C552A provides user with fully bi-directional parallel data port that fully supports parallel Centronics-type printer. parallel port serial ports provide PC/AT-compatible computers with single device serve three system ports. FEATURES/BENEFITS PC/ATCompatible TL16C550 ACEs Enhanced Bidirectional Printer Port 16-Byte FIFOs Reduce Interrupts Independent Control Transmit, Receive, Line Status, Data Interrupts Each Channel Individual Modem Control Signals Each Channel Programmable Serial Interface Characteristics Each Channel: 8-bit Characters Even-, Odd-, No-Parity Generation Detection 1/2-, 2-Stop Generation 3-State Drive Data Control Each Channel SUPPORT additional information this other Mixed Signal/Analog Products visit Mixed Signal home page Additional information regarding this product available calling Texas Instruments U.S. Product Information Center (PIC) (972) 644-5580 during normal business hours (CST/CDT). European information visit SIZE current size mils mils. TECHNOLOGY LinEPICProcess level: PACKAGING Package Option: 68-pin Ceramic Quad FlatPack POWER DISSIPATION table below shows modeled data. This data used approximating system thermal characteristics: Package Thermal Data Package Note: much better thermal impedances achieved using flow, with increasing metal backplane thickness trace area Printed Circuit Board (PCB) that used. PROCESS/PERFORMANCE OPTIONS TL16C552AM processed military temperature range SN-level, SNJlevel programs requiring devices processed MIL-PRF-38535. DSCC Standard Microcircuit Drawing (SMD) this device given below. DSCC Parent TL16C552AMHVB DSCC 5962-9755001QXA SUPPORT LITERATURE access data sheets TI's home page internet (http://www.ti.com) reference literature number SLLS189B when contacting PIC. PC/AT trademark International Business Machines Corporation. Other recent searchesSi3424BDV - Si3424BDV Si3424BDV Datasheet MPC60x - MPC60x MPC60x Datasheet LBS11526 - LBS11526 LBS11526 Datasheet CY8C20142 - CY8C20142 CY8C20142 Datasheet AT431 - AT431 AT431 Datasheet 1935213 - 1935213 1935213 Datasheet
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