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QUARTZ CRYSTAL 2000 Product Catalog 2000-2001.Mar. Info


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022-03
QUARTZ CRYSTAL
2000 Product Catalog
2000-2001.Mar.
Information Changes Product Codes product codes this document scheduled change April 1,2001. purchasing products after this date, please request latest version this document from your nearest sales office.
NOTICE
part this material reproduced duplicated form means without written permission Seiko Epson. Seiko Epson reserves right make changes this material without notice. Seiko Epson does assume liability kind arising inaccuracies contained this material application product circuit and, further, there representation that this material applicable products requiring high level reliability, such medical products. Moreover, license intellectual property rights granted implication otherwise, there representation warranty that anything made accordance with this material will free from patent copyright infringement third party. This material portions there contain technology subject relating strategic products under control Foreign Exchange Foreign Trade Japan require export license from Ministry International Trade Industry other approval from another government agency.
2000 Product Catalog
Issued Sep.,2000
SEIKO EPSON CORPORATION
Electronic Devices Marketing Dept.
CONTENTS
PRODUCTS
CRYSTAL UNIT
-frequency High-frequency
FC-255
FA-238 CRYSTAL OSILLATOR
High-frequency
SG-636PDE
jitter
EG-2001CA REAL TIME CLOCK MODULE
Parallel
RTC-7301DG/SF DEVICE
resonater
FS-335
PRODUCTS
Crystal unit THIN FREQUENCY CRYSTAL UNIT
FC-255
High-density mounting-type Max. thickness. Small packaging area light weight. Excellent environmental capability. Most suitable small communications devices.
Actual size
Specifications (characteristics)
Item Symbol Specifications Remarks please contact inquiries
Nominal frequency Temperature range
32.768 about available frequency
Storage temperature Operating temperature
TSTG TOPR
+125 Max. Ta=+25 DL=0.1 10-6 Please tighter tolerance
Maximum drive level Frequency tolerance(standard)
Peak temperature(frequency) Temperature coefficient(frequency) Load capacitance Series resistance Motional capacitance Shunt capacitance Insulation resistance Aging
-0.04 10-6/ Max. 12.5 Max. Typ. Typ. Min. 10-6/year Max. Ta=+25 first year Please specify
External dimensions
(Unit:
Recommended soldering pattern
(Unit:
Internal connection
EA03J
0.85
View
Max.
bottom view
PRODUCTS
Crystal unit THIN HIGH-FREQUENCY CRYSTAL UNIT
FA-238
High-density mounting-type SMD. Excellent reliability environment capability. Capable covering wide frequency range. (from MHz) Max. thickness equal SMD-type
Actual size
Specifications (characteristics)
Item Symbol TSTG TOPR Specifications 20.000 50.000 +125 Max. Typ. 10-6 10-6(STD) Ta=+25 °C±3 Please tighter tolerance Please specify °C,DL=100 Only crystal oscillation guaranteed Remarks Fundamental mode Stored bare product after unpacking
Nominal frequency range Temperature range Drive level Storage temperature Operating temperature Maximum drive level
Recommended drive level
Frequency tolerance (standard)
Frequency temperature characteristics (standard)
Available from (Custom)
Available from (Custom)
Load capacitance Series resistance Shunt capacitance Insulation resistance Aging Shock resistance
(standard:12 Max. MHz) Max. MHz)
Max. Min. 10-6/year Max. 10-6 Max. Ta=+25 first year
Three drops hard board from excitation test with 29400 sine wave directions
External dimensions
(Unit:
Internal connection
Recommended soldering pattern
(Unit:
1693 EOXA
View
Max. 1.55
1.40
1.40
1.35
PRODUCTS
Crystal oscillator SMALL HIGH-FREQUENCY CRYSTAL OSCILLATOR
SG-636PDE
Reflowable high density mounting type package. Operable 2.5V frequencies from 2.21675 41.000 MHz. Output enable(OE) function allow more current consumption.
Actual size
Specifications (characteristics)
Item Output frequency range Power source Max. supply voltage Operating voltage voltage Storage temperature Temperature Operating temperature range Frequency stability Current consumption Output disable current C-MOS level Duty Output voltage Output load condition (fan out)
Symbol
Specifications
2.21675 41.0000 -0.5 +7.0 ±0.25 +100 ±100 10-6 Max. Max. -0.4 Min. Max.
Remarks
Please contact inquiries about available frequency. Stored bare product after unpacking
VDD-GND
TSTG TOPR f/f0 tw/t (IOH) (IOL) tTLH tTHL tosc S.R.
load condition OE=GND C-MOS load: level
C-MOS
Max.
Min. Max. Max. Max.
Output enable/disable input voltage
C-MOS level Output rise time C-MOS level Output fall time Oscillation start time Aging
IIH=1 Max.(OE=VDD) IIL=-1 Min. (OE=GND)
C-MOS load: C-MOS load:
Max. 10-6 /year Max.
Time 2.25 Ta=+25 °C,first year
Three drops hard board from excitation test with 29400 m/s2 sine wave directions
Shock resistance
10-6 Max.
Note: Unless otherwise stated,characteristics (specifications) shown above table based rated operating temperature voltage condition. External by-pass capacitor required. Metal exposed this product. This won't affect quality, reliability electrical spec.
External dimensions
10.5 Max.
(Unit:
terminal
Recommended soldering pattern
(Unit:
5.08 (1.0) (1.0)
Max.
0615A
Max.
40.0000C
5.08
PRODUCTS
Crystal oscillator LOW-JITTER CRYSTAL OSCILLATOR
EG-2001CA
Generates high frequency clock with fundamental mode. Very jitter phase noise. Ceramic package with Max. thickness. Excellent shock resistance environmental capability. current consumption C-MOS technology. Provided with output enable function.
Actual size
Specifications (characteristics)
Item
Output frequency range
Symbol VDD-GND TSTG TOPR f/f0
Specifications 106.2500 166.0000
Remarks Please contact inquiries about available frequency
-0.5 +7.0 V±0.3 +100 ±100 10-6 Max. load condition Max. OE=GND C-MOS level VDD, Max. tw/t Duty level 1.4V Level, Max. VDD-0.4 Min. IOH= Output voltage Max. IOL= Output load condition 135.0000 Max. (fan out) Max. 135.0000 Output enable Min. disable input voltage Max. C-MOS level Output Max. C-MOS load: tTLH level rise time Max. load: V2.0 C-MOS level Output Max. C-MOS load: tTHL fall time level Max. load: V0.8 tOSC Oscillation start time Max. Time Deterministic Jitter Typ. Peak peak Random Jitter Typ. tjacc Accumulated Jitter Typ. Long ferm Frequency stability including variation reflow soldering drift, operating temperature range, operating voltage range, load change Aging.
Max. supply voltage Power source Operating voltage voltage Storage temperature Temperature Operating temperature range Frequency stability Current consumption Output disable current
External dimensions
7.0±0.2 Max. 5.08
(Unit:
Recommended soldering pattern
(Unit:
5.0±0.2
1PC924A
terminal
5.08
125.000H
PRODUCTS
Real time clock module 4-bit REAL TIME CLOCK MODULE
RTC-7301DG/SF
Built-in liquid crystal oscillator 32.768 with frequency adjusted Frequency selectable clock output (32.768 1/30 Built-in second adjustment function, digital pace adjustment function
(Max. adjustment: ±192 10-6)
Built-in alarm timer interrupt functions. Built-in semiconductor temperature sensor (Voltage output: -7.8
RTC-7301SF)
Operating voltage range:2.4 timekeeper (retained) voltage range: current consumption (0.6 Typ.) High speed parallel interface compatible with S-RAM
details mentioned application manual.
http://www.epson.co.jp/device/
Actual size
Specifications (characteristics) Absolute Max. ratings
Item Power supply voltage Input voltage Output voltage(1) Output voltage(2) Storage temperature Symbol Condition Min. Max. -0.3 Input terminal,D0 pins -0.3 VDD+ VOUT1 -0.3 VOUT2 FOUT, D0-D3 pins, VTEMP -0.3 VDD+ TSTG +125
GND=0V Unit
Terminal connection RTC-7301DG
terminal
FOUT
terminal (VDD) (VDD)
Operating conditions
Item Power supply voltage Symbol VCLK TOPR Condition
GND=0V
Min.
Max.
Unit
RTC-7301SF
Clock power supply voltage
Operating temperature
Frequency characteristics
Item Frequency precision Frequency voltage characteristics Frequency temperature characteristics tSTA Symbol f/fo Condition Specifications +10/-120 (Max.) Unit 10-6
Oscillating starting time
Aging amount
Ta=+25 VDD= Ta=+25 VDD= 5.5V Ta=-10 VDD= Ta=+25 VDD= Ta=+25 VDD=
10-6/V
(VDD) have same level voltage. connect external terminals. connected internally.
terminal FCON FOUT VTEMP (VDD)
terminal (VDD) (VDD) (VDD) (VDD) (VDD)
10-6
External dimensions
RTC-7301DG
23.1 Max.
(Unit:
characteristics
Item
GND=0 V,VDD=1.6V V,Ta=
Condition Min. Typ. Max. Unit
R7301
7.62 Min.
Symbol
IDD1 IDD2
(Temperature voltage output)=Hi-z(OFF)
2.54
0.46
Note)There VTEMP RTC-7301DG
standards VTEMP within conditions described above apply.
RTC-7301SF
Temperature sensor characteristics
Item Temperature output voltage Output precision Temperature sensitivity Linearity Temperature detection range Output resistance Load condition Response time Symbol VTEMP
Condition
GND=0 V,Ta=
Min. Typ. Max. Unit
10.5 Max.
based output voltage 1.470 VTEMP pins, VDD=2.7 TACR VDD=2.7 ±5.0 -7.3 -7.8 -8.3 mV/°C VDD=2.7 VDD=2.7 ±2.0 TSOP VDD=2.7 VTEMP pins, VDD=2.7 standard standard VDD=2.7 VDD=2.7 tRSP VDD=3.3 CL=50 Max.
2.54 Min.
Current consumption (When non-accessed) FOUT =Output VTEMP =Output
CS0,RD,WR=VDD VDD= A0-A3,CS1=GND D0-D3,IRQ=Hi-z FOUT=Hi-z(OFF) VDD= VTEMP
0.25 105°
R7301
Max.
0.15
Max. Min. 0.36
Note)There temperature sensor function RTC-7301DG.
Real time clock module
Register table Bank0 Clock calendar registers Bank1 Alarms FOUT registers
Address Address Register
second digit second digit minute digit minute digit 1hour digit hour digit digit digit digit month digit month digit year digit year digit year digit 1000 year digit
Bank2 Digital offset timer registers
Address Registers
Max.
Register
second digit second digit minute digit minute digit 1hour digit hour digit digit digit digit
Digital offset Timer counter preset value Timer counter data Timer settings Timer control Control register
DT_ON
TI/TP
Controller CTEMP CDT_ON
FOUT divider ratio setting register FOUT divider ratio setting register
Alarm control
TEST TEMP 2000 1000
TEST TEMP
TEST TEMP
Control registers Bank Bank STOP BUSY/ADJ
Control register Bank Bank STOP BUSY/ADJ
Bank Bank STOP BUSY/ADJ
Reading data
Switching characteristics
tACC tACS
conditions: VDD, load: (tACC,tACS,tARD) VDD=2.4 VDD=4.5 Unit Symbol Condition
Item Read cycle time Address access time access time access time output time output floating output time output floating Output hold time Write cycle time Chip select time Address valid write Address setup time Address hold time Write pulse width Input data time Input data hold time FOUT output frequency duty
tACC tACS tARD tCLZ tCHZ tOLZ tOHZ DUTY
tCLZ
tCHZ
tACS tCLZ tARD tCHZ
tOLZ
tOHZ
Writing data Control)
Min.
Max.
Min.
FOUT= 32.768
Block diagram
32.768 VTEMP FOUT FCON*2
7301SF
Control line Degital Trimming REGISTER
DIVIDER
Writing data Control)
Temperature Sensor FOUT CONTROLLER
CLOCK CALENDAR TIMER REGISTER
7301DG
INTERRUPTS CONTROLLER
ALARM REGISTER INTERFACE CIRCUIT
CONTROL REGISTER SYSTEM CONTROLLER
*This block diagram RTC-7301SF. aware that RTC-7301DG differs according following points. *1)The VTEMP output connected external pin. *2)The FCON input connected external pin, fixed internally.
PRODUCTS
device RESONATOR
FS-335
Reflow solderable ceramic package. Capable covering wide frequency range, from MHz. thickness equal SMD-type Perfect small wireless equipment. Excellent shock resistance enviromental capability (prevention contamination)
Actual size
Specifications (characteristics)
Item Nominal frequency range Temperature range Storage temperature Symbol Specifications Remarks
TSTG TOPR S.R.
Max. Max. Typ. 10-6, 10-6,±100 10-6 ±100 10-6 (-3.4±0.8) 10-8/ Min. Max. Max. Typ. Typ. Min. 10-6/year Max. 10-6 Max. MHz, Ta=+25 MHz, Ta=+25 312.24 MHz) 312.24 MHz) Ta=+25
Nine drops concrete from 1500
Stored bare product after unpacking MHz, Ta=+25 MHz, Ta=+25
Operating temperature
Maximum drive level Recommended drive level Frequency tolerance (standard) Peak temperature Temperature coefficient Harmonic ratio Series resistance Motional capacitance Shunt capacitance Insulation resistance Aging Shock resistance
External dimensions
(Unit:
Recommended soldering pattern
(Unit:
2.54 1.27 1.05
0.64 1.27
2.54
Connection IN/OUT 1,3,4,6
[NOTE]
Distributor
AMERICA
EPSON ELECTRONICS AMERICA, INC.
1960 East Grand Avenue, Segundo, 90245 U.S.A. Phone (1)310-955-5300 (1)310-955-5400 http://www.eea.epson.com
EUROPE
EPSON EUROPE ELECTRONICS GmbH
Riesstrasse 80992 Munich Germany Phone: (49)-(0)89-14005-0 Fax: (49)-(0)89-14005-110 Altstadtstrasse 176, 51379 Leverkusen Germany Phone (49)-(0)2171-5045-0 Fax: (49)-(0)2171-5045-10 http://www.epson-electronics.de
EPSON EUROPE ELECTRONICS GmbH (Leverkusen Office) EPSON EUROPE ELECTRONICS GmbH Branch Office)
Unit 2.4, Doncastle House Doncastle Road Bracknell Berkshire RG12 England Phone: (44)-(0)1344-381700 Fax: (44)-(0)1344-381701
EPSON EUROPE ELECTRONICS GmbH (French Branch Office)
Avenue Atlantique Conquerants Z.A. Courtaboeuf F-91976 Ulis Cedex France Phone: (33)-(0)1-64862350 Fax: (33)-(0)1-64862355
ASIA
EPSON (CHINA) CO., LTD.
28F., Beijing Silver Tower North DongSangHuan Chao Yang District, Beijing, China Phone: (86) 10-6410-6655 Fax: (86) 10-6410-7319
EPSON (CHINA) CO., LTD. (Shanghai branch office)
Bldg.,27, No.69, Guijing Road, Caoheijing, Shanghai, China Phone: (86) 21-6485-0835 Fax: (86) 21-6485-0775
EPSON HONG KONG LTD.
20/F., Harbour Centre, Harbour Road, Wanchai, Hong kong Phone: (852) 2585-4600 Fax: (852) 2827-2152 http://www.epson.com.hk
EPSON ELECTRONIC TECHNOLOGY DEVELOPMENT (SHENZHEN )CO., LTD.
Flat 16A, 16/F, Times Plaza, Taizi Road, Shenzhen, China Phone: (86) 755-6811118 Fax: (86) 755-6677786
EPSON TAIWAN TECHNOLOGY TRADING LTD.
10F, No.287, Nanking East Road, Sec.3, Taipei, Taiwan Phone: (886) 2-2717-7360 Fax: (886)2-2718-9366 http://www.epson.com.tw
EPSON SINGAPORE PTE. LTD.
No.1, Temasek Avenue #36-00, Millenia Tower, Singapore 039192 Phone: (65) 337-7911 Fax: (65) 334-2716 http://www.epson.com.sg
SEIKO EPSON CORPORATION KOREA Office
50F, Building,60 Yoido-dong, Youngdeungpo-Ku, Seoul, 150-763, Korea Phone: (82) 2-784-6027 Fax: (82) 2-767-3677
ELECTRONIC DEVICE MARKETING DEPARTMENT
Electronic devices information server
http:/ /www.epson.co.jp/device http://www.epson.co.jp/device

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