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TXC-06826 T3BwP
GLOBA L
T3BwP
time-to-market in applications such as:
· T-carrier termination equipment · Computer telephony network interface boards · Voice over packet / cell gateways · Multi-service access devices · DSLAMs · Echo cancellation units
Fully Integrated DS3 / DS1 / DS0 Bandwidth Processor
Your Complete DS3 System-on-Chip (SoC) Solution.
The T3BwP provides a complete single chip solution for next generation channelized DS3 access systems. This highly integrated device features outstanding functionality in a space saving and cost-efficient package. With flexible, programmable control and full DS0 granularity the T3BwP can reduce your design costs while accelerating your
T3BwP
DS3 / DS1 / DS0 Bandwidth Processor
Line Side
System Side
1 DS3 or 28 DS1s
28-Channel DS1 Framer
28-Channel DS1 Cross-connect
Transmission DS1 and MVIP or H.100 / H.110
M13 MUX 672 x 4, 096 Channel DS0 Cross-connect
µP Interface RISC µP IRAM DRAM SEEPROM Interface
Message-based API Interface
Boot Code and Device Drivers
T3BwP
DS3 / DS1 / DS0 Bandwidth Processor
Multi-mode operation for multiple markets. Multi-mode operation lets you apply the T3BwP to a host of market opportunities. The T3BwP can handle ATM, packet, and TDM signals in a mixed stream, or configure them separately and flexibly throughout its 28 DS1 channels. On the system side, the T3BwP can be configured to support any combination of unframed DS1, transmission DS1, and either H.100 / H.110 or MVIP buses. For TDM applications, all 672 DS0 channels can be switched to any of the 4, 096 H.100 / H.110 computer telephony channels.
On the line side, the T3BwP supports either 28 DS1 interfaces, each of which can be directly connected to any T1 Line Interface Unit (LIU), or a DS3 interface, which can be connected to any T3 LIU. When you choose the TranSwitch DART T3 LIU, the RISC processor on the T3BwP can control the DART directly. This lightens the load on the host microprocessor - and on your product development team - further cutting your time-to-market.
T3BwP Multi-service Application
T1 Service Card T1 Line T1 Line H.110 Bus POTS Card SLACs Analog Lines
T1 LIUs
TXC-06826 T3BwP
UTOPIA Bridge Card (DSL / ATM)
TXC-05427 COBRA
RAS Card DSPs Modems
UTOPIA Interface
TXC-06826 T3BwP
IVR / VM Card DSPs IVR / VM Server
TXC-05427 COBRA
T3 WAN (PSTN) Card
IP Gateway Card HDLC Controller Network Processor MAC
T3 Line
TXC-02030 DART
TXC-06826 T3BwP
KEY FEATURES of the T3BwB TXC-06826
Interfaces · Line: 1 DS3 or 28 DS1s
· Terminal: Unframed DS1, transmission DS1, and either H.100 / H.110 or MVIP bus support Performance Features
TXC-06826 T3BwP
· Package: 456-lead PBGA
TranSwitch Corporation is a leading innovator of VLSI solutions for multi-service access and transport applications. TranSwitch serves the Original Equipment Manufacturers (OEMs) who supply three fast-growing communications end markets: Multi-service Access Infrastructure (including Wireless), Broadband Internet Infrastructure, and Converged Public Networks. Our solutions span Asynchronous / PDH, SONET / SDH, and A / IP technologies, providing the core functionality for network elements including:
Multi-service Access Devices · DSLAMs · SONET / SDH Add / Drop Multiplexers · Access Concentrators Edge Switches · Voice Gateways · ATM, IP, and Frame Relay Switches
TranSwitch Corporation 3 Enterprise Drive Shelton, CT 06484 USA Tel +1.203.929.8810 Fax +1.203.926.9453 www.transwitch.com NASDAQ: TXCC