Daten Preliminary data Wesentliche Merkmale Typ. Gesamtleistung:

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Daten Preliminary data Wesentliche Merkmale Typ. Gesamtleistung:

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(880 GaAIAs Infrared Emitting Diode (880 1047A 1047B
Daten Preliminary data
Wesentliche Merkmale Typ. Gesamtleistung: (21) TOPLED® GaAlAs-LED sehr hohem Wirkungsgrad Hohe Hohe Impulsbelastbarkeit Gute spektrale Anpassung Vorderseitenmetallisierung: Aluminium Goldlegierung Lieferung: vereinzelt Folie Anwendungen IR-Fernsteuerung Fernseh-, Rundfunkund Lichtdimmern Gleich- Wechsellichtbetrieb Lichtschranken Sensorik Diskrete Optokoppler
Features Typ. total radiant power: (21) TOPLED® package. Chipsize: Very highly efficient GaAlAs High reliability High pulse handling capability Good spectral match silicon photodetectors Frontside metallization: aluminum Backside metallization: gold alloy Delivery: diced foil Applications remote control hifi sets, video tape recorder, dimmers Remote control steady varying intensity Light-reflection switches (max. kHz) Sensor technology Discrete optocouplers
Type 1047A 1047B
Bestellnummer Ordering Code Q67220-C1386 request
Beschreibung Description Infrarot emittierender Chip, Oberseite Kathodenanschluss Infrared emitting die, side cathode connection Infrarot emittierender Chip, Oberseite Kathodenanschluss, aufgerauht Infrared emitting die, side cathode connection, surface frosted
2002-02-21
1047A, 1047B
Elektrische Werte (gemessen TO18-Bodenplatte ohne Verguss, Electrical values (measured TO18 header without resin, Bezeichnung Parameter Strahlung Wavelength peak emission Spektrale Bandbreite Imax, Spectral bandwidth Imax Sperrspannung Reverse voltage 10µA Schaltzeiten, 10%, Switching times, from from 10%, Durchlaspannung Forward voltage Gesamtstrahlungsflu4) Total radiant flux4) 1047A 1047B Temperaturkoeffizient2) Temperature coefficient2) Temperaturkoeffizient2) Temperature coefficient2) Symbol Symbol min. peak Wert1) Value1) typ. max. Einheit Unit
0.5/0.4
1.55
0.25
nm/K
mV/K
2002-02-21
1047A, 1047B
Mechanische Werte Mechanical values Bezeichnung Parameter (x-Richtung) Length chip edge (x-direction) (y-Richtung) Length chip edge (y-direction) Durchmesser Wafers Diameter wafer height Bondpaddurchmesser Diameter bondpad Symbol Symbol min. 0.28 0.28 Wert Value typ. max. 0.32 0.32 Einheit Unit
Bezeichnung Parameter Vorderseitenmetallisierung Metallization frontside Metallization backside Trennverfahren Dicing Verbindung Chip bonding
Wert Value Aluminium Aluminum Goldlegierung Gold alloy Sawing Kleben Epoxy bonding
2002-02-21
1047A, 1047B
Grenzwert3) (gemessen TO18-Bodenplatte ohne Verguss,TA 25°C) Maximum Ratings3) (measured TO18 header without resin, Bezeichnung Parameter Maximaler Betriebstemperaturbereich Maximum operating temperature range Maximaler Lagertemperaturbereich Maximum storage temperature range Maximaler Maximum forward current Maximaler Maximum surge current 0.005 Symbol Symbol Tstg Wert Value 40.+100 40.+100 Einheit Unit
2002-02-21
1047A, 1047B
Relative Spectral Emission2)
OHR00877
Radiant Intensity2) (IF) Single pulse,
(100mA)
OHR00878
1000
Permissible Pulse Handling Capability2) f(t), duty cycle parameter
Forward Current2), (VF) Single pulse,
OHR00886
OHR00881
0.005 0.01 0.02 0.05
2002-02-21
1047A, 1047B
Chip Outlines
n-contact
0.13 (0.0051)
(0.0118)
0.21 (0.0083)
p-contact
GMOY6031
werden typische1) Werte folgt angegeben: (inch) Dimensions specified typical1) values follows: (inch).
2002-02-21
1047A, 1047B
Published OSRAM Opto Semiconductors GmbH Wernerwerkstrasse D-93049 Regensburg Rights Reserved. Attention please! information generally describes type component shall considered assured characteristics detailed specification. Terms delivery rights change design reserved. technical requirements components contain dangerous substances. information types question please contact sales organization. Packing Please recycling operators known you. also help touch with your nearest sales office. agreement will take packing material back, sorted. will have bear costs transport. packing material that returned unsorted which obliged accept, shall have invoice costs incurred. Components used life-support devices systems must expressly authorized such purpose! Critical components5), only used life-support devices systems6) with express written approval OSRAM
Typical (refered typ.) data defined long-term production mean values only given information. This specified value. final electrical testing spot check with sufficient statistical accuracy carried out. Minimum maximum values( refered min. max.) refer limits sample measurement. Based data measured OSRAM Opto Semiconductor's TOPLED® package. They represent typical1) data. Maximum ratings strongly package dependent differ between different packages. Value referenced vendor's measurement system (correlation customer product(s) required). critical component component used life-support device system whose failure reasonably expected cause failure that life-support device system, affect safety effectiveness that device system. Life support devices systems intended implanted human body, support and/or maintain sustain human life. they fail, reasonable assume that health user endangered.
2002-02-21

Daten Preliminary data Wesentliche Merkmale Typ. Gesamtleistung:

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