Chip Scale Mold Resin Polyimide Tape Substrate Solder A
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Encapsulant Wire Wire
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Redistribution Line (Cu) Polyimide Layer Encapsulant Metal post (Cu/Barrier) Solder Ball
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Paste (Insulator) Terminal (Resin Bump) Resin protrusion with metal Package Type Count Body Size (mm) Pitch (mm) Thickness (mm)
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FBGA BCC(1) BCC(1) BCC(1) Chip Scale Super
4.55 10.75 wafer Size
0.65 0.75 0.75
0.2-1.4
tape none none none laminate leadframe leadframe none
WB/bump WB/bump WB/bump FC/RDL
Note: additional information BCC, please page Depends upon size.
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