| The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers. |
Besondere Merkmale nicht diffuses Besonderheit Bauteils: beide Farben
Top Searches for this datasheetMULTILED®, Diffused 5351 Besondere Merkmale nicht diffuses Besonderheit Bauteils: beide Farben getrennt ansteuerbar; Aufsetzebene (super-rot), Abstrahlwinkel: Technologie: GaAlP optischer Wirkungsgrad: lm/W (super-rot), lm/W Gruppierungsparameter: (TTW) Verpackung: gegurtet lieferbar Anwendungen optischer Indikator drei verschiedene Zustandsanzeigen Features package: colorless, diffused package feature device: both colors controlled separately; solder leads with stand-off wavelength: (super-red), (green) viewing angle: technology: GaAlP optical efficiency: lm/W (super-red), lm/W (green) grouping parameter: luminous intensity soldering methods: soldering packing: bulk, available taped reel Applications optical indicators three different status indications possible 2002-04-03 5351 Type Emissionsfarbe Color Emission Color Package Luminous Intensity (mcd) super-red green super-red green colorless diffused 18.0 28.0 Bestellnummer Ordering Code 5351-GL 5351-JM Q62703-Q2046 Q62703-Q2047 Streuung einer Verpackungseinheit Streuung einer 5351-GL), 5351-JM). MULTILED® bestimmt Helligkeit jeweils dunkleren Chips einem Helligkeitsgruppe LED. Luminous intensity ratio packaging unit Luminous intensity ratio 5351-GL), 5351-JM). case MULTILED®, brightness darker chip package unit determines brightness group LED. Helligkeitswerte werden einer einer Genauigkeit ermittelt. Luminous intensity tested current pulse duration tolerance Anm.: Standardlieferform Serientypen beinhaltet eine untere bzw. eine obere Familiengruppe oder mindestens zwei Einzelgruppen. einer Verpackungseinheit Gurt immer eine Helligkeitsgruppe enthalten. technologiebedingte Helligkeits-Streuung heutigen LED-Herstellprozesse einen Fertigungszeitraum (Halbleitermaterial Chipherstellung Montageprozess) erlaubt keine Zusage einer einzelnen Helligkeitsgruppe. Daher mindestens zwei Helligkeitsgruppen vorgesehen werden! Note: standard shipping format serial types includes lower upper family group least individual groups. packing unit tape ever contains more than luminous intensity group. Luminosity variations caused technology used current manufacturing processes over protracted manufacturing period (semiconductor material chip fabrication assembly process) mean that possible assign LEDs single luminous intensity group. this reason least luminous intensity groups must provided! 2002-04-03 5351 Bezeichnung Parameter Betriebstemperatur Operating temperature range Lagertemperatur Storage temperature range Sperrschichttemperatur Junction temperature Durchlassstrom Forward current Surge current 0.005 Leistungsaufnahme Power consumption Thermal resistance Sperrschicht/Umgebung chip Junction/ambient chips chip Junction/solder point chips Montage PC-Board mounted board (pad size Minimale Minimum lead length Symbol Symbol Wert Value Einheit Unit Tstg Ptot sich Each additional lead length increases K/W. 2002-04-03 5351 Bezeichnung Parameter Symbol Symbol emittierten Lichtes Wavelength peak emission Dominant wavelength Spektrale Bandbreite Irel Spectral bandwidth Irel Abstrahlwinkel (Vollwinkel) Viewing angle Durchlassspannung Forward voltage Temperaturkoeffizient peak Temperature coefficient peak -10°C 100°C Temperaturkoeffizient Temperature coefficient -10°C 100°C Temperaturkoeffizient Temperature coefficient -10°C 100°C Optischer Wirkungsgrad Optical efficiency Werte Values Einheit Unit (typ.) peak (min.) (typ.) (typ.) (typ.) (max.) (typ.) 0.11 0.11 Grad deg. nm/K TCpeak (typ.) TCdom 0.07 0.07 nm/K (typ.) mV/K (typ.) lm/W werden einer einer Genauigkeit ermittelt. Wavelength groups tested current pulse duration tolerance Spannungswerte werden einer einer Genauigkeit ±0,1 ermittelt. Voltages tested current pulse duration tolerance ±0.1 2002-04-03 5351 Relative spektrale Emission Irel Relative Spectral Emission spektrale Augenempfindlichkeit Standard response curve OHL01702 green super-red Abstrahlcharakteristik Irel Radiation Characteristic OHL01191 100° 2002-04-03 100° 120° 5351 Durchlassstrom (VF) Forward Current OHL01263 Relative IV/IV(10 (IF) Relative Luminous Intensity OHL01703 green super-red Maximal Durchlassstrom Max. Permissible Forward Current OHL01123 Maximal Durchlassstrom Max. Permissible Forward Current OHL01122 chips chip chips chip temp. ambient temp. solder point 2002-04-03 5351 Relative IV/IV(25 (TA) Relative Luminous Intensity OHL01708 Impulsbelastbarkeit (tp) Permissible Pulse Handling Capability Duty cycle parameter, OHL01162 green super-red 0.005 0.01 0.02 0.05 2002-04-03 5351 Package Outlines (0.016) (0.028) (0.024) (0.016) Area flat (0.354) (0.323) Anode: green (0.232) (0.217) 2.54 (0.100) spacing (0.201) (0.189) (0.071) (0.047) 25.2 (0.992) 24.2 (0.953) (0.307) (0.295) 12.4 (0.488) 11.9 (0.469) (0.024) Cathode Anode: (0.016) Circuit diagram GEXY6720 werden folgt angegeben: (inch) Dimensions specified follows: (inch). Kathodenkennung: mittlerer Cathode mark: middle solder lead Gewicht Approx. weight: 2002-04-03 5351 Soldering Conditions (TTW) Soldering (nach CECC 00802) (acc. CECC 00802) OHLY0598 Normalkurve standard curve Welle wave Grenzkurven limit curves Welle wave forced cooling Empfohlenes Recommended Solder (TTW) Soldering (0.157) OHLPY985 werden folgt angegeben: (inch) Dimensions specified follows: (inch). 2002-04-03 (1.890) 5351 Revision History: 2002-04-03 Previous Version: Page 2001-03-07 Subjects (major changes since last revision) thermal resistance (footnote) Published OSRAM Opto Semiconductors GmbH Wernerwerkstrasse D-93049 Regensburg Rights Reserved. Attention please! information describes type component shall considered assured characteristics. Terms delivery rights change design reserved. technical requirements components contain dangerous substances. information types question please contact Sales Organization. printed downloaded, please find latest version Internet. Packing Please recycling operators known you. also help touch with your nearest sales office. agreement will take packing material back, sorted. must bear costs transport. packing material that returned unsorted which obliged accept, shall have invoice costs incurred. Components used life-support devices systems must expressly authorized such purpose! Critical components only used life-support devices systems with express written approval OSRAM critical component component used life-support device system whose failure reasonably expected cause failure that life-support device system, affect safety effectiveness that device system. Life support devices systems intended implanted human body, support and/or maintain sustain human life. they fail, reasonable assume that health user endangered. 2002-04-03 Other recent searchesTDA9962 - TDA9962 TDA9962 Datasheet SOM040200 - SOM040200 SOM040200 Datasheet MCP1640 - MCP1640 MCP1640 Datasheet MCP1640 - MCP1640 MCP1640 Datasheet MCP1640B - MCP1640B MCP1640B Datasheet MCP1640C - MCP1640C MCP1640C Datasheet LTL-4201 - LTL-4201 LTL-4201 Datasheet 4202 - 4202 4202 Datasheet LTL-4211 - LTL-4211 LTL-4211 Datasheet 4212 - 4212 4212 Datasheet LTL-4221 - LTL-4221 LTL-4221 Datasheet 4222 - 4222 4222 Datasheet LTL-4231 - LTL-4231 LTL-4231 Datasheet 4232 - 4232 4232 Datasheet LTL-4251 - LTL-4251 LTL-4251 Datasheet 4252 - 4252 4252 Datasheet LTL-4291 - LTL-4291 LTL-4291 Datasheet 4292 - 4292 4292 Datasheet E0133 - E0133 E0133 Datasheet CY7C1352 - CY7C1352 CY7C1352 Datasheet
Privacy Policy | Disclaimer |