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Besondere Merkmale nicht diffuses Besonderheit Bauteils: beide Farben


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MULTILED®, Diffused 5351
Besondere Merkmale nicht diffuses Besonderheit Bauteils: beide Farben getrennt ansteuerbar; Aufsetzebene (super-rot), Abstrahlwinkel: Technologie: GaAlP optischer Wirkungsgrad: lm/W (super-rot), lm/W Gruppierungsparameter: (TTW) Verpackung: gegurtet lieferbar Anwendungen optischer Indikator drei verschiedene Zustandsanzeigen
Features package: colorless, diffused package feature device: both colors controlled separately; solder leads with stand-off wavelength: (super-red), (green) viewing angle: technology: GaAlP optical efficiency: lm/W (super-red), lm/W (green) grouping parameter: luminous intensity soldering methods: soldering packing: bulk, available taped reel Applications optical indicators three different status indications possible
2002-04-03
5351
Type Emissionsfarbe Color Emission Color Package Luminous Intensity (mcd) super-red green super-red green colorless diffused 18.0 28.0 Bestellnummer Ordering Code
5351-GL 5351-JM
Q62703-Q2046 Q62703-Q2047
Streuung einer Verpackungseinheit Streuung einer 5351-GL), 5351-JM).
MULTILED® bestimmt Helligkeit jeweils dunkleren Chips einem Helligkeitsgruppe LED.
Luminous intensity ratio packaging unit Luminous intensity ratio 5351-GL), 5351-JM).
case MULTILED®, brightness darker chip package unit determines brightness group LED.
Helligkeitswerte werden einer einer Genauigkeit ermittelt. Luminous intensity tested current pulse duration tolerance
Anm.: Standardlieferform Serientypen beinhaltet eine untere bzw. eine obere Familiengruppe oder mindestens zwei Einzelgruppen. einer Verpackungseinheit Gurt immer eine Helligkeitsgruppe enthalten. technologiebedingte Helligkeits-Streuung heutigen LED-Herstellprozesse einen Fertigungszeitraum (Halbleitermaterial Chipherstellung Montageprozess) erlaubt keine Zusage einer einzelnen Helligkeitsgruppe. Daher mindestens zwei Helligkeitsgruppen vorgesehen werden! Note: standard shipping format serial types includes lower upper family group least individual groups. packing unit tape ever contains more than luminous intensity group. Luminosity variations caused technology used current manufacturing processes over protracted manufacturing period (semiconductor material chip fabrication assembly process) mean that possible assign LEDs single luminous intensity group. this reason least luminous intensity groups must provided!
2002-04-03
5351
Bezeichnung Parameter Betriebstemperatur Operating temperature range Lagertemperatur Storage temperature range Sperrschichttemperatur Junction temperature Durchlassstrom Forward current Surge current 0.005 Leistungsaufnahme Power consumption Thermal resistance Sperrschicht/Umgebung chip Junction/ambient chips chip Junction/solder point chips Montage PC-Board mounted board (pad size Minimale Minimum lead length
Symbol Symbol
Wert Value
Einheit Unit
Tstg
Ptot
sich Each additional lead length increases K/W.
2002-04-03
5351
Bezeichnung Parameter Symbol Symbol emittierten Lichtes Wavelength peak emission Dominant wavelength Spektrale Bandbreite Irel Spectral bandwidth Irel Abstrahlwinkel (Vollwinkel) Viewing angle Durchlassspannung Forward voltage Temperaturkoeffizient peak Temperature coefficient peak -10°C 100°C Temperaturkoeffizient Temperature coefficient -10°C 100°C Temperaturkoeffizient Temperature coefficient -10°C 100°C Optischer Wirkungsgrad Optical efficiency
Werte Values
Einheit Unit
(typ.)
peak
(min.)
(typ.)
(typ.) (typ.) (max.) (typ.)
0.11
0.11
Grad deg. nm/K
TCpeak
(typ.)
TCdom
0.07
0.07
nm/K
(typ.)
mV/K
(typ.)
lm/W
werden einer einer Genauigkeit ermittelt. Wavelength groups tested current pulse duration tolerance Spannungswerte werden einer einer Genauigkeit ±0,1 ermittelt. Voltages tested current pulse duration tolerance ±0.1
2002-04-03
5351
Relative spektrale Emission Irel Relative Spectral Emission spektrale Augenempfindlichkeit Standard response curve
OHL01702
green
super-red
Abstrahlcharakteristik Irel Radiation Characteristic
OHL01191
100°
2002-04-03
100°
120°
5351
Durchlassstrom (VF) Forward Current
OHL01263
Relative IV/IV(10 (IF) Relative Luminous Intensity
OHL01703
green super-red
Maximal Durchlassstrom Max. Permissible Forward Current
OHL01123
Maximal Durchlassstrom Max. Permissible Forward Current
OHL01122
chips chip
chips
chip
temp. ambient
temp. solder point
2002-04-03
5351
Relative IV/IV(25 (TA) Relative Luminous Intensity
OHL01708
Impulsbelastbarkeit (tp) Permissible Pulse Handling Capability Duty cycle parameter,
OHL01162
green super-red
0.005 0.01 0.02 0.05
2002-04-03
5351
Package Outlines
(0.016) (0.028)
(0.024)
(0.016)
Area flat (0.354) (0.323)
Anode: green (0.232) (0.217)
2.54 (0.100) spacing
(0.201) (0.189)
(0.071) (0.047) 25.2 (0.992) 24.2 (0.953)
(0.307) (0.295) 12.4 (0.488) 11.9 (0.469)
(0.024) Cathode Anode: (0.016)
Circuit diagram
GEXY6720
werden folgt angegeben: (inch) Dimensions specified follows: (inch).
Kathodenkennung: mittlerer Cathode mark: middle solder lead Gewicht Approx. weight:
2002-04-03
5351
Soldering Conditions
(TTW) Soldering
(nach CECC 00802) (acc. CECC 00802)
OHLY0598
Normalkurve standard curve Welle wave Grenzkurven limit curves
Welle wave forced cooling
Empfohlenes Recommended Solder
(TTW) Soldering
(0.157)
OHLPY985
werden folgt angegeben: (inch) Dimensions specified follows: (inch).
2002-04-03
(1.890)
5351
Revision History: 2002-04-03 Previous Version: Page 2001-03-07 Subjects (major changes since last revision) thermal resistance (footnote)
Published OSRAM Opto Semiconductors GmbH Wernerwerkstrasse D-93049 Regensburg Rights Reserved. Attention please! information describes type component shall considered assured characteristics. Terms delivery rights change design reserved. technical requirements components contain dangerous substances. information types question please contact Sales Organization. printed downloaded, please find latest version Internet. Packing Please recycling operators known you. also help touch with your nearest sales office. agreement will take packing material back, sorted. must bear costs transport. packing material that returned unsorted which obliged accept, shall have invoice costs incurred. Components used life-support devices systems must expressly authorized such purpose! Critical components only used life-support devices systems with express written approval OSRAM critical component component used life-support device system whose failure reasonably expected cause failure that life-support device system, affect safety effectiveness that device system. Life support devices systems intended implanted human body, support and/or maintain sustain human life. they fail, reasonable assume that health user endangered.
2002-04-03

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