4401035 Thermal Resistance Packages (for additional informat
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Thermal Resistance Packages
4401035
Thermal Resistance Packages
(for additional information, contact Package Engineer)
Similarly, thermal resistance from junction case denoted defined here, case temperature (°C) external surface package. With thermal resistance package available, junction temperature maximum power dissipation calculated using same equation different forms: Values available most packages. However, with airflow' data have limited availability. Additional information available "AMI Packaging Capabilities" brochure,
Introduction
purpose this section provide thermal data semiconductor packages (hereafter called package). Thermal resistance package measure temperature change across package caused power dissipation packaged semiconductor device. Power dissipation transference heat generated device during operation. Thermal resistance indication heat transfer from semiconductor device through package materials environment terms temperature unit power. Thermal resistance data used designer customer estimate junction temperature their operation.
Thermal resistance from junction ambient denoted defined
where: junction temperature device (°C); ambient temperature (°C); power dissipation (W).
With units indicated above, will have units degrees Celsius watt (°C/
Thermal Resistance Packages
4401035
obtained from factory.
Thermal Resistance Packages
4401035 THERMAL RESISTANCE (°C/W) PACKAGE versus SIZE values: (@zero airflow) (@300 fpm) (@600 fpm) PACKAGE CPGA CPGA CPGA CQFP CQFP CQFP JLDCC JLDCC JLDCC JLDCC PQFP ALLOY PQFP ALLOY TQFP TQFP TQFP 109/82/74 86/66/62 63/53/47 102/??/63 68/62/50 75/66/57 56/54/44 0.062" 0.240" 34/23/18 27/18/15 26/21/17 41/30/28 33/27/24 31/23/19 22/17/14 0.480" 22/15/8 19/12/5 17/10/3
0.120" 45/33/27 36/25/21 33/26/19 52/45/41 52/36/30 38/33/29 83/??/51 63/50/38 46/38/32 47/37/32 83/59/53 58/45/41 57/44/38 74/65/62 76/68/62 79/70/61 68/59/49 52/43/37
0.360" 28/18/13 20/14/10 23/17/14
54/41/30 36/27/19 33/26/22 57/39/33 43/34/31 30/23/19 59/50/43 61/51/45 29/22/17 48/41/32 52/41/26 35/26/20 30/26/18
Thermal Resistance Packages
4401035 THERMAL RESISTANCE (°C/W), PACKAGE versus SIZE PACKAGE CPGA CPGA CPGA CQFP MQUAD MQUAD MQUAD PQFP PQFP PQFP PQFP PQFP PQFP PQFP PQFP 208a TQFP TQFP TQFP TQFP
Thermal Resistance Packages
4401035
NOTE: These values from different sources.
MAXIMUM POWER DISSIPATION ESTIMATES, BASED MAXIMUM JUNCTION TEMPERATURE, PACKAGE versus PINCOUNT PACKAGE CERDIP PDIP PLCC PREJLDCC S-BRAZE SOIC TQFP
PACKAGE CPGA CQFP PPGA TQFP
Thermal Resistance Packages
4401035
PACKAGE M-QUAD PQFP PQFP
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