HYM72V64M636B(L)F Series Preliminary HYM72V64M636B(L)F8 64Mx
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64Mx64bits PC133 SDRAM DIMM
HYM72V64M636B(L)F Series
Preliminary
HYM72V64M636B(L)F8 64Mx64bits Synchronous DRAM Modules. modules composed sixteen 32Mx8bits CMOS Synchronous DRAMs FBGA package, 2Kbit EEPROM 8pin TSOP package 144pin glass-epoxy printed circuit board. 0.1uF decoupling capacitor mounted printed circuit board parallel each SDRAM. HYM72V64M636B(L)F8 Small Outline Dual In-line Memory Modules suitable easy interchange addition 512Mbytes memory. HYM72V64M636B(L)F8 Series fully synchronous operation referenced positive edge clock inputs outputs synchronized with rising edge clock input. data paths internally pipelined achieve very high bandwidth.
FEATURES
PC133MHz support 144pin SDRAM Unbuffered DIMM Serial Presence Detect with EEPROM 1.181" Height with double sided components Single 3.3±0.3V power supply device pins compatible with LVTTL interface Data mask function SDRAM internal banks four banks Module bank physical bank Auto refresh self refresh 8192 refresh cycles 64ms Programmable Burst Length Burst Type Full page Sequential Burst Interleave Burst Programmable Latency Clocks
ORDERING INFORMATION
Part HYM72V64M636BF8-K HYM72V64M636BF8-H HYM72V64M636BLF8-K HYM72V64M636BLF8-H Clock Frequency
133MHz Normal 133MHz Banks 133MHz Power 133MHz 54ball FBGA Gold
Internal Bank
Ref.
Power
SDRAM Package
Plating
This document general product description subject change without notice. Hynix Semiconductor does assume responsibility circuits described. patent licenses implied. Rev. 0.1/Apr.
PC133 SDRAM DIMM
HYM72V64M636B(L)F8 Series
CK0, CKE0, CKE1 /S0, BA0, NAME Clock Inputs Clock Enable Chip Select SDRAM Bank Address Address Address Strobe, Column Address Strobe, Write Enable Data Input/Output Mask Data Input/Output Power Supply (3.3V) Ground Clock Input Data Input/Output Address Input Connection DESCRIPTION system clock input. other inputs registered SDRAM rising edge Controls internal clock signal when deactivated, SDRAM will states among power down, suspend self refresh Enables disables inputs except Selects bank activated during /RAS activity Selects bank read/written during /CAS activity Address RA12, Column Address Auto-precharge flag /RAS, /CAS define operation Refer function truth table details Controls output buffers read mode masks input data write mode Multiplexed data input output Power supply internal circuits input buffers Ground Serial Presence Detect Clock input Serial Presence Detect Data input/output Serial Presence Detect Address Input connection
/RAS, /CAS, DQM0~DQM7 DQ63 SA0~2
Rev. 0.1/Apr.
PC133 SDRAM DIMM
HYM72V64M636B(L)F8 Series
ASSIGNMENTS
FRONT SIDE
BACK SIDE
FRONT SIDE
BACK SIDE
NAME
DQM0 DQM1 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15
NAME
DQ32 DQ33 DQ34 DQ35 DQ36 DQ37 DQ38 DQ39 DQM4 DQM5 DQ40 DQ41 DQ42 DQ43 DQ44 DQ45 DQ46 DQ47
NAME
DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 A10/AP DQM2 DQM3 DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31
NAME
DQ48 DQ49 DQ50 DQ51 DQ52 DQ53 DQ54 DQ55 DQM6 DQM7 DQ56 DQ57 DQ58 DQ59 DQ60 DQ61 DQ62 DQ63
Voltage
/RAS CKE0 /CAS
CKE1
Rev. 0.1/Apr.
PC133 SDRAM DIMM
HYM72V64M636B(L)F8 Series
BLOCK DIAGRAM
PCLK0
PCLK2
PCLK3
DQM0
DQM4 32~39
DQM1 8~15
DQM5 40~47
DQM2 16~23
DQM6 48~55
DQM3 24~31
DQM7
46~63
CKE0 CKE1
very
apacitor each
erial
Rev. 0.1/Apr.
PC133 SDRAM DIMM
HYM72V64M636B(L)F8 Series
SERIAL PRESENCE DETECT
BYTE NUMBER BYTE0 BYTE1 BYTE2 BYTE3 BYTE4 BYTE5 BYTE6 BYTE7 BYTE8 BYTE9 BYTE10 BYTE11 BYTE12 BYTE13 BYTE14 BYTE15 BYTE16 BYTE17 BYTE18 BYTE19 BYTE20 BYTE21 FUNCTION DESCRIPTION Bytes Written into Serial Memory Module Manufacturer Total Bytes Memory Device Fundamental Memory Type Addresses This Assembly Column Addresses This Assembly Module Banks This Assembly Data Width This Assembly Data Width This Assembly (Continued) Voltage Interface Standard This Assembly SDRAM Cycle Time @/CAS Latency=3 Access Time from Clock @/CAS Latency=3 DIMM Configuration Type Refresh Rate/Type Primary SDRAM Width Error Checking SDRAM Width Minimum Clock Delay Back Back Random Column Address Burst Lenth Supported Banks Each SDRAM Device SDRAM Device Attributes, /CAS Lataency SDRAM Device Attributes, Lataency SDRAM Device Attributes, Lataency SDRAM Module Attributes 7.5ns 5.4ns None 7.8125us Self Refresh Supported None tCCD 1,2,4,8,Full Page Banks /CAS Latency=2,3 Latency=0 Latency=0 Neither Buffered Registered voltage tolerence, Burst Read Single Write, Precharge All, Auto Precharge, Early Precharge 7.5ns 5.4ns 15ns 15ns 15ns 45ns 256MB 1.5ns 0.8ns 1.5ns 0.8ns Intel 1.2B Hynix JEDED Unused Hynix (Korea Area) (United States Area) (Europe Area) (Japan Area) HSS(Singapore) ASIA Area 1.5ns 0.8ns 1.5ns 0.8ns 20ns 15ns 20ns 45ns 10ns FUNCTION VALUE NOTE
Bytes Bytes SDRAM Bank Bits LVTTL
7.5ns 5.4ns
BYTE22
SDRAM Device Attributes, General
BYTE23 BYTE24 BYTE25 BYTE26 BYTE27 BYTE28 BYTE29 BYTE30 BYTE31 BYTE32 BYTE33 BYTE34 BYTE35 BYTE36 BYTE62 BYTE63 BYTE64 BYTE65
SDRAM Cycle Time @/CAS Latency=2 Access Time from Clock @/CAS Latency=2 SDRAM Cycle Time @/CAS Latency=1 Access Time from Clock @/CAS Latency=1 Minimum Precharge Time (tRP) Minimum Active Active Delay (tRRD) Minimum /RAS /CAS Delay (tRCD) Minimum /RAS Pulse Width (tRAS) Module Bank Density Command Address Signal Input Setup Time Command Address Signal Input Hold Time Data Signal Input Setup Time Data Signal Input Hold Time Superset Information (may used future) Revision Checksum Byte 0~62 Manufacturer JEDEC Code .Manufacturer JEDEC Code
BYTE72
Manufacturing Location
Rev. 0.1/Apr.
PC133 SDRAM DIMM
HYM72V64M636B(L)F8 Series
Continued
BYTE NUMBER
BYTE73 BYTE74 BYTE75 BYTE76 BYTE77 BYTE78 BYTE79 BYTE80 BYTE81 BYTE82 BYTE83 BYTE84 BYTE85 BYTE86 BYTE87 BYTE91 BYTE92 BYTE93 BYTE94 BYTE95 BYTE99 ~125 BYTE126 BYTE127 BYTE128 ~256
FUNCTION Manufacturer's Part Number (Component) Manufacturer's Part Number (128Mb based) Manufacturer's Part Number (Voltage Interface) Manufacturer's Part Number (Memory Width) .Manufacturer's Part Number (Memory Width) Manufacturer's Part Number (Module Type) Manufacturer's Part Number (Data Width) .Manufacturer's Part Number (Data Width) Manufacturer's Part Number (Refresh, SDRAM Bank) Manufacturer's Part Number(Manufacturing Site) Manufacturer's Part Number (Package Type) Manufacturer's Part Number (Component Configuration) Manufacturer's Part Number (Hyphent) Manufacturer's Part Number (Min. Cycle Time) Manufacturer's Part Number Revision Code (for Component) .Revision Code (for PCB) Manufacturing Date .Manufacturing Date Assembly Serial Number Manufacturer Specific Data (may used future) Reserved Intel Specification Details 100MHz Support Unused Storage Locations
FUNCTION
(SDRAM) (3.3V, LVTTL) DIMM) Refresh, 4Banks) based) (Hyphen) Blanks Process Code Process Code Year Work Week Serial Number None 100MHz Refer Note7
VALUE
NOTE
Note bank address excluded Interleave Burst Type adopted ASCII adopted Basically Hynix writes Part except `HYM' Byte 73~90 limited bytes from byte byte fixed dependent CK0, connected DIMM, junction temp, CL2(3) support, Intel defined Concurrent Auto Precharge support Refer Intel Specification 1.2B case L-Part, character will added between byte byte Refer Hynix site.
Byte 82~84 L-Part
BYTE NUMBER
BYTE82 BYTE83 BYTE84
FUNCTION Manufacturer's Part Number(Manufacturing Site) Manufacturer's Part Number (Power) Manufacturer's Part Number (Package Type)
FUNCTION
VALUE NOTE
Rev. 0.1/Apr.
PC133 SDRAM DIMM
HYM72V64M636B(L)F8 Series
ABSOLUTE MAXIMUM RATINGS
Parameter Ambient Temperature Storage Temperature Voltage relative Voltage relative Short Circuit Output Current Power Dissipation Soldering Temperature Time TSTG VIN, VOUT VDD, VDDQ TSOLDER Symbol -1.0 -1.0 Rating Unit
Note Operation above absolute maximum rating adversely affect device reliability.
OPERATING CONDITION (TA=0 70°C)
Parameter Power Supply Voltage Input High voltage Input voltage Symbol VDD, VDDQ -0.3 VDDQ Unit Note
Note 1.All voltages referenced 2.VIH(max) acceptable 5.6V pulse width with <=3ns duration. 3.VIL(min) acceptable -2.0V pulse width with <=3ns duration.
OPERATING TEST CONDITION (TA=0 70°C, VDD=3.3±0.3V, VSS=0V)
Parameter Input High Level Voltage Input Timing Measurement Reference Level Voltage Input Rise Fall Time Output Timing Measurement Reference Level Voltage Output Load Capacitance Access Time Measurement Symbol Vtrip Voutref Value 2.4/0.4 Unit Note
Note 1.Output load measure access times equivalent gates capacitor (50pF). details, refer AC/DC output load circuit
Rev. 0.1/Apr.
PC133 SDRAM DIMM
HYM72V64M636B(L)F8 Series
CAPACITANCE (TA=25°C, f=1MHz)
-K/H Parameter CK0, CKE0, CKE1 Input Capacitance /S0, A0~11, BA0, /RAS, /CAS, DQM0~DQM7 Data Input Output Capacitance DQ63 Symbol CI/O Unit
OUTPUT LOAD CIRCUIT
Vtt=1.4V
RT=250
Output
Output
50pF
50pF
Output Load Circuit
Output Load Circuit
Rev. 0.1/Apr.
PC133 SDRAM DIMM
HYM72V64M636B(L)F8 Series
CHARACTERISTICS (TA=0 70°C, VDD=3.3±0.3V)
Parameter Input Leakage Current Output Leakage Current Output High Voltage Output Voltage Symbol Min. Unit Note -2mA +2mA
Note 1.VIN 3.6V, other pins tested under 2.DOUT disabled, VOUT=0
CHARACTERISTICS
Speed Parameter Symbol Test Condition Operating Current Precharge Standby Current Power Down Mode IDD1 IDD2P IDD2PS Burst length=1, bank active tRC(min), IOL=0mA VIL(max), VIL(max), VIH(min), VIH(min), Input signals changed time during 2clks. other pins VDD-0.2V 0.2V VIH(min), Input signals stable. VIL(max), VIL(max), VIH(min), VIH(min), Input signals changed time during 2clks. other pins VDD-0.2V 0.2V VIH(min), Input signals stable. tCK(min), IOL=0mA banks active tRRC tRRC(min), banks active 0.2V Normal power
1200
Unit
Note
IDD2N Precharge Standby Current Power Down Mode IDD2NS Active Standby Current Power Down Mode IDD3P IDD3PS
IDD3N Active Standby Current Power Down Mode IDD3NS Burst Mode Operating Current Auto Refresh Current Self Refresh Current
IDD4 IDD5 IDD6
1600 1920
Note IDD1 IDD4 depend output loading cycle rates. Specified values measured with output open Min. tRRC (Refresh cycle time) shown CHARACTERISTICS 3.HYM72V64M636BF8-K/H 4.HYM72V64M636BLF8-K/H
Rev. 0.1/Apr.
PC133 SDRAM DIMM
HYM72V64M636B(L)F8 Series
CHARACTERISTICS operating conditions unless otherwise noted)
Parameter Symbol System Clock Cycle Time Latency Latency tCK3 tCK2 tCHW tCLW tAC3 tAC2 tCKS tCKH tOLZ tOHZ3 tOHZ2 1000 1000 Latency Unit Note
Clock High Pulse Width Clock Pulse Width Access Time From Clock Latency
Data-Out Hold Time Data-Input Setup Time Data-Input Hold Time Address Setup Time Address Hold Time Setup Time Hold Time Command Setup Time Command Hold Time Data Output Low-Z Time Data Output High-Z Time Latency Latency
Note 1.Assume (input rise fall time 1ns, then [(tR+tF)/2-1]ns should added parameter 2.Access times measured with input signals 1v/ns edge rate, from 0.8v 2.0v 1ns, then (tR/2-0.5)ns should added parameter
Rev. 0.1/Apr.
PC133 SDRAM DIMM
HYM72V64M636B(L)F8 Series
CHARACTERISTICS
Parameter Symbol Operation Cycle Time Auto Refresh Delay Active Time Precharge Time Bank Active Delay Delay Write Command Data-In Delay Data-In Precharge Command Data-In Active Command Data-Out Hi-Z Data-In Mask Command Precharge Data Output Hi-Z Latency Latency tRRC tRCD tRAS tRRD tCCD tWTL tDPL tDAL tDQZ tDQM tMRD tPROZ3 tPROZ2 tPDE tSRE tREF 100K 100K Unit Note
Power Down Exit Time Self Refresh Exit Time Refresh Time
Note command given tRRC after self refresh exit
Rev. 0.1/Apr.
PC133 SDRAM DIMM
HYM72V64M636B(L)F8 Series
DEVICE OPERATING OPTION TABLE
HYM72V64M636B(L)F8-K
Latency 133MHz(7.5ns) 125MHz(8ns) 100MHz(10ns) 2CLKs 3CLKs 2CLKs tRCD 2CLKs 3CLKs 2CLKs tRAS 6CLKs 6CLKs 5CLKs 8CLKs 9CLKs 7CLKs 2CLKs 3CLKs 2CLKs 5.4ns 2.7ns
HYM72V64M636B(L)F8-H
Latency 133MHz(7.5ns) 125MHz(8ns) 100MHz(10ns) 3CLKs 3CLKs 2CLKs tRCD 3CLKs 3CLKs 2CLKs tRAS 6CLKs 6CLKs 5CLKs 9CLKs 9CLKs 7CLKs 3CLKs 3CLKs 2CLKs 5.4ns 2.7ns
Rev. 0.1/Apr.
PC133 SDRAM DIMM
HYM72V64M636B(L)F8 Series
COMMAND TRUTH TABLE
Command Mode Register Operation Bank Active Read Read with Autoprecharge Write Write with Autoprecharge Precharge Banks Precharge selected Bank Burst Stop Auto Refresh Burst-Read-SingleWRITE Entry Self Refresh1 Exit Entry Precharge power down Exit Clock Suspend Entry Exit High (Other Pins code) CKEn-1 CKEn
ADDR
A10/ code
Note
Note Exiting Self Refresh occurs asynchronously bringing from high Dont care, Logic High, Logic Low. =Bank Address, Address, Column Address, Opcode Operand Code, Operation
Rev. 0.1/Apr.
PC133 SDRAM DIMM
HYM72V64M636B(L)F8 Series
Rev. 0.1/Apr.
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