95-08-14 00-01-21 Frye Raymond Monnin ORIGINAL FIRST PAGE TH

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REVISIONS DESCRIPTION Update boilerplate document. devices vendor CAGE 61772 source supply devices Editorial changes throughout. Changes accordance with 5962-R187-95 Updated boilerplate one-part, one-part number format. Added provisions inclusion radiation-hardened devices. DATE (YR-MO-DA) 93-11-15 APPROVED Frye
95-08-14 00-01-21
Frye Raymond Monnin
ORIGINAL FIRST PAGE THIS DRAWING BEEN REPLACED.
SHEET SHEET STATUS SHEETS SHEET PREPARED Kenneth Rice CHECKED Charles Reusing APPROVED Michael Frye DRAWING APPROVAL DATE November 1989 REVISION LEVEL MICROCIRCUITS, MEMORY, DIGITAL, CMOS, FIFO, MONOLITHIC SILICON
PMIC
STANDARD MICROCIRCUIT DRAWING
THIS DRAWING AVAILABLE DEPARTMENTS AGENCIES DEPARTMENT DEFENSE AMSC
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216
SIZE
CAGE CODE
SHEET
67268
5962-89568
DSCC FORM 2233 DISTRIBUTION STATEMENT Approved public release; distribution unlimited.
5962-E255-99
SCOPE Scope. This drawing documents product assurance class levels consisting high reliability (device classes space application (device class choice case outlines lead finishes available reflected Part Identifying Number (PIN). When available, choice Radiation Hardness Assurance (RHA) levels reflected PIN. PIN. shall shown following example: device classes using class designator PIN: 5962
89568
Federal stock class designator
designator (see 1.2.1)
Device type (see 1.2.2)
Case outline (see 1.2.4)
Lead finish (see 1.2.5)
Drawing number device classes where class designator included PIN: 5962
89568
Federal stock class designator
designator (see 1.2.1)
Device type (see 1.2.2)
Device class designator (see 1.2.3)
Case outline (see 1.2.4)
Lead finish (see 1.2.5)
Drawing number 1.2.1 (RHA) designator. Device classes marked devices meet MIL-PRF-38535 specified levels marked with appropriate designator. Device class marked devices meet MIL-PRF-38535, appendix specified levels marked with appropriate designator. dash indicates non-RHA device. 1.2.2 Device type(s). device type(s) shall identify circuit function follows: Device type Generic number 7204 7204 7204 7204 7204 7204 7204 Circuit function 9-bit parallel FIFO 9-bit parallel FIFO 9-bit parallel FIFO 9-bit parallel FIFO 9-bit parallel FIFO 9-bit parallel FIFO 9-bit parallel FIFO Access time
1.2.3 Device class designator. device class designator shall single letter identifying product assurance level listed below. Since device class designator some level devices established after this drawing developed, class designator will specified part number will marked parts. Device class Device requirements documentation Vendor self-certification requirements non-JAN class microcircuits accordance with MIL-PRF-38535, appendix Certification qualification MIL-PRF-38535
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
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REVISION LEVEL SHEET
1.2.4 Case outline(s). case outline(s) shall designated MIL-STD-1835 follows: Outline letter Descriptive designator GDIP1-T28 CDIP2-T28 GDFP2-F28 CQCC1-N32 GDIP4-T28 CDIP3-T28 Terminals Package style Dual-in-line Flat pack Rectangular leadless chip carrier Dual-in-line
1.2.5 Lead finish. lead finish specified MIL-PRF-38535 device classes MIL-PRF-38535, appendix device class Absolute maximum ratings. Terminal voltage with respect ground output current Storage temperature range Maximum power dissipation Lead temperature (soldering, seconds) Thermal resistance, junction-to-case (JC) Junction temperature (TJ) Recommended operating conditions. Supply voltage range (VCC) Minimum high level input voltage (VIH) Input voltage (VIL) Case operating temperature range Logic testing device classes Fault coverage measurement manufacturing logic tests (MIL-STD-883, test method 5012) percent APPLICABLE DOCUMENTS Government specification, standards, handbooks. following specification, standards, handbooks form part this drawing extent specified herein. Unless otherwise specified, issues these documents those listed issue Department Defense Index Specifications Standards (DoDISS) supplement thereto, cited solicitation. SPECIFICATION DEPARTMENT DEFENSE MIL-PRF-38535 Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT DEFENSE MIL-STD-883 MIL-STD-973 MIL-STD-1835 Test Method Standard Microcircuits. Configuration Management. Interface Standard Microcircuit Case Outlines. -0.5 +7.0 -65C +155C +260C MIL-STD-1835 +150C
+4.5 +5.5 minimum maximum -55C +125C
Maximum junction temperature increased +175C during burn-in steady state life. minimum input pins except which minimum. undershoots allowed once cycle. Values will added when they become available.
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REVISION LEVEL SHEET
HANDBOOKS DEPARTMENT DEFENSE MIL-HDBK-103 MIL-HDBK-780 List Standard Microcircuit Drawings (SMD's) Standard Microcircuit Drawings
Non-Government publications. following document(s) form part this document extent specified herein. Unless otherwise specified, issues documents which adopted those listed issue DODISS cited solicitation. Unless otherwise specified, issues documents listed DODISS issues documents cited solicitation. AMERICAN SOCIETY TESTING MATERIALS (ASTM) ASStandard F1192M-95 Standard Guide Measurement Single Event Phenomena from Heavy Irradiation Semiconductor Devices.
(Applications copies ASpublications should addressed American Society Testing Materials, 1916 Race Street, Philadelphia, 19103). ELECTRONICS INDUSTRIES ASSOCIATION (EIA) JEDEC Standard EIA/JESD78 Latch-Up Test.
(Applications copies should addressed Electronics Industries Association, 2500 Wilson Boulevard, Arlington, 22201.) (Non-Government standards other publications normally available from organizations that prepare distribute documents. These documents also available through libraries other informational services.) Order precedence. event conflict between text this drawing references cited herein, text this drawing shall take precedence. Nothing this document, however, supersedes applicable laws regulations unless specific exemption been obtained. REQUIREMENTS Item requirements. individual item requirements device classes shall accordance with MIL-PRF38535 specified herein modified device manufacturer's Quality Management (QM) plan. modification plan shall affect form, fit, function described herein. individual item requirements device class shall accordance with MIL-PRF-38535, appendix non-JAN class level devices specified herein. Design, construction, physical dimensions. design, construction, physical dimensions shall specified MIL-PRF-38535 herein device classes MIL-PRF-38535, appendix herein device class 3.2.1 Case outline(s). case outline(s) shall accordance with 1.2.4 herein. 3.2.2 Terminal connections. terminal connections shall specified figure 3.2.3 Truth table(s). truth table(s) shall specified figure Electrical performance characteristics postirradiation parameter limits. Unless otherwise specified herein, electrical performance characteristics postirradiation parameter limits specified table shall apply over full case operating temperature range. Electrical test requirements. electrical test requirements shall subgroups specified table IIA. electrical tests each subgroup defined table Marking. part shall marked with listed herein. addition, manufacturer's also marked listed MIL-HDBK-103. packages where marking entire number feasible space limitations, manufacturer option marking "5962-" device. product using this option, designator shall still marked. Marking device classes shall accordance with MIL-PRF-38535. Marking device class shall accordance with MIL-PRF-38535, appendix
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3.5.1 Certification/compliance mark. certification mark device classes shall "QML" required MIL-PRF-38535. compliance mark device class shall required MIL-PRF-38535, appendix Certificate compliance. device classes certificate compliance shall required from QML-38535 listed manufacturer order supply requirements this drawing (see 6.6.1 herein). device class certificate compliance shall required from manufacturer order listed approved source supply MIL-HDBK-103 (see 6.6.2 herein). certificate compliance submitted DSCC-VA prior listing approved source supply this drawing shall affirm that manufacturer's product meets, device classes requirements MIL-PRF-38535 herein device class requirements MIL-PRF-38535, appendix herein. Certificate conformance. certificate conformance required device classes MIL-PRF-38535 device class MIL-PRF-38535, appendix shall provided with each microcircuits delivered this drawing. Notification change device class device class notification DSCC-VA change product (see herein) involving devices acquired this drawing required change defined MIL-STD-973. Verification review device class device class DSCC, DSCC's agent, acquiring activity retain option review manufacturer's facility applicable required documentation. Offshore documentation shall made available onshore option reviewer. 3.10 Microcircuit group assignment device class Device class devices covered this drawing shall microcircuit group number (see MIL-PRF-38535, appendix QUALITY ASSURANCE PROVISIONS Sampling inspection. device classes sampling inspection procedures shall accordance with MIL-PRF-38535 modified device manufacturer's Quality Management (QM) plan. modification plan shall affect form, fit, function described herein. device class sampling inspection procedures shall accordance with MIL-PRF-38535, appendix Screening. device classes screening shall accordance with MIL-PRF-38535, shall conducted devices prior qualification technology conformance inspection. device class screening shall accordance with method 5004 MIL-STD-883, shall conducted devices prior quality conformance inspection. 4.2.1 Additional criteria device class Delete sequence specified initial (preburn-in) electrical parameters through interim (postburn-in) electrical parameters method 5004 substitute lines through table herein. test circuit shall maintained manufacturer under document revision level control shall made available preparing acquiring activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1015. Dynamic burn-in (method 1015 MIL-STD-883, test condition circuit, 4.2.1b herein).
Interim final electrical parameters shall specified table herein.
4.2.2 Additional criteria device classes burn-in test duration, test condition test temperature, approved alternatives shall specified device manufacturer's plan accordance with MIL-PRF-38535. burn-in test circuit shall maintained under document revision level control device manufacturer's Technology Review Board (TRB) accordance with MILPRF-38535 shall made available acquiring preparing activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1015 MIL-STD-883. Interim final electrical test parameters shall specified table herein. Additional screening device class beyond requirements device class shall specified MIL-PRF38535, appendix
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TABLE Electrical performance characteristics.
Symbol ICC1
Test
Conditions -55C +125C unless otherwise specified
Input leakage current
Output leakage current
VOUT VCC,
-2.0
Output voltage
Output high voltage
Operating supply current
outputs open,
15.3 MHz, outputs open,
Standby current
VIH, outputs open
inputs outputs open
Power down current
Input capacitance
+25C, 4.4.1e +25C, 4.4.1e 4.4.1c.
Output capacitance
Functional tests
Group subgroups
Device types 01-04, 06,07 01-05 06,07
Limits
Unit
footnotes table.
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TABLE Electrical performance characteristics Continued. Test
Symbol tRPW tRLZ tWLZ
Shift frequency
Read cycle time
Access time
Read recovery time
Read pulse width
Read pulse data low-Z
Write pulse data low-Z
Data valid from read pulse high
Conditions -55C +125C unless otherwise specified figures
Group subgroups
Device types 01,02 03,04 05-07 01-04 05-07 01-04, 06,07
Limits
12.5 33.3
Unit
footnotes table.
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TABLE Electrical performance characteristics Continued. Test
Symbol tRHZ tWPW tRSC
Read pulse high data high-Z
Write cycle time
Write pulse width
Write recovery time
Data setup time
Data hold time
Reset cycle time
Reset pulse width
Conditions -55C +125C unless otherwise specified figures
Group subgroups
Device types 02-04 01,02 03,04 05-07 01,02 03,04 01-03 05-07
Limits
Unit
footnotes table.
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TABLE Electrical performance characteristics Continued. Test
Symbol tRSR tRSS tRTC tRTR tEFL tREF tRFF
Reset recovery time
Reset setup time
Retransmit cycle time
Retransmit pulse width
Retransmit recovery time Reset empty flag
Read empty flag
Read high full flag high
Conditions -55C +125C unless otherwise specified figures
Group subgroups
Device types 01,02 03,04 05-07 01,02 03,04 05-07 01-03 01-03
Limits
Unit
footnotes table.
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TABLE Electrical performance characteristics Continued. Test
Symbol tWEF tWFF tHFH tFFH tXOL tXOH tXIR
Write high empty flag high
Write full flag
Reset half-full full flag high
Expansion delay from clock
Expansion high delay from clock
pulse width
recovery time
Conditions -55C +125C unless otherwise specified figures
Group subgroups
Device types 01-03 01-03
Limits
Unit
footnotes table.
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TABLE Electrical performance characteristics Continued. Test
Symbol tXIS tRTS tRPE tWHF tRHF tWPF
Conditions -55C +125C unless otherwise specified
set-up time
Retransmit setup time
Read pulse width after high
Write half-full flag
Read high half-full flag high
Write pulse width after high
Group subgroups
Device types 01-05 06,07
Limits
Unit
When performing postirradiation electrical measurements level +25C. Limits shown guaranteed +25C test condition column postirradiation limits device types specified device types column. Preirradiation values marked devices shall also postirradiation values unless otherwise specified. tested, shall guaranteed limits specified table Only applies read data flow-through mode.
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Device types Case outlines Terminal number
Terminal symbol
connection
FIGURE Terminal connections.
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Reset retransmit Single device configuration/width expansion mode
Mode Reset Retransmit Read/write
Inputs
Internal status Read pointer Location zero Location zero Increment
Outputs
Write pointer Location zero Unchanged Increment
Pointer will increment flag high.
Reset first load Depth expansion/compound expansion mode
Internal status Read pointer Write pointer Location zero Location zero Location zero Location zero
Inputs
Outputs
Mode Reset first device Reset other devices Read/write
connected previous device. NOTES: Reset input, First load/retransmit Empty flag output, Full flag output, Expansion input, Half-full flag output level voltage High level voltage Don't care
FIGURE Truth tables.
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NOTE: includes scope capacitance.
test conditions
Input pulse levels Input rise fall times Input timing reference levels Output reference levels
FIGURE Output load circuit test conditions.
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FIGURE Timing waveforms.
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FIGURE Timing waveforms Continued.
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FIGURE Timing waveforms Continued.
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FIGURE Timing waveforms Continued.
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NOTES: change state during retransmit result offset read write pointers, flags will valid tRTC. around rising edge
During Retransmit, change status, flags will valid tRTC. FIGURE Timing waveforms continued.
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TABLE IIA. Electrical test requirements. Line Test requirements Subgroups (per method 5005, table Device class Interim electrical parameters (see 4.2) Static burn-in method 1015 Same line Dynamic burn-in (method 1015) Same line Final electrical parameters Group test requirements Group end-point electrical parameters Group end-point electrical parameters Group end-point electrical parameters 1*,2,3,7*, 8A,8B,9,10,11 1,2,3,4**,7,8A, 8B,9,10,11 2,3,7, 8A,8B 2,3,7, 8A,8B 1,7,9 Required Required required Subgroups (per MIL-I-38535, table III) Device class 1,7,9 required Device class 1,7,9 required 1*,7*
Required 1*,7*
1*,2,3,7*, 1*,2,3,7*, 8A,8B,9,10,11 8A,8B,9,10,11 1,2,3,4**,7, 1,2,3,4**,7, 8A,8B,9,10,11 8A,8B,9,10,11 2,3,7, 8A,8B 2,3,7, 8A,8B 1,7,9 1,2,3,7, 8A,8B,9,10, 2,3,7 8A,8B 1,7,9
Blank spaces indicate tests applicable. subgroups combined when using high-speed testers. Subgroups functional tests shall verify truth table. indicates applies subgroups 4.4.1e. indicates delta limit (see table IIB) shall required where specified, delta values shall computed with reference previous interim electrical parameters (see line 1).For device classes performance delta limits shall specified manufacturer's plan. 4.4.1d.
Qualification inspection device classes Qualification inspection device classes shall accordance with MIL-PRF-38535. Inspections performed shall those specified MIL-PRF-38535 herein groups inspections (see 4.4.1 through 4.4.4). Conformance inspection. Technology conformance inspection classes shall accordance with MIL-PRF38535 including groups inspections specified herein except where option MIL-PRF-38535 permits alternate in-line control testing. Quality conformance inspection device class shall accordance with MIL-PRF-38535, appendix specified herein. Inspections performed device class shall those specified method 5005 MIL-STD-883 herein groups inspections (see 4.4.1 through 4.4.4). 4.4.1 Group inspection. Tests shall specified table herein. Subgroups table method 5005 MIL-STD-883 shall omitted.
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device class subgroups tests shall sufficient verify truth table. device classes subgroups shall include verifying functionality device; these tests shall have been fault graded accordance with MIL-STD-883, test method 5012 (see herein). (latch-up) tests shall measured only initial qualification after design process changes which affect performance device. device class procedures circuits shall maintained under document revision level control manufacturer shall made available preparing activity acquiring activity upon request. device classes procedures circuits shall under control device manufacturer's accordance with MIL-PRF-38535 shall made available preparing activity acquiring activity upon request. Testing shall pins, five devices with zero failures. Latch-up test shall considered destructive. Information contained JEDEC Standard EIA/JESD78 used reference. Subgroup (CIN COUT measurements) shall measured only initial qualification after process design changes which affect input output capacitance. Capacitance shall measured between designated terminal frequency MHz. Sample size devices with failures, input output terminals tested. 4.4.2 Group inspection. group inspection end-point electrical parameters shall specified table herein. 4.4.2.1 Additional criteria device class Steady-state life test conditions, method 1005 MIL-STD-883: Test condition test circuit shall maintained manufacturer under document revision level control shall made available preparing acquiring activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1005. +125C, minimum. Test duration: 1,000 hours, except specified method 1005 MIL-STD-883. TABLE IIB. Delta limits +25C.
Parameter ICC2,ICC3 ILI,
Device types ±10% specified value table ±10% specified value table
above parameter shall recorded before after required burn-in life tests determine delta. 4.4.2.2 Additional criteria device classes steady-state life test duration, test condition test temperature, approved alternatives shall specified device manufacturer's plan accordance with MIL-PRF-38535. test circuit shall maintained under document revision level control device manufacturer's accordance with MILPRF-38535 shall made available acquiring preparing activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1005 MIL-STD-883. 4.4.3 Group inspection. group inspection end-point electrical parameters shall specified table herein. 4.4.4 Group inspection. Group inspection required only parts intended marked radiation hardness assured (see herein). levels device classes shall specified MIL-PRF-38535. End-point electrical parameters shall specified table herein. 4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall performed accordance with MIL-STD-883 method 1019, condition specified herein.
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4.4.4.1.1 Accelerated aging test. Accelerated aging tests shall performed devices requiring level greater than rads(Si). post-anneal end-point electrical parameter limits shall specified table herein shall pre-irradiation end-point electrical parameter limit Testing shall performed initial qualification after design process changes which affect response device. 4.4.4.2 Dose rate induced latchup testing. Dose rate induced latchup testing shall performed accordance with test method 1020 MIL-STD-883 specified herein. Test shall performed devices, SEC, approved test structures technology qualification after design process changes which affect capability process. 4.4.4.3 Dose rate upset testing. Dose rate upset testing shall performed accordance with test method 1021 MILSTD-883 herein. Transient dose rate upset testing shall performed initial qualification after design process changes which affect performance devices. Test devices with defects unless otherwise specified. Transient dose rate upset testing class devices shall performed specified approved radiation hardness assurance plan MIL-PRF-38535.
4.4.4.4 Single event phenomena (SEP). testing shall required class devices. testing shall performed Standard Evaluation Circuit (SEC) alternate test vehicle approved qualifying activity initial qualification after design process changes which affect upset latchup characteristics. Test four devices with zero failures. ASstandard F1192 used guideline when performing testing. test conditions follows: beam angle incidence shall normal surface degrees normal, inclusive (i.e., angle 60). shadowing beam fixturing package related effects allowed. fluence shall greater than errors ions/cm2. flux shall between ion/cm2/s. cross section shall verified flux independent measuring cross section flux rates which differ least order magnitude. particle range shall microns silicon. test temperature shall +25C maximum rated operating temperature ±10C. Bias conditions shall 3.14 upset measurements 3.46 latchup measurements. Test four devices with zero failures. test limits table herein.
Delta measurements device class Delta measurements, specified table IIA, shall made recorded before after required burn-in screens steady-state life tests determine delta compliance. electrical parameters measured, with associated delta limits listed table IIB. device manufacturer may, option, either perform delta measurements within hours after life test perform final electrical parameter tests, subgroups PACKAGING Packaging requirements. requirements packaging shall accordance with MIL-PRF-38535 device classes MIL-PRF-38535, appendix device class NOTES Intended use. Microcircuits conforming this drawing intended government microcircuit applications (original equipment), design applications, logistics purposes. 6.1.1 Replaceability. Microcircuits covered this drawing will replace same generic device covered contractor-prepared specification drawing. 6.1.2 Substitutability. Device class devices will replace device class devices. SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
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Configuration control SMD's. proposed changes existing SMD's will coordinated with users record individual documents. This coordination will accomplished accordance with MIL-STD-973 using Form 1692, Engineering Change Proposal (Short Form). Record users. Military industrial users shall inform Defense Supply Center Columbus when system application requires configuration control which SMD's applicable that system. DSCC will maintain record users this list will used coordination distribution changes drawings. Users drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0525. Comments. Comments this drawing should directed DSCC-VA, Columbus, Ohio 43216-5000, telephone (614) 692-0674. Abbreviations, symbols, definitions. abbreviations, symbols, definitions used herein defined MILPRF-38535 MIL-STD-1331, follows. COUT 6.5.2 Waveforms. Waveform symbol Input MUST VALID CHANGE FROM CHANGE FROM DON'T CARE CHANGE PERMITTED Output WILL VALID WILL CHANGE FROM WILL CHANGE FROM CHANGING STATE UNKNOWN HIGH IMPEDANCE Input terminal capacitance. Output bidirectional output terminal capacitance. Ground zero voltage potential. Supply current. Input leakage current. Output leakage current. Case temperature. Positive supply voltage.
Sources supply. 6.6.1 Sources supply device classes Sources supply device classes listed QML-38535. vendors listed QML-38535 have submitted certificate compliance (see herein) DSCC-VA have agreed this drawing. 6.6.2 Approved sources supply device class Approved sources supply class listed MIL-HDBK-103. vendors listed MIL-HDBK-103 have agreed this drawing certificate compliance (see herein) been submitted accepted DSCC-VA.
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STANDARDIZED MILITARY DRAWING SOURCE APPROVAL BULLETIN DATE: 00-01-21 Approved sources supply 5962-89568 listed below immediate acquisition only shall added MIL-HDBK-103 QML-38535 during next revision. MIL-HDBK-103 QML-38535 will revised include addition deletion sources. vendors listed below have agreed this drawing certificate compliance been submitted accepted DSCC-VA. This bulletin superseded next dated revision MIL-HDBK-103 QML38535
Vendor CAGE number 61772 61772 61772 61772 61772 61772 61772 61772 61772 61772 61772 61772 61772 0HGZ7 0HGZ7 Vendor similar IDT7204L120DB MM1I-67204-55MB IDT7204L120XEB IDT7204L120LB MM4J-67204-55MB IDT7204L80DB MM1I-67204-55MB IDT7204L80XEB IDT7204L80LB MM4J-67204-55MB IDT7204L65DB MM1I-67204-55MB IDT7204L65XEB IDT7204L65LB MM4J-67204-55MB IDT7204L50DB MM1I-67204-45MB AM7204A-50BXA IDT7204L50TDB IDT7204L50XEB IDT7204L50LB MM4J-67204-45MB AM7204A-50BUA MMDP67204EV-50MQ MMDP67204EV-50SV
Standardized military drawing 5962-8956801XA 5962-8956801YA 5962-8956801ZA 5962-8956802XA 5962-8956802YA 5962-8956802ZA 5962-8956803XA 5962-8956803YA 5962-8956803ZA 5962-8956804XA
5962-8956804UA 5962-8956804YA 5962-8956804ZA
5962-8956804QYA 5962-8956804VYA
footnote list.
STANDARDIZED MILITARY DRAWING SOURCE APPROVAL BULLETIN Continued.
Vendor CAGE number 61772 61772 61772 61772 0HGZ7 0HGZ7 0HGZ7 0HGZ7 61772 61772 61772 61772 0HGZ7 0HGZ7 0HGZ7 0HGZ7 61772 61772 61772 61772 Vendor similar IDT7204L40DB MM1I-67204-35MB AM7204A-40BXA IDT7204L40TDB IDT7204L40XEB IDT7204L40LB MM4J-67204-35MB AM7204A-40BUA MMCP67204EV-40MQ MMCP67204EV-40SV MMDP67204EV-40MQ MMDP67204EV-40SV IDT7204L30DB IDT7204L30XEB IDT7204L30LB IDT7204L30TDB MMCP67204EV-30MQ MMCP67204EV-30SV MMCP67204EV-30MQ MMCP67204EV-30SV IDT7204L20DB IDT7204L20XEB IDT7204L20LB IDT7204L20TDB
Standardized military drawing 5962-8956805XA
5962-8956805UA 5962-8956805YA 5962-8956805ZA
5962-8956805QUA 5962-8956805VUA 5962-8956805QYA 5962-8956805VYA 5962-8956806XA 5962-8956806YA 5962-8956806ZA 5962-8956806UA 5962-8956806QUA 5962-8956806VUA 5962-8956806QYA 5962-8956806VYA 5962-8956807XA 5962-8956807YA 5962-8956807ZA 5962-8956807UA
lead finish shown each representing hermetic package most readily available from manufacturer listed part. desired lead finish listed, contact Vendor determine availability. longer available from approved source. Caution. this number item acquisition. Items acquired this number satisfy performance requirements this drawing.
STANDARDIZED MILITARY DRAWING SOURCE APPROVAL BULLETIN Continued.
Vendor CAGE number 61772
Vendor name address Integrated Device Technology, Incorporated 2975 Stender Santa Clara, 95054-8015 TEMIC BP70602 chantrerie 44306 NANTES CEDEX France U.S.A point contact: TEMIC 2325 Orchard Parkway Jose, 95131
0HGZ7
information contained herein disseminated convenience only Government assumes liability whatsoever inaccuracies this information bulletin.

95-08-14 00-01-21 Frye Raymond Monnin ORIGINAL FIRST PAGE TH

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