PAGE CYPRESS SEMICONDUCTOR PRODUCT DESCRIPTION (for qualific
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512, 2048 FIFO QUALIFICATION MARKETING PART NUMBER CY7C453 CY7C451 CY7C441 CY7C443 DEVICE DESCRIPTION 2048 Cascadeable FIFO Cascadeable FIFO FIFO 2048 FIFO
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CYPRESS SEMICONDUCTOR
PRODUCT DESCRIPTION (for qualification)
Information provided this document intended generic qualification technically describes Cypress part supplied: Marketing Part Device Description: Cypress Division: Size (stepping): CY7C453 2048 CASCADEABLE CLOCKED FIFO LOGIC 7C453A July/1992 mils mils What markings Die:
Overall Mask) Level (pre-requisite qualification): Cypress Qualification completion/Marketing Availability Dates (Current REV):
TECHNOLOGY/FAB PROCESS DESCRIPTION
Number Metal Layers: Passivation Type Materials: Free Phosphorus contents glass layer(%): Coating(s), used: Gate Oxide Material/Thickness (MOS): Name/Location (prime) Facility: Line ID/Wafer Process Generic Process Technology/Design Rule (µ-drawn): Metal Composition: Sio2, Si3N4 None CMOS, SiO2 Cypress Texas (Fab Plastic Silicone Gel; Hermetic Polyimide (PIQ3600) Metal 1%SiAl, Metal
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CYPRESS SEMICONDUCTOR
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Copper Solder Plated, 80%Sn, 20%Pb Silver Syringe dispense Thermosonic Attach Dim: Attach Material: Wire Material/Size: Anam, Korea Anam J32R5 mils mils Epoxy Gold 32-pin PLCC mils side Sumitomo EME-6300H(R)
HERMETIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Alloy Solder Dipped, 63%Sn, 37%Pb Bare Ceramic Syringe Dispenser Ultrasonic Attach Dim: Attach Material: Wire Material/Size: Alphatec, Bangkok Alphatec D283H mils mils Silver Glass Aluminum 1.25 32-pin, 300-mil CERDIP mils side
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CYPRESS SEMICONDUCTOR
Marketing Part: Description:
DEVICE RELIABILITY SUMMARY CY7C453/451/441/443 Wafer Fab: PDIP, SOJ, Cerpack, Cerdip, Assembly: LCC, PLCC
Round Rock, Cypress Jose,
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Early Failure Rate Device 7C443A 7C453A Lot# 2118291A 2118291 Assy Lot# 69914 65634 Hours 0/77 0/1000 Cumulative 0/1077
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Latent Failure Rate Device 7C443A 7C453A Lot# 2118291A 2118291 Assy Lot# 69914 65634 Hours 0/77 0/346 Hours 0/77 0/345 Cumulative 0/423
High Temperature Steady State Life Test (HTSSL, 5.75V, 150°C) Device 7C443A 7C443A Lot# 2118291A 2121420 Assy Lot# 69914 73179 Hours 0/76 0/76 Hours 0/76 1/76 Cumulative 1/152
Temperature Cycle (Condition -65°C 150°C) Device 7C443A 7C453A Lot# 2118291A 2118291 Assy Lot# 69914 65634 Cycles Cycles 0/76 0/76 1/76
1000 Cycles
Cumulative 1/228
Temperature Cycle -40°C 125°C) Device 7C443A Lot# 212420 Assy Lot# 73179 Cycles Cycles 0/76 1000 Cycles 0/76 Cumulative
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CYPRESS SEMICONDUCTOR
Autoclave (PCT, bias, 121°C, 100%RH, 15psig) Device 7C443A 7C443A Lot# 2118291A 2121420 Assy Lot# 69389 73179 Hours 0/76 0/76 Hours 0/76 0/76 Cumulative 0/152
Highly Accelerated Biased Humidity Test (HAST, 5.5V, 130°C, 85%RH) Device 7C443A 7C443A Lot# 2118291A 2121420 Assy Lot# 69389 73179 Hours 0/75 0/76 Cumulative 0/151
Military Group Life Test 150°C Device 7C453A Lot# 2206963 Assy Lot# 78762 Hours 0/78 Cumulative 0/78
Notes: Failure metal bridge. Fine Leak failure.
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CYPRESS SEMICONDUCTOR
Device Reliability Summary
512, 2048 FIFOs CY7C453/451/441/443 Electrostatic Discharge Human Body Model Circuit 883, Method 3015 >+4400V Unit >-4400V >+4400V Unit >-4400V >+4400V Unit >-4400V (Highest passing voltage, +10% Guard-banded) >+1500V >+1500V >+1500V Charge Device Model Unit Unit Unit >-1500V >-1500V >-1500V
Latchup Testing Cypress Internal Latch-up Procedure Tests: Current Injection 200mA Trigger Socket Temp 150°C
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CYPRESS SEMICONDUCTOR
OTHER INFORMATION
approval similarity, identify other devices using same basic with bonding metal mask options test selections explain: 7C451AT Laser option 7C453AT 7C441AT Laser option 443AT 7C443AT Metal Mask option 7C453AT Cypress planning changes near future, identify change (Qtr/Yr) Design Rev./Shrink: Fab/Assembly site change: Other Packages qualified this device: Voltage Rating (per STD-008, Method 3018): Flammability Classification (UL-94V): Alternate Fab/Assembly Locations: Assembly Please attach following Qualification Reliability data revision Package type, assembly sites identified above (mark included): HAST (5.5V, 130°C, 85%RH, 15psig) Temperature Cycles (-65°C 150°C) Data Retention Bake, Plastic (165°C) Data Retention Bake, Hermetic (250°C) Autoclave (PCT, 121°C, 100%RH) Tests (MIL-STD 883, method 3015) Operating Life (temp): Latchup Testing Steady State Life (HTSSL, 5.75V, 150°C) Temperature Humidity Bias (5.5V, 85°C, 85%RH) Other: Other: Aged Bond Strength Alpha Particle Sensitivity 150°C None None Process Change: Cross Licensee/Licensor: None None None None None
Other Devices qualified this technology:
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CYPRESS SEMICONDUCTOR
PRODUCT INFORMATION QUALIFICATION SIMILARITY
Product Family: Division: Supplier's Part Number 7C453/451/443/441 Cypress Semiconductor Rated Speed Size/ Type Revision Size (stepping) Design Rule Fabrication Passivation Mold Assembly Volt Type Compound Line Rating Location Availability (mm/yy)
Process Line CY7C453/451 CY7C443/441 CY7C453/451 32-pin PLCC 32-pin, 300Mil CDIP 28-pin, 300-mil PDIP 32-pin 0.8µ CMOS Oxynitride Oxynitride Oxynitride Oxynitride Sumitomo Hysol Sumitomo Hysol Sumitomo Hysol Sumitomo Hysol Anam, Korea >2,000V
0.8µ
CMOS
Alphatec, >2,000V Bangkok Alphatec, >2,000V Bangkok Alphatec, >2,000V Bangkok
CY7C443/441
0.8µ
CMOS
CY7C45X/44X
0.8µ
CMOS
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CYPRESS SEMICONDUCTOR
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