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INCH IMAGE SENSOR CAMERA KC74125B interline transfer area image s
Top Searches for this datasheetKC74125B INCH IMAGE SENSOR CAMERA KC74125B interline transfer area image sensor developed inch optical format video cameras, surveillance cameras, object detectors image pattern recognizers. High sensitivity achieved through onchip micro lenses (Hole Accumulated Diode) photosensors. This chip features field integration read system electronic shutter with variable charge storage time. 14Pin FEATURES High Sensitivity Optical Size inch Format adjust Substrate Bias Variable Speed Electronic Shutter (1/60, 1/100 1/10,000sec) Dark Current Horizontal Register 5.0V Drive 14pin Ceramic Package Field Integration Read System Bias Reset Gate ORDERING INFORMATION Device KC74125B Package 14Pin Operating STRUCTURE Number Total Pixels: Number Effective Pixels: Chip Size: Unit Pixel Size: Optical Blacks Dummies: 537(H) 505(V) 510(H) 492(V) 4.83mm(H) 4.04mm(V) 7.15µm(H) 5.55µm(V) Refer Figure Below Vertical Line (Even Field Only) Dummy Pixels Optical Black Pixels Effective Imaging Area OUTPUT V-CCD Effective Pixels H-CCD INCH IMAGE SENSOR CAMERA KC74125B BLOCK DIAGRAM (Top View) VOUT Vertical Shift Register Vertical Shift Register Vertical Shift Register Horizontal Shift Register Vertical Shift Register Figure Block Diagram DESCRIPTION Table Description Symbol VOUT Description Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock connection Ground Signal output Symbol Description Signal output Substrate clock Protection transistor bias Reset gate clock Horizontal register transfer clock Horizontal register transfer clock KC74125B INCH IMAGE SENSOR CAMERA ABSOLUTE MAXIMUM RATINGS (NOTE) Table Absolute Maximum Ratings Characteristics Substrate voltage VDD, VOUT Vertical clock input voltage Horizontal clock input voltage Voltage difference between vertical horizontal clock input pins Output clock input voltage Protection circuit bias voltage Operating temperature Storage temperature TSTG -0.3 Symbols Min. -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 Max. Unit NOTE: device destroyed, applied voltage temperature higher than absolute maximum rating voltage temperature. INCH IMAGE SENSOR CAMERA KC74125B CHARACTERISTICS Table Characteristics Item Output stage drain bias Protection circuit bias voltage Output stage drain current Symbol Min. 14.55 Typ. 15.0 Max. 15.45 Unit lowest vertical clock level CLOCK VOLTAGE CONDITIONS Table Clock Voltage Conditions Item Read-out clock voltage Vertical transfer clock voltage Symbol VVH1, VVH3 VVM1 VVL1 Horizontal transfer clock voltage VHH1, VHH2 VHL1, VHL2 Charge reset clock voltage VRGH VRGL Substrate clock voltage VSUB Min. 14.55 -0.2 -8.0 -0.05 4.75 -0.2 21.5 Typ. 15.0 -7.5 22.5 Max. 15.45 -7.0 5.25 0.05 5.25 23.5 Unit Remark High level Middle High High Shutter KC74125B INCH IMAGE SENSOR CAMERA DRIVE CLOCK WAVEFORM CONDITIONS Read Clock Waveform 100% VVH3 Vertical Transfer Clock Waveform VVH1 VVHH VVHL VVHH VVHL =1~4) INCH IMAGE SENSOR CAMERA KC74125B Horizontal Transfer Clock Waveform Diagram Reset Gate Clock Waveform Diagram Point waveform VRGLH VRGLL VRGL 0.5V VRGL waveform VRGLH maximum value VRGLL minimum value coupling waveform period from Point diagram about rise VRGL (VRGLH VRGLL)/2, VFRG VRGH VRGL Substrate Clock Waveform 100% KC74125B INCH IMAGE SENSOR CAMERA CLOCK EQUIVALENT CIRCUIT CONSTANT Table Clock Equivalent Circuit Constant Item Read-out clock Vertical clock Symbol Min. Horizontal clock Reset clock Substrate clock Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit INCH IMAGE SENSOR CAMERA KC74125B EQUIVALENT CIRCUIT PARAMETERS Table Equivalent Circuit Parameters Item Capacitance between vertical transfer clock Symbol Capacitance between vertical transfer clocks CV12, CV34 CV23, CV41 CV13 CV24 Capacitance between horizontal transfer clock Capacitance between horizontal transfer clocks Capacitance between substrate clock Vertical transfer clock serial resistor Vertical transfer clock ground resistor Horizontal transfer clock serial resistor Reset gate clock serial resistor CH1, CH12 CSUB RVGND RH1, Typ. Unit Remark KC74125B INCH IMAGE SENSOR CAMERA OPERATING CHARACTERISTICS Device Temperature Table Operating Characteristics Item Sensitivity Saturation signal Smear Blooming margin Uniformity Dark signal (NOTE) Dark shading (NOTE) Image Flicker NOTE: Test Temperature Symbol YSAT YLAG Min. Typ. Max. Unit mV/lux Remark 0.007 1,000 0.01 times TEST CONDITION light source with color temperature 3,200K hallogen lamp CM-500S filter. light source adjusted accordance with average value signals indicated each item. INCH IMAGE SENSOR CAMERA KC74125B TEST METHODS Measure light intensities when averaged illuminance output value standard illuminance output value, 150mV (YA) when half 150mV (1/2 YA). Adjust light intensity times value with which then measure averaged illuminance output value YSAT). Adjust light intensity times value with which then remove read-out clock drain signal photosensors electronic shutter operation respective horizontal blanking times with other clocks unchanged. Measure maximum illuminance output value (YSM). Adjust light intensity 1,000 times value with which then inspect whether there blooming phenomenon not. Measure maximum minimum illuminance output value (YMAX, YMIN) when light intensity adjusted make Measure with horizontal idling time transfer level reference, when device ambient temperature light sources shielded. Follow test method measure maximum (DMAX) minimum illuminance output (DMIN). KC74125B INCH IMAGE SENSOR CAMERA Adjust light intensity signal output value strobe light 150mV (YA), calculate below formula with measuring image signal which qenerated below timing diagram. Light Strobe Timing Signal Output 150mV YLag Output Adjust light intensity signal average value 150mV (YA), calculate below formula with measuring signal differences [mV]) between fields. INCH IMAGE SENSOR CAMERA KC74125B SPECTRAL RESPONSE CHARACTERISTICS Excluding Light Source Characteristics Spectral Response Wave Length (nm) Figure Spectral Response Characteristics KC74125B INCH IMAGE SENSOR CAMERA APPLICATION CIRCUITS -7.5V 10µ/16V 3.9K 2SK1070 MA110 10µ/16V VOUT 100K 1µ/35V KC74125B KS7221D 10µ/16V XSUB XSG1 XSG2 Figure Application Circuits INCH IMAGE SENSOR CAMERA KC74125B READ-OUT CLOCK TIMING CHART Unit: [µs] Field 38.1 Even Field Figure Read-out Clock Timing Chart KC74125B INCH IMAGE SENSOR CAMERA CLOCK TIMING CHART (VERTICAL SYNC.) 2468 1357 CLP1 Figure Clock Timing Chart (Vertical Sync.) INCH IMAGE SENSOR CAMERA KC74125B CLOCK TIMING CHART (HORIZONTAL SYNC.) XSHD XSHP CLP1 Figure Clock Timing Chart (Horizontal Sync.) KC74125B INCH IMAGE SENSOR CAMERA PACKAGE DIMENSIONS (Unit Glass 7583 Ceramicframe 90%Min. (black) 0.38 Ceramic Base 90%Min. (black) Lead Frame Alloy Inner Outer 0.50 (L/F 0.25 0.30 2.50 (L/F R0.70 4-R0.50 2.600 NOTES: Glass (7583) Max. Leakage Hellium Detector Resistance Between Leads Insulation Resistance :10-8atm. cc/sec mmHg :Above 100HM :Electrical leakage shall exceed nano 100V Ceamic Material Lead Frame Coplanarity :Min. al20 (black) :0.25 Max. (after attach) :0.076/mm, -0.102/mm 4.13 Planarity clad Thickness 1.27 :5um 10um stamp) :2.5um 12.7um (for etch) :Min. 0.762mm from lead :4um 20um Thickness Coverage thickness Flatness attach seal area Other :Max. 0.051mm :Max. 0.051mm according semi standards. Figure Package Dimensions INCH IMAGE SENSOR CAMERA KC74125B HANDLING INSTRUCTIONS Static Charge Prevention image sensors easily damaged static discharge. Before handling, sure take following protective measures. chargeable gloves, clothes material. Also conductive shoes. When handling directly, earth band. Install conductive floor working table prevent generation static electricity. Ionized recommended discharging when handling image sensor. shipment mounted substrates, boxes treated prevention static charges. Soldering Make sure package temperature does exceed Solder dipping mounting furnace causes damage glass other defects. grounded soldering iron solder each less than seconds. repairs remount, cool sufficiently. dismount imaging device, solder suction equipment. When using electronic disoldering tool, thermal controller zero cross on/off type connect ground. Dust Dirt Protection Operate clean environments (around class 1000 will appropriate). either touch glass plates hand have object come contact with glass surface. Should dirt stick glass surface blow with blow(for dirt stuck through static electricity ionized recommended). Clean with cotton ethyl alcohol glass surface grease stained. caerful scratch glass. Keep case protect from dust dirt. prevent condensation, preheat precool when moving room with great temperature differences. When protective tape applied before shipping, just before remove tape applied electrostatic protection. reuse tape. expose strong light (sun rays) long period, color filter discolored. Exposure high temperature humidity will affect characteristics. accordingly avoid storage usage such conditions. image sensors precise optical equipment that should subject mechanical shocks. Other recent searchesUCC39411 - UCC39411 UCC39411 Datasheet UCC39411 - UCC39411 UCC39411 Datasheet UCC2808-1 - UCC2808-1 UCC2808-1 Datasheet UCC2808-2 - UCC2808-2 UCC2808-2 Datasheet UCC3808-1 - UCC3808-1 UCC3808-1 Datasheet UCC3808-2 - UCC3808-2 UCC3808-2 Datasheet RS3AC - RS3AC RS3AC Datasheet RS3MC - RS3MC RS3MC Datasheet MMG5004N - MMG5004N MMG5004N Datasheet EN25Q32A - EN25Q32A EN25Q32A Datasheet KH25L3205D - KH25L3205D KH25L3205D Datasheet ELM94xxB - ELM94xxB ELM94xxB Datasheet AKD7780 - AKD7780 AKD7780 Datasheet 8XC196KC - 8XC196KC 8XC196KC Datasheet
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