DESCRIPTION PURPOSE CHANGE: Technology Wafer Fabrication Process Assem

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DESCRIPTION PURPOSE CHANGE: Technology Wafer Fabrication Process Assem

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DATE: November 1999 MEANS DISTINGUISHING CHANGED DEVICES: G9911-04 Product Affected: Plastic packages Product Mark Back Mark Manufacturing Location Affected: Date Code Other: "assembly cut-off number" Date Effective: February 2000 Contact: Title: Phone E-mail: Corporate Quality Reliability Manager (408) 492-8206 (408) 727-2328 pstow@idt.com Additional Data: Samples:
DESCRIPTION PURPOSE CHANGE: Technology Wafer Fabrication Process Assembly Process Ablebond 8340 silver epoxy qualified attached material Plastic Equipment Packages. Material Testing Manufacturing Site Data Sheet RELIABILITY/QUALIFICATION SUMMARY: Please attached qualification reports (Attachment
CUSTOMER ACKNOWLEDGMENT RECEIPT: records indicate that require written notification this change. Please acknowledgement below E-Mail grant approval request additional information. does receive acknowledgement within days this notice will assumed that this change acceptable. Customer: Name/Date: Title: CUSTOMER COMMENTS:
Approval shipments prior effective date.
E-Mail Address: Phone# /Fax#
RECD.
DATE:
FRC-1509-01 (Rev. 4/15/99
Page
Refer QCC-1795
ATTACHMENT G9911-04
Integrated Device Technology, Inc.
Reliability Qualification Report
QUAL DESCRIPTION
Qual Report Qual Type Reference Qual Plan Qual Objective
QR-991101 ASSEMBLY TECHNIQUE P99-04-05 QUALIFICATION 8340 (RP-119-4) ATTACH MATERIAL
QUAL VEHICLE
Product Group Device Type Size Wafer Assembly Package Type Body Size Package Thickness Lead Pitch Lead frame type Lead frame thickness Size Attach Material Wire Bond Mold Compound Lead Finish Assembly Location
SRAM 71016N mils 449010431A QEH60330 PH44 Leads TSOP) 10.16 18.41 0.80 Olin C7025 mils mils 8340 (RP-119-4 ABLESTIK) 1.0mil (TANAKA) 2184VA-9 (ARATRONIC) SnPb Plating IDT-Penang
SRAM 71016N mils 449010431A QEH60331 PH44 Leads TSOP) 10.16 18.41 0.80 Olin C7025 mils mils 8340 (RP-119-4 ABLESTIK) 1.0mil (TANAKA) 2184VA-9 (ARATRONIC) SnPb Plating IDT-Penang
SRAM 71V416Z mils 449010431A QEH60285 PH44 Leads TSOP) 10.16 18.41 0.80 Olin C7025 mils mils 8340 (RP-119-4 ABLESTIK) 1.0mil (TANAKA) 2184VA-9 (ARATRONIC) SnPb Plating IDT-Penang
Corporate QA/Rel Engineering
Integrated Device Technology, Inc.
ATTACHMENT G9911-04
Reliability Qualification Report
III. QUALIFICATION MATRIX DATA RESULTS Group Package Process
Test
ACC/SS
Assy
#REF! PH44
#REF! PH44
QUAL RESULTS
#REF! PH44
QUAL RESULTS
TEST POINT
QUAL RESULTS
Description
X-RAY Spec. MAC-3012 (Package voids, attach voids Wire sweep) INTERNAL VISUAL INSPECTION Mil-Std-883, Method 2010 SHEAR TEST Mil-Std-883, Method 2019 MOISTURE CLASSIFICATION Spec QCA-1416 0/45 0/30 Level
0/45 0/30
0/45 0/30
0/45 0/30
Group Package Integrity
Test
Description
HIGHLY ACCELERATED STRESS TEST (HAST), static bias, 130°C/85% POINT ELECTRICAL TEST
Precondition (L3)
0/45
0/45 0/45
0/45 0/45
0/33 0/33
Group Package Design
Test
Description
TEMPERATURE CYCLE (T/C) Mil-Std-883, Method 1010, Cond. (-65°C 150°C) POINT ELECTRICAL TEST Notes: 4064 (S-7390) Failing mechanical stress. Delaminations noted corner die. Closed invalid failure related attach material qual. S-7383 reject passed retest. Closed invalid. mechanical reject.
Precondition (L3)
0/45
0/45
0/45 0/45
1/45 1/44
Quality Level, number units S.A.T. Scanning Acoustic Tomography

DESCRIPTION PURPOSE CHANGE: Technology Wafer Fabrication Process Assem

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