µPD78P078 8-BIT SINGLE-CHIP MICROCONTROLLER DESCRIPTION
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INTEGRATED CIRCUIT
µPD78P078
8-BIT SINGLE-CHIP MICROCONTROLLER
DESCRIPTION
µPD78P078 member PD78078 Subseries 78K/0 Series, which on-chip mask µPD78078 replaced with one-time PROM EPROM. Because this device programmed users, ideally suited system evaluation, small-lot multipledevice production, early development time-to-market. PD78P078 used evaluation when system using µPD78075B Subseries developed. Cautions PD78075B Subseries different from PD78078 Subseries specification. PD78P078 evaluation PD78075B Subseries, refer PD78075B, 78075BY Subseries User's Manual (planned). µPD78P078KL-T does maintain planned reliability when used your systems' massproduced products. Please only experimentally evaluation purposes during trial manufacture. details functions described user's manuals. sure read following manuals before designing. µPD78078, 78078Y Subseries User's Manual U10641E 78K/0 Series User's Manual Instructions U12326E
FEATURES
Pin-compatible with mask version (except pin) Internal PROM: Kbytes Note µPD78P078KL-T: Reprogrammable (ideally suited system evaluation) µPD78P078GC, PD78P078GK: One-time programmable (ideally suited small-lot production) Internal high-speed RAM: bytes Internal expansion RAM: bytes Note Internal buffer RAM: bytes Operable same supply voltage mask version Corresponding QTOPmicrocontrollers
Notes internal PROM capacity changed setting memory size switching register (IMS). internal expansion capacity changed internal expansion size switching register (IXS). Remarks Refer DIFFERENCES BETWEEN PD78P078 MASK VERSIONS differences between PROM version mask version. QTOP microcontroller general term microcontrollers which incorporate one-time PROM totally supported NEC's programming service (from programming marking, screening verification).
this document, term PROM used parts common one-time PROM versions EPROM versions.
information this document subject change without notice. mark shows major revised points.
Document U10168EJ3V0DS00 (3rd edition) Date Published July 1997 Printed Japan
1995
µPD78P078
ORDERING INFORMATION
Part Number Package 100-pin plastic (fine pitch) resin thickness: 1.45 100-pin plastic LQFP (fine pitch) resin thickness: 1.40 100-pin plastic resin thickness: 100-pin ceramic WQFN Internal One-Time PROM One-Time PROM One-Time PROM EPROM Quality Grade Standard Standard Standard applicable
PD78P078GC-7EA PD78P078GC-8EU PD78P078GF-3BA PD78P078KL-T
Caution µPD78P078GC comes types packages (refer PACKAGE DRAWINGS). Please consult sales representative regarding available packages.
Please refer "Quality Grades Semiconductor Devices" (Document C11531E) published Corporation know specification quality grade devices recommended applications.
µPD78P078
78K/0 Series Development following shows 78K/0 Series products development. Subseries names shown inside frames.
Products mass production Products under development subseries products compatible with bus. Control 100-pin 100-pin 100-pin 100-pin 80-pin 80-pin 80-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 42/44-pin
µPD78075B µPD78078 µPD78070A µPD780018 Note µPD780058 µPD78058F µPD78054 µPD780034 µPD780024 µPD78014H µPD78018F µPD78014 µPD780001 µPD78002 µPD78083
Inverter control
PD78075BY µPD78078Y µPD78070AY µPD780018Y µPD780058Y Note µPD78058FY µPD78054Y µPD780034Y µPD780024Y µPD78018FY µPD78014Y µPD78002Y
noise reduction version PD78078. timer added PD78054, external interface function enhanced. ROM-less versions PD78078. Serial PD78078 enhanced, only selected functions provided. Serial PD78054 enhanced, noise reduction version. noise reduction version PD78054. UART converter were added µPD78014, enhanced. converter PD780024 enhanced. Serial PD78018F enhanced, noise reduction version. noise reduction version µPD78018F. Low-voltage (1.8 operation versions PD78014 with several capacities available. converter 16-bit timer were added µPD78002. converter added µPD78002. Basic subseries control. On-chip UART, capable operating voltage (1.8
64-pin 64-pin
µPD780964 µPD780924
FIPdrive
converter µPD780924 enhanced. On-chip inverter control circuit UART, noise reduction version.
78K/0 Series
100-pin 100-pin 80-pin 80-pin
µPD780208 PD780228 µPD78044H µPD78044F
PD78044F were enhanced, Display output total: PD78044H were enhanced, Display output total: N-ch open-drain input/output added PD78044F, Display output total: Basic subseries driving FIP, Display output total:
drive 100-pin 100-pin 100-pin
µPD780308 µPD78064B µPD78064
IEBussupported
µPD780308Y µPD78064Y
µPD78064 enhanced, were expanded. noise reduction version PD78064. Basic subseries driving LCDs, On-chip UART.
80-pin 80-pin
µPD78098B µPD78098
noise reduction version PD78098. IEBus controller added PD78054.
Meter control 80-pin 100-pin
µPD780973 µPD780805
General-purpose model automobile meter driving controller/driver PD780805. On-chip automobile meter driving controller/driver.
64-pin
µPD78P0914
On-chip output, digital code decoder, Hsync counter.
Note Under planning
µPD78P078
following table shows differences among subseries functions.
Function Subseries Name Capacity 8-bit Timer 16-bit Watch 8-bit 10-bit 8-bit (UART: 1ch) (UART: 1ch) (UART: 2ch) (time-division UART: 1ch) (UART: 1ch) Available Available Serial Interface External MIN. Value Expansion Available
µPD78075B µPD78078 µPD78070A µPD780018 µPD780058 µPD78058F µPD78054 µPD780034 µPD780024 µPD78014H µPD78018F µPD78014 µPD780001 µPD78002 µPD78083 Inverter µPD780964 control µPD780924 µPD780208 drive µPD780228 µPD78044H µPD78044F µPD780308 drive µPD78064B µPD78064 IEBus µPD78098B supported µPD78098 Meter µPD780973 control µPD780805 µPD78P0914
Control
(time-division 3-wire: 1ch) (time-division UART: 1ch) (UART: 1ch) (UART: 1ch, time-division 3-wire: 1ch)
Note
(UART: 1ch) (UART: 1ch)
Available Available
Note
10-bit timer: channel
µPD78P078
FUNCTION DESCRIPTION
Item Internal memory PROM: Kbytes Note High-speed RAM: bytes Expansion RAM: bytes Note Buffer RAM: bytes Memory space General register Minimum instruction execution time When main system clock selected When subsystem clock selected Instruction 16-bit operation Multiply/divide bits bits, bits bits) manipulation (set, reset, test, Boolean operation) adjust, etc. ports Total CMOS input CMOS input/output converter converter Serial interface 8-bit resolution channels 8-bit resolution channels 3-wire serial I/O/SBI/2-wire serial mode selectable: channel 3-wire serial mode (with max. 32-byte on-chip automatic transmit/receive function): channel 3-wire serial I/O/UART mode selectable: channel Timer 16-bit timer/event counter: channel 8-bit timer/event counter: channels Watch timer: channel Watchdog timer: channel Timer output Clock output pins (14-bit output enable: pin, 8-bit output enable: pins) 19.5 kHz, 39.1 kHz, 78.1 kHz, kHz, kHz, kHz, 1.25 MHz, MHz, with main system clock) 32.768 32.768 with subsystem clock) Buzzer output kHz, kHz, with main system clock) 32.768 kHz) Kbytes bits registers bits registers banks) Minimum instruction execution time variable function integrated. µs/0.8 s/1.6 µs/3.2 µs/6.4 s/12.8 MHz) Function
N-ch open-drain input/output
Notes Internal PROM capacity changed memory size switching register (IMS). Internal expansion capacity changed internal expansion size switching register (IXS).
µPD78P078
Item Vectored interrupt source Test input Supply voltage Package Maskable Non-maskable Software Internal: External: Internal: Internal: External:
Function
100-pin plastic (fine pitch) resin thickness: 1.45 100-pin plastic LQFP (fine pitch) resin thickness: 1.40 100-pin plastic resin thickness: 100-pin ceramic WQFN
µPD78P078
CONFIGURATIONS (Top View) Normal operating mode 100-pin plastic (fine pitch) resin thickness: 1.45 PD78P078GC-7EA 100-pin plastic LQFP (fine pitch) resin thickness: 1.40 PD78P078GC-8EU
P14/ANI4 P15/ANI5 P16/ANI6 P17/ANI7 AVSS P130/ANO0 P131/ANO1 AVREF1 P70/SI2/RXD P71/SO2/TXD P72/SCK2/ASCK P20/SI1 P21/SO1 P22/SCK1 P23/STB P24/BUSY P25/SI0/SB0 P26/SO0/SB1 P27/SCK0 P80/A0 P81/A1 P82/A2 P83/A3 P84/A4
P13/ANI3 P12/ANI2 P11/ANI1 P10/ANI0 AVREF0 AVDD P06/INTP6 P05/INTP5 P04/INTP4 P03/INTP3 P02/INTP2 P01/INTP1/TI01 P00/INTP0/TI00 RESET XT1/P07 P127/RTP7 P126/RTP6 P125/RTP5 P124/RTP4 P123/RTP3
P122/RTP2 P121/RTP1 P120/RTP0 P36/BUZ P35/PCL P34/TI2 P33/TI1 P32/TO2 P31/TO1 P30/TO0 P103 P102 P101/TI6/TO6 P100/TI5/TO5 P67/ASTB P66/WAIT P65/WR
P54/A12 P55/A13 P56/A14 P57/A15
P85/A5 P86/A6 P87/A7 P40/AD0
Cautions Connect directly Connect AVDD VDD. Connect AVSS
P41/AD1 P42/AD2 P43/AD3 P44/AD4 P45/AD5 P46/AD6 P47/AD7 P50/A8 P51/A9 P52/A10 P53/A11
P64/RD
µPD78P078
100-pin plastic resin thickness: PD78P078GF-3BA 100-pin ceramic WQFN PD78P078KL-T
P101/TI6/TO6
P120/RTP0 P121/RTP1 P122/RTP2 P123/RTP3 P124/RTP4 P125/RTP5 P126/RTP6 P127/RTP7 XT1/P07 RESET P00/INTP0/TI00 P01/INTP1/TI01 P02/INTP2 P03/INTP3 P04/INTP4 P05/INTP5 P06/INTP6 AVDD AVREF0 P10/ANI0 P11/ANI1 P12/ANI2 P13/ANI3 P14/ANI4 P15/ANI5
P100/TI5/TO5 P67/ASTB
P36/BUZ
P35/PCL
P32/TO2
P31/TO1
P30/TO0
P34/TI2
P33/TI1
P103
P102
P66/WAIT P65/WR P64/RD P57/A15 P56/A14 P55/A13 P54/A12 P53/A11 P52/A10 P51/A9 P50/A8 P47/AD7 P46/AD6 P45/AD5 P44/AD4 P43/AD3 P42/AD2 P41/AD1 P40/AD0 P87/A7 P86/A6 P85/A5 P84/A4 P83/A3 P82/A2
P17/ANI7 AVSS
AVREF1
P72/SCK2/ASCK
P20/SI1
P21/SO1
P22/SCK1
P23/STB P24/BUSY
P25/SI0/SB0
P26/SO0/SB1
P27/SCK0
P130/ANO0
P131/ANO1
P16/ANI6
P80/A0
P70/SI2/RXD
Cautions Connect directly Connect AVDD VDD. Connect AVSS
P71/SO2/TXD
P81/A1
µPD78P078
ANI0 ANI7 ANO0, ANO1 ASCK ASTB REF0, AVREF1 BUSY INTP0 INTP6 P100 P103
Address Address/Data Analog Input Analog Output Asynchronous Serial Clock Address Strobe Analog Power Supply Analog Reference Voltage Analog Ground Busy Buzzer Clock Interrupt from Peripherals Port0 Port1 Port2 Port3 Port4 Port5 Port6 Port7 Port8 Port9 Port10
P120 P127 P130, P131 RESET RTP0 RTP7 SB0, SCK0 SCK2 TI00, TI01 TI1, TI2, TI5, TO2, TO5, WAIT XT1,
Port12 Port13 Programmable Clock Read Strobe Reset Real-Time Output Port Receive Data Transmit Data Serial Serial Clock Serial Input Serial Output Strobe Timer Input Timer Input Timer Output Power Supply Programming Power Supply Ground Wait Write Strobe Crystal (Main System Clock) Crystal (Subsystem Clock)
µPD78P078
PROM programming mode 100-pin plastic (fine pitch) resin thickness: 1.45 PD78P078GC-7EA 100-pin plastic LQFP (fine pitch) resin thickness: 1.40 PD78P078GC-8EU
RESET Open Open
Cautions
(L): RESET: Open:
Individually connect pull-down resistor. Connect GND. level. connection.
µPD78P078
100-pin plastic resin thickness: PD78P078GF-3BA 100-pin ceramic WQFN PD78P078KL-T
Open Open
RESET
Cautions
(L): RESET: Open:
Individually connect pull-down resistor. Connect GND. level. connection. RESET Reset Power Supply Programming Power Supply Ground
Address Chip Enable Data Output Enable Program
µPD78P078
BLOCK DIAGRAM
TO0/P30 TI00/INTP0/P00 TI01/INTP1/P01 TO1/P31 TI1/P33 TO2/P32 TI2/P34
16-bit TIMER/ EVENT COUNTER
PORT0
PORT1
8-bit TIMER/EVENT COUNTER
PORT2
8-bit TIMER/EVENT COUNTER
PORT3
TI5/TO5/P100
8-bit TIMER/EVENT COUNTER
PORT4
TI6/TO6/P101
8-bit TIMER/EVENT COUNTER
PORT5 PORT6
WATCHDOG TIMER
78K/0 CORE
PROM KBytes)
PORT7
WATCH TIMER
PORT8
SI0/SB0/P25 SO0/SB1/P26 SCK0/P27 SI1/P20 SO1/P21 SCK1/P22 STB/P23 BUSY/P24 SI2/RxD/P70 SO2/TxD/P71 SCK2/ASCK/P72 ANI0/P10 ANI7/P17 AVDD AVSS AVREF0 ANO0/P130, ANO1/P131 AVSS AVREF1 INTP0/P00 INTP6/P06
SERIAL INTERFACE
PORT9
PORT10
SERIAL INTERFACE Bytes)
P100 P103
PORT12
P120 P127
SERIAL INTERFACE
PORT13
REAL-TIME OUTPUT PORT
P130, P131 RTP0/P120 RTP7/P127 AD0/P40 AD7/P47 A0/P80 A7/P87 A8/P50 A15/P57 RD/P64 WR/P65 WAIT/P66 ASTB/P67 RESET XT1/P07
CONVERTER
CONVERTER
EXTERNAL ACCESS
INTERRUPT CONTROL
BUZ/P36
BUZZER OUTPUT SYSTEM CONTROL
PCL/P35
CLOCK OUTPUT CONTROL
µPD78P078
CONTENTS
DIFFERENCES BETWEEN µPD78P078 MASK VERSIONS FUNCTIONS Pins Normal Operating Mode Pins PROM Programming Mode Input/Output Circuits Recommended Connection Unused Pins
MEMORY SIZE SWITCHING REGISTER (IMS) INTERNAL EXPANSION SIZE SWITCHING REGISTER (IXS) PROM PROGRAMMING Operating Modes PROM Write Procedure PROM Read Procedure
PROGRAM ERASURE (µPD78P078KL-T ONLY). OPAQUE FILM ERASURE WINDOW µPD78P078KL-T ONLY) ONE-TIME PROM VERSION SCREENING ELECTRICAL SPECIFICATIONS CHARACTERISTIC CURVES (REFERENCE VALUES) PACKAGE DRAWINGS RECOMMENDED SOLDERING CONDITIONS APPENDIX DEVELOPMENT TOOLS. APPENDIX RELATED DOCUMENTS
µPD78P078
DIFFERENCES BETWEEN µPD78P078 MASK VERSIONS
PD78P078 single-chip microcontroller with on-chip one-time PROM with on-chip EPROM which program write, erasure rewrite capability. possible make functions, except PROM specification mask option pins, same those mask versions setting memory size switching register (IMS) internal expansion size switching register (IXS). Differences between PROM version PD78P078) mask versions PD78074B, 78075B, 78076, 78078) shown Table 1-1. Table 1-1. Differences between PD78P078 Mask Versions
Parameter Internal type Internal capacity Kbytes
µPD78P078
One-time PROM/EPROM
Mask Versions Mask
µPD78074B: Kbytes µPD78075B: Kbytes µPD78076: Kbytes µPD78078: Kbytes
Internal expansion capacity
bytes
µPD78074B: none µPD78075B: none µPD78076: bytes µPD78078: bytes
Internal capacity changed with memory size switching register Internal expansion capacity changed with internal expansion size switching register On-chip mask option pull-up resistor pins Electrical specifications
Changeable
Note
changeable changeable
Changeable Note
Refer Data Sheet each version.
Notes internal PROM becomes Kbytes internal high-speed becomes bytes RESET input. internal expansion becomes bytes RESET input. Caution PROM version mask version differ noise tolerance noise emission. When replacing PROM version with mask version when switching from experimental production mass production, make thorough evaluation with version (not version) mask version.
µPD78P078
FUNCTIONS
Pins Normal Operating Mode
Port pins (1/3)
Name Note Input Input/output Port 8-bit input/output port Input/output specifiable bit-wise. When used input port, possible connect on-chip pull-up resistor software. Note Input/output Port 8-bit input/output port Input/output specifiable bit-wise. When used input port, possible connect on-chip pull-up resistor software. Input Input/output Port 8-bit input/output port Input/output specifiable bit-wise. When used input port, possible connect on-chip pull-up resistor software. Input SCK1 BUSY SI0/SB0 SO0/SB1 SCK0 Input only Input Input Input/Output Input Input/output Port 8-bit input/output port Function Input only Input/output specifiable bit-wise. When used input port, possible connect on-chip pull-up resistor software. After Reset Input Input Alternate Function INTP0/TI00 INTP1/TI01 INTP2 INTP3 INTP4 INTP5 INTP6 ANI0 ANI7
Notes When P07/XT1 pins used input ports, processor clock control register (PCC) (FRC) sure feedback resistor subsystem clock oscillator). When P10/ANI0 P17/ANI7 pins used analog inputs converter, pull-up resistor automatically disabled.
µPD78P078
Port pins (2/3)
Name Input/Output Input/output Port 8-bit input/output port Input/output specifiable 8-bit units. When used input port, possible connect on-chip pull-up resistor software. test input flag (KRIF) falling edge detection. Input/output Port 8-bit input/output port possible directly drive LEDs. Input/output specifiable bit-wise. When used input port, possible connect on-chip pull-up resistor software. Input/output Input/output Port 3-bit input/output port Input/output specifiable bit-wise. When used input port, possible connect on-chip pull-up resistor software. Port 8-bit input/output port Input/output specifiable bit-wise. When used input port, possible connect on-chip pull-up resistor software. Input/output Port 7-bit input/output port Input/output specifiable bit-wise. N-ch open-drain input/output port. possible directly drive LEDs. When used input port, possible connect on-chip pull-up resistor software. Input Input SCK2/ASCK SO2/TXD Input/output Port 8-bit input/output port Input/output specifiable bit-wise. N-ch open-drain input/output port. possible directly drive LEDs. When used input port, possible connect on-chip pull-up resistor software. Input Input WAIT ASTB SI2/RXD Input Input Function After Reset Input Alternate Function
µPD78P078
Port pins (3/3)
Name P100 P101 P102, P103 P120 P127 Input/output Input/Output Input/output Port 4-bit input/output port Input/output specifiable bit-wise. When used input port, possible connect on-chip pull-up resistor software. Port 8-bit input/output port Input/output specifiable bit-wise. When used input port, possible connect on-chip pull-up resistor software. P130, P131 Input/output Port 2-bit input/output port Input/output specifiable bit-wise. When used input port, possible connect on-chip pull-up resistor software. Input ANO0, ANO1 Input RTP0 RTP7 TI6/TO6 Function After Reset Input Alternate Function TI5/TO5
µPD78P078
Non-port pins (1/2)
Name INTP0 INTP1 INTP2 INTP3 INTP4 INTP5 INTP6 SCK0 SCK1 SCK2 BUSY ASCK TI00 TI01 RTP0 RTP7 Output Output Output Input/output Output Output Input Input Output Input Input Serial interface automatic transmit/receive strobe output. Serial interface automatic transmit/receive busy input. Asynchronous serial interface serial data input. Asynchronous serial interface serial data output. Asynchronous serial interface serial clock input. External count clock input 16-bit timer (TM0). Capture trigger signal input capture register (CR00). External count clock input 8-bit timer (TM1). External count clock input 8-bit timer (TM2). External count clock input 8-bit timer (TM5). External count clock input 8-bit timer (TM6). 16-bit timer output (TM0) (also used 14-bit output). 8-bit timer output (TM1). 8-bit timer output (TM2). 8-bit timer output (TM1) (also used 8-bit output). 8-bit timer output (TM2) (also used 8-bit output). Clock output (for main system clock, subsystem clock trimming). Buzzer output. Real-time output port which data output synchronization with trigger. Low-order address/data external memory expansion. Input Input Input P120 P127 Input Input Input Input Input Input Input Input Input/output Serial interface serial clock input/output. Input Input/output Serial interface serial data input/output. Input Output Serial interface serial data output. Input Input Serial interface serial data input. Input Input/Output Input Function External interrupt request input which active edge (rising edge, falling edge, both rising falling edges) specified. After Reset Input Alternate Function P00/TI00 P01/TI01 P25/SB0 P70/RxD P26/SB1 P71/TxD P25/SI0 P26/SO0 P72/ASCK P70/SI2 P71/SO2 P72/SCK2 P00/INTP0 P01/INTP1 P100/TO5 P101/TO6 P100/TI5 P101/TI6
µPD78P078
Non-port pins (2/2)
Name WAIT ASTB ANI0 ANI7 ANO0, ANO1 AVREF0 AVREF1 AVDD AVSS RESET Input Positive power supply. High-voltage applied during program write/verification. Connected directly normal operating mode. Ground potential. Input Input Subsystem clock oscillation crystal connection. Input Input Output Input Output Input Input Input/Output Output Output Output Function Low-order address external memory expansion. High-order address external memory expansion. External memory read operation strobe signal output. External memory write operation strobe signal output. Wait insertion external memory access. Strobe output which latches address data output ports access external memory. converter analog input. converter analog output. converter reference voltage input. converter reference voltage input. converter analog power supply. Connected VDD. converter ground potential. Connected System reset input. Main system clock oscillation crystal connection. Input Input P130, P131 After Reset Input Input Input Input Input Input Alternate Function
Pins PROM Programming Mode
Name Input/Output Input PROM programming mode setting. When +12.5 applied level signal applied RESET pin, this chip PROM programming mode. Function
RESET
Input Input Input/output Input Input Input
PROM programming mode setting high-voltage applied during program write/verification. Address bus. Data bus. PROM enable input/program pulse input. Read strobe input PROM. Program/program inhibit input PROM programming mode. Positive power supply. Ground potential.
µPD78P078
Input/Output Circuits Recommended Connection Unused Pins Types input/output circuits pins recommended connection unused pins shown Table 2-1. configuration each type input/output circuit, Figure 2-1. Table 2-1. Type Input/Output Circuit Each (1/2)
Name P00/INTP0/TI00 P01/INTP1/TI01 P02/INTP2 P03/INTP3 P04/INTP4 P05/INTP5 P06/INTP6 P07/XT1 P10/ANI0 P17/ANI7 P20/SI1 P21/SO1 P22/SCK1 P23/STB P24/BUSY P25/SI0/SB0 P26/SO0/SB1 P27/SCK0 P30/TO0 P31/TO1 P32/TO2 P33/TI1 P34/TI2 P35/PCL P36/BUZ P40/AD0 P47/AD7 P50/A8 P57/A15 P64/RD P65/WR P66/WAIT P67/ASTB 13-D Input/output Input/output Input/output Input/output Independently connect resistor. Independently connect resistor. Independently connect resistor. Independently connect resistor. 10-A Input Input/output Connect VDD. Independently connect resistor. Input/Output Circuit Type Input Input/output Connect Independently connect resistor. Input/Output Recommended Connection Unused Pins
µPD78P078
Table 2-1. Type Input/Output Circuit Each (2/2)
Name Input/Output Circuit Type P70/SI2/RxD P71/SO2/TxD P72/SCK2/ASCK P80/A0 P87/A7 P100/TI5/TO5 P101/TI6/TO6 P102, P103 Input/output Input Leave open. Connect Connect VDD. Connect Connect directly Independently connect resistor. P120/RTP0 P127/RTP7 P130/ANO0, P131/ANO1 12-A RESET AVREF0 AVREF1 AVDD AVSS 13-D Input/output Input/output Independently connect resistor. Independently connect resistor. Input/output Independently connect resistor. Input/Output Recommended Connection Unused Pins
µPD78P078
Figure 2-1. List Input/Output Circuits (1/2)
Type Type
pullup enable data P-ch
P-ch
IN/OUT Schmitt-triggered input with hysteresis characteristics output disable N-ch
Type pullup enable data
Type 10-A
P-ch
pullup enable data IN/OUT P-ch
P-ch
P-ch
IN/OUT open drain output disable N-ch
output disable
N-ch
input enable Type Type pullup enable data P-ch IN/OUT IN/OUT output disable N-ch output disable P-ch Comparator N-ch VREF (threshold voltage) input enable N-ch
pullup enable data P-ch
P-ch
P-ch
µPD78P078
Figure 2-1. List Input/Output Circuits (2/2)
Type 12-A pullup enable data P-ch IN/OUT output disable input enable N-ch Type feedback cut-off P-ch
P-ch
P-ch Analog output voltage N-ch
Type 13-D
IN/OUT data output disable N-ch
P-ch
Medium voltage input buffer
µPD78P078
MEMORY SIZE SWITCHING REGISTER (IMS)
This register disable part internal memories software. setting this memory size switching register (IMS), possible same memory mapping that mask versions with different internal memory (ROM). with 8-bit memory manipulation instruction. RESET input sets CFH. Figure 3-1. Memory Size Switching Register Format
Symbol RAM2 RAM1 RAM0 ROM3 ROM2 ROM1 ROM0 Address FFF0H After Reset
ROM3 ROM2 ROM1 ROM0
Selection Internal Capacity Kbytes Kbytes Kbytes Kbytes Note Kbytes Setting prohibited
Other than above
RAM2 RAM1 RAM0
Selection Internal High-Speed Capacity bytes Setting prohibited
Other than above
Note When external device expansion function used, internal capacity should Kbytes less. Table shows setting values which make memory mapping same that mask version. Table 3-1. Memory Size Switching Register Setting Values
Target Mask Versions Setting Value
PD78074B PD78075B PD78076 PD78078
µPD78P078
INTERNAL EXPANSION SIZE SWITCHING REGISTER (IXS)
This register used internal expansion capacity software. setting this internal expansion size switching register (IXS), possible same memory mapping that mask versions with different internal expansion RAM. with 8-bit memory manipulation instruction. RESET input sets 0AH. Figure 4-1. Internal Expansion Size Switching Register Format
Symbol IXRAM3 IXRAM2 IXRAM1 IXRAM0 Address FFF4H After Reset
IXRAM3
IXRAM2
IXRAM1
IXRAM0
Selection Internal Expansion Capacity bytes bytes Setting prohibited
Other than above
Table shows setting values which make memory mapping same that mask versions. Table 4-1. Internal Expansion Size Switching Register Setting Values
Target Mask Versions
Setting Value Note
µPD78074B µPD78075B µPD78076 µPD78078
Note program PD78P078 which "MOV IXS, #0CH" written executed µPD78074B PD78075B, operations affected.
µPD78P078
PROM PROGRAMMING
PD78P078 on-chip 60-Kbyte PROM program memory. programming, PROM programming mode with RESET pins. connection unused pins, refer "PIN CONFIGURATIONS PROM programming mode." Caution Programs must written addresses 0000H EFFFH (The last address EFFFH must specified). They cannot written PROM programmer which cannot specify write address. Operating Modes When +12.5 applied low-level signal applied RESET pin, PROM programming mode set. This mode will become operating mode shown Table when pins shown. Further, when read mode set, possible read contents PROM.
Table 5-1. Operating Modes PROM Programming
Operating Mode Page data latch Page write Byte write Program verify Program inhibit +12.5 +6.5 Read Output disable Standby Data output High-impedance High-impedance Data input High-impedance Data input Data output High-impedance RESET
µPD78P078
Read mode Read mode set. Output disable mode Data output becomes high-impedance, output disable mode, set. Therefore, allows data read from device controlling pin, multiple PD78P078s connected data bus. Standby mode Standby mode set. this mode, data outputs become high-impedance irrespective status. Page data latch mode Page data latch mode beginning page write mode. this mode, page 4-byte data latched internal address/data latch circuit. Page write mode After page bytes addresses data latched page data latch mode, page write executed applying 0.1-ms program pulse (active low) with Then, program verification performed, set. programming performed one-time program pulse, times write verification operations should executed repeatedly. Byte write mode Byte write executed when 0.1-ms program pulse (active low) applied with Then, program verification performed set. programming performed one-time program pulse, times write verification operations should executed repeatedly. Program verify mode Program verify mode set. this mode, check write operation performed correctly after write. Program inhibit mode Program inhibit mode used when pin, pins multiple PD78P078s connected parallel write performed those devices. When write operation performed, page write mode byte write mode described above used. this time, write performed device which driven high.
µPD78P078
PROM Write Procedure Figure 5-1. Page Program Mode Flow Chart
Start Address 12.5
Latch Address Address Latch Address Address Latch Address Address Address Address Latch
X=X+1 0.1-ms program pulse
Verify bytes Pass Address
Fail
Pass
Verify bytes pass Write
Fail
Defective product
Start address Program last address
µPD78P078
Figure 5-2. Page Program Mode Timing
Page data latch
Page program
Program verify
Data input Data output
µPD78P078
Figure 5-3. Byte Program Mode Flow Chart
Start Address 12.5
X=X+1 0.1-ms program pulse Address Address Fail Verify Pass Address
Pass
Verify bytes pass Write
Fail
Defective product
Start address Program last address
µPD78P078
Figure 5-4. Byte Program Mode Timing
Program
Program verify
Data input
Data output
Cautions should applied before removed after must exceed +13.5 including overshoot. Reliability adversely affected removal/reinsertion performed while +12.5 being applied VPP.
µPD78P078
PROM Read Procedure contents PROM readable external data according read procedure shown below. RESET level, supply pin, connect other unused pins shown "PIN CONFIGURATIONS PROM programming mode". Supply pins. Input address read data into pins. Read mode Output data pins. timings above steps shown Figure 5-5. Figure 5-5. PROM Read Timings
Address input
(input)
(input)
Hi-Z
Data output
Hi-Z
µPD78P078
PROGRAM ERASURE (µPD78P078KL-T ONLY)
PD78P078KL-T capable erasing (FFH) data written program memory rewriting. erase programmed data, expose erasure window light having wavelength shorter than about Normally, irradiate ultraviolet rays 254-nm wavelength. amount exposure required completely erase programmed data follows: intensity erasing time: more Erasure time: min. more (When lamp W/cm2 used. However, longer time needed because deterioration performance lamp, soiled erasure window, etc.) When erasing contents data, lamp within from erasure window. Further, filter provided lamp, irradiate ultraviolet rays after removing filter.
OPAQUE FILM ERASURE WINDOW (µPD78P078KL-T ONLY)
protect from unintentional erasure rays other than that lamp erasing EPROM contents, protect internal circuit other than EPROM from misoperating rays, cover erasure window with opaque film when EPROM contents erasure performed.
ONE-TIME PROM VERSION SCREENING
one-time PROM version PD78P078GC-7EA, 78P078GC-8EU, 78P078GF-3BA) cannot tested completely before shipped, because structure. recommended perform screening verify PROM after writing necessary data performing high-temperature storage under condition below.
Storage Temperature Storage Time hours
offers additional one-time PROM writing marking, screening, verify products designated "QTOP microcontroller". Please contact sales representative details.
µPD78P078
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
Parameter Supply voltage Symbol AVDD AVREF0 AVREF1 AVSS Input voltage P07, P17, P27, P37, P47, P57, P67, P72, P87, P96, P100 P103, P120 P127, P130, P131, XT2, RESET Output voltage Analog input voltage Output current, high Total P37, P56, P57, P67, P96, P100 P103, P120 P127 Total P06, P17, P27, P47, P55, P72, P87, P130, P131 Output current, Note Total Total P56, P57, Peak value
r.m.s. value
Test Conditions
Ratings -0.3 +7.0 -0.3 +13.5 -0.3 -0.3 -0.3 -0.3 +0.3 -0.3
Unit
P63,
N-ch open-drain
PROM programming mode
-0.3 -0.3 +13.5 -0.3 AVSS REF0 +150
Analog input pins
Peak value
r.m.s. value
Peak value
r.m.s. value
Total P37, P67, Peak value P96, P100 P103, P120 P127 r.m.s. value Total P27, P47, Total P06, P17, P72, P130, P131 Operating ambient temperature Storage temperature Tstg Peak value
r.m.s. value
Peak value
r.m.s. value
Note r.m.s. value should calculated follows: [r.m.s. value] [Peak value] Duty Caution Exposure Absolute Maximum Ratings extended periods affect device reliability; exceeding ratings could cause permanent damage. parameters apply independently. device should operated within limits specified under Characteristics. Remark Unless otherwise specified, alternate-function characteristics same port characteristics.
µPD78P078
Capacitance
Parameter Input capacitance capacitance Symbol MHz, Unmeasured pins returned Test Conditions MHz, Unmeasured pins returned P07, P17, P27, P37, P47, P57, P67, P72, P87, P96, P100 P103, P120 P127, P130, P131 P63, MIN. TYP. MAX. Unit
Remark
Unless otherwise specified, alternate-function characteristics same port characteristics.
Main System Clock Oscillator Characteristics
Resonator Recommended Circuit Ceramic resonator
Parameter
Test Conditions
MIN.
TYP.
MAX.
Unit
Oscillation frequency (fX)
Note
Oscillation voltage range After reaches MIN. value oscillation voltage range
Oscillation stabilization time
Note
Crystal resonator
Oscillation frequency (fX) Note
Oscillation stabilization time
Note
External clock
input frequency (fX)
Note
PD74HCU04
input high-/low-level width (tXH, tXL)
Notes Only oscillator characteristics shown. instruction execution time, refer Characteristics. Time required oscillation stabilize after reset STOP mode been released. Cautions When using oscillation circuit main system clock, wire portion enclosed broken lines figures follows avoid adverse influences wiring capacitance: Keep wiring length short possible. cross wiring over other signal lines. route wiring vicinity lines through which high fluctuating current flows. Always keep ground point capacitor oscillation circuit same potential connect ground pattern through which high current flows. extract signals from oscillation circuit. When main system clock stopped device operating subsystem clock, wait until oscillation stabilization time been secured program before switching back main system clock.
µPD78P078
Subsystem Clock Oscillator Characteristics
Resonator Recommended Circuit Crystal resonator
Parameter
Test Conditions
MIN.
TYP.
MAX.
Unit
Oscillation frequency (fXT)
Note
32.768
Oscillation stabilization time
Note
External clock
input frequency (fXT) Note
PD74HCU04
input high-/low-level width (tXTH, tXTL
Notes Only oscillator characteristics shown. instruction execution time, refer Characteristics. Time required oscillation stabilize after reaches minimum value oscillation voltage range. Cautions When using oscillation circuit subsystem clock, wire portion enclosed broken lines figure follows avoid adverse influences wiring capacitance: Keep wiring length short possible. cross wiring over other signal lines. route wiring vicinity lines through which high fluctuating current flows. Always keep ground point capacitor oscillation circuit same potential connect ground pattern through which high current flows. extract signals from oscillation circuit. amplification factor subsystem clock oscillator designed reduce current consumption therefore, subsystem clock oscillator influenced noise more easily than main system clock oscillator. When using subsystem clock, therefore, exercise utmost care wiring circuit.
µPD78P078
Recommended Oscillator Constant Main System Clock: Ceramic Resonator
Manufacturer Part Number Frequency Recommended Circuit Constant (pF) CCR1000K2 CCR2.0MC3 CCR4.0MC3 FCR4.0MC5 Murata Mfg. CSB1000J Co., Ltd. 1.00 2.00 4.00 4.00 1.00 On-chip On-chip On-chip On-chip On-chip On-chip (pF) On-chip On-chip On-chip On-chip On-chip On-chip Oscillation Voltage Range MIN. MAX. On-chip capacitor On-chip capacitor surface mount type On-chip capacitor surface mount type On-chip capacitor insertion type Insertion type Insertion type On-chip capacitor insertion type Insertion type On-chip capacitor insertion type Insertion type On-chip capacitor insertion type Remarks
CSA2.00MG040 2.00 CST2.00MG040 CSA4.00MG CST4.00MGW CSA4.00MGU CST4.00MGWU 2.00 4.00 4.00 4.00 4.00
Main System Clock: Ceramic Resonator
Manufacturer Part Number Frequency Recommended Circuit Constant (pF) Kyocera KFR-1000F 1.00 1.00 2.00 4.00 4.00 4.00 4.00 On-chip On-chip (pF) On-chip On-chip Oscillation Voltage Range MIN. MAX. Insertion type Surface mount type Insertion type On-chip capacitor insertion type Insertion type On-chip capacitor surface mount type PBRC4.00A Surface mount type Remarks
Corporation PBR-1000Y KBR-2.0MS KBR-4.0MKC KBR-4.0MSB PBRC4.00B
Caution oscillator constant oscillation voltage range indicate conditions stable oscillation. Oscillation frequency precision guaranteed. applications requiring oscillation frequency precision, oscillation frequency must adjusted implementation circuit. details, please contact directly manufacturer resonator will use.
µPD78P078
Characteristics
Parameter Input voltage, high Symbol VIH1 Test Conditions P17, P21, P23, P32, P37, P47, P57, P67, P71, P87, P96, P102, P103, P120 P127, P130, P131 VIH2 P06, P20, P22, P27, P33, P34, P70, P72, P100, P101, RESET VIH3 VIH4 VIH5 P63, (N-ch open-drain) XT1/P07, Note Input voltage, P17, P21, P23, P32, P37, P47, P57, P67, P71, P87, P96, P102, P103, P120 P127, P130, P131 P06, P20, P22, P27, P33, P34, P70, P72, P100, P101, RESET P63, (N-ch open-drain) XT1/P07, Note Output voltage, high -100 0.15 0.85 MIN. TYP. MAX. Unit
Note When used P07, inverted phase should input using inverter. Remark Unless otherwise specified, alternate-function characteristics same port characteristics.
µPD78P078
Characteristics
Parameter Output voltage, Symbol VOL1 P63, P06, P37, P47, P67, P72, P87, P96, P100 P103, P120 P127, P130, P131 VOL2 SB0, SB1, SCK0 open-drain, pulled VOL3 Input leakage current, high ILIH1 P06, P17, P27, P37, P47, P57, P67, P72, P87, P96, P100 P103, P120 P127, P130, P131, RESET ILIH2 ILIH3 Input leakage current, LIL1 XT1/P07, P63, P06, P17, P27, P37, P47, P57, P67, P72, P87, P96, P100 P103, P120 P127, P130, P131, RESET LIL2 LIL3 Output leakage current, high Output leakage current, XT1/P07, P63,
Note
Test Conditions P57,
MIN.
TYP.
MAX.
Unit
P17, P27,
Note value -200 (MAX.) only clock cycles wait) when read-out instruction executed port (P6), port mode register (PM6), port (P9) port mode register (PM9). cases other than clock cycles read-out instruction execution, value (MAX.). Remark Unless otherwise specified, alternate-function characteristics same port characteristics.
µPD78P078
Characteristics
Parameter Software pull-up resistor Note Symbol Test Conditions P17, P27, P37, P47, P57, P67, P72, P87, P96, P100 P103, P120 P127, P130, P131 Supply current Note IDD1 5.0-MHz crystal oscil- lation operating mode (fXX MHz)
Note Note Note Note Note Note
MIN.
TYP.
MAX.
Unit
0.45 0.65 0.05 0.05
16.2 1.35 28.5 1.95 12.5
5.0-MHz crystal oscil- lation operating mode (fXX MHz) IDD2
Note
crystal oscil- lation HALT mode (fXX MHz)
Note
crystal oscil- lation HALT mode (fXX MHz) IDD3 32.768-kHz crystal oscillation operating mode IDD4 32.768-kHz crystal oscillation HALT mode IDD5 STOP mode IDD6 STOP mode Feedback resistor used
Note Note Note
Feedback resistor used
Notes Software pull-up resistor used only within range Current flowing pin. However, current flowing converter, converter, on-chip pull-up resistor included. operation (when oscillation mode selection register (OSMS) 00H). operation (when OSMS 01H). When main system clock stopped. High-speed mode operation (when processor clock control register (PCC) 00H). Low-speed mode operation (when 04H). Remarks Unless otherwise specified, alternate-function characteristics same port characteristics. Main system clock frequency X/2) Main system clock oscillation frequency
µPD78P078
Characteristics Basic Operation
Parameter Cycle time (minimum instruction execution time) Symbol Operating main system clock
Note
Test Conditions fX/2
Note
MIN.
2/fsam
Note
TYP.
MAX.
Unit
Operating subsystem clock TI00 input high-/lowlevel width TI01 input high-/lowlevel width TI1, TI2, TI5, input frequency TI1, TI2, TI5, input high-/low-level width Interrupt input high-/ low-level width TIH1, tTIL1 tINTH INTL INTP1 INTP6, RESET low-level width INTP0 TIH00 TIL00 TIH01 TIL01 fTI1
2/fsam Note 2/fsam Note
2/fsam Note 2/fsam Note
2/fsam
Note
Notes When oscillation mode selection register (OSMS) 00H. When OSMS 01H. fsam selected fXX/2 fXX/32, fXX/128 bits (SCS0, SCS1) sampling clock selection register (SCS). Remark fXX: Main system clock frequency fX/2) Main system clock oscillation frequency
µPD78P078
(Main System Clock fX/2 Operation)
(Main System Clock Operation)
Cycle Time
Operation guaranteed range
Cycle Time
Operation guaranteed range
Power Supply Voltage
Power Supply Voltage
µPD78P078
Read/Write Operation When PCC2 PCC0 000B
Parameter ASTB high-level width Address setup time Address hold time Address Data input time Data input time Read data hold time low-level width WAIT input time WAIT input time WAIT low-level width Write data setup time Write data hold time low-level width ASTB delay time ASTB delay time external fetch ASTB delay time external fetch address hold time write data output time write data output time address hold time WAIT delay time WAIT delay time RDWD tWRWD WRADH WTRD WTWR 0.85tCY 1.15t 1.15t 1.15tCY 3.15tCY 3.15tCY RDADH 0.85tCY 1.15tCY Symbol ASTH ADD1 ADD2 tRDD1 tRDD2 tRDH RDL1 RDL2 RDWT1 RDWT2 WRWT ASTRD ASTWR RDAST load resistance (1.15 2n)t (2.85 2n)tCY (2.85 2n)tCY 0.85t 0.85tCY 1.15tCY 2n)t (2.85 2n)tCY 0.85t 2tCY 2tCY 2n)tCY Test Conditions MIN. 0.85tCY 0.85tCY (2.85 2n)t 2n)tCY 2n)tCY (2.85 2n)tCY MAX. Unit
Remarks
MCS: oscillation mode selection register (OSMS) PCC2 PCC0: processor clock control register (PCC) CY/4 indicates number waits.
µPD78P078
Except when PCC2 PCC0 000B
Parameter ASTB high-level width Address setup time Address hold time Address Data input time Data input time Read data hold time low-level width WAIT input time WAIT input time WAIT low-level width Write data setup time Write data hold time low-level width ASTB delay time ASTB delay time external fetch ASTB delay time external fetch address hold time write data output time write data output time address hold time WAIT delay time WAIT delay time tRDWD WRWD WRADH WTRD WTWR 0.4tCY 0.6t 0.6t 2.6tCY 2.6tCY RDADH Symbol ASTH tADH ADD1 ADD2 RDD1 RDD2 RDL1 RDL2 RDWT1 RDWT2 WRWT tWTL tWDS ASTRD ASTWR RDAST load resistance 2n)t (2.4 2n)t (2.4 2n)t 0.4tCY 1.4tCY (1.4 2n)t (2.4 2n)t 2tCY 2tCY 2n)tCY Test Conditions MIN. 0.4tCY 2n)tCY 2n)tCY (1.4 2n)t (2.4 2n)t MAX. Unit
Remarks
MCS: oscillation mode selection register (OSMS) PCC2 PCC0: processor clock control register (PCC) TCY/4 indicates number waits.
µPD78P078
Serial Interface Serial Interface Channel 3-wire serial mode (SCK0 internal clock output)
Symbol KCY1 Test Conditions SCK0 high-/low-level width setup time SCK0 KH1, SIK1 hold time (from SCK0 SCK0 output delay time tKSO1 Note KSI1 MIN. KCY1 tKCY1/2 TYP. MAX. Unit
Parameter SCK0 cycle time
Note output line load capacitance. (ii) 3-wire serial mode (SCK0 external clock input)
Symbol KCY2 Test Conditions SCK0 high-/low-level width KH2, setup time SCK0 hold time (from SCK0 SCK0 output delay time SCK0 rise, fall time When using external device expansion function When using external device expansion function KSO2 Note KSI2 SIK2 MIN. TYP. MAX. Unit
Parameter SCK0 cycle time
Note output line load capacitance.
µPD78P078
(iii) mode (SCK0 internal clock output)
Parameter SCK0 cycle time Symbol KCY3 Test Conditions SCK0 high-/low-level width SB0, setup time SCK0 SB0, hold time (from SCK0 SCK0 SB0, output delay time SCK0 SB0, SB0, SCK0 SB0, high-level width SB0, low-level width KSO3 Note KCY3 KCY3 KCY3 KCY3 KSI3 tKL3 SIK3 MIN. KCY3/2 tKCY3/2 KCY3/2 TYP. MAX. Unit
Note SB0, output line load resistance load capacitance. (iv) mode (SCK0 external clock input)
Parameter SCK0 cycle time Symbol KCY4 Test Conditions SCK0 high-/low-level width tKL4 SB0, setup time SCK0 SB0, hold time (from SCK0 SCK0 SB0, output delay time SCK0 SB0, SB0, SCK0 SB0, high-level width SB0, low-level width SCK0 rise, fall time When using external device expansion function When using external device expansion function KSO4
Note
MIN. KCY4/2
TYP.
MAX.
Unit
SIK4
KSI4
KCY4 KCY4 KCY4 KCY4
Note SB0, output line load resistance load capacitance.
µPD78P078
2-wire serial mode (SCK0 internal clock output)
Parameter SCK0 cycle time Symbol KCY5 Test Conditions SCK0 high-level width SCK0 low-level width SB0, setup time SCK0 tSIK5
Note
MIN.
TYP.
MAX.
Unit
tKCY5/2 KCY5/2 tKCY5 KCY5/2
SB0, hold time (from SCK0 SCK0 SB0, output delay time
tKSI5 KSO5
Note SCK0, SB0, output line load resistance load capacitance. (vi) 2-wire serial mode (SCK0 external clock input)
Parameter SCK0 cycle time Symbol tKCY6 Test Conditions SCK0 high-level width SCK0 low-level width SB0, setup time SCK0 SB0, hold time (from SCK0 SCK0 SB0, output delay time SCK0 rise, fall time KSO6
Note
MIN. KCY6
TYP.
MAX.
Unit
SIK6 KSI6
When using external device expansion function When using external device expansion function
Note SB0, output line load resistance load capacitance.
µPD78P078
Serial Interface Channel 3-wire serial mode (SCK1 internal clock output)
Symbol KCY7 Test Conditions SCK1 high-/low-level width setup time SCK1 tKL7 SIK7 hold time (from SCK1 SCK1 output delay time KSO7 Note KSI7 MIN. KCY7 tKCY7/2 TYP. MAX. Unit
Parameter SCK1 cycle time
Note output line load capacitance. (ii) 3-wire serial mode (SCK1 external clock input)
Parameter SCK1 cycle time Symbol KCY8 Test Conditions SCK1 high-/low-level width tKL8 setup time SCK1 hold time (from SCK1 SCK1 output delay time SCK1 rise, fall time When using external device expansion function When using external device expansion function KSO8 Note KSI8 SIK8 MIN. TYP. MAX. Unit
Note output line load capacitance.
µPD78P078
(iii) 3-wire serial mode with automatic transmit/receive function (SCK1 internal clock output)
Parameter SCK1 cycle time Symbol KCY9 Test Conditions SCK1 high-/low-level width setup time SCK1 KH9, SIK9 hold time (from SCK1 SCK1 output delay time SCK1 Strobe signal high-level width Busy signal setup time busy signal detection timing) Busy signal hold time (from busy signal detection timing) Busy inactive SCK1 KCY9 tSBW KCY9/2 KCY9 KCY9 KCY9 tKCY9/2 KCY9 KCY9 KCY9 tKSO9 Note KSI9 MIN. KCY9 tKCY9/2 TYP. MAX. Unit
Note output line load capacitance.
µPD78P078
(iv) 3-wire serial mode with automatic transmit/receive function (SCK1 external clock input)
Parameter SCK1 cycle time Symbol KCY10 Test Conditions SCK1 high-/low-level width KH10 tKL10 setup time SCK1 hold time (from SCK1 SCK1 output delay time SCK1 rise, fall time R10, When using external device expansion function When using external device expansion function KSO10 Note KSI10 SIK10 MIN. TYP. MAX. Unit
Note output line load capacitance.
µPD78P078
Serial Interface Channel 3-wire serial mode (SCK2 internal clock output)
Symbol tKCY11 Test Conditions SCK2 high-/low-level width setup time SCK2 KH11, KL11 SIK11 hold time (from SCK2 SCK2 output delay time KSO11 Note KSI11 MIN. KCY11/2 tKCY11/2 TYP. MAX. Unit
Parameter SCK2 cycle time
Note output line load capacitance. (ii) 3-wire serial mode (SCK2 external clock input)
Parameter SCK2 cycle time Symbol tKCY12 Test Conditions SCK2 high-/low-level width KH12, KL12 setup time SCK2 hold time (from SCK2 SCK2 output delay time SCK2 rise, fall time R12, When using external device expansion function KSO12 Note KSI12 SIK12 MIN. TYP. MAX. Unit
Note output line load capacitance.
µPD78P078
(iii) UART mode (dedicated baud rate generator output)
Parameter Transfer rate Symbol Test Conditions MIN. TYP. MAX. Unit
(iv) UART mode (external clock input)
Parameter ASCK cycle time Symbol KCY13 Test Conditions ASCK high-/low-level width KH13 tKL13 Transfer rate ASCK rise, fall time R13, When using external device expansion function MIN. TYP. MAX. Unit
µPD78P078
Timing Test Point (Excluding Inputs)
Test points
Clock Timing
1/fX VIH4 (MIN.) VIL4 (MAX.)
input
1/fXT tXTL tXTH VIH5 (MIN.) VIL5 (MAX.)
input
Timing
tTIL00, tTIL01
tTIH00, tTIH01
TI00, TI01
1/fTI1 tTIL1 tTIH1
TI1, TI2, TI5,
µPD78P078
Read/Write Operation External fetch wait):
High-order (low-order) 8-bit address tADD1 Hi-Z
tADS ASTB
Low-order 8-bit address
Instruction code
tASTH
tADH
tRDD1
tRDADH tRDAST
tASTRD tRDL1 tRDH
Remark
effective only separate mode.
External fetch (wait insertion):
High-order (low-order) 8-bit address tADD1
tADS tASTH ASTB
Low-order 8-bit address
Hi-Z tRDD1
Instruction code
tADH
tRDADH tRDAST
tASTRD WAIT tRDWT1 tWTL tWTRD tRDL1 tRDH
Remark
effective only separate mode.
µPD78P078
External data access wait):
tADS tASTH ASTB tADD2 Low-order Hi-Z
8-bit address
High-order (low-order) 8-bit address Hi-Z Hi-Z
Read data tRDD2 tRDH
Write data
tADH
tASTRD tASTWR tWRL tRDL2 tRDWD tWRWD tWDS tWDH tWRADH
Remark
effective only separate mode.
External data access (wait insertion):
tADS tASTH ASTB tASTRD
Low-order 8-bit address
High-order (low-order) 8-bit address tADD2 Hi-Z Hi-Z Hi-Z
Read data tRDH
Write data
tADH tRDD2
tRDL2 tASTWR WAIT tRDWT2 tWTL tWTRD
tRDWD tWRWD
tWDS
tWDH tWRADH
tWRL tWTL tWRWT tWTWR
Remark
effective only separate mode.
µPD78P078
Serial Transfer Timing 3-wire serial mode:
tKCYm tKLm SCK0 SCK2 tKHm
tSIKm
tKSIm
tKSOm
Input data
Output data
Remark
mode (bus release signal transfer):
tKCY3, tKL3, SCK0 tKSB SB0, tKSO3, tSBL tSBH tSBK tSIK3, tKSI3, tKH3,
mode (command signal transfer):
tKCY3, tKL3, SCK0 tKSB SB0, tKSO3, tSBK tSIK3, tKSI3, tKH3,
µPD78P078
2-wire serial mode:
tKCY5, tKL5, SCK0 tKH5,
tKSO5,
tSIK5,
tKSI5,
SB0,
3-wire serial mode with automatic transmit/receive function:
tSIK9, tKSO9,
tKSI9, tKH9,
tF10 SCK1 tKL9, tKCY9, tR10 tSBD tSBW
3-wire serial mode with automatic transmit/receive function (busy processing):
SCK1
Note
Note tBYS
Note tBYH tSPS
BUSY (Active high)
Note signal actually here, represented this show timing.
µPD78P078
UART mode (external clock input):
tKCY13 tKL13 tR13 ASCK tKH13 tF13
µPD78P078
Converter Characteristics AVDD AVSS
Parameter Resolution Total error
Note
Symbol
Test Conditions AVREF0
MIN.
TYP.
MAX. AVREF0 AVDD
Unit
Conversion time Sampling time Analog input voltage Reference voltage AVREF0 resistance
CONV SAMP VIAN AVREF0 RAIREF0
19.1 12/fxx AVSS
Note Excluding quantization error (±1/2LSB). Shown percentage full scale value. Remark Main system clock frequency Main system clock oscillation frequency
Converter Characteristics AVSS
Parameter Resolution Total error Note Note Settling time
Note
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Note AVREF1 AVREF1 AVREF1
Output resistance Analog reference voltage AVREF1 resistance
AVREF1 RAIREF1
Note DACS0, DACS1 Note
Notes converter output load resistance load capacitance. Value converter channel. Remark DACS0, DACS1: conversion value setting register
µPD78P078
Data Memory STOP Mode Supply Voltage Data Retention Characteristics
Parameter Data retention supply voltage Data retention supply current Symbol VDDDR DDDR VDDDR When subsystem clock stopped feedback resistor disconnected Release signal setup time Oscillation stabilization wait time tSREL WAIT Release RESET Release interrupt 217/f Note Test Conditions MIN. TYP. MAX. Unit
Note 12/f 214/f 217/f selected bits (OSTS0 OSTS2) oscillation stabilization time selection register. Remark fXX: Main system clock frequency fX/2) Main system clock oscillation frequency
Data Retention Timing (STOP mode released RESET)
Internal reset operation HALT mode STOP mode Data retention mode VDDDR STOP instruction execution RESET tSREL Operating mode
tWAIT
Data Retention Timing (Standby release signal: STOP mode released interrupt signal)
HALT mode STOP mode Data retention mode VDDDR STOP instruction execution Standby release signal (interrupt request) tWAIT tSREL Operating mode
µPD78P078
Interrupt Input Timing
tINTL INTP0 INTP6
tINTH
RESET Input Timing
tRSL
RESET
µPD78P078
PROM Programming Characteristics Characteristics PROM Write Mode 0.25 12.5
Parameter Input voltage, high Input voltage, Output voltage, high Output voltage, Input leakage current supply voltage supply voltage supply current supply current Symbol Symbol Note 12.2 6.25 12.5 Test Conditions MIN. 12.8 6.75 TYP. MAX. Unit
PROM Read Mode
Parameter Input voltage, high Input voltage, Output voltage, high Output voltage, Input leakage current Output leakage current supply voltage supply voltage supply current supply current Symbol Symbol Note VOH1 VOH2 CCA1 VIL, -100 VOUT VDD, Test Conditions MIN. TYP. MAX. Unit
Note Corresponding PD27C1001A symbol.
µPD78P078
Characteristics PROM Write Mode Page program mode 0.25 12.5
Parameter Address setup time setup time setup time Input data setup time Address hold time (from Symbol Symbol Note Input data hold time (from data output float delay time setup time setup time Program pulse width valid data delay time pulse width during data latching setup time hold time hold time PGMS PGMS tVPS 0.095 0.105 tAHL Test Conditions MIN. TYP. MAX. Unit
Byte program mode 0.25 12.5
Parameter Address setup time setup time setup time Input data setup time Address hold time (from Input data hold time (from data output float delay time setup time setup time Program pulse width valid data delay time hold time tVPS 0.095 0.105 Symbol Symbol Note Test Conditions MIN. TYP. MAX. Unit
Note Corresponding µPD27C1001A symbol.
µPD78P078
PROM Read Mode
Parameter Address data output delay time data output delay time data output delay time data output float delay time Address data hold time Symbol Symbol Note tACC Test Conditions MIN. TYP. MAX. Unit
Note Corresponding PD27C1001A symbol. PROM Programming Mode
Parameter PROM programming mode setup time Symbol Symbol Note Test Conditions MIN. TYP. MAX. Unit
µPD78P078
PROM Write Mode Timing (page program mode)
Page data latch Hi-Z tVPS tVDS Data input tAHL
Page program
Program verify
tAHV
Hi-Z tPGMS output
Data
Hi-Z
tCES tOES tCEH
tOEH
µPD78P078
PROM Write Mode Timing (byte program mode)
Program tOES tCES tVDS tVPS Hi-Z Data input Hi-Z
Program verify
Data output Hi-Z
tOEH
Cautions should applied before removed after VPP. must exceed +13.5 including overshoot. Reliability adversely affected removal/reinsertion performed while +12.5 being applied PROM Read Mode Timing
Effective address
tACC Note Hi-Z Note Data output Hi-Z Note
Notes want read within range tACC, make input delay time from fall maximum tOE. time from when either first reaches VIH.
µPD78P078
PROM Programming Mode Setting Timing
RESET
tSMA Effective address
µPD78P078
CHARACTERISTIC CURVES (REFERENCE VALUES)
MHz)
10.0
HALT oscillation, oscillation)
Supply Current [mA]
0.05
HALT stop, oscillation)
0.01
0.005
0.001 Supply Voltage
µPD78P078
MHz, MHz)
10.0
HALT oscillation, oscillation)
Supply Current [mA]
0.05
HALT stop, oscillation)
0.01
0.005
0.001
Supply Voltage
µPD78P078
PACKAGE DRAWINGS
PLASTIC (FINE PITCH)
detail lead
NOTE
ITEM MILLIMETERS 16.0±0.2 14.0±0.2 14.0±0.2 16.0±0.2 0.22 +0.05 -0.04 0.10 (T.P.) 1.0±0.2 0.5±0.2 0.17 +0.03 -0.07 0.10 1.45 0.125±0.075 5°±5° MAX. INCHES 0.630±0.008 0.551 +0.009 -0.008 0.551 +0.009 -0.008 0.630±0.008 0.039 0.039 0.009±0.002 0.004 0.020 (T.P.) 0.039 +0.009 -0.008 0.020 +0.008 -0.009 0.007 +0.001 -0.003 0.004 0.057 0.005±0.003 5°±5° 0.067 MAX. P100GC-50-7EA-2
Each lead centerline located within 0.10 (0.004 inch) true position (T.P.) maximum material condition.
Remark
shape material versions same those mass-produced versions.
µPD78P078
PLASTIC LQFP (FINE PITCH)
detail lead
NOTE Each lead centerline located within 0.08 (0.003 inch) true position (T.P.) maximum material condition.
ITEM MILLIMETERS 16.00±0.20 14.00±0.20 14.00±0.20 16.00±0.20 1.00 1.00 0.22 +0.05 -0.04 0.08 0.50 (T.P.) 1.00±0.20 0.50±0.20 0.17 +0.03 -0.07 0.08 1.40±0.05 0.10±0.05 1.60 MAX. INCHES 0.630±0.008 0.551 +0.009 -0.008 0.551 +0.009 -0.008 0.630±0.008 0.039 0.039 0.009±0.002 0.003 0.020 (T.P.) 0.039 +0.009 -0.008 0.020 +0.008 -0.009 0.007 +0.001 -0.003 0.003 0.055±0.002 0.004±0.002 0.063 MAX. S100GC-50-8EU
Remark
shape material versions same those mass-produced versions.
µPD78P078
PLASTIC
detail lead
NOTE Each lead centerline located within 0.15 (0.006 inch) true position (T.P.) maximum material condition. ITEM
P100GF-65-3BA1-2 MILLIMETERS 23.6 20.0 14.0 17.6 0.30 0.10 0.15 0.65 (T.P.) 0.15+0.10 -0.05 0.10 MAX. INCHES 0.929 0.016 0.795 +0.009 -0.008 0.551+0.009 -0.008 0.693 0.016 0.031 0.024 0.012+0.004 -0.005 0.006 0.026 (T.P.) 0.071+0.008 -0.009 0.031+0.009 -0.008 0.006+0.004 -0.003 0.004 0.106 0.004 0.004 0.119 MAX.
Remark
shape material versions same those massproduced versions.
5°±5°
µPD78P078
CERAMIC WQFN
X100KW-65A-1 NOTE Each lead centerline located within 0.06 (0.003 inch) true position (T.P.) maximum material condition. ITEM MILLIMETERS 20.6 19.0 13.8 14.6 1.94 2.14 MAX, 0.45 0.10 0.06 0.65 0.875 1.125 3.17 12.0 0.75 0.10 INCHES 0.811 0.016 0.748 0.543 0.575 0.016 0.076 0.084 0.138 MAX. 0.018 +0.004 -0.005 0.003 0.026 0.039 +0.009 -0.008 0.012 0.034 0.044 0.125 0.472 0.030+0.008 -0.009 0.004
µPD78P078
RECOMMENDED SOLDERING CONDITIONS
recommended that PD78P078 soldered under following conditions. details recommended soldering conditions, refer information document "Semiconductor Device Mounting Technology Manual" (C10535E). soldering methods conditions other than those recommended, please contact your sales representative. Table 12-1. Soldering Conditions Surface Mount Devices (1/2) PD78P078GC-7EA: 100-pin plastic (fine pitch) resin thickness: 1.45
Soldering Method Infrared reflow Soldering Conditions Package peak temperature: Reflow time: seconds less higher), Number reflow processes: less, Exposure limit: days Note hours pre-baking required afterwards) Package peak temperature: Reflow time: seconds less higher), Number reflow processes: less, Exposure limit: days Note hours pre-baking required afterwards) temperature: below, Flow time: seconds less (per row) Symbol IR35-107-2
VP15-107-2
Partial heating
Note Exposure limit before soldering after pack package opened. Storage conditions: relative humidity less. Caution different soldering methods together (except partial heating method).
µPD78P078
Table 12-1. Soldering Conditions Surface Mount Devices (2/2) PD78P078GC-8EU: 100-pin plastic LQFP (fine pitch) resin thickness: 1.40
Soldering Method Infrared reflow Soldering Conditions Package peak temperature: Reflow time: seconds less higher), Number reflow processes: less, Exposure limit: days Note hours pre-baking required afterwards) Package peak temperature: Reflow time: seconds less higher), Number reflow processes: less, Exposure limit: days Note hours pre-baking required afterwards) Solder temperature: below, Flow time: seconds less, Number flow processes: Preheating temperature: below (package surface temperature), Exposure limit: days Note hours pre-baking required afterwards) temperature: below, Flow time: seconds less (per row) Symbol IR35-107-2
VP15-107-2
Wave soldering
WS60-107-1
Partial heating
Note Exposure limit before soldering after pack package opened. Storage conditions: relative humidity less.
µPD78P078GF-3BA: 100-pin plastic resin thickness:
Soldering Method Infrared reflow Wave soldering Soldering Conditions Package peak temperature: Reflow time: seconds less higher), Number reflow processes: less Package peak temperature: Reflow time: seconds less higher), Number reflow processes: less Solder temperature: below, Flow time: seconds less, Number flow processes: Preheating temperature: below (package surface temperature) temperature: below, Flow time: seconds less (per row) Symbol IR35-00-3 VP15-00-3 WS60-00-1
Partial heating
Caution
different soldering methods together (except partial heating method).
µPD78P078
APPENDIX DEVELOPMENT TOOLS
following development tools available support development systems using µPD78P078. Language Processing Software
RA78K/0 Note CC78K/0
Note
Assembler package common 78K/0 Series compiler package common 78K/0 Series Device file used PD78078 Subseries compiler library source file common 78K/0 Series
DF78078 Note CC78K/0-L Note
PROM Writing Tools
PG-1500 PA-78P078GC PA-78P078GF PA-78P078KL-T PG-1500 Controller Note Control program PG-1500 PROM programmer Programmer adapter connected PG-1500
Debugging Tools
IE-78000-R IE-78000-R-A IE-78000-R-BK IE-78078-R-EM EP-78064GC-R EP-78064GF-R TGC-100SDW Adapter mounted board target system created 100-pin plastic (GC-7EA, GC-8EU type). TGC-100SDW product Tokyo Eletech Corporation (03-5295-1661). Contact dealer purchase this product. EV-9200GF-100 SM78K0 Note ID78K0 Note SD78K/0 Note DF78078 Note Socket mounted board target system created 100-pin plastic (GF-3BA type) System simulator common 78K/0 Series Integrated debugger IE-78000-R-A Screen debugger IE-78000-R Device file used PD78078 Subseries In-circuit emulator common 78K/0 Series In-circuit emulator common 78K/0 Series (for integrated debugger) Break board common 78K/0 Series Emulation board evaluation PD78078 Subseries Emulation probe common PD78064
Real-Time
RX78K/0 Note MX78K0 Note Real-time used 78K/0 Series used 78K/0 Series
Notes
PC-9800 Series (MS-DOS based PC/ATand compatibles DOS/IBM DOSTM/MS-DOS) based HP9000 Series 300(HP-UXTM) based HP9000 Series 700(HP-UX), SPARCstation(SunOSTM), EWS4800 Series (EWS-UX/V) based PC-9800 Series (MS-DOS Windows based PC/AT compatibles DOS/IBM DOS/MS-DOS Windows) based NEWS(NEWS-OS) based
µPD78P078
Fuzzy Inference Development Support System
FE9000 Note 1/FE9200 Note FT9080
Note
Fuzzy knowledge data input tool Translator Fuzzy inference module Fuzzy inference debugger
/FT9085
Note
FI78K0 Note FD78K0 Note
Notes PC-9800 Series (MS-DOS) based PC/AT compatibles DOS/IBM DOS/MS-DOS) based PC/AT compatibles DOS/IBM DOS/MS-DOS Windows) based Remarks Refer 78K/0 Series Selection Guide (U11126E) information third party development tools. RA78K/0, CC78K/0, SM78K0, ID78K0, SD78K/0, RX78K/0 combination with DF78078.
µPD78P078
DRAWINGS CONVERSION SOCKET (EV-9200GF-100) RECOMMENDED FOOTPRINT
Figure A-1. Drawing EV-9200GF-100 (for Reference only)
EV-9200GF-100
No.1 index
EV-9200GF-100-G0 ITEM MILLIMETERS 24.6 18.6 12.0 22.6 25.3 16.6 19.3 0.35 INCHES 0.969 0.827 0.591 0.732 0.079 0.031 0.472 0.89 0.996 0.236 0.654 0.323 0.315 0.098 0.079 0.014
0.091 0.059
µPD78P078
Figure A-2. Recommended Footprint EV-9200GF-100 (for Reference only)
EV-9200GF-100-P1 ITEM Caution MILLIMETERS 26.3 21.6 0.65±0.02 29=18.85±0.05 INCHES 1.035 0.85 0.026+0.001 -0.002 1.142=0.742+0.002 -0.002 0.65±0.02 19=12.35±0.05 0.026+0.001 0.748=0.486+0.003 -0.002 -0.002 15.6 20.3 0.05 0.05 0.35 0.02 0.614 0.799 0.472+0.003 -0.002 0.236+0.003 -0.002 0.014+0.001 -0.001
2.36 0.03 1.57 0.03
0.093+0.001 -0.002 0.091 0.062+0.001 -0.002
Dimensions mount EV-9200 that target device (QFP) different some parts. recommended mount dimensions QFP, refer "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E).
µPD78P078
DRAWING CONVERSION ADAPTER (TGC-100SDW)
Figure A-3. Drawing TGC-100SDW (for Reference only)
Protrusion height
ITEM MILLIMETERS 21.55 0.5x24=12 0.5x24=12 15.0 21.55 INCHES 0.848 0.020x0.945=0.472 0.020 0.020x0.945=0.472 0.591 0.848 ITEM MILLIMETERS 14.45 1.85±0.25 0.25 INCHES 0.569 0.073±0.010 0.138 0.079 0.154 0.010
3.55
10.9 13.3 15.7 18.1 13.75 0.5x24=12.0 1.125±0.3 1.125±0.2 10.0 11.3 18.1
0.140
0.429 0.524 0.618 0.713 0.541 0.020x0.945=0.472 0.044±0.012 0.044±0.008 0.295 0.394 0.445 0.713
16.0 1.125±0.3 0~5°
0.177
0.630 0.044±0.012 0.000~0.197° 0.232 0.031 0.094 0.106 TGC-100SDW-G1E
0.197
0.197 0.051 0.071 0.079
0.035 0.012
note: Product TOKYO ELETECH CORPORATION.
µPD78P078
APPENDIX RELATED DOCUMENTS
Documents Related Devices
Document Name Document Japanese English U10641E U10167E Planned U12017E This document U12326E U10182E
µPD78078, 78078Y Subseries User's Manual µPD78076, 78078 Data Sheet µPD78075B, 78075BY Subseries User's Manual µPD78074B, 78075B Data Sheet µPD78P078 Data Sheet
78K/0 Series User's Manual-Instructions 78K/0 Series Instruction Table 78K/0 Series Instruction
U10641J U10167J U12560J U12017J U10168J U12326J U10903J U10904J IEM-5607 IEU-767
µPD78078 Subseries Special Function Register Table
78K/0 Series Application Note-Basic (III)
Documents Related Development Tools (User's Manual) (1/2)
Document Name Document Japanese RA78K Series Assembler Package RA78K Series Structured Assembler Preprocessor RA78K0 Assembler Package Operation Assembly Language Structured Assembly Language CC78K Series Compiler Operation Language CC78K0 Compiler CC78K/0 Compiler Application Note CC78K Series Library Source File PG-1500 PROM Programmer PG-1500 Controller PC-9800 Series (MS-DOS) Based PG-1500 Controller Series DOS) Based IE-78000-R IE-78000-R-A IE-78000-R-BK IE-78078-R-EM EP-78064 SM78K0 System Simulator Windows Based SM78K Series System Simulator ID78K0 Integrated Debugger Based ID78K0 Integrated Debugger Based ID78K0 Integrated Debugger Windows Based Reference External Part User Open Interface Specifications Reference Reference Guide U11151J U11539J U11649J U11539E U11649E Operation Language Programming Know-how U12322J U11940J EEU-704 EEU-5008 EEU-810 U10057J EEU-867 U10775J EEU-934 U10181J U10092J EEU-1335 EEU-1291 U10540E U11376E U10057E EEU-1427 U10775E EEU-1469 U10181E U10092E EEU-656 EEU-655 U11517J U11518J EEA-618 EEU-1280 EEU-1284 U11517E U11518E EEA-1208 Operation Language EEU-809 EEU-815 EEU-817 U11802J U11801J U11789J English EEU-1399 EEU-1404 EEU-1402 U11802E U11801E U11789E
Caution
contents documents listed above subject change without prior notice. Make sure latest edition when starting design.
µPD78P078
Documents Related Development Tools (User's Manual) (2/2)
Document Name Document Japanese SD78K/0 Screen Debugger PC-9800 Series (MS-DOS) Based SD78K/0 Screen Debugger PC/AT DOS) Based Introduction Reference Introduction Reference EEU-852 U10952J EEU-5024 U11279J English U10539E EEU-1414 U11279E
Documents Related Embedded Software (User's Manual)
Document Name 78K/0 Series Real-time Basic Installation 78K/0 Series MX78K0 Fuzzy Knowledge Data Input Tools 78K/0, 78K/II, 87AD Series Fuzzy Inference Development Support System Translator 78K/0 Series Fuzzy Inference Development Support System Fuzzy Inference Module 78K/0 Series Fuzzy Inference Development Support System Fuzzy Inference Debugger EEU-921 EEU-1458 EEU-858 EEU-1441 Basic U11537J U11536J U12257J EEU-829 EEU-862 Document Japanese English EEU-1438 EEU-1444
Other Documents
Document Name Package Manual Semiconductor Device Mounting Technology Manual Quality Grades Semiconductor Devices Semiconductor Device Reliability/Quality Control System Electrostatic Discharge (ESD) Test Guide Quality Assurance Semiconductor Devices Microcomputer Product Series Guide C10943X C10535J C11531J C10983J MEM-539 C11893J U11416J C10535E C11531E C10983E MEI-1202 Document Japanese English
Caution
contents documents listed above subject change without prior notice. Make sure latest edition when starting design.
µPD78P078
[MEMO]
µPD78P078
NOTES CMOS DEVICES
PRECAUTION AGAINST SEMICONDUCTORS
Note: Strong electric field, when exposed device, cause destruction gate oxide ultimately degrade device operation. Steps must taken stop generation static electricity much possible, quickly dissipate once, when occurred. Environmental control must adequate. When dry, humidifier should used. recommended avoid using insulators that easily build static electricity. Semiconductor devices must stored transported anti-static container, static shielding conductive material. test measurement tools including work bench floor should grounded. operator should grounded using wrist strap. Semiconductor devices must touched with bare hands. Similar precautions need taken boards with semiconductor devices
HANDLING UNUSED INPUT PINS CMOS
Note: connection CMOS device inputs cause malfunction. connection provided input pins, possible that internal input level generated noise, etc., hence causing malfunction. CMOS device behave differently than Bipolar NMOS devices. Input levels CMOS devices must fixed high using pull-up pull-down circuitry. Each unused should connected with resistor, considered have possibility being output pin. handling related unused pins must judged device device related specifications governing devices.
STATUS BEFORE INITIALIZATION DEVICES
Note: Power-on does necessarily define initial status device. Production process does define initial operation status device. Immediately after power source turned devices with reset function have been initialized. Hence, power-on does guarantee out-pin levels, settings contents registers. Device initialized until reset signal received. Reset operation must executed immediately after power-on devices having reset function.
µPD78P078
Regional Information
Some information contained this document vary from country country. Before using product your application, please contact office your country obtain list authorized representatives distributors. They will verify: Device availability Ordering information Product release schedule Availability related technical literature Development environment specifications (for example, specifications third-party tools components, host computers, power plugs, supply voltages, forth) Network requirements addition, trademarks, registered trademarks, export restrictions, other legal issues also vary from country country.
Electronics Inc. (U.S.)
Santa Clara, California Tel: 800-366-9782 Fax: 800-729-9288
Electronics (Germany) GmbH
Benelux Office Eindhoven, Netherlands Tel: 040-2445845 Fax: 040-2444580
Electronics Hong Kong Ltd.
Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044
Electronics (Germany) GmbH
Duesseldorf, Germany Tel: 0211-65 Fax: 0211-65
Electronics Hong Kong Ltd. Electronics (France) S.A.
Velizy-Villacoublay, France Tel: 01-30-67 Fax: 01-30-67 Seoul Branch Seoul, Korea Tel: 02-528-0303 Fax: 02-528-4411
Electronics (UK) Ltd.
Milton Keynes, Tel: 01908-691-133 Fax: 01908-670-290
Electronics (France) S.A.
Spain Office Madrid, Spain Tel: 01-504-2787 Fax: 01-504-2860
Electronics Singapore Pte. Ltd.
United Square, Singapore 1130 Tel: 253-8311 Fax: 250-3583
Electronics Italiana s.r.1.
Milano, Italy Tel: 02-66 Fax: 02-66
Electronics Taiwan Ltd. Electronics (Germany) GmbH
Scandinavia Office Taeby, Sweden Tel: 08-63 Fax: 08-63 Taipei, Taiwan Tel: 02-719-2377 Fax: 02-719-5951
Brasil S.A.
Paulo-SP, Brasil Tel: 011-889-1680 Fax: 011-889-1689
J96.
µPD78P078
FIP, IEBus, QTOP trademarks Corporation. MS-DOS Windows either registered trademarks trademarks Microsoft Corporation United States and/or other countries. DOS, PC/AT, trademarks International Business Machines Corporation. HP9000 Series 300, HP9000 Series 700, HP-UX trademarks Hewlett-Packard Company. SPARCstation trademark SPARC International, Inc. SunOS trademark Microsystems, Inc. NEWS NEWS-OS trademarks Sony Corporation. related documents indicated this publication include preliminary versions. However, preliminary versions marked such. export these products from Japan regulated Japanese government. export some these products prohibited without governmental license. export re-export some these products from country other than Japan also prohibited without license from that country. Please call sales representative. License needed PD78P078KL-T customer must judge need license PD78P078GC-7EA, µPD78P078GC-8EU, µPD78P078GF-3BA part this document copied reproduced form means without prior written consent Corporation. Corporation assumes responsibility errors which appear this document. Corporation does assume liability infringement patents, copyrights other intellectual property rights third parties arising from device described herein other liability arising from such device. license, either express, implied otherwise, granted under patents, copyrights other intellectual property rights Corporation others. While Corporation been making continuous effort enhance reliability semiconductor devices, possibility defects cannot eliminated entirely. minimize risks damage injury persons property arising from defect semiconductor device, customers must incorporate sufficient safety measures design, such redundancy, fire-containment, anti-failure features. devices classified into following three quality grades: "Standard", "Special", "Specific". Specific quality grade applies only devices developed based customer designated "quality assurance program" specific application. recommended applications device depend quality grade, indicated below. Customers must check quality grade each device before using particular application. Standard: Computers, office equipment, communications equipment, test measurement equipment, audio visual equipment, home electronic appliances, machine tools, personal electronic equipment industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment medical equipment (not specifically designed life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems medical equipment life support, etc. quality grade devices "Standard" unless otherwise specified NEC's Data Sheets Data Books. customers intend devices applications other than those specified Standard quality grade, they should contact sales representative advance. Anti-radioactive design implemented this product.
96.5
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