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µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY
Top Searches for this datasheetINTEGRATED CIRCUIT µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY 8-BIT SINGLE-CHIP MICROCONTROLLER DESCRIPTION µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY products µPD78018FY subseries within 78K/0 series, products which added control function µPD78018F subseries. one-time PROM EPROM product µPD78P018FY capable operating same power supply voltage mask product other development tools also provided. Functions described detail following User's Manual, which should read when carring design work. µPD78018F, 78018FY Subseries User's Manual U10659E 78K/0 Series Users Manual Instruction U12326E FEATURES Serial interface channels (I2C mode channel) Large on-chip Item Product Name Program Memory (ROM) bytes bytes bytes bytes bytes bytes bytes 1024 bytes Internal HighSpeed bytes Data Memory Internal Expanded Buffer bytes Package 64-pin plastic shrink (750 mil) 64-pin plastic µPD78011FY µPD78012FY µPD78013FY µPD78014FY µPD78015FY µPD78016FY µPD78018FY bytes 1024 bytes External memory expansion space bytes Minimum instruction execution time varied from high-speed (0.4 ultra-low-speed (122 ports: (N-ch open-drain 8-bit resolution converter channels Timer channels Supply voltage APPLICATION FIELDS Cellular phone, pager, VCR, audio, camera, home appliances, information this document subject change without notice. Document U10281EJ2V0DS00 (2nd edition) Date Published August 1997 Printed Japan mark shows major revised points. 1994 µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY ORDERING INFORMATION Part Number Package 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin plastic plastic plastic plastic plastic plastic plastic plastic plastic plastic plastic plastic plastic plastic shrink shrink shrink shrink shrink shrink shrink (750 mil) (750 mil) (750 mil) (750 mil) (750 mil) (750 mil) (750 mil) Remark indicates code suffix. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY 78K/0 SERIES DEVELOPMENT following shows products organized according usage. names parallelograms subseries names. Products mass production Products under development subseries products compatible with bus. Control 100-pin 100-pin 100-pin 100-pin 80-pin 80-pin 80-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 42/44-pin PD78075B PD78078 PD78070A PD780058 PD78058F µPD78054 µPD780034 PD780024 PD78014H µPD78018F µPD78014 PD780001 µPD78002 PD78083 Inverter control µPD78075BY µPD78078Y PD78070AY PD780018AY PD780058YNote PD78058FY PD78054Y µPD780034Y PD780024Y µPD78018FY PD78014Y PD78002Y EMI-noise reduced version PD78078 timer added PD78054 external interface enhanced ROM-less version µPD78078 Serial PD78078Y enhanced function limited. Serial PD78054 enhanced EMI-noise reduced. EMI-noise reduced version PD78054 UART converter were enhanced PD78014 enhanced converter PD780024 enhanced Serial PD78018F added EMI-noise reduced. EMI-noise reduced version µPD78018F Low-voltage (1.8 operation version µPD78014, with larger selection capacities converter 16-bit timer were added µPD78002 converter added µPD78002 Basic subseries control On-chip UART, capable operating voltage (1.8 64-pin 64-pin µPD780964 µPD780924 FIPdrive converter PD780924 enhanced On-chip inverter control circuit UART. EMI-noise reduced. 100-pin 100-pin 78K/0 Series 80-pin 80-pin PD780208 PD780228 PD78044H µPD78044F drive PD78044F were enhanced, Display output total: PD78044H were enhanced, Display output total: N-ch open drain added PD78044F, Display output total: Basic subseries driving FIP, Display output total: 100-pin 100-pin 100-pin PD780308 µPD78064B µPD78064 µPD780308Y PD78064Y µPD78064 enhanced, ROM, capacity increased EMI-noise reduced version PD78064 Basic subseries driving LCDs, On-chip UART IEBussupported 80-pin 80-pin PD78098B PD78098 Meter control EMI-noise reduced version µPD78098 IEBus controller added µPD78054 80-pin PD780973 On-chip controller/driver automobile meters 64-pin PD78P0914 On-chip output, digital code decoder, Hsync counter Note Under planning µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY following lists main functional differences between subseries products. Functions Subseries Name Control µPD78075BY MIN. Value Capacity Serial Interface Configuration 3-wire/2-wire/I2C With automatic transmit/receive function, 3-wire 3-wire/UART With automatic transmit/receive function, 3-wire Time division, 3-wire (for multimaster) 3-wire/2-wire/I2C With automatic transmit/receive function, 3-wire 3-wire/time division UART 3-wire/2-wire/I2C With automatic transmit/receive function, 3-wire 3-wire/UART UART 3-wire (for multimaster) µPD78078Y µPD78070AY µPD780018AY µPD780058Y µPD78058FY µPD78054Y µPD780034Y µPD780024Y µPD78018FY µPD78014Y µPD78002Y drive 3-wire/2-wire/I2C With automatic transmit/receive function, 3-wire 3-wire/2-wire/SBI/I2C With automatic transmit/receive function, 3-wire 3-wire/2-wire/SBI/I2C 3-wire/2-wire/I2C 3-wire/time division UART 3-wire µPD780308Y µPD78064Y 3-wire/2-wire/I2C 3-wire/UART Remark functions other than serial interface same those subseries products without suffix µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY OVERVIEW FUNCTION (1/2) Item Product Name High-speed Expanded Buffer Memory space General-purpose registers bytes bytes bits registers bits registers banks) µPD78011FY µPD78012FY µPD78013FY µPD78014FY µPD78015FY µPD78016FY µPD78018FY bytes bytes bytes bytes bytes 1024 bytes bytes 1024 bytes bytes bytes Internal memory bytes Minimum instruction execution time On-chip minimum instruction execution time cycle modification function When main system clock selected When subsystem clock selected Instruction µs/0.8 µs/1.6 µs/3.2 µs/6.4 10.0 operation) 32.768 operation) 16-bit operation Multiplication/division bits bits,16 bits bits) manipulation (set, reset, test, boolean operation) correction, etc. ports Total CMOS input CMOS N-channel open-drain withstand voltage) converter 8-bit resolution channels Operable over wide power supply voltage range: 3-wire serial I/O/2-wire serial I/O/I2C mode selectable: channel 3-wire mode (on-chip max. bytes automatic data transmit/receive function): channel 16-bit timer/event counter 8-bit timer/event counter Watch timer Watchdog timer channel channels channel channel Serial interface Timer Timer output Clock output (14-bit output 39.1 kHz, 78.1 kHz, kHz, kHz, kHz, 1.25 main system clock: 10.0 operation), 32.768 subsystem clock: 32.768 operation) kHz, kHz, main system clock: 10.0 operation) Internal External Internal Buzzer output Vectored interrupt sources Non-maskable Software Maskable µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY OVERVIEW FUNCTION (2/2) Item Product Name Test input µPD78011FY µPD78012FY µPD78013FY µPD78014FY µPD78015FY µPD78016FY µPD78018FY Internal External +85°C 64-pin plastic shrink (750 mil) 64-pin plastic Supply voltage Operating ambient temperature Package µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY TABLE CONTENTS CONFIGURATION (TOP VIEW) BLOCK DIAGRAM FUNCTIONS PORT PINS PINS OTHER THAN PORT PINS CIRCUITS RECOMMENDED CONNECTION UNUSED PINS MEMORY SPACE PERIPHERAL HARDWARE FUNCTION FEATURES PORTS CLOCK GENERATOR TIMER/EVENT COUNTER CLOCK OUTPUT CONTROL CIRCUIT BUZZER OUTPUT CONTROL CIRCUIT CONVERTER SERIAL INTERFACES INTERRUPT FUNCTIONS TEST FUNCTIONS INTERRUPT FUNCTIONS TEST FUNCTIONS EXTERNAL DEVICE EXPANSION FUNCTIONS STANDBY FUNCTIONS RESET FUNCTIONS INSTRUCTION ELECTRICAL SPECIFICATIONS CHARACTERISTIC CURVE (REFERENCE VALUES) PACKAGE DRAWINGS RECOMMENDED SOLDERING CONDITIONS APPENDIX DEVELOPMENT TOOLS APPENDIX RELATED DOCUMENTS µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY CONFIGURATION (TOP VIEW) 64-Pin Plastic Shrink (750 mil) P20/SI1 P21/SO1 P22/SCK1 P23/STB P24/BUSY P25/SI0/SB0/SDA0 P26/SO0/SB1/SDA1 P27/SCK0/SCL P30/TO0 P31/TO1 P32/TO2 P33/TI1 P34/TI2 P35/PCL P36/BUZ P40/AD0 P41/AD1 P42/AD2 P43/AD3 P44/AD4 P45/AD5 P46/AD6 P47/AD7 P50/A8 P51/A9 P52/A10 P53/A11 P54/A12 P55/A13 P17/ANI7 P16/ANI6 P15/ANI5 P14/ANI4 P13/ANI3 P12/ANI2 P11/ANI1 P10/ANI0 P04/XT1 P03/INTP3 P02/INTP2 P01/INTP1 P00/INTP0/TI0 RESET P67/ASTB P66/WAIT P65/WR P64/RD P57/A15 P56/A14 Cautions Always connect (Internally Connected) directly. Always connect AVDD VDD. Always connect AVSS VSS. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY 64-Pin Plastic P26/SO0/SB1/SDA1 P25/SI0/SB0/SDA0 P27/SCK0/SCL P24/BUSY P22/SCK1 P17/ANI7 P16/ANI6 P15/ANI5 P14/ANI4 P13/ANI3 P30/TO0 P31/TO1 P32/TO2 P33/TI1 P34/TI2 P35/PCL P36/BUZ P40/AD0 P41/AD1 P42/AD2 P43/AD3 P44/AD4 P45/AD5 P46/AD6 P12/ANI2 P21/SO1 P23/STB P20/SI1 P11/ANI1 P10/ANI0 P04/XT1 P03/INTP3 P02/INTP2 P01/INTP1 P00/INTP0/TI0 RESET P67/ASTB P66/WAIT P56/A14 P57/A15 P64/RD P47/AD7 P52/A10 P53/A11 P54/A12 P55/A13 Cautions Always connect (Internally Connected) directly. Always connect AVDD VDD. Always connect AVSS VSS. P65/WR P50/A8 P51/A9 µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY ANI0 ANI7 ASTB AVDD AVREF AVSS BUSY Address Address/Data Analog Input Address Strobe Analog Power Supply Analog Reference Voltage Analog Ground Busy Buzzer Clock Internally Connected RESET SB0, SCK0, SCK1 SDA0, SDA1 SI0, SO0, WAIT XT1, Programmable Clock Read Strobe Reset Serial Serial Clock Serial Clock Serial Data Serial Input Serial Output Strobe Timer Input Timer Output Power Supply Ground Wait Write Strobe Crystal (Main System Clock) Crystal (Subsystem Clock) INTP0 INTP3 Interrupt from Peripherals Port0 Port1 Port2 Port3 Port4 Port5 Port6 µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY BLOCK DIAGRAM TO0/P30 TI0/INTP0/P00 TO1/P31 TI1/P33 TO2/P32 TI2/P34 16-bit TIMER/ EVENT COUNTER PORT0 8-bit TIMER/ EVENT COUNTER PORT1 8-bit TIMER/ EVENT COUNTER PORT2 WATCHDOG TIMER PORT3 WATCH TIMER 78K/0 CORE SERIAL INTERFACE PORT4 SI0/SB0/P25 SO0/SB1/P26 SCK0/P27 SI1/P20 SO1/P21 SCK1/P22 STB/P23 BUSY/P24 SERIAL INTERFACE PORT5 PORT6 AD0/P40 AD7/P47 A8/P50 A15/P57 ANI0/P10 ANI7/P17 AVDD AVSS AVREF EXTERNAL ACCESS RD/P64 WR/P65 WAIT/P66 ASTB/P67 RESET CONVERTER INTP0/P00 INTP3/P03 INTERRUPT CONTROL SYSTEM CONTROL BUZ/P36 BUZZER OUTPUT PCL/P35 CLOCK OUTPUT CONTROL (VPP) Remarks Internal capacity varies depending product. µPD78P018FY µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY FUNCTIONS PORT PINS (1/2) Name P04Note Input Input/ output Input only Port 8-bit input/output port. Input/output specified bit-wise. When used input port, on-chip pull-up resistor used software.Note Port 8-bit input/output port. Input/output specified bit-wise. When used input port, on-chip pull-up resistor used software. Input Input Input Input/ output Port 5-bit port Input only Input/output specified bit-wise. When used input port, on-chip pull-up resistor used software. Function Reset Input Input DualFunction INTP0/TI0 INTP1 INTP2 INTP3 ANI0 ANI7 Input/ output Input SCK1 BUSY SI0/SB0/SDA0 SO0/SB1/SDA1 SCK0/SCL Input/ output Port 8-bit input/output port. Input/output specified 1-bit units. When used input port, on-chip pull-up resistor used software. Input Input/ output Port 8-bit input/output port. Input/output specified 8-bit unit. When used input port, on-chip pull-up resistor used software. Test input flag (KRIF) falling edge detection. Input Notes When using P04/XT1 pins input port, (FRC) processor clock control register (PCC). on-chip feedback register subsystem clock oscillator. When using P10/ANI0 P17/ANI7 pins converter analog input, on-chip pull-up resistor automatically unused. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY PORT PINS (2/2) Name Input/ output Function Port 8-bit input/output port. driven directly. Input/output specified bit-wise. When used input port, on-chip pull-up resistor used software. Port 8-bit input/output port. Input/output specified bit-wise. N-ch open-drain input/output port. On-chip pull-up resistor specified mask option. driven directly. Reset Input DualFunction Input/ output Input When used input port, on-chip pull-up resistor used software. WAIT ASTB PINS OTHER THAN PORT PINS (1/2) Name INTP0 INTP1 INTP2 INTP3 SDA0 SDA1 SCK0 SCK1 BUSY Output Input Serial interface automatic transmit/receive strobe output. Serial interface automatic transmit/receive busy input. Input Input Input /output Serial interface serial clock input/output. Input Input /output Serial interface serial data input/output. Input Output Serial interface serial data output. Input Input Input Function External interrupt request input which effective edge (rising edge, falling edge, both rising edge falling edge) specified. Falling edge detection external interrupt request input. Serial interface serial data input. Input Reset Input DualFunction P00/TI0 P25/SB0/SDA0 P26/SB1/SDA1 P25/SI0/SDA0 P26/SO0/SDA1 P25/SI0/SB0 P26/SO0/SB1 P27/SCL P27/SCK0 µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY PINS OTHER THAN PORT PINS (2/2) DualFunction P00/INTP0 Input Input Input Input Input Input Input Input Name WAIT ASTB Input Function External count clock input 16-bit timer (TM0). External count clock input 8-bit timer (TM1). External count clock input 8-bit timer (TM2). Reset Input Output 16-bit timer (TM0) output (shared 14-bit output). 8-bit timer (TM1) output. 8-bit timer (TM2) output. Output Output Input /output Output Output Clock output (for main system clock, subsystem clock trimming). Buzzer output. Low-order address/data external memory expansion. High-order address external memory expansion. External memory read operation strobe signal output. External memory write operation strobe signal output. Input Output Wait insertion external memory access. Strobe output which latches address information output port port access external memory. converter analog input. converter reference voltage input. converter analog power supply. Connected VDD. converter ground potential. Connected VSS. System reset input. Main system clock oscillation crystal connection. ANI0 ANI7 AVREF AVDD AVSS RESET Input Input Input Input Input Input Subsystem clock oscillation crystal connection. Input Positive power supply. Ground potential. Internal connection. Connected directly. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY CIRCUITS RECOMMENDED CONNECTION UNUSED PINS input/output circuit type each recommended connection unused pins shown Table 3-1. input/output circuit configuration each type, refer Figure 3-1. Table 3-1. Input/Output Circuit Type Each Name P00/INTP0/TI0 P01/INTP1 P02/INTP2 P03/INTP3 P04/XT1 P10/ANI0 P17/ANI7 P20/SI1 P21/SO1 P22/SCK1 P23/STB P24/BUSY P25/SI0/SB0 P26/SO0/SB1 P27/SCK0 P30/TO0 P31/TO1 P32/TO2 P33/TI1 P34/TI2 P35/PCL P36/BUZ P40/AD0 P47/AD7 P50/A8 P57/A15 P64/RD P65/WR P66/WAIT P67/ASTB RESET AVREF AVDD AVSS Input Leave open. Connected Connected Connected Connected directly. 13-B Individually connected resistor. Individually connected resistor. Individually connected resistor. Individually connected resistor. 10-A Input Input/output Connected VSS. Individually connected resisitor. Input/output Circuit Type Input Input/output Recommended Connection when Used Connected Individually connected resistor. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Figure 3-1. Input/Output Circuits Type Type 10-A P-ch pull-up enable data open drain output disable Schmitt-Triggered Input with Hysteresis Characteristic P-ch N-ch Type P-ch data P-ch N-ch Type P-ch P-ch N-ch P-ch N-ch VREF (Threshold Voltage) pull-up enable pull-up enable data output disable Comparator output disable input enable Type input enable Type 13-B Mask Option pull-up enable data output disable P-ch P-ch N-ch data output disable N-ch P-ch Middle-High Voltage Input Buffer Type Type P-ch data P-ch N-ch pull-up enable feedback cut-off P-ch output disable µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY MEMORY SPACE memory µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY 78016FY shown Figures 4-2. Figure 4-1. Memory (µPD78011FY, 78012FY, 78013FY, 78014FY) FFFFH Special Function Registers (SFR) Bits FF00H FEFFH General-Purpose Registers Bits FEE0H FEDFH FA7FH Prohibited F800H F7FFH Internal Expanded Bits F600H F5FFH External Memory Internal High-Speed RAMNote nnnnH Note mmmmH mmmmH Prohibited Data Memory Space FAE0H FADFH FAC0H FABFH FA80H FA7FH Program Memory Space nnnnH nnnnH Buffer Bits nnnnH Program Area 1000H 0FFFH CALLF Entry Area Prohibited 0800H 07FFH Program Area External Memory 0080H 007FH CALLT Table Area 0040H 003FH Internal ROMNote Vector Table Area 0000H 0000H Note Intermal internal high-speed capacities vary depending product (refer table below). Internal High-Speed Start Address mmmmH FD00H Product Name Intenal Address nnnnH µPD78011FY µPD78012FY µPD78013FY µPD78014FY 1FFFH 3FFFH 5FFFH 7FFFH FB00H µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Figure 4-2. Memory (µPD78015FY, 78016FY, 78018FY) FFFFH Special Function Registers (SFR) Bits FF00H FEFFH General-Purpose Registers Bits FEE0H FEDFH Internal High-Speed RAMNote mmmmH mmmmH Prohibited Data Memory Space FAE0H FADFH FAC0H FABFH FA80H FA7FH Prohibited F800H F7FFH Program Memory Space kkkkH kkkkH 0800H 07FFH Internal Expanded RAMNote Program Area 0080H 007FH CALLT Table Area 0040H 003FH Internal ROMNote 0000H 0000H Vector Table Area Buffer Bits nnnnH Prohibited 1000H 0FFFH CALLF Entry Area Program Area External Memory nnnnH nnnnH Note Intermal ROM, internal high-speed RAM, internal expanded capacities vary depending product (refer table below). Internal High-Speed Start Address mmmmH FB00H Internal Expanded Start Address kkkkH F600H Product Name Intenal Address nnnnH 9FFFH BFFFH EFFFH µPD78015FY µPD78016FY µPD78018FY F400H µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY PERIPHERAL HARDWARE FUNCTION FEATURES PORTS port following three types CMOS input (P00, P04) CMOS input/output (P01 P03, port port P67) N-ch open-drain input/output(15V withstand voltage) (P60 P63) Total Table 5-1. Functions Ports Port Name Port Name P00, Port Port Port Port Dedicated Input port Input/output ports. Input/output specified bit-wise. When used input port, pull-up resistor used software. Input/output ports. Input/output specified bit-wise. When used input port, pull-up resistor used software. Input/output ports. Input/output specified bit-wise. When used input port, pull-up resistor used software. Input/output ports. Input/output specified bit-wise. When used input port, pull-up resistor used software. Input/output ports. Input/output specified 8-bit units. When used input port, pull-up resistor used software. Test input flag (KRIF) falling edge detection. Input/output ports. Input/output specified bit-wise. When used input port, pull-up resistor used software. driven directly. N-ch open-drain input/output port. Input/output specified bit-wise. On-chip pull-up resistor specified mask option. driven directly. Input/output ports. Input/output specified bit-wise. When used input port, pull-up resistor used software. Function Port Port µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY CLOCK GENERATOR There types clock generator: main system clock subsystem clock. minimum instruction exection time changed. 0.4µs/0.8µs/1.6µs/3.2µs/6.4µs (Main system clock: 10.0 operation) 122µs (Subsystem clock: 32.768 operation) Figure 5-1. Clock Generator Block Diagram XT1/P04 Subsystem Clock Osicillator Watch Timer Clock Output Function Prescaler Main System Clock Osicillator Prescaler Clock Peripheral Hardware STOP Selector Standby Control Circuit Wait Control Circuit Clock (fCPU) INTP0 Sampling Clock µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY TIMER/EVENT COUNTER following five channels incorporated timer/event counter. 16-bit timer/event counter 8-bit timer/event counter Watch timer Watchdog timer channel channels channel channel Table 5-2. Operation Timer/Event Counter 16-bit Timer/Event Counter Operation mode Functions Interval timer Externanal event counter Timer output output Pulse width mesurement Sqare wave output Interrupt request Test input channel channel output output input output 8-bit Timer/Event Counter channels channels outputs outputs Watch Timer channel input Watchdog Timer channel Figure 5-2. 16-bit Timer/Enent Counter Block Diagram Internal 16-Bit Compare Register (CR00) Pulse Output Control Circuit 16-Bit Timer Register (TM0) Clear Selector Output Control Circuit INTTM0 Match TO0/P30 fX/2 fX/22 fX/23 TI0/INTP0/P00 Edge Detector Selector INTP0 16-Bit Capture Register (CR01) Internal µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Figure 5-3. 8-bit Timer/Enent Counter Block Diagram Internal INTIM1 8-Bit Compare Register (CR10) 8-Bit Compare Register (CR20) Selector Match Output Control Circuit TO2/P32 INTTM2 fX/22 fX/210 fX/212 TI1/P33 Selector 8-Bit Timer Register (TM1) Clear Selector 8-Bit Timer Register (TM2) Clear fX/22 fX/210 fX/212 TI2/P34 Selector Selector Output Control Circuit Internal TO1/P31 Figure 5-4. Watch Timer Block Diagram fX/28 Selector Selector 5-Bit Counter Selector INTWT Prescaler Selector INTTM3 µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Figure 5-5. Watchdog Timer Block Diagram Prescaler INTWDT Maskable Interrupt Request Selector 8-Bit Counter Control Circuit RESET INTWDT Non-Maskable Interrupt Request CLOCK OUTPUT CONTROL CIRCUIT clock with following frequencies output clock output. 39.1 kHz/78.1 kHz/156 kHz/313 kHz/625 kHz/1.25 (Main system clock: 10.0 operation) 32.768 (Subsystem clock: 32.768 operation) Figure 5-6. Clock Output Control Block Diagram fX/23 fX/24 fX/25 fX/26 fX/27 fX/28 Selector Synchronization Circuit Output Control Circuit PCL/P35 BUZZER OUTPUT CONTROL CIRCUIT clock with following frequencies output buzzer output. kHz/4.9 kHz/9.8 (Main system clock: 10.0 operation) Figure 5-7. Buzzer Output Control Block Diagram fX/210 fX/211 fX/212 Selector Output Control Circuit BUZ/P36 µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY CONVERTER converter on-chip eight 8-bit resolution channels. There following method start conversion. Hardware starting Software starting Figure 5-8. Converter Block Diagram Series Resistor String ANI0/P10 ANI1/P11 ANI2/P12 ANI3/P13 ANI4/P14 ANI5/P15 ANI6/P16 ANI7/P17 Succesive Approxmation Register (SAR) AVSS Selector Selector Sample Hold Circuit Voltage Comparator AVDD AVREF INTP3/P03 Falling Edge Detector Control Circuit INTAD INTP3 Conversion Result Register (ADCR) Internal SERIAL INTERFACES There on-chip clocked serial interfaces follows. Serial Interface channel Serial Interface channel Table 5-3. Type Function Serial Interface Function 3-wire serial mode 3-wire serial mode with automatic data transmit/ receive function 2-wire serial mode (Inter mode Serial Interface Channel (MSB/LSB-first switchable) Serial Interface Channel (MSB/LSB-first switchable) (MSB/LSB-first switchable) (MSB-first) (MSB-first) µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Figure 5-9. Serial Interface Channel Block Diagram Internal SI0/SB0/SDA0/P25 Selector Serial Shift Register (SIO0) Output Latch SO0/SB1/SDA1/P26 Selector Start Condition/ Stop Condition/ Acknowledge Detection Circuit Acknowlede Output Circuit SCK0/SCL/P27 Serial Clock Counter Interrupt Request Signal Generator INTCSI0 fx/22 fx/29 Serial Clock Control Circuit Selector Figure 5-10. Serial Interface Channel Block Diagram Internal Automatic Data Transmit/ Receive Address Pointer (ADTP) Buffer SI1/P20 Serial Shift Register (SIO0) SO1/P21 STB/P23 BUSY/P24 Handshake Control Circuit SCK/P22 Serial Clock Counter Interrupt Request Signal Generator INTCSI1 fX/22 fX/29 Serial Clock Control Circuit Selector µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY INTERRUPT FUNCTIONS TEST FUNCTIONS INTERRUPT FUNCTIONS There interrupt functions, sources three different kinds, shown below. Non-maskable Maskable Software Table 6-1. Interrupt Source List Default Priority Note Interrupt Source Name INTWDT Trigger Watchdog timer overflow (with watchdog timer mode selected) Watchdog timer overflow (with interval timer mode selected) input edge detection External 0006H 0008H 000AH 000CH Serial interface channel transfer Serial interface channel transfer Reference time interval signal from watch timer timer/event counter match signal generation 8-bit timer/event counter match signal generation 8-bit timer/event counter match signal generation converter conversion instruction execution Internal 000EH 0010H 0012H Internal/ External Vector Table Address Basic Configuratin Type Note Internal 0004H Interrupt Type Non-maskable Maskable INTWDT INTP0 INTP1 INTP2 INTP3 INTCSI0 INTCSI1 INTTM3 INTTM0 0014H INTTM1 0016H INTTM2 0018H Software INTAD 001AH 003EH Notes default pririty priority applicable when more than maskable interrupt request generated. highest priority lowest. Basic configuration types correspond next page. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Figure 6-1. Basic Interrupt Function Configuration (1/2) Internal Non-Maskable Interrupt Internal Interrupt Request Priority Control Circuit Vector Table Address Generator Standby Release Signal Internal Maskable Interrupt Internal Interrupt Request Priority Control Circuit Vector Table Address Generator Standby Release Signal External Maskable Interrupt (INTP0) Internal Sampling Clock Select Register (SCS) External Interrupt Mode Register (INTM0) Interrupt Request Sampling Clock Edge Detector Priority Control Circuit Vector Table Address Generator Standby Release Signal µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Figure 6-1. Basic Interrupt Function Configuration (2/2) External Maskable Interrupt (Except INTP0) Internal External Interrupt Mode Register (INTM0) Interrupt Request Edge Detector Priority Control Circuit Vector Table Address Generator Standby Release Signal Software Interrupt Internal Interrupt Request Priority Control Circuit Vector Table Address Generator Interrupt request flag Interrupt enable flag In-service priority flag Interrupt mask flag Priority spcification flag µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY TEST FUNCTIONS There test functions shown Table 6-2. Table 6-2. Test Source List Test Source Internal/External Name INTWT INTPT4 Trigger Watch timer overflow Port falling edge detection Internal External Figure 6-2. Test Function Basic Configuration Internal Test Input Standby Release Signal Test input flag Test mask flag µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY EXTERNAL DEVICE EXPANSION FUNCTIONS external device expansion function used connect external devices areas other than internal ROM, SFR. Ports used connection with external devices. STANDBY FUNCTIONS There following standby functions reduce current dissipation. HALT mode operating clock stopped. average consumption current reduced intermittent operation combination with normal operat mode. STOP mode main system clock oscillation stopped. whole operation main system clock stopped, that system operates withultra-low power consumption using only subsystem clock. Figure 8-1. Standby Functions Main System Clock Operation Interrupt Request STOP Instruction Interrupt Request CSS=1 CSS=0 HALT Instruction Subsystem Clock OperationNote HALT Instruction Interrupt Request STOP Mode (Main system clock oscillation stopped) HALT Mode (Clock supply stopped, oscillation) HALT ModeNote (Clock supply stopped, oscillation) Note power consumption reduced stopping main system clock. When operating subsystem clock, stop main system clock. STOP instruction cannot used. Caution When main system clock stopped system operated subsystem clock, subsystem clock should switched again main system clock after oscillation stabilization time secured program program. RESET FUNCTIONS There following reset methods. External reset input RESET pin. Internal reset watchdog timer runaway time detection. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY INSTRUCTION 8-Bit Instruction MOV, XCH, ADD, ADDC, SUB, SUBC, AND, XOR, CMP, MULU, DIVUW, INC, DEC, ROR, ROL, RORC, ROLC, ROR4, ROL4, PUSH, POP, DBNZ Operand #byte Operand ADDC SUBC ADDC SUBC ADDC SUBC sadder ADDC DBNZ DBNZ ADDC SUBC ADDC SUBC ADDC SUBC Note saddr !addr16 [DE] [HL] [HL+byte] [HL+B] $adder16 [HL+C] ADDC SUBC None RORC ROLC SUBC !adder16 PUSH [DE] [HL] ROR4 ROL4 [HL+byte] [HL+B] [HL+C] MULU DIVUW Note Except µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY 16-Bit Instruction MOVW, XCHW ADDW, SUBW, CMPW, PUSH, POP, INCW, DECW Operand Operand #byte ADDW SUBW CMPW MOVW MOVWNote INCW, DECW PUSH, Note MOVW XCHW saddrp MOVW !addr16 MOVW MOVW None MOVW sfrp sadderp !adder16 MOVW MOVW MOVW MOVW MOVW MOVW MOVW Note Only when rp=BC, Manipulation Instruction MOV1, AND1, OR1, XOR1, SET1, CLR1, NOT1, BTCLR Operand A.bit Operand A.bit MOV1 BTCLR BTCLR BTCLR BTCLR BTCLR SET1 CLR1 sfr.bit saddr.bit PWS.bit [HL].bit $addr16 None sfr.bit MOV1 SET1 CLR1 saddr.bit MOV1 SET1 CLR1 PSW.bit MOV1 SET1 CLR1 [HL].bit MOV1 SET1 CLR1 MOV1 AND1 XOR1 MOV1 AND1 XOR1 MOV1 AND1 XOR1 MOV1 AND1 XOR1 MOV1 AND1 XOR1 SET1 CLR1 NOT1 µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Call Instruction/Branch Instruction CALL, CALLF, CALLT, BNC, BNZ, BTCLR, DBNZ Operand Operand Basic instruction CALL, CALLF CALLT BNC, BT,BF, BTCLR, DBNZ !addr16 !addr11 [addr5] $addr16 Compound instruction Other Instruction ADJBA, ADJBS, BRK, RET, RETI, RETB, SEL, NOP, HALT, STOP µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings Parameter Supply voltage Symbol AVDD AVREF AVSS Input voltage Output voltage Analog input voltage Output current high P17, P27, total P03, P47, P57, total Output current Peak value P47, total Peak value P03, P56, P57, IOLNote total P03, total Peak value Peak value Analog input P04, P17, P27, toP47, P57, P67, Open-drain -0.3 -0.3 AVSS AVREF Test Conditions Rating -0.3 +7.0 -0.3 -0.3 -0.3 +0.3 -0.3 Unit P17, P27, Peak value total Operating ambient temperature Storage temperature Tstg +150 Note should calculated follows: [rms] [peak value] duty Caution Product quality suffer absolute maximum rating exceeded even single parameter even momentarily. That absolute maximuam ratings rated values which product verge suffering physical damage, therefore product must used under conditions which ensure that absolute maximum ratings exceeded. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Capacitance Parameter Input capacitance capacitance Symbol Test Conditions Unmeasured pins returned P03, P17, Unmeasured P27, toP37, pins returned toP47, P57, MIN. TYP. MAX. Unit Remark characteristics dual-function port same unless specified otherwise. Main System Clock Oscillation Circuit Characteristics Resonator Ceramic resonator Recommended Circuit Parameter Oscillator frequency (fX) Note Oscillation stabilization time Note Oscillator frequency (fX) Note Oscillation stabilization time Note input frequency (fX) Note input Test Conditions After reaches oscillator voltage range MIN. MIN. TYP. MAX. Unit Crystal resonator External clock 10.0 µPD74HCU04 high/low level width (tXH tXL) Notes Indicates only oscillation circuit characteristics. Refer Characteristics instruction execution time. Time required stabilize oscillation after reset STOP mode release. Cautions When using main system clock oscillator, wiring area enclosed with dotted line should carried follows avoid adverse effect from wiring capacitance. Wiring should short possible. Wiring should cross other signal lines. Wiring should placed close varying high current. potential oscillator capacitor ground should same VSS. ground wiring ground pattern which high current flows. fetch signal from oscillator. When main system clock stopped system operated subsystem clock, subsystem clock should switched again main system clock after oscillation stabilization time secured program. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Subsystem Clock Oscillation Circuit Characteristics Resonator Crystal resonator Recommended Circuit Parameter Oscillator frequency (fXT) Note Oscillation stabilization time Note input frequency (fXT) Note input high/low level width (tXTH tXTL) Test Conditions MIN. TYP. MAX. Unit 32.768 External clock Notes Indicates only oscillation circuit characteristics. Refer Characteristics instruction execution time. Time required stabilize oscillation after reaches oscillator voltage MIN. Cautions When using subsystem clock oscillator, wiring area enclosed with dotted line should carried follows avoid adverse effect from wiring capacitance. Wiring should short possible. Wiring should cross other signal lines. Wiring should placed close varying high current. potential oscillator capacitor ground should same VSS. ground wiring ground pattern which high current flows. fetch signal from oscillator. subsystem clock oscillation circuit circuit with amplification level,more prone misoperation noise than main system clock. Particular care therefore required with wiring method when subsystem clock used. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Recommended Oscillation Circuit Constant Recommended oscillation circuit constant differs depending model. µPD78011FY, 78012FY, 78013FY, 78014FY Main system clock: ceramic resonator Manufacturer Product Name Frequency (MHz) 4.19 4.19 5.00 5.00 8.00 8.00 10.00 10.00 4.19 4.19 5.00 5.00 8.38 8.38 10.00 10.00 Recommended Oscillation Circuit Constant (pF) Corp. CCR4.19MC3 FCR4.19MC5 CCR5.00MC3 FCR5.00MC5 CCR8.38MC FCR8.38MC5 CCR10.00MC FCR10.00MC5 Murata Mfg. Ltd. CSA4.19MG CST4.19MGW CSA5.00MG CST5.00MGW CSA8.38MTZ CST8.38MTW CSA10.00MTZ CST10.00MTW Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in (pF) Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Oscillation Voltage Range MIN. MAX. Main system clock: ceramic resonator Manufacturer Product Name Frequency (MHz) 5.00 5.00 5.00 5.00 8.00 10.00 Recommended Oscillation Circuit Constant (pF) Kyocera Corp. PBRC5.00A PBRC5.00B KBR-5.00MSA KBR-5.00MKS KBR-8M KBR-10M Built-in Built-in (pF) Built-in Built-in Oscillation Voltage Range MIN. MAX. Caution oscillation circuit constants oscillation voltage range indicate conditions stable oscillation guarantee accuracy oscillation frequency. application circuit requires accuracy oscillation frequency, necessary oscillation frequency resonator application circuit. this, necessary directly contact manufacturer resonator being used. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY µPD78015FY, 78016FY Main system clock: ceramic resonator Manufacturer Product Name Frequency (MHz) 1.00 2.00 2.00 4.00 4.00 6.00 6.00 10.0 10.0 6.00 6.00 10.0 10.0 10.0 Recommended Oscillation Circuit Constant (pF) Murata Mfg. Ltd. CSB1000J CSA2.00MG040 CST2.00MG040 CSA4.00MG040 CST4.00MGW040 CSA6.00MG CST6.00MGW CSA10.0MTZ CST10.0MTW Murata Mfg. Ltd. (EMI noise reduced products) CSA6.00MG040 CST6.00MGW040 CSA10.0MTZ040 CST10.0MTW040 Corp. FCR4.0MC5 FCR10.0MC Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in (pF) Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Oscillation Voltage Range MIN. MAX. Main system clock: ceramic resonator Manufacturer Product Name Frequency (MHz) 5.00 5.00 5.00 5.00 8.00 10.00 Recommended Oscillation Circuit Constant (pF) Kyocera Corp. PBRC5.00A PBRC5.00B KBR-5.00MSA KBR-5.00MKS KBR-8M KBR-10M Built-in Built-in (pF) Built-in Built-in Oscillation Voltage Range MIN. MAX. Caution oscillation circuit constants oscillation voltage range indicate conditions stable oscillation guarantee accuracy oscillation frequency. application circuit requires accuracy oscillation frequency, necessary oscillation frequency resonator application circuit. this, necessary directly contact manufacturer resonator being used. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY µPD78018FY Main system clock: ceramic resonator Manufacturer Product Name Frequency (MHz) 4.00 4.00 8.00 8.00 10.0 10.0 4.00 4.00 8.00 8.00 Recommended Oscillation Circuit Constant (pF) Corp. CCR4.0MC3 FCR4.0MC5 CCR8.0MC5 FCR8.0MC CCR10.0MC5 FCR10.0MC Murata Mfg. Ltd. CSA4.0MG CST4.0MGW CSA8.0MTZ CST8.0MTW Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in (pF) Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Oscillation Voltage Range MIN. MAX. Main system clock: ceramic resonator Manufacturer Product Name Frequency (MHz) 4.00 4.00 4.00 4.00 8.00 10.00 Recommended Oscillation Circuit Constant (pF) Kyocera Corp. FBRC4.00A FBRC4.00B KBR-4.00MSB KBR-4.00MKC KBR-8M KBR-10M Built-in Built-in (pF) Built-in Built-in Oscillation Voltage Range MIN. MAX. Caution oscillation circuit constants oscillation voltage range indicate conditions stable oscillation guarantee accuracy oscillation frequency. application circuit requires accuracy oscillation frequency, necessary oscillation frequency resonator application circuit. this, necessary directly contact manufacturer resonator being used. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Characteristics Parameter Input voltage high Symbol VIH1 Test Conditions P17, P21, P23, P32, P37, P47, P57, VIH2 P03, P20, P22, P27, P33, P34, RESET VIH3 (N-ch open-drain) VIH4 Note Input voltage VIL1 P17, P21, P23, P32, P37, P47, P57, VIL2 P03, P20, P22, P27, P33, P34, RESET VIL3 VIL4 Note Output voltage high Output voltage P03, P17, P37, P47, VOL2 SB0, SB1, SCK0 VOL1 VOH1 -100 P57, open-drain pulled-up VOL3 VIL5 XT1/P04, 0.15 0.85 VIH5 XT1/P04, MIN. TYP. MAX. Unit Note When using XT1/P04 P04, input inverse using inverter. characteristics dual-function port same unless specified otherwise. Remark µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Characteristics Parameter Symbol Test Conditions P03, P17, P27, P37, P47, P57, P67, RESET ILIH2 ILIH3 Input leakege ILIL1 current XT1/P04, P03, P17, P27, P37, P47, P57, P67, RESET ILIL2 ILIL3 Output leakage ILOH1 current high Output leakage ILOL current Mask option pull-up resister Software pull-up resister P03, P17, P27, P37, P47, P57, VOUT VOUT XT1/P04, Note MIN. TYP. MAX. Unit Input leakage ILIH1 current high Note P63, pull-up resistor provided (specifiable mask option) low-level input leak current -200 (MAX.) flows only during clocks (no-wait time) after instruction been executed read port (P6) port mode register (PM6). Outside period clocks following execution read-out instruction, current (MAX.). Remark characteristics dual-function port same unless specified otherwise. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Characteristics Parameter Supply current Note Symbol IDD1 10.00 crystal Test Conditions Note Note Note Note MIN. TYP. 0.05 0.05 MAX. 18.0 Unit oscillation operation mode IDD2 10.00 crystal oscillation HALT mode IDD3 32.768 crystal oscillation operation mode Note Note IDD4 32.768 crystal oscillation HALT mode IDD5 STOP mode when using feedback resistor IDD6 STOP mode when using feedback resistor Notes This current excludes AVREF current, port current, current which flows built-in pull-down resistor. When operating high-speed mode (when processor clock control register (PCC) 00H) When operating low-speed mode (when 04H) When main system clock stopped. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Characteristics Basic Operation Parameter Cycle time (Min. instruction execution time) Operating subsystem clock input frequency tTIH0 tTIL0 TI1, input frequency TI1, input high/low-level width Interrupt request input high/low-level width INTP1 INTP3, tTIL1 tINTH tINTL INTP0 2/fsam Note 2/fsam Note 2/fsam RESET level width tRSL Note Symbol Test Conditions Operating main system clock MIN. 2/fsam 2/fsam Note Note TYP. MAX. Unit 2/fsam Note fTI1 tTIH1 Note combination with bits (SCS0) (SCS1) sampling clock select register (SCS), selection fsam possible between fX/2N+1, fX/64 fX/128 (when µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY main system clock operation) 60.0 10.0 Operation Guaranteed Range Cycle Time Supply voltage µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Read/Write Operation Parameter ASTB high-level width Address setup time Address hold time Data input time from address Symbol tASTH tADS tADH tADD1 tADD2 Data input time from tRDD1 tRDD2 Read data hold time low-level width tRDH tRDL1 tRDL2 WAIT input time from tRDWT1 tRDWT2 WAIT input time from WAIT low-level width Write data setup time Write data hold time low-level width delay time from ASTB delay time from ASTB ASTB delay time from external fetch Address hold time from external fetch Write data output time from tWRWT tWTL tWDS tWDH tWRL1 tASTRD tASTWR tRDAST tRDADH tRDWD Load resistor (0.5 (2.5 0.5tCY 1.5tCY 0.5tCY 0.5tCY Write data output time from tWRWD Address hold time from tWRADH delay time from WAIT delay time from WAIT tWTRD tWTWR 0.5tCY 0.5tCY 0.5tCY 0.5tCY 2.5tCY 2.5tCY (1.5 (2.5 0.5tCY 1.5tCY 0.5tCY Test Conditions MIN. 0.5tCY 0.5tCY (2.5 (2.5 MAX. Unit Remarks TCY/4 indicates number waits. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Serial Interface Serial Interface Channel 3-wire serial mode (SCK0. Internal clock output) Parameter SCK0 cycle time Symbol tKCY1 Conditions MIN. 1600 3200 4800 SCK0 high/low-level width setup time SCK0) tKH1 tKL1 tSIK1 tKCY1/2 tKCY1/2 hold time (from SCK0) output delay time from SCK0 tKSO1 Note tKSI1 TYP. MAX. Unit Note load capacitance SCK0 output line. (ii) 3-wire serial mode (SCK0. External clock input) Parameter SCK0 cycle time Symbol tKCY2 Test Conditions MIN. 1600 3200 4800 SCK0 high/low-level width tKH2 tKL2 1600 2400 setup time SCK0) hold time (from SCK0) output delay time from SCK0 SCK0 rise, fall time When external device expansion function used When external When 16-bit timer tKSO2 Note tKSI2 tSIK2 TYP. MAX. Unit device expansion output function function used used When 16-bit timer output function used 1000 Note load capacitance output line. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY (iii) 2-wire serial mode (SCK0. Internal clock output) Parameter SCK0 cycle time Symbol tKCY3 Test Conditions Note MIN. 1600 3200 4800 SCK0 high-level width tKH3 tKCY3/2 tKCY3/2 SCK0 low-level width tKL3 tKCY3/2 tKCY3/2 SB0, setup time SCK0) tSIK3 SB0, hold time (from SCK0) SB0, output delay time from SCK0 tKSO3 tKSI3 TYP. MAX. Unit Note load resistance load capacitance SCK0, output line. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY (iv) 2-wire serial mode (SCK0. External clock input) Parameter SCK0 cycle time Symbol tKCY4 Test Conditions MIN. 1600 3200 4800 SCK0 high-level width tKH4 1300 2100 SCK0 low-level width tKL4 1600 2400 SB0, setup time SCK0) SB0, hold time (from SCK0) SB0, output delay time from SCK0 tKSO4 SCK0 rise, fall time When external device expansion function used When external When 16-bit timer Note tKSI4 tSIK4 tKCY4/2 TYP. MAX. Unit device expansion output function function used used When 16-bit timer output function used 1000 Note load resistance load capacitance output line. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY mode (SCK0. Internal clock output) Parameter cycle time Symbol tKCY5 Test Conditions Note MIN. high-level width tKH5 tKCY5 tKCY5 low-level width tKL5 tKCY5 tKCY5 SDA0, SDA1 setup time tSIK5 SCL) SDA0, SDA1 hold time (from SCL) SDA0, SDA1 output delay time from tKSO5 SDA0, SDA1 from SDA0, SDA1 from from SDA0, SDA1 SDA0, SDA1 high-level tSBH width tSBK tKSB tKSI5 TYP. MAX. Unit Note load resistance load capacitance SCL, SDA0 SDA1 output line. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY (vi) mode (SCK0. External clock output) Parameter cycle time high/low-level width SDA0, SDA1 setup time SCL) SDA0, SDA1 hold time (from SCL) SDA0, SDA1 output delay time from tKSO6 SDA0, SDA1 from SDA0, SDA1 from from SDA0, SDA1 SDA0, SDA1 high-level tSBH width rise, fall time When external device expansion function used When external When 16-bit timer tSBK tKSB tKSI6 Symbol tKCY6 tKH6 tKL6 tSIK6 Test Conditions MIN. 1000 TYP. MAX. Unit Note device expansion output function function used used When 16-bit timer output function used 1000 Note load resistance load capacitance output line. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Serial Interface Channel 3-wire serial mode (SCK1. Internal clock output) Parameter SCK1 cycle time Symbol tKCY7 Test Conditions MIN. 1600 3200 4800 SCK1 high/low-level width setup time SCK1) tKH7 tKL7 tSIK7 tKCY7/2 tKCY7/2 hold time (from SCK1) output delay time from SCK1 tKSO7 Note tKSI7 TYP. MAX. Unit Note load capacitance SCK1 output line. (ii) 3-wire serial mode (SCK1. External clock input) Parameter SCK1 cycle time Symbol tKCY8 Test Conditions MIN. 1600 3200 4800 SCK1 high/low-level width tKH8 tKL8 1600 2400 setup time SCK1) hold time (from SCK1) output delay time from SCK1 SCK1 rise, fall time When external device expansion function used When external When 16-bit timer tKSO8 Note tKSI8 tSIK8 TYP. MAX. Unit device expansion output function function used used When 16-bit timer output function used 1000 Note load capacitance output line. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY (iii) 3-wire serial mode with automatic transmit/receive function (SCK1. Internal clock output) Parameter SCK1 cycle time Symbol tKCY9 Test Conditions MIN. 1600 3200 4800 SCK1 high/low-level width setup time SCK1) tKH9 tKL9 tSIK9 tKCY9/2 tKCY9/2 hold time (from SCK1) output delay time from SCK1 from SCK1 Strobe signal high-level width tSBD tSBW tKCY9/2 tKCY9 tKCY9 tKCY9 Busy signal setup time busy signal detection timing) Busy signal hold time (from busy signal detection timing) tBYH SCK1 from busy inactive tSPS 2tKCY9 tBYS tKCY9/2 tKCY9 tKCY9 tKCY9 tKSO9 Note tKSI9 TYP. MAX. Unit Note load capacitance SCK1 output line. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY (iv) 3-wire serial mode with automatic transmit/receive function (SCK1. External clock input) Parameter SCK1 cycle time Symbol tKCY10 Test Conditions MIN. 1600 3200 4800 SCK1 high/low-level width tKH10, tKL10 1600 2400 setup time SCK1) hold time (from SCK1) output delay time from SCK1 SCK1 rise, fall time tR10, tF10 When external device expansion function used When external device expansion function used 1000 tKSO10 Note tKSI10 tSIK10 TYP. MAX. Unit Note load capacitance output line. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Timing Test Point (Excluding Input) Test Points Clock Timing 1/fX Input VIH4 (MIN.) VIL4 (MAX.) 1/fXT tXTL tXTH Input VIH5 (MIN.) VIL5 (MAX.) Timing tTIL0 tTIH0 1/fTI1 tTIL1 tTIH1 TI1,TI2 µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Read/Write Operation External fetch wait): Higher 8-Bit Address tADD1 Hi-Z tADS tASTH ASTB Lower 8-Bit Address Operation Code tRDD1 tRDADH tRDAST tADH tASTRD tRDL1 tRDH External fetch (Wait insertion): Higher 8-Bit Address tADD1 tADS tASTH ASTB Lower 8-Bit Address Hi-Z tRDD1 Operation Code tRDADH tRDAST tADH tASTRD WAIT tRDWT1 tWTL tWTRD tRDL1 tRDH µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY External data access wait): tADD2 tADS tASTH ASTB Lower 8-Bit Address Higher 8-Bit Address Hi-Z tRDD2 Read Data Hi-Z Write Data Hi-Z tADH tRDH tASTRD tASTWR tWRL1 tRDL2 tRDWD tWRWD tWDS tWDH tWRADH External data access (Wait insertion): tADD2 tADS tADH tASTH ASTB tASTRD tRDL2 tASTWR WAIT tRDWT2 tWTL tRDD2 Lower 8-Bit Address Higher 8-Bit Address Hi-Z Hi-Z Hi-Z Read Data Write Data tRDH tRDWD tWDS tWRWD tWRL1 tWDH tWRADH tWTRD tWRWT tWTL tWTWR µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Serial Transfer Timing 3-wire serial mode: tKLm tKCYm tKHm SCK0,SCK1 tSIKm tKSIm SI0,SI1 Input Data tKSOm SO0,SO1 Output Data 2-wire serial mode: tKCY5,6 tKL5,6 SCK0 tKSO5,6 SB0, tSIK5,6 tKSI5,6 tKH5,6 mode: tKL5, SDA0, SDA1 tSBH tSBK tKH5, tKSI5, tSIK5, tKSO5, tKSB tSBK tKSB tKCY5, µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY 3-wire serial mode with automatic transmit/receive function: tSIK9,10 tKSO9,10 tKSI9,10 tKH9,10 tF10 SCK1 tKL9,10 tKCY9,10 tR10 tSBD tSBW 3-wire serial mode with automatic transmit/receive function (busy processing): SCK1 Note tBYS Note tBYH Note tSPS BUSY (Active High) Note signal actually driven here; shown such indicate timing. converter characteristics AVDD AVSS Parameter Resolution Overall error Note AVREF AVDD AVREF Conversion time tCONV AVDD AVDD Sampling time Analog input voltage Reference voltage AVREF resistance tSAMP VIAN AVREF RAIREF 19.1 38.2 24/fX AVSS AVREF AVDD Symbol Test Conditions MIN. TYP. MAX. Unit Note Overall error excluding quantization error (±1/2 LSB). indicated ratio full-scale value. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Data Memory STOP Mode Supply Voltage Data Retention Characteristics Parameter Data retention supply voltage Data retention supply current IDDDR VDDDR Subsystem clock stop feedback resister disconnected Release signal time Oscillation stabilization wait time tSREL tWAIT Release RESET Release interrupt request Note Symbol VDDDR Test Conditions MIN. TYP. MAX. Unit Note combination with (OSTS0 OSTS2) oscillation stabilization time select register (OSTS), selection 213/fX 215/fX 218/fX possible. Data Retention Timing (STOP Mode Release RESET) Internal Reset Operation HALT Mode STOP Mode Data Retension Mode Operating Mode STOP Instruction Execution VDDDR tSREL RESET tWAIT Data Retention Timing (Standby Release Signal STOP Mode Release Interrupt Request Signal) HALT Mode STOP Mode Data Retension Mode Operating Mode VDDDR STOP Instruction Execition tSREL Standby Release Signal (Interrupt Request) tWAIT µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Interrupt Request Input Timing tINTL INTP0 INTP2 tINTH tINTL INTP3 RESET Input Timing tRSL RESET µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY CHARACTERISTIC CURVE (REFERENCE VALUES) (Main System Clock: 10.0 MHz) 10.0 HALT Oscillation, Stop) Supply Current [mA] 0.05 HALT Stop, Oscillation) 0.01 0.005 10.0 32.768 0.001 Supply Voltage µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY PACKAGE DRAWINGS PLASTIC SHRINK (750 mil) NOTE Each lead centerline located within 0.17 (0.007 inch) true position (T.P.) maximum material condition. Item center leads when formed parallel. ITEM MILLIMETERS 58.68 MAX. 1.78 MAX. 1.778 (T.P.) 0.50±0.10 MIN. 3.2±0.3 0.51 MIN. 4.31 MAX. 5.08 MAX. 19.05 (T.P.) 17.0 0.25 +0.10 -0.05 0.17 0~15° INCHES 2.311 MAX. 0.070 MAX. 0.070 (T.P.) 0.020 +0.004 -0.005 0.035 MIN. 0.126±0.012 0.020 MIN. 0.170 MAX. 0.200 MAX. 0.750 (T.P.) 0.669 0.010 +0.004 -0.003 0.007 0~15° P64C-70-750A,C-1 Remark Dimensions materials products same those mass-production products. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY PLASTIC detail lead P64GC-80-AB8-2 ITEM MILLIMETERS 17.6 14.0 14.0 17.6 0.35 0.10 0.15 (T.P.) 0.15+0.10 -0.05 0.10 2.55 2.85 MAX. INCHES 0.693 0.016 0.551 +0.009 -0.008 0.551+0.009 -0.008 0.693 0.016 0.039 0.039 0.014 +0.004 -0.005 0.006 0.031 (T.P.) 0.071 0.008 0.031+0.009 -0.008 0.006 +0.004 -0.003 0.004 0.100 0.004 0.004 0.112 MAX. NOTE Each lead centerline located within 0.15 (0.006 inch) true position (T.P.) maximum material condition. Remark Dimensions materials products same those mass-production products. 5°±5° µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY RECOMMENDED SOLDERING CONDITIONS should soldered mounted under conditions recommended table below. detail recommended soldering conditions, refer information document Semiconductor Device Mounting Technology Manual (C10535E). soldering methods conditions other than those recommended below, contact salespersonnel. Table 14-1. Surface Mounting Type Soldering Conditions 64-Pin Plastic 64-Pin Plastic 64-Pin Plastic 64-Pin Plastic 64-Pin Plastic 64-Pin Plastic 64-Pin Plastic Recommended Condition Symbol IR35-00-3 Soldering Method Infrared reflow Soldering Conditions Package peak temperature: Duration: sec. max. above), Number times: Three times max. Package peak temperature: Duration: sec. max. above), Number times: Three times max. Solder bath temperature: max. Duration: sec. max. Number times: Once Preheating temperature: max. (Package surface temperature) temperature: max., Duration: sec. max. (per device side) VP15-00-3 Wave soldering WS60-00-1 Partial heating Caution more than soldering method should avoided (except case partial heating). Table 14-2. Insertion Type Soldering Conditions Soldering Method Wave soldering (pin only) Partial heating 64-Pin Plastic Shrink (750 mil) 64-Pin Plastic Shrink (750 mil) 64-Pin Plastic Shrink (750 mil) 64-Pin Plastic Shrink (750 mil) 64-Pin Plastic Shrink (750 mil) 64-Pin Plastic Shrink (750 mil) 64-Pin Plastic Shrink (750 mil) Soldering Conditions Solder bath temperature: 260°C max., Duration: sec. max. temperature: 300°C max., Duration: sec. max. (per pin) Caution Wave soldering only lead part order that solder contact with chip directly. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY APPENDIX DEVELOPMENT TOOLS following development tools available system development using µPD78018FY subseries. Language Processing Software RA78K/0 Notes CC78K/0 Notes DF78014 Notes CC78K/0-L Notes 78K/0 series common assembler package 78K/0 series common compiler package Device file common µPD78014 subseries 78K/0 series common compiler library source file PROM Writting Tools PG-1500 PA-78P018CW PA-78P018GC PA-78P018KK-S PG-1500 controller Notes PROM programmer Programmer adapter connected PG-1500 PG-1500 control program Debugging Tool IE-78000-R IE-78000-R-A IE-78000-R-BK IE-78014-R-EM-A IE-78000-R-SV3 IE-70000-98-IF-B IE-70000-98N-IF IE-70000-PC-IF-B EP-78240CW-R EP-78240GC-R EV-9200GC-64 EV-9900 SM78K0 Notes ID78K0 Notes SD78K0 Notes DF78014 Notes 78K/0 series common in-circuit emulator 78K/0 series common in-circuit emulator (for integrated debugger) 78K/0 series common break board µPD78018F 78018FY subseries evaluation emulation board (VDD Interface adapter cable when used host machine (for IE-78000-R-A) Interface adapter when PC-9800 series (except notebook used host machine (for IE-78000-R-A) Interface adapter cable when PC-9800 series notebook used host machine (for IE-78000-R-A) Interface adapter when PC/ATis used host machine (for IE-78000-R-A) Emulation probe common µPD78244 subseries Socket mounted target system board created 64-pin plastic (GC-AB8 type) Tools removing µPD78P018FYKK-S from EV-9200GC-64 78K/0 series common system simulator IE-78000-R-A integrated dubugger IE-78000-R screen debugger Device file common µPD78014 subseries Real-Time RX78K/0 Notes MX78K0 Notes 78K/0 series real-time 78K/0 series µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Fuzzy Inference Devleopment Support System FE9000 Note 1/FE9200 Note FT9080 Note 1/FT9085 Note FI78K0 Notes FD78K0 Notes Fuzzy knowledge data creation tool Translator Fuzzy inference module Fuzzy inference debugger Notes PC-9800 series (MS-DOSTM) based PC/AT compatible DOSTM/IBM DOSTM/MS-DOS) based HP9000 series 300(HP-UXTM) based HP9000 series 700(HP-UX) based, SPARCstation(SunOSTM) based, EWS4800 series (EWS-UX/V) based PC-9800 series (MS-DOS WindowsTM) based PC/AT compatible DOS/IBM DOS/MS-DOS Windows) based NEWS(NEWS-OSTM) based Remarks development tools manufactured third party, refer 78K/0 Series Selection Guide (U11126E). RA78K/0, CC78K/0, SM78K0, ID78K0, SD78K/0, RX78K/0 used combination with DF78014. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY APPENDIX RELATED DOCUMENTS Device Related Documents Document Name Document Japanese U10659J U12326J U10903J U10904J U10287J IEA-715 IEA-718 English U10659E IEU-1372 IEA-1288 IEA-1289 µPD78018F, 78018FY Subseries User's Manual 78K/0 Series User's Manual Instruction 78K/0 Series Instruction Table 78K/0 Series Instruction µPD78018FY Subseries Special Function Register Table 78K/0 Series Application Note Fundamental Floating-Point Arithmetic Program Development Tools Documents (User's Manual) (1/2) Document Name RA78K Series Assembler Package Operation Language RA78K Series Structured Assembler Preprocessor RA78K0 Assembler Package Operation Assembly Language Structured Assembly Language CC78K Series Compiler Operation Language CC78K0 Compiler Operation Language CC78K/0 Compiler Application Note CC78K Series Library Source File PG-1500 PROM Programmer PG-1500 Controller PC-9800 Series (MS-DOS) Based PG-1500 Controller Series DOS) Based IE-78000-R IE-78000-R-A IE-78000-R-BK IE-78014-R-EM-A EP-78240 SM78K0 System Simulator Reference Programming Know-how Document Japanese EEU-809 EEU-815 EEU-817 U11802J U11801J U11789J EEU-656 EEU-655 U11517J U11518J EEA-618 U12322J U11940J EEU-704 EEU-5008 U11376J U10057J EEU-867 EEU-962 EEU-986 U10181J English EEU-1399 EEU-1404 EEU-1402 U11802E U11801E U11789E EEU-1280 EEU-1284 U11517E U11518E EEA-1208 EEU-1335 EEU-1291 U10540E U11376E U10057E EEU-1427 U10418E EEU-1513 U10181E Caution contents above related documents subject change without notice. latest documents should used desining, etc. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Development Tools Documents (User's Manual) (2/2) Document Name SM78K Series System Simulator External Part User Open Interface Specifications Reference Reference Guide Introduction Reference Introduction Reference Document Japanese U10092J English U10092E ID78K0 Integrated Debugger Based ID78K0 Integrated Debugger Based ID78K0 Integrated Debugger Windows Based SD78K/0 Screen Debugger PC-9800 Series (MS-DOS) Based SD78K/0 Screen Debugger PC/AT DOS) Based U11151J U11539J U11649J EEU-852 U10952J EEU-5024 U11279J U11539E U11649E U10539E EEU-1414 U11279E Embedded Software Documents (User's Manual) Document Name 78K/0 Series Real-Time Fundamental Installation 78K/0 Series MX78K0 Fuzzy Knowledge Data Creation Tool 78K/0, 78K/II, 87AD Series Fuzzy Inference Development Support System Translator 78K/0 Series Fuzzy Inference Development Suport System Fuzzy Inference Module 78K/0 Series Fuzzy Inference Development Support System Fuzzy Inference Debugger EEU-921 EEU-1458 EEU-858 EEU-1441 Fundamental Document Japanese U11537J U11536J U12257J EEU-829 EEU-862 English U11537E U11536E EEU-1438 EEU-1444 Other Documents Document Name Package Manual Semiconductor Device Mounting Technology Manual Quality Grades Semiconductor Device Semiconductor Device Reliability/Quality Control System Electrostatic Discharge (ESD) Test Guide Quality Assurance Semiconductor Device Guide Products Related Microcomputer: Other Companies Document Japanese C10943X C10535J C11531J C10983J MEM-539 C11893J U11416J C10535E C11531E C10983E MEI-1202 English Caution contents above related documents subject change without notice. latest documents should used desining, etc. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY NOTES CMOS DEVICES PRECAUTION AGAINST SEMICONDUCTORS Note: Strong electric field, when exposed device, cause destruction gate oxide ultimately degrade device operation. Steps must taken stop generation static electricity much possible, quickly dissipate once, when occurred. Environmental control must adequate. When dry, humidifier should used. recommended avoid using insulators that easily build static electricity. Semiconductor devices must stored transported anti-static container, static shielding conductive material. test measurement tools including work bench floor should grounded. operator should grounded using wrist strap. Semiconductor devices must touched with bare hands. Similar precautions need taken boards with semiconductor devices HANDLING UNUSED INPUT PINS CMOS Note: connection CMOS device inputs cause malfunction. connection provided input pins, possible that internal input level generated noise, etc., hence causing malfunction. CMOS device behave differently than Bipolar NMOS devices. Input levels CMOS devices must fixed high using pull-up pull-down circuitry. Each unused should connected with resistor, considered have possibility being output pin. handling related unused pins must judged device device related specifications governing devices. STATUS BEFORE INITIALIZATION DEVICES Note: Power-on does necessarily define initial status device. Production process does define initial operation status device. Immediately after power source turned devices with reset function have been initialized. Hence, power-on does guarantee out-pin levels, settings contents registers. Device initialized until reset signal received. Reset operation must executed immediately after power-on devices having reset function. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Regional Information Some information contained this document vary from country country. Before using product your application, please contact office your country obtain list authorized representatives distributors. They will verify: Device availability Ordering information Product release schedule Availability related technical literature Development environment specifications (for example, specifications third-party tools components, host computers, power plugs, supply voltages, forth) Network requirements addition, trademarks, registered trademarks, export restrictions, other legal issues also vary from country country. Electronics Inc. (U.S.) Santa Clara, California Tel: 800-366-9782 Fax: 800-729-9288 Electronics (Germany) GmbH Benelux Office Eindhoven, Netherlands Tel: 040-2445845 Fax: 040-2444580 Electronics Hong Kong Ltd. Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044 Electronics (Germany) GmbH Duesseldorf, Germany Tel: 0211-65 Fax: 0211-65 Electronics Hong Kong Ltd. Electronics (France) S.A. Velizy-Villacoublay, France Tel: 01-30-67 Fax: 01-30-67 Seoul Branch Seoul, Korea Tel: 02-528-0303 Fax: 02-528-4411 Electronics (UK) Ltd. Milton Keynes, Tel: 01908-691-133 Fax: 01908-670-290 Electronics (France) S.A. Spain Office Madrid, Spain Tel: 01-504-2787 Fax: 01-504-2860 Electronics Singapore Pte. Ltd. United Square, Singapore 1130 Tel: 253-8311 Fax: 250-3583 Electronics Italiana s.r.1. Milano, Italy Tel: 02-66 Fax: 02-66 Electronics Taiwan Ltd. Electronics (Germany) GmbH Scandinavia Office Taeby, Sweden Tel: 08-63 Fax: 08-63 Taipei, Taiwan Tel: 02-719-2377 Fax: 02-719-5951 Brasil S.A. Paulo-SP, Brasil Tel: 011-889-1680 Fax: 011-889-1689 J96. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY Purchase components conveys license under Philips Patent Rights these components system, provided that system conforms Standard Specification defined Philips. IEBus trademarks Corporation. MS-DOS Windows either registered trademarks trademarks Microsoft Corporation United States and/or other countries. DOS, PC/AT, trademarks Corporation. HP9000 series 300, HP9000 series 700, HP-UX trademarks Hewlett-Packard Company. SPARCstation trademark SPARC International, Inc. SunOS trademark Microsystems, Inc. NEWS NEWS-OS trademarks Sony Corporation. µPD78011FY, 78012FY, 78013FY, 78014FY, 78015FY, 78016FY, 78018FY related documents referred this publication include preliminary versions. However, preliminary versions marked such. export this product from Japan regulated Japanese government. export this product prohibited without governmental license, need which must judged customer. export re-export this product from country other than Japan also prohibited without license from that country. Please call sales representative. part this document copied reproduced form means without prior written consent Corporation. Corporation assumes responsibility errors which appear this document. Corporation does assume liability infringement patents, copyrights other intellectual property rights third parties arising from device described herein other liability arising from such device. license, either express, implied otherwise, granted under patents, copyrights other intellectual property rights Corporation others. While Corporation been making continuous effort enhance reliability semiconductor devices, possibility defects cannot eliminated entirely. minimize risks damage injury persons property arising from defect semiconductor device, customers must incorporate sufficient safety measures design, such redundancy, fire-containment, anti-failure features. devices classified into following three quality grades: "Standard", "Special", "Specific". Specific quality grade applies only devices developed based customer designated "quality assurance program" specific application. recommended applications device depend quality grade, indicated below. Customers must check quality grade each device before using particular application. Standard: Computers, office equipment, communications equipment, test measurement equipment, audio visual equipment, home electronic appliances, machine tools, personal electronic equipment industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment medical equipment (not specifically designed life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems medical equipment life support, etc. quality grade devices "Standard" unless otherwise specified NEC's Data Sheets Data Books. customers intend devices applications other than those specified Standard quality grade, they should contact sales representative advance. 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