µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F 8-BIT S

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µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F 8-BIT S

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INTEGRATED CIRCUIT
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
8-BIT SINGLE-CHIP MICROCONTROLLER
DESCRIPTION
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F products µPD78018F subseries within 78K/0 series. Compared with older µPD78014 subseries, this subseries operates lower voltage provides fuller variations. one-time PROM EPROM product µPD78P018F capable operating same power supply voltage range mask product other development tools also provided. Functions described detail following User's Manual, which should read when carring design work. µPD78018F, 78018FY Subseries User's Manual U10659E 78K/0 Series Users Manual Instruction U12326E
FEATURES
Large on-chip
Item Product Name Program Memory (ROM) bytes bytes bytes bytes bytes bytes bytes 1024 bytes bytes 1024 bytes Internal HighSpeed bytes Data Memory Internal Expanded Buffer bytes Package 64-pin plastic shrink (750 mil) 64-pin plastic 64-pin plastic LQFP
µPD78011F µPD78012F µPD78013F µPD78014F µPD78015F µPD78016F µPD78018F
External memory expansion space bytes Minimum instruction execution time varied from high-speed (0.4 ultra-low-speed (122 ports: (N-ch open-drain 8-bit resolution converter channels Serial interface channels Timer channels Supply voltage
APPLICATION FIELDS
Cellular phone, pager, VCR, audio, camera, home appliances,
information this document subject change without notice. Document U10280EJ2V1DS00 (2nd edition) Date Published June 1998 CP(K) Printed Japan
mark
shows major revised points.
1994
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
ORDERING INFORMATION
Part Number Package 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin plastic plastic plastic plastic plastic plastic plastic plastic plastic plastic plastic plastic plastic plastic plastic plastic plastic plastic plastic plastic plastic shrink (750 mil) LQFP shrink (750 mil) LQFP shrink (750 mil) LQFP shrink (750 mil) LQFP shrink (750 mil) LQFP shrink (750 mil) LQFP shrink (750 mil) LQFP
Remark indicates code suffix.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
78K/0 SERIES DEVELOPMENT
following shows products organized according usage. names parallelograms subseries names.
Products mass production Products under development subseries products compatible with bus. Control 100-pin 100-pin 100-pin 100-pin 80-pin 80-pin 80-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 64-pin 42/44-pin
PD78075B PD78078 PD78070A PD780058 PD78058F µPD78054 µPD780034 PD780024 PD78014H µPD78018F µPD78014 PD780001 µPD78002 PD78083
Inverter control
µPD78075BY µPD78078Y PD78070AY PD780018AY PD780058YNote PD78058FY PD78054Y µPD780034Y PD780024Y µPD78018FY PD78014Y PD78002Y
EMI-noise reduced version PD78078 timer added PD78054 external interface enhanced ROM-less version µPD78078 Serial PD78078Y enhanced function limited. Serial PD78054 enhanced EMI-noise reduced. EMI-noise reduced version PD78054 UART converter were enhanced PD78014 enhanced converter PD780024 enhanced Serial PD78018F added EMI-noise reduced. EMI-noise reduced version µPD78018F Low-voltage (1.8 operation version µPD78014, with larger selection capacities converter 16-bit timer were added µPD78002 converter added µPD78002 Basic subseries control On-chip UART, capable operating voltage (1.8
64-pin 64-pin
µPD780964 µPD780924
FIPdrive
converter PD780924 enhanced On-chip inverter control circuit UART. EMI-noise reduced.
100-pin 100-pin 78K/0 Series 80-pin 80-pin
PD780208 PD780228 PD78044H µPD78044F
drive
PD78044F were enhanced, Display output total: PD78044H were enhanced, Display output total: N-ch open drain added PD78044F, Display output total: Basic subseries driving FIP, Display output total:
100-pin 100-pin 100-pin
PD780308 µPD78064B µPD78064
µPD780308Y PD78064Y
µPD78064 enhanced, ROM, capacity increased EMI-noise reduced version PD78064 Basic subseries driving LCDs, On-chip UART
IEBussupported 80-pin 80-pin
PD78098B PD78098
Meter control
EMI-noise reduced version µPD78098 IEBus controller added µPD78054
80-pin
PD780973
On-chip controller/driver automobile meters
64-pin
PD78P0914
On-chip output, digital code decoder, Hsync counter
Note Under planning
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
following lists main functional differences between subseries products.
Function Subseries Name Control Capacity 32K-40K 48K-60K 24K-60K 48K-60K 16K-60K 8K-32K (UART: 1ch, time division 3-wire: 1ch) 8K-60K 8K-32K 8K-16K 8K-32K Note 32K-60K 48K-60K 32K-48K 16K-40K 48K-60K 16K-32K 40K-60K 32K-60K 24K-32K (UART: 1ch) (UART: 1ch) (time division UART: 1ch) (UART: 1ch) (UART: 1ch) (UART: 2ch) (time division UART: 1ch) (UART: 1ch) 8-bit 10-bit 8-bit 8-bit 16-bit Watch Timer Serial Interface MIN. Value External Expansion
µPD78075B µPD78078 µPD78070A µPD780058 µPD78058F µPD78054 µPD780034 µPD780024 µPD78014H µPD78018F µPD78014 µPD780001 µPD78002 µPD78083
(UART: 1ch)
Inverter control drive
µPD780964 µPD780924 µPD780208 µPD780228 µPD78044H µPD78044F
drive
µPD780308 µPD78064B µPD78064
IEBus µPD78098 supported µPD78098B
Meter control µPD780973
µPD78P0914
Note 10-bit timer: channel
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
OVERVIEW FUNCTION (1/2)
Item Product Name High-speed Expanded Buffer Memory space General-purpose registers
µPD78011F
bytes
µPD78012F
bytes
µPD78013F µPD78014F
bytes bytes
µPD78015F
bytes 1024 bytes
µPD78016F
bytes
µPD78018F
bytes
Internal memory
bytes bytes bytes bits registers bits registers banks)
bytes
1024 bytes
Minimum instruction execution time On-chip minimum instruction execution time cycle modification function When main system clock selected When subsystem clock selected Instruction µs/0.8 µs/1.6 µs/3.2 µs/6.4 10.0 operation) 32.768 operation) 16-bit operation Multiplication/division bits bits,16 bits bits) manipulation (set, reset, test, boolean operation) correction, etc.
ports
Total CMOS input CMOS N-channel open-drain withstand voltage)
converter
8-bit resolution channels Operable over wide power supply voltage range: AVDD 3-wire serial I/O/SBI/2-wire serial mode selectable: channel 3-wire mode (on-chip max. bytes automatic data transmit/receive function): channel 16-bit timer/event counter 8-bit timer/event counter Watch timer Watchdog timer channel channels channel channel
Serial interface
Timer
Timer output Clock output
(14-bit output 39.1 kHz, 78.1 kHz, kHz, kHz, kHz, 1.25 main system clock: 10.0 operation), 32.768 subsystem clock: 32.768 operation) kHz, kHz, main system clock: 10.0 operation) Internal External Internal
Buzzer output Vectored interrupt sources Non-maskable Maskable
Software
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
OVERVIEW FUNCTION (2/2)
Item Product Name Test input
µPD78011F
Internal External
µPD78012F
µPD78013F
µPD78014F
µPD78015F
µPD78016F
µPD78018F
Supply voltage Operating ambient temperature Package
+85°C 64-pin plastic shrink (750 mil) 64-pin plastic 64-pin plastic LQFP
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
TABLE CONTENTS CONFIGURATION (TOP VIEW) BLOCK DIAGRAM FUNCTIONS
PORT PINS PINS OTHER THAN PORT PINS CIRCUITS RECOMMENDED CONNECTION UNUSED PINS
MEMORY SPACE PERIPHEL HARDWARE FUNCTION FEATURES
PORTS CLOCK GENERATOR TIMER/EVENT COUNTER CLOCK OUTPUT CONTROL CIRCUIT BUZZER OUTPUT CONTROL CIRCUIT CONVERTER SERIAL INTERFACES
INTERRUPT FUNCTIONS TEST FUNCTIONS
INTERRUPT FUNCTIONS TEST FUNCTIONS
EXTERNAL DEVICE EXPANSION FUNCTIONS STANDBY FUNCTIONS RESET FUNCTIONS
INSTRUCTION ELECTRICAL SPECIFICATIONS CHARACTERISTIC CURVE (REFERENCE VALUES) PACKAGE DRAWINGS RECOMMENDED SOLDERING CONDITIONS APPENDIX DEVELOPMENT TOOLS APPENDIX RELATED DOCUMENTS
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
CONFIGURATION (Top View)
64-Pin Plastic Shrink (750 mil)
P20/SI1 P21/SO1 P22/SCK1 P23/STB P24/BUSY P25/SI0/SB0 P26/SO0/SB1 P27/SCK0 P30/TO0 P31/TO1 P32/TO2 P33/TI1 P34/TI2 P35/PCL P36/BUZ P40/AD0 P41/AD1 P42/AD2 P43/AD3 P44/AD4 P45/AD5 P46/AD6 P47/AD7 P50/A8 P51/A9 P52/A10 P53/A11 P54/A12 P55/A13 P17/ANI7 P16/ANI6 P15/ANI5 P14/ANI4 P13/ANI3 P12/ANI2 P11/ANI1 P10/ANI0 P04/XT1 P03/INTP3 P02/INTP2 P01/INTP1 P00/INTP0/TI0 RESET P67/ASTB P66/WAIT P65/WR P64/RD P57/A15 P56/A14
Cautions Always connect (Internally Connected) directly. Always connect AVDD VDD. Always connect AVSS VSS.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
64-Pin Plastic
64-Pin Plastic LQFP
P26/SO0/SB1
P25/SI0/SB0
P24/BUSY
P27/SCK0
P22/SCK1
P17/ANI7
P16/ANI6
P15/ANI5
P14/ANI4
P13/ANI3
P30/TO0 P31/TO1 P32/TO2 P33/TI1 P34/TI2 P35/PCL P36/BUZ P40/AD0 P41/AD1 P42/AD2 P43/AD3 P44/AD4 P45/AD5 P46/AD6
P12/ANI2
P21/SO1
P23/STB
P20/SI1
P11/ANI1 P10/ANI0 P04/XT1 P03/INTP3 P02/INTP2 P01/INTP1 P00/INTP0/TI0 RESET P67/ASTB P66/WAIT
P56/A14
P57/A15
P64/RD
P47/AD7
P52/A10
P53/A11
P54/A12
P55/A13
Cautions Always connect (Internally Connected) directly. Always connect AVDD VDD. Always connect AVSS VSS.
P65/WR
P50/A8
P51/A9
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
ANI0 ANI7 ASTB AVDD AVREF AVSS BUSY Address Address/Data Analog Input Address Strobe Analog Power Supply Analog Reference Voltage Analog Ground Busy Buzzer Clock
RESET SB0, SCK0, SCK1 SI0, SO0, WAIT XT1,
Programmable Clock Read Strobe Reset Serial Serial Clock Serial Input Serial Output Strobe Timer Input Timer Output Power Supply Ground Wait Write Strobe Crystal (Main System Clock) Crystal (Subsystem Clock)
Internally Connected INTP0 INTP3 Interrupt from Peripherals Port0 Port1 Port2 Port3 Port4 Port5 Port6
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
BLOCK DIAGRAM
TO0/P30 TI0/INTP0/P00 TO1/P31 TI1/P33 TO2/P32 TI2/P34 16-bit TIMER/ EVENT COUNTER PORT0 8-bit TIMER/ EVENT COUNTER
PORT1
8-bit TIMER/ EVENT COUNTER
PORT2
WATCHDOG TIMER
PORT3
WATCH TIMER 78K/0 CORE SERIAL INTERFACE
PORT4
SI0/SB0/P25 SO0/SB1/P26 SCK0/P27 SI1/P20 SO1/P21 SCK1/P22 STB/P23 BUSY/P24 SERIAL INTERFACE
PORT5
PORT6
AD0/P40 AD7/P47 A8/P50 A15/P57
ANI0/P10 ANI7/P17 AVDD AVSS AVREF
EXTERNAL ACCESS
RD/P64 WR/P65 WAIT/P66 ASTB/P67 RESET
CONVERTER
INTP0/P00 INTP3/P03
INTERRUPT CONTROL
SYSTEM CONTROL
BUZ/P36
BUZZER OUTPUT
PCL/P35
CLOCK OUTPUT CONTROL
(VPP)
Remarks Internal capacity varies depending product. µPD78P018F
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
FUNCTIONS
PORT PINS (1/2)
Name P04Note Input Input/ output Input only Port 8-bit input/output port. Input/output specified bit-wise. When used input port, on-chip pull-up resistor used software.Note Port 8-bit input/output port. Input/output specified bit-wise. When used input port, on-chip pull-up resistor used software. Input Input Input Input/ output Port 5-bit port Input only Input/output specified bit-wise. When used input port, on-chip pull-up resistor used software. Function Reset Input Input DualFunction INTP0/TI0 INTP1 INTP2 INTP3 ANI0 ANI7
Input/ output
Input
SCK1 BUSY SI0/SB0 SO0/SB1 SCK0
Input/ output
Port 8-bit input/output port. Input/output specified 1-bit units. When used input port, on-chip pull-up resistor used software.
Input
Input/ output
Port 8-bit input/output port. Input/output specified 8-bit unit. When used input port, on-chip pull-up resistor used software. Test input flag (KRIF) falling edge detection.
Input
Notes When using P04/XT1 pins input port, (FRC) processor clock control register (PCC). on-chip feedback register subsystem clock oscillator. When using P10/ANI0 P17/ANI7 pins converter analog input, on-chip pull-up resistor automatically unused.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
PORT PINS (2/2)
Name Input/ output Function Port 8-bit input/output port. driven directly. Input/output specified bit-wise. When used input port, on-chip pull-up resistor used software. Port 8-bit input/output port. Input/output specified bit-wise. N-ch open-drain input/output port. On-chip pull-up resistor specified mask option. driven directly. Reset Input DualFunction
Input/ output
Input
When used input port, on-chip pull-up resistor used software.
WAIT ASTB
PINS OTHER THAN PORT PINS (1/2)
Name INTP0 INTP1 INTP2 INTP3 SCK0 SCK1 BUSY Input /output Input /output Output Input Serial interface serial data input/output. Input Output Serial interface serial data output. Input Input Input Function External interrupt request input which effective edge (rising edge, falling edge, both rising edge falling edge) specified. Falling edge detection external interrupt request input. Serial interface serial data input. Input Reset Input DualFunction P00/TI0 P25/SB0 P26/SB1 P25/SI0 P26/SO0 Serial interface serial clock input/output. Input Serial interface automatic transmit/receive strobe output. Serial interface automatic transmit/receive busy input. Input Input
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
PINS OTHER THAN PORT PINS (2/2)
DualFunction P00/INTP0 Input Input Input Input Input Input Input Input
Name WAIT ASTB
Input
Function External count clock input 16-bit timer (TM0). External count clock input 8-bit timer (TM1). External count clock input 8-bit timer (TM2).
Reset Input
Output
16-bit timer (TM0) output (shared 14-bit output). 8-bit timer (TM1) output. 8-bit timer (TM2) output.
Output Output Input /output Output Output
Clock output (for main system clock, subsystem clock trimming). Buzzer output. Low-order address/data external memory expansion. High-order address external memory expansion. External memory read operation strobe signal output. External memory write operation strobe signal output.
Input Output
Wait insertion external memory access. Strobe output which latches address information output port port access external memory. converter analog input. converter reference voltage input. converter analog power supply. Connected VDD. converter ground potential. Connected VSS. System reset input. Main system clock oscillation crystal connection.
ANI0 ANI7 AVREF AVDD AVSS RESET
Input Input Input Input Input
Input
Subsystem clock oscillation crystal connection.
Input
Positive power supply. Ground potential. Internal connection. Connected directly.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
CIRCUITS RECOMMENDED CONNECTION UNUSED PINS input/output circuit type each recommended connection unused pins shown Table 3-1. input/output circuit configuration each type, refer Figure 3-1. Table 3-1. Input/Output Circuit Type Each
Name P00/INTP0/TI0 P01/INTP1 P02/INTP2 P03/INTP3 P04/XT1 P10/ANI0 P17/ANI7 P20/SI1 P21/SO1 P22/SCK1 P23/STB P24/BUSY P25/SI0/SB0 P26/SO0/SB1 P27/SCK0 P30/TO0 P31/TO1 P32/TO2 P33/TI1 P34/TI2 P35/PCL P36/BUZ P40/AD0 P47/AD7 P50/A8 P57/A15 P64/RD P65/WR P66/WAIT P67/ASTB RESET AVREF AVDD AVSS Input Leave open. Connected Connected Connected Connected directly. 13-B Individually connected resistor. Individually connected resistor. Individually connected resistor. Individually connected resistor. 10-A Input Input/output Connected VSS. Individually connected resisitor. Input/output Circuit Type Input Input/output Recommended Connection when Used Connected Individually connected resistor.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Figure 3-1. Input/Output Circuits
Type Type 10-A
pull-up enable data open drain output disable Schmitt-Triggered Input with Hysteresis Characteristic P-ch N-ch P-ch
Type
pull-up enable data output disable input enable
P-ch
Type
pull-up enable data output disable Comparator
P-ch P-ch N-ch P-ch N-ch VREF (Threshold Voltage)
P-ch N-ch
input enable
Type
pull-up enable data output disable
Type 13-B
Mask Option data output disable N-ch P-ch
P-ch P-ch N-ch
Middle-High Voltage Input Buffer
Type
pull-up enable data output disable
P-ch
Type
feedback cut-off P-ch
P-ch N-ch
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
MEMORY SPACE
memory maps µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F shown Figure 4-2. Figure 4-1. Memory (µPD78011F, 78012F, 78013F, 78014F)
FFFFH Special Function Registers (SFR) Bits FF00H FEFFH General-Purpose Registers Bits FEE0H FEDFH
Internal High-Speed RAMNote
mmmmH mmmmH Prohibited Data Memory Space FAE0H FADFH FAC0H FABFH FA80H FA7FH Program Memory Space nnnnH nnnnH Buffer Bits
nnnnH Program Area 1000H 0FFFH CALLF Entry Area Prohibited 0800H 07FFH Program Area External Memory 0080H 007FH CALLT Table Area 0040H 003FH Internal ROMNote Vector Table Area 0000H
0000H
Note
Intermal internal high-speed capacities vary depending product (refer table below).
Internal High-Speed Start Address mmmmH FD00H
Product Name
Intenal Address nnnnH 1FFFH 3FFFH 5FFFH 7FFFH
µPD78011F µPD78012F µPD78013F µPD78014F
FB00H
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Figure 4-2. Memory (µPD78015F, 78016F, 78018F)
FFFFH Special Function Registers (SFR) Bits FF00H FEFFH General-Purpose Registers Bits FEE0H FEDFH
Internal High-Speed RAMNote
mmmmH mmmmH-1 Prohibited Data Memory Space FAE0H FADFH FAC0H FABFH FA80H FA7FH Prohibited F800H F7FFH Program Memory Space kkkkH kkkkH 0800H 07FFH Internal Expanded RAMNote Program Area 0080H 007FH CALLT Table Area 0040H 003FH Internal ROMNote 0000H 0000H Vector Table Area Buffer Bits nnnnH Prohibited 1000H 0FFFH CALLF Entry Area Program Area
External Memory nnnnH nnnnH
Note Intermal ROM, internal high-speed RAM, internal expanded capacities vary depending product (refer table below).
Product Name
Intenal Address nnnnH 9FFFH BFFFH EFFFH
Internal High-Speed Start Address mmmmH FB00H
Internal Expanded Start Address kkkkH F600H
µPD78015F µPD78016F µPD78018F
F400H
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
PERIPHERAL HARDWARE FUNCTION FEATURES
PORTS port following three types CMOS input (P00, P04) CMOS input/output (P01 P03, port port P67) N-ch open-drain input/output(15V withstand voltage) (P60 P63) Total
Table 5-1. Functions Ports
Port Name Port Name P00, Port Port Port Port Dedicated Input port Input/output ports. Input/output specified bit-wise. When used input port, pull-up resistor used software. Input/output ports. Input/output specified bit-wise. When used input port, pull-up resistor used software. Input/output ports. Input/output specified bit-wise. When used input port, pull-up resistor used software. Input/output ports. Input/output specified bit-wise. When used input port, pull-up resistor used software. Input/output ports. Input/output specified 8-bit units. When used input port, pull-up resistor used software. Test input flag (KRIF) falling edge detection. Input/output ports. Input/output specified bit-wise. When used input port, pull-up resistor used software. driven directly. N-ch open-drain input/output port. Input/output specified bit-wise. On-chip pull-up resistor specified mask option. driven directly. Input/output ports. Input/output specified bit-wise. When used input port, pull-up resistor used software. Function
Port
Port
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
CLOCK GENERATOR There types clock generator: main system clock subsystem clock. minimum instruction exection time changed. 0.4µs/0.8µs/1.6µs/3.2µs/6.4µs (Main system clock: 10.0 operation) 122µs (Subsystem clock: 32.768 operation)
Figure 5-1. Clock Generator Block Diagram
XT1/P04
Subsystem Clock Oscillator
Watch Timer Clock Output Function Prescaler
Main System Clock Oscillator
Prescaler
Clock Peripheral Hardware
STOP
Selector
Standby Control Circuit
Wait Control Circuit
Clock (fCPU)
INTP0 Sampling Clock
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
TIMER/EVENT COUNTER following five channels incorporated timer/event counter. 16-bit timer/event counter 8-bit timer/event counter Watch timer Watchdog timer channel channels channel channel
Table 5-2. Operation Timer/Event Counter
16-bit Timer/Event Counter Operation mode Functions Interval timer Externanal event counter Timer output output Pulse width mesurement Sqare wave output Interrupt request Test input channel channel output output input output 8-bit Timer/Event Counter channels channels outputs outputs
Watch Timer channel input
Watchdog Timer channel
Figure 5-2. 16-bit Timer/Enent Counter Block Diagram
Internal
16-Bit Compare Register (CR00) Pulse Output Control Circuit 16-Bit Timer Register (TM0) Clear Selector Output Control Circuit
INTTM0
Match
TO0/P30
fX/2 fX/22 fX/23 TI0/INTP0/P00
Edge Detector Selector
INTP0 16-Bit Capture Register (CR01)
Internal
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Figure 5-3. 8-bit Timer/Enent Counter Block Diagram
Internal INTIM1 8-Bit Compare Register (CR10)
8-Bit Compare Register (CR20) Selector
Match
Output Control Circuit
TO2/P32 INTTM2
fX/22 fX/210 fX/212 TI1/P33
Selector 8-Bit Timer Register (TM1) Clear Selector
8-Bit Timer Register (TM2) Clear
fX/22 fX/210 fX/212 TI2/P34
Selector
Selector
Output Control Circuit Internal
TO1/P31
Figure 5-4. Watch Timer Block Diagram
fX/28
Selector
Selector
5-Bit Counter
Selector INTWT
Prescaler
Selector
INTTM3
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Figure 5-5. Watchdog Timer Block Diagram
Prescaler
INTWDT Maskable Interrupt Request Selector 8-Bit Counter Control Circuit RESET INTWDT Non-Maskable Interrupt Request
CLOCK OUTPUT CONTROL CIRCUIT clock with following frequencies output clock output. 39.1 kHz/78.1 kHz/156 kHz/313 kHz/625 kHz/1.25 (Main system clock: 10.0 operation) 32.768 (Subsystem clock: 32.768 operation)
Figure 5-6. Clock Output Control Block Diagram
fX/23 fX/24 fX/25 fX/26 fX/27 fX/28
Selector Synchronization Circuit Output Control Circuit PCL/P35
BUZZER OUTPUT CONTROL CIRCUIT clock with following frequencies output buzzer output. kHz/4.9 kHz/9.8 (Main system clock: 10.0 operation)
Figure 5-7. Buzzer Output Control Block Diagram
fX/210 fX/211 fX/212
Selector Output Control Circuit BUZ/P36
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
CONVERTER converter on-chip eight 8-bit resolution channels. There following method start conversion. Hardware starting Software starting
Figure 5-8. Converter Block Diagram
Series Resistor String ANI0/P10 ANI1/P11 ANI2/P12 ANI3/P13 ANI4/P14 ANI5/P15 ANI6/P16 ANI7/P17 Succesive Approxmation Register (SAR) AVSS Selector Selector Sample Hold Circuit Voltage Comparator AVDD AVREF
INTP3/P03
Falling Edge Detector
Control Circuit
INTAD INTP3
Conversion Result Register (ADCR)
Internal
SERIAL INTERFACES There on-chip clocked serial interfaces follows. Serial Interface channel Serial Interface channel Table 5-3. Type Function Serial Interface
Function 3-wire serial mode 3-wire serial mode with automatic data transmit/ receive function (Serial Interface) mode 2-wire serial mode (MSB-first) (MSB-first) Serial Interface Channel (MSB/LSB-first switchable) Serial Interface Channel (MSB/LSB-first switchable) (MSB/LSB-first switchable)
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Figure 5-9. Serial Interface Channel Block Diagram
Internal
SI0/SB0/P25
Selector Serial Shift Register (SIO0) Output Latch
SO0/SB1/P26
Selector
Release/Command/ Acknowledge Detection Circuit Serial Clock Counter
Busy/Acknowlede Output Circuit
SCK0/P27
Interrupt Request Signal Generator
INTCSI0
fx/22 fx/29
Serial Clock Control Circuit Selector
Figure 5-10. Serial Interface Channel Block Diagram
Internal
Automatic Data Transmit/ Receive Address Pointer (ADTP)
Buffer
SI1/P20
Serial Shift Register (SIO0)
SO1/P21
STB/P23
BUSY/P24
Handshake Control Circuit
SCK/P22
Serial Clock Counter
Interrupt Request Signal Generator
INTCSI1
fX/22 fX/29 Serial Clock Control Circuit Selector
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
INTERRUPT FUNCTIONS TEST FUNCTIONS
INTERRUPT FUNCTIONS There interrupt functions, sources three different kinds, shown below. Non-maskable Maskable Software
Table 6-1. Interrupt Source List
Default Priority Note Interrupt Source Name INTWDT Trigger Watchdog timer overflow (with watchdog timer mode selected) Watchdog timer overflow (with interval timer mode selected) input edge detection External 0006H 0008H 000AH 000CH Serial interface channel transfer Serial interface channel transfer Reference time interval signal from watch timer timer/event counter match signal generation 8-bit timer/event counter match signal generation 8-bit timer/event counter match signal generation converter conversion instruction execution Internal 000EH 0010H 0012H Internal/ External Vector Table Address Basic Configuratin Type Note Internal 0004H
Interrupt Type
Non-maskable
Maskable
INTWDT
INTP0 INTP1 INTP2 INTP3 INTCSI0 INTCSI1 INTTM3
INTTM0
0014H
INTTM1
0016H
INTTM2
0018H
Software
INTAD
001AH 003EH
Notes default pririty priority applicable when more than maskable interrupt request generated. highest priority lowest. Basic configuration types correspond next page.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Figure 6-1. Basic Interrupt Function Configuration (1/2)
Internal Non-Maskable Interrupt
Internal
Interrupt Request
Priority Control Circuit
Vector Table Address Generator Standby Release Signal
Internal Maskable Interrupt
Internal
Interrupt Request
Priority Control Circuit
Vector Table Address Generator Standby Release Signal
External Maskable Interrupt (INTP0)
Internal
Sampling Clock Select Register (SCS)
External Interrupt Mode Register (INTM0)
Interrupt Request
Sampling Clock
Edge Detector
Priority Control Circuit
Vector Table Address Generator Standby Release Signal
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Figure 6-1. Basic Interrupt Function Configuration (2/2) External Maskable Interrupt (Except INTP0)
Internal
External Interrupt Mode Register (INTM0)
Interrupt Request
Edge Detector
Priority Control Circuit
Vector Table Address Generator Standby Release Signal
Software Interrupt
Internal
Interrupt Request
Priority Control Circuit
Vector Table Address Generator
Interrupt request flag Interrupt enable flag In-service priority flag Interrupt mask flag Priority spcification flag
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
TEST FUNCTIONS There test functions shown Table 6-2.
Table 6-2. Test Source List
Test Source Internal/External Name INTWT INTPT4 Trigger Watch timer overflow Port falling edge detection Internal External
Figure 6-2. Test Function Basic Configuration
Internal
Test Input
Standby Release Signal
Test input flag
Test mask flag
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
EXTERNAL DEVICE EXPANSION FUNCTIONS
external device expansion function used connect external devices areas other than internal ROM, SFR. Ports used connection with external devices.
STANDBY FUNCTIONS
There following standby functions reduce current dissipation. HALT mode operating clock stopped. average consumption current reduced intermittent operation combination with normal operat mode. STOP mode main system clock oscillation stopped. whole operation main system clock stopped, that system operates withultra-low power consumption using only subsystem clock.
Figure 8-1. Standby Functions
Main System Clock Operation Interrupt Request STOP Instruction Interrupt Request
CSS=1 CSS=0 HALT Instruction
Subsystem Clock OperationNote HALT Instruction
Interrupt Request
STOP Mode (Main system clock oscillation stopped)
HALT Mode (Clock supply stopped, oscillation)
HALT ModeNote (Clock supply stopped, oscillation)
Note power consumption reduced stopping main system clock. When operating subsystem clock, (MCC) processor clock control register (PCC) stop main system clock. STOP instruction cannot used. Caution When main system clock stopped system operated subsystem clock, subsystem clock should switched again main system clock after oscillation stabilization time secured program program.
RESET FUNCTIONS
There following reset methods. External reset input RESET pin. Internal reset watchdog timer runaway time detection.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
INSTRUCTION
8-Bit Instruction MOV, XCH, ADD, ADDC, SUB, SUBC, AND, XOR, CMP, MULU, DIVUW, INC, DEC, ROR, ROL, RORC, ROLC, ROR4, ROL4, PUSH, POP, DBNZ
Operand #byte Operand ADDC SUBC ADDC SUBC ADDC SUBC sadder ADDC DBNZ DBNZ ADDC SUBC ADDC SUBC ADDC SUBC Note saddr !addr16 [DE] [HL] [HL+byte] [HL+B] $adder16 [HL+C] ADDC SUBC None
RORC ROLC
SUBC !adder16 PUSH
[DE] [HL]
ROR4 ROL4
[HL+byte] [HL+B] [HL+C]
MULU DIVUW
Note Except
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
16-Bit Instruction MOVW, XCHW ADDW, SUBW, CMPW, PUSH, POP, INCW, DECW
Operand Operand #byte ADDW SUBW CMPW MOVW MOVWNote INCW, DECW PUSH, Note MOVW XCHW saddrp MOVW !addr16 MOVW MOVW None MOVW
sfrp sadderp !adder16
MOVW MOVW
MOVW MOVW MOVW
MOVW
MOVW
Note Only when rp=BC, Manipulation Instruction MOV1, AND1, OR1, XOR1, SET1, CLR1, NOT1, BTCLR
Operand A.bit Operand A.bit MOV1 BTCLR BTCLR BTCLR BTCLR BTCLR SET1 CLR1 sfr.bit saddr.bit PWS.bit [HL].bit $addr16 None
sfr.bit
MOV1
SET1 CLR1
saddr.bit
MOV1
SET1 CLR1
PSW.bit
MOV1
SET1 CLR1
[HL].bit
MOV1
SET1 CLR1
MOV1 AND1 XOR1
MOV1 AND1 XOR1
MOV1 AND1 XOR1
MOV1 AND1 XOR1
MOV1 AND1 XOR1
SET1 CLR1 NOT1
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Call Instruction/Branch Instruction CALL, CALLF, CALLT, BNC, BNZ, BTCLR, DBNZ
Operand Operand Basic instruction CALL, CALLF CALLT BNC, BT,BF, BTCLR, DBNZ !addr16 !addr11 [addr5] $addr16
Compound instruction
Other Instruction ADJBA, ADJBS, BRK, RET, RETI, RETB, SEL, NOP, HALT, STOP
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
Parameter Supply voltage Symbol AVDD AVREF AVSS Input voltage Output voltage Analog input voltage Output current high P17, P27, total P03, P47, P57, total Output current Peak value P47, total Peak value P03, P56, P57, IOLNote total P03, total Peak value Peak value Analog input P04, P17, P27, toP47, P57, P67, Open-drain -0.3 -0.3 AVSS AVREF Test Conditions Rating -0.3 +7.0 -0.3 -0.3 -0.3 +0.3 -0.3 Unit
P17, P27, Peak value total Operating ambient temperature Storage temperature
Tstg
+150
Note should calculated follows: [rms] [peak value] duty Caution Product quality suffer absolute maximum rating exceeded even single parameter even momentarily. That absolute maximuam ratings rated values which product verge suffering physical damage, therefore product must used under conditions which ensure that absolute maximum ratings exceeded.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Capacitance
Parameter Input capacitance capacitance Symbol Test Conditions Unmeasured pins returned P03, P17, Unmeasured P27, toP37, pins returned toP47, P57, MIN. TYP. MAX. Unit
Remark
characteristics dual-function port same unless specified otherwise.
Main System Clock Oscillation Circuit Characteristics
Resonator Ceramic resonator Recommended Circuit
Parameter Oscillator frequency (fX) Note Oscillation stabilization time Note Oscillator frequency (fX) Note Oscillation stabilization time Note input frequency (fX) Note input
Test Conditions After reaches oscillator voltage range MIN.
MIN.
TYP.
MAX.
Unit
Crystal resonator
External clock
10.0
µPD74HCU04 high/low level width
(tXH tXL)
Notes Indicates only oscillation circuit characteristics. Refer Characteristics instruction execution time. Time required stabilize oscillation after reset STOP mode release. Cautions When using main system clock oscillator, wiring area enclosed with dotted line should carried follows avoid adverse effect from wiring capacitance. Wiring should short possible. Wiring should cross other signal lines. Wiring should placed close varying high current. potential oscillator capacitor ground should same VSS. ground wiring ground pattern which high current flows. fetch signal from oscillator. When main system clock stopped system operated subsystem clock, subsystem clock should switched again main system clock after oscillation stabilization time secured program.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Subsystem Clock Oscillation Circuit Characteristics
Resonator Crystal resonator Recommended Circuit
Parameter Oscillator frequency (fXT) Note Oscillation stabilization time Note input frequency (fXT) Note input high/low level width (tXTH tXTL)
Test Conditions
MIN.
TYP.
MAX.
Unit
32.768
External clock
Notes Indicates only oscillation circuit characteristics. Refer Characteristics instruction execution time. Time required stabilize oscillation after reaches oscillator voltage MIN. Cautions When using subsystem clock oscillator, wiring area enclosed with dotted line should carried follows avoid adverse effect from wiring capacitance. Wiring should short possible. Wiring should cross other signal lines. Wiring should placed close varying high current. potential oscillator capacitor ground should same VSS. ground wiring ground pattern which high current flows. fetch signal from oscillator. subsystem clock oscillation circuit circuit with amplification level,more prone misoperation noise than main system clock. Particular care therefore required with wiring method when subsystem clock used.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Recommended Oscillation Circuit Constant Recommended oscillation circuit constant differs depending model. µPD78011F, 78012F, 78013F, 78014F Main system clock: ceramic resonator
Manufacturer Product Name Frequency (MHz) 4.19 4.19 5.00 5.00 8.00 8.00 10.00 10.00 4.19 4.19 5.00 5.00 8.38 8.38 10.00 10.00 Recommended Oscillation Circuit Constant (pF) Corp. CCR4.19MC3 FCR4.19MC5 CCR5.00MC3 FCR5.00MC5 CCR8.38MC FCR8.38MC5 CCR10.00MC FCR10.00MC5 Murata Mfg. Ltd. CSA4.19MG CST4.19MGW CSA5.00MG CST5.00MGW CSA8.38MTZ CST8.38MTW CSA10.00MTZ CST10.00MTW Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in (pF) Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Oscillation Voltage Range MIN. MAX.
Main system clock: ceramic resonator
Manufacturer Product Name Frequency (MHz) 5.00 5.00 5.00 5.00 8.00 10.00 Recommended Oscillation Circuit Constant (pF) Kyocera Corp. PBRC5.00A PBRC5.00B KBR-5.00MSA KBR-5.00MKS KBR-8M KBR-10M Built-in Built-in (pF) Built-in Built-in Oscillation Voltage Range MIN. MAX.
Caution
oscillation circuit constants oscillation voltage range indicate conditions stable oscillation guarantee accuracy oscillation frequency. application circuit requires accuracy oscillation frequency, necessary oscillation frequency resonator application circuit. this, necessary directly contact manufacturer resonator being used.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
µPD78015F, 78016F Main system clock: ceramic resonator
Manufacturer Product Name Frequency (MHz) 1.00 2.00 2.00 4.00 4.00 6.00 6.00 10.0 10.0 6.00 6.00 10.0 10.0 10.0 Recommended Oscillation Circuit Constant (pF) Corp. CSB1000J CSA2.00MG040 CST2.00MG040 CSA4.00MG040 CST4.00MGW040 CSA6.00MG CST6.00MGW CSA10.0MTZ CST10.0MTW Murata Mfg. Ltd. (EMI noise reduced products) CSA6.00MG040 CST6.00MGW040 CSA10.0MTZ040 CST10.0MTW040 Corp. FCR4.0MC5 FCR10.0MC Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in (pF) Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Oscillation Voltage Range MIN. MAX.
Main system clock: ceramic resonator
Manufacturer Product Name Frequency (MHz) 5.00 5.00 5.00 5.00 8.00 10.00 Recommended Oscillation Circuit Constant (pF) Kyocera Corp. PBRC5.00A PBRC5.00B KBR-5.00MSA KBR-5.00MKS KBR-8M KBR-10M Built-in Built-in (pF) Built-in Built-in Oscillation Voltage Range MIN. MAX.
Caution
oscillation circuit constants oscillation voltage range indicate conditions stable oscillation guarantee accuracy oscillation frequency. application circuit requires accuracy oscillation frequency, necessary oscillation frequency resonator application circuit. this, necessary directly contact manufacturer resonator being used.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
µPD78018F Main system clock: ceramic resonator
Manufacturer Product Name Frequency (MHz) 4.00 4.00 8.00 8.00 10.0 10.0 4.00 4.00 8.00 8.00 Recommended Oscillation Circuit Constant (pF) Corp. CCR4.0MC3 FCR4.0MC5 CCR8.0MC5 FCR8.0MC CCR10.0MC5 FCR10.0MC Murata Mfg. Ltd. CSA4.0MG CST4.0MGW CSA8.0MTZ CST8.0MTW Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in (pF) Built-in Built-in Built-in Built-in Built-in Built-in Built-in Built-in Oscillation Voltage Range MIN. MAX.
Main system clock: ceramic resonator
Manufacturer Product Name Frequency (MHz) 4.00 4.00 4.00 4.00 8.00 10.00 Recommended Oscillation Circuit Constant (pF) Kyocera Corp. FBRC4.00A FBRC4.00B KBR-4.00MSB KBR-4.00MKC KBR-8M KBR-10M Built-in Built-in (pF) Built-in Built-in Oscillation Voltage Range MIN. MAX.
Caution
oscillation circuit constants oscillation voltage range indicate conditions stable oscillation guarantee accuracy oscillation frequency. application circuit requires accuracy oscillation frequency, necessary oscillation frequency resonator application circuit. this, necessary directly contact manufacturer resonator being used.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Characteristics
Parameter Input voltage high Symbol VIH1 Test Conditions P17, P21, P23, P32, P37, P47, P57, VIH2 P03, P20, P22, P27, P33, P34, RESET VIH3 (N-ch open-drain) VIH4 Note Input voltage VIL1 P17, P21, P23, P32, P37, P47, P57, VIL2 P03, P20, P22, P27, P33, P34, RESET VIL3 VIL4 Note Output voltage high Output voltage P03, P17, P37, P47, VOL2 SB0, SB1, SCK0 VOL1 VOH1 -100 P57, open-drain pulled-up VOL3 VIL5 XT1/P04, 0.15 0.85 VIH5 XT1/P04, MIN. TYP. MAX. Unit
Note
When using XT1/P04 P04, input inverse using inverter. characteristics dual-function port same unless specified otherwise.
Remark
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Characteristics
Parameter Symbol Test Conditions P03, P17, P27, P37, P47, P57, P67, RESET ILIH2 ILIH3 Input leakege ILIL1 current XT1/P04, P03, P17, P27, P37, P47, P57, P67, RESET ILIL2 ILIL3 Output leakage ILOH1 current high Output leakage ILOL current Mask option pull-up resister Software pull-up resister P03, P17, P27, P37, P47, P57, VOUT VOUT XT1/P04, Note MIN. TYP. MAX. Unit
Input leakage ILIH1 current high
Note P63, pull-up resistor provided (specifiable mask option) low-level input leak current -200 (MAX.) flows only during clocks (no-wait time) after instruction been executed read port (P6) port mode register (PM6). Outside period clocks following execution read-out instruction, current (MAX.). Remark characteristics dual-function port same unless specified otherwise.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Characteristics
Parameter Supply current
Note
Symbol IDD1 10.00 crystal
Test Conditions Note
Note Note Note
MIN.
TYP. 0.05 0.05
MAX. 18.0
Unit
oscillation operation mode IDD2 10.00 crystal oscillation HALT mode IDD3 32.768 crystal oscillation operation mode
Note
Note
IDD4
32.768 crystal oscillation HALT mode
IDD5
STOP mode when using feedback resistor
IDD6
STOP mode when using feedback resistor
Notes This current excludes AVREF current, port current, current which flows built-in pull-down resistor. When operating high-speed mode (when processor clock control register (PCC) 00H) When operating low-speed mode (when 04H) When main system clock stopped.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Characteristics Basic Operation
Parameter Cycle time (Min. instruction execution time) Operating subsystem clock input frequency tTIH0 tTIL0 TI1, input frequency TI1, input high/low-level width Interrupt request input high/low-level width INTP1 INTP3, tTIL1 tINTH tINTL INTP0 2/fsam Note 2/fsam Note 2/fsam RESET level width tRSL
Note
Symbol
Test Conditions Operating main system clock
MIN. 2/fsam 2/fsam
Note Note
TYP.
MAX.
Unit
2/fsam Note
fTI1
tTIH1
Note combination with bits (SCS0) (SCS1) sampling clock select register (SCS), selection fsam possible between fX/2N+1, fX/64 fx/128 (when
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
main system clock operation)
60.0
10.0
Operation Guaranteed Range
Cycle Time
Supply voltage
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Read/Write Operation
Parameter ASTB high-level width Address setup time Address hold time Data input time from address Symbol tASTH tADS tADH tADD1 tADD2 Data input time from tRDD1 tRDD2 Read data hold time low-level width tRDH tRDL1 tRDL2 WAIT input time from tRDWT1 tRDWT2 WAIT input time from WAIT low-level width Write data setup time Write data hold time low-level width delay time from ASTB delay time from ASTB ASTB delay time from external fetch Address hold time from external fetch Write data output time from tWRWT tWTL tWDS tWDH tWRL1 tASTRD tASTWR tRDAST tRDADH tRDWD Load resistor (0.5 (2.5 0.5tCY 1.5tCY 0.5tCY 0.5tCY Write data output time from tWRWD Address hold time from tWRADH delay time from WAIT delay time from WAIT tWTRD tWTWR 0.5tCY 0.5tCY 0.5tCY 0.5tCY 2.5tCY 2.5tCY (1.5 (2.5 0.5tCY 1.5tCY 0.5tCY Test Conditions MIN. 0.5tCY 0.5tCY (2.5 (2.5 MAX. Unit
Remarks TCY/4 indicates number waits.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Serial Interface Serial Interface Channel 3-wire serial mode (SCK0. Internal clock output)
Parameter SCK0 cycle time Symbol tKCY1 Conditions MIN. 1600 3200 4800 SCK0 high/low-level width setup time SCK0) tKH1 tKL1 tSIK1 tKCY1/2 tKCY1/2 hold time (from SCK0) output delay time from SCK0 tKSO1 Note tKSI1 TYP. MAX. Unit
Note load capacitance SCK0 output line. (ii) 3-wire serial mode (SCK0. External clock input)
Parameter SCK0 cycle time Symbol tKCY2 Test Conditions MIN. 1600 3200 4800 SCK0 high/low-level width tKH2 tKL2 1600 2400 setup time SCK0) hold time (from SCK0) output delay time from SCK0 SCK0 rise, fall time When external device expansion function used When external When 16-bit timer tKSO2 Note tKSI2 tSIK2 TYP. MAX. Unit
device expansion output function function used used When 16-bit timer output function used 1000
Note load capacitance output line.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
(iii) mode (SCK0. Internal clock output)
Parameter SCK0 cycle time Symbol tKCY3 Test Conditions MIN. 3200 4800 SCK0 high/low-level width SB0, setup time SCK0) tKH3 tKL3 tSIK3 tKCY3/2 tKCY3/2 SB0, hold time (from SCK0) SB0, SB1output delay time from SCK0 SB0, from SCK0 tKSB SCK0 from SB0, tSBK SB0, high-level width SB0, low-level width tSBL tKCY3 tSBH tKSO3 Note tKCY3 tKCY3 tKCY3 1000 tKSI3 tKCY3/2 TYP. MAX. Unit
Note load resistors load capacitance SB0, SCK0 output line.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
(iv) mode (SCK0. External clock input)
Parameter SCK0 cycle time Symbol tKCY4 Test Conditions MIN. 3200 4800 SCK0 high/low-level width tKH4 tKL4 1600 2400 SB0, setup time SCK0) tSIK4 SB0, hold time (from SCK0) SB0, output delay time from SCK0 SB0, from SCK0 tKSB SCK0 from SB0, tSBK SB0, high-level width SB0, low-level width SCK0 rise, fall time When external device expansion function used When external When 16-bit timer tSBL tKCY4 tSBH tKSO4
Note
TYP.
MAX.
Unit
tKSI4
tKCY4/2
tKCY4 tKCY4 tKCY4
1000
device expansion output function function used used When 16-bit timer output function used 1000
Note load resistors load capacitance output line.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
2-wire serial mode (SCK0. Internal clock output)
Parameter SCK0 cycle time Symbol tKCY5 Test Conditions MIN. 1600 3200 4800 SCK0 high-level width tKH5 tKCY5/2 tKCY5/2 SCK0 low-level width tKL5 tKCY5/2 tKCY5/2 SB0, setup time SCK0) tSIK5 SB0, hold time (from SCK0) SB0, output delay time from SCK0 tKSO5 tKSI5 TYP. MAX. Unit
Note
Note load resistors load capacitance SCK0, output line.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
(vi) 2-wire serial mode (SCK0. External clock input)
Parameter SCK0 cycle time Symbol tKCY6 Test Conditions MIN. 1600 3200 4800 SCK0 high-level width tKH6 1300 2100 SCK0 low-level width tKL6 1600 2400 SB0, setup time SCK0) SB0, hold time (from SCK0) SB0, output delay time from SCK0 tKSO6 SCK0 rise, fall time When external device expansion function used When external When 16-bit timer Note tKSI6 tSIK6 tKCY6/2 TYP. MAX. Unit
device expansion output function function used used When 16-bit timer output function used 1000
Note load resistors load capacitance output line.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Serial Interface Channel 3-wire serial mode (SCK1. Internal clock output)
Parameter SCK1 cycle time Symbol tKCY7 Test Conditions MIN. 1600 3200 4800 SCK1 high/low-level width setup time SCK1) tKH7 tKL7 tSIK7 tKCY7/2 tKCY7/2 hold time (from SCK1) output delay time from SCK1 tKSO7 Note tKSI7 TYP. MAX. Unit
Note load capacitance SCK1 output line. (ii) 3-wire serial mode (SCK1. External clock input)
Parameter SCK1 cycle time Symbol tKCY8 Test Conditions MIN. 1600 3200 4800 SCK1 high/low-level width tKH8 tKL8 1600 2400 setup time SCK1) hold time (from SCK1) output delay time from SCK1 SCK1 rise, fall time When external device expansion function used When external When 16-bit timer tKSO8 Note tKSI8 tSIK8 TYP. MAX. Unit
device expansion output function function used used When 16-bit timer output function used 1000
Note load capacitance output line.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
(iii) 3-wire serial mode with automatic transmit/receive function (SCK1. Internal clock output)
Parameter SCK1 cycle time Symbol tKCY9 Test Conditions MIN. 1600 3200 4800 SCK1 high/low-level width setup time SCK1) tKH9 tKL9 tSIK9 tKCY9/2 tKCY9/2 hold time (from SCK1) output delay time from SCK1 from SCK1 Strobe signal high-level width tSBD tSBW tKCY9/2 tKCY9 tKCY9 tKCY9 Busy signal setup time busy signal detection timing) Busy signal hold time (from busy signal detection timing) tBYH SCK1 from busy inactive tSPS 2tKCY9 tBYS tKCY9/2 tKCY9 tKCY9 tKCY9 tKSO9 Note tKSI9 TYP. MAX. Unit
Note load capacitance SCK1 output line.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
(iv) 3-wire serial mode with automatic transmit/receive function (SCK1. External clock input)
Parameter SCK1 cycle time Symbol tKCY10 Test Conditions MIN. 1600 3200 4800 SCK1 high/low-level width tKH10, tKL10 1600 2400 setup time SCK1) hold time (from SCK1) output delay time from SCK1 SCK1 rise, fall time tR10, tF10 When external device expansion function used When external device expansion function used 1000 tKSO10 Note tKSI10 tSIK10 TYP. MAX. Unit
Note load capacitance output line.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Timing Test Point (Excluding Input)
Test Points
Clock Timing
1/fX
Input
VIH4 (MIN.) VIL4 (MAX.)
1/fXT tXTL tXTH
Input
VIH5 (MIN.) VIL5 (MAX.)
Timing
tTIL0
tTIH0
1/fTI1 tTIL1 tTIH1
TI1,TI2
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Read/Write Operation External fetch wait):
Higher 8-Bit Address tADD1 Hi-Z
tADS tASTH ASTB
Lower 8-Bit Address
Operation Code tRDD1 tRDADH tRDAST
tADH
tASTRD tRDL1 tRDH
External fetch (Wait insertion):
Higher 8-Bit Address tADD1
tADS tASTH ASTB
Lower 8-Bit Address
Hi-Z tRDD1
Operation Code tRDADH tRDAST
tADH
tASTRD WAIT tRDWT1 tWTL tWTRD tRDL1 tRDH
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
External data access wait):
tADD2 tADS tASTH ASTB
Lower 8-Bit Address
Higher 8-Bit Address
Hi-Z tRDD2
Read Data
Hi-Z
Write Data
Hi-Z
tADH
tRDH
tASTRD tASTWR tWRL1 tRDL2 tRDWD tWRWD tWDS tWDH tWRADH
External data access (Wait insertion):
tADD2 tADS tADH tASTH ASTB tASTRD tRDL2 tASTWR WAIT tRDWT2 tWTL tRDD2
Lower 8-Bit Address
Higher 8-Bit Address Hi-Z Hi-Z Hi-Z
Read Data
Write Data
tRDH
tRDWD
tWDS tWRWD tWRL1
tWDH
tWRADH
tWTRD tWRWT
tWTL
tWTWR
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Serial Transfer Timing 3-wire serial mode:
tKLm
tKCYm tKHm
SCK0,SCK1
tSIKm
tKSIm
SI0,SI1
Input Data
tKSOm
SO0,SO1
Output Data
mode (Bus release signal transfer):
tKCY3, tKL3, SCK0 tKSB tSBL tSBH tSBK tSIK3, tKSI3, tKH3,
SB0, tKSO3,
Mode (command signal transfer):
tKCY3, tKL3, SCK0 tSIK3, tKH3,
tKSB
tSBK
tKSI3,
SB0, tKSO3,
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
2-wire serial mode:
tKCY5,6 tKL5,6 SCK0 tKSO5,6 SB0, tSIK5,6 tKSI5,6 tKH5,6
3-wire serial mode with automatic transmit/receive function:
tSIK9,10 tKSO9,10
tKSI9,10 tKH9,10 tF10
SCK1 tKL9,10 tKCY9,10 tR10 tSBD tSBW
3-wire serial mode with automatic transmit/receive function (busy processing):
SCK1
Note
tBYS
Note
tBYH
Note
tSPS
BUSY (Active High)
Note signal actually driven here; shown such indicate timing.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
converter characteristics AVDD AVSS
Parameter Resolution Overall error Note AVREF AVDD AVREF Conversion time tCONV AVDD AVDD Sampling time Analog input voltage Reference voltage AVREF resistance tSAMP VIAN AVREF RAIREF 19.1 38.2 24/fX AVSS AVREF AVDD Symbol Test Conditions MIN. TYP. MAX. Unit
Note Overall error excluding quantization error (±1/2 LSB). indicated ratio full-scale value. Data Memory STOP Mode Supply Voltage Data Retention Characteristics
Parameter Data retention supply voltage Data retention supply current IDDDR VDDDR Subsystem clock stop feedback resister disconnected Release signal time Oscillation stabilization wait time tSREL tWAIT Release RESET Release interrupt request Note
Symbol VDDDR
Test Conditions
MIN.
TYP.
MAX.
Unit
Note combination with (OSTS0 OSTS2) oscillation stabilization time select register (OSTS), selection 213/fX 215/fX 218/fX possible.
Data Retention Timing (STOP Mode Release RESET)
Internal Reset Operation HALT Mode STOP Mode Data Retension Mode Operating Mode
STOP Instruction Execution
VDDDR
tSREL
RESET tWAIT
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Data Retention Timing (Standby Release Signal STOP Mode Release Interrupt Request Signal)
HALT Mode STOP Mode Data Retension Mode Operating Mode
VDDDR STOP Instruction Execition
tSREL
Standby Release Signal (Interrupt Request) tWAIT
Interrupt Request Input Timing
tINTL INTP0 INTP2 tINTH
tINTL
INTP3
RESET Input Timing
tRSL
RESET
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
CHARACTERISTIC CURVE (REFERENCE VALUES)
(Main System Clock: 10.0 MHz)
10.0
HALT Oscillation, Stop)
Supply Current [mA]
0.05
HALT Stop, Oscillation) 0.01
0.005 10.0 32.768
0.001
Supply Voltage
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
PACKAGE DRAWINGS
PLASTIC SHRINK (750 mil)
NOTE Each lead centerline located within 0.17 (0.007 inch) true position (T.P.) maximum material condition. Item center leads when formed parallel.
ITEM
MILLIMETERS 58.68 MAX. 1.78 MAX. 1.778 (T.P.) 0.50±0.10 MIN. 3.2±0.3 0.51 MIN. 4.31 MAX. 5.08 MAX. 19.05 (T.P.) 17.0 0.25 +0.10 -0.05 0.17 0~15°
INCHES 2.311 MAX. 0.070 MAX. 0.070 (T.P.) 0.020 +0.004 -0.005 0.035 MIN. 0.126±0.012 0.020 MIN. 0.170 MAX. 0.200 MAX. 0.750 (T.P.) 0.669 0.010 +0.004 -0.003 0.007 0~15° P64C-70-750A,C-1
Remark
Dimensions materials products same those mass-production products.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
PLASTIC
detail lead
P64GC-80-AB8-2 ITEM MILLIMETERS 17.6 14.0 14.0 17.6 0.35 0.10 0.15 (T.P.) 0.15+0.10 -0.05 0.10 2.55 2.85 MAX. INCHES 0.693 0.016 0.551 +0.009 -0.008 0.551+0.009 -0.008 0.693 0.016 0.039 0.039 0.014 +0.004 -0.005 0.006 0.031 (T.P.) 0.071 0.008 0.031+0.009 -0.008 0.006 +0.004 -0.003 0.004 0.100 0.004 0.004 0.112 MAX.
NOTE Each lead centerline located within 0.15 (0.006 inch) true position (T.P.) maximum material condition.
Remark
Dimensions materials products same those mass-production products.
5°±5°
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
PLASTIC LQFP
detail lead
NOTE
ITEM MILLIMETERS 14.8±0.4 12.0±0.2 12.0±0.2 14.8±0.4 1.125 1.125 0.30±0.10 0.13 0.65 (T.P.) 1.4±0.2 0.6±0.2 0.15 +0.10 -0.05 0.10 0.125±0.075 5°±5° MAX. INCHES 0.583±0.016 0.472 +0.009 -0.008 0.472 +0.009 -0.008 0.583±0.016 0.044 0.044 0.012 +0.004 -0.005 0.005 0.026 (T.P.) 0.055±0.008 0.024 +0.008 -0.009 0.006 +0.004 -0.003 0.004 0.055 0.005±0.003 5°±5° 0.067 MAX. P64GK-65-8A8-1
Each lead centerline located within 0.13 (0.005 inch) true position (T.P.) maximum material condition.
Remark
Dimensions materials products same those mass-production products.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
RECOMMENDED SOLDERING CONDITIONS
should soldered mounted under conditions recommended table below. detail recommended soldering conditions, refer information document Semiconductor Device Mounting Technology Manual (C10535E). soldering methods conditions other than those recommended below, contact salespersonnel. Table 14-1. Surface Mounting Type Soldering Conditions (1/2) 64-Pin Plastic 64-Pin Plastic
64-Pin Plastic 64-Pin Plastic 64-Pin Plastic 64-Pin Plastic 64-Pin Plastic
Recommended Condition Symbol IR35-00-3
Soldering Method Infrared reflow
Soldering Conditions Package peak temperature: Duration: sec. max. above), Number times: Three times max. Package peak temperature: Duration: sec. max. above), Number times: Three times max. Solder bath temperature: max. Duration: sec. max. Number times: Once Preheating temperature: max. (Package surface temperature) temperature: max., Duration: sec. max. (per device side)
VP15-00-3
Wave soldering
WS60-00-1
Partial heating
Caution more than soldering method should avoided (except case partial heating).
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Table 14-1. Surface Mounting Type Soldering Conditions (2/2) 64-Pin Plastic LQFP 64-Pin Plastic LQFP
64-Pin Plastic LQFP 64-Pin Plastic LQFP 64-Pin Plastic LQFP 64-Pin Plastic LQFP 64-Pin Plastic LQFP
Recommended Condition Symbol IR35-107-2
Soldering Method Infrared reflow
Soldering Conditions Package peak temperature: Duration: sec. max. above), Number times: Twice max., Number days: days Note (after that, prebaking hours necessary.) Precautions Start second reflow after device temprature first reflow returns normal. Flux washing water after first reflow should avoided.
Package peak temperature: Duration: sec. max. above), Number times: Twice max., Number days: days Note (after that, prebaking hours necessary.) Precautions Start second reflow after device temprature first reflow returns normal. Flux washing water after first reflow should avoided. Solder bath temperature: max. Duration: sec. max. Number times: Once, Preheating temperature: max. (Package surface temperature), Number days: days Note (after that, prebaking hours necessary.) temperature: max., Duration: sec. max. (per device side)
VP15-107-2
Wave soldering
WS60-107-1
Partial heating
Note number days device stored MAX. after pack been opend. Caution more than soldering method should avoided (except case partial heating).
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Table 14-2. Insertion Type Soldering Conditions
Soldering Method Wave soldering (pin only) Partial heating
64-Pin Plastic Shrink (750 mil) 64-Pin Plastic Shrink (750 mil) 64-Pin Plastic Shrink (750 mil) 64-Pin Plastic Shrink (750 mil) 64-Pin Plastic Shrink (750 mil) 64-Pin Plastic Shrink (750 mil) 64-Pin Plastic Shrink (750 mil)
Soldering Conditions Solder bath temperature: 260°C max., Duration: sec. max.
temperature: 300°C max., Duration: sec. max. (per pin)
Caution
Wave soldering only lead part order that solder contact with chip directly.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
APPENDIX DEVELOPMENT TOOLS
following development tools available system development using µPD78018F subseries. Language Processing Software
RA78K/0 Notes CC78K/0 Notes DF78014 Notes CC78K/0-L Notes 78K/0 series common assembler package 78K/0 series common compiler package Device file common µPD78014 subseries 78K/0 series common compiler library source file
PROM Writting Tools
PG-1500 PA-78P014CW PA-78P018GC PA-78P018GK PA-78P018KK-S PG-1500 controller Notes PG-1500 control program PROM programmer Programmer adapter connected PG-1500
Debugging Tool
IE-78000-R IE-78000-R-A IE-78000-R-BK IE-78014-R-EM-A IE-78000-R-SV3 IE-70000-98-IF-B IE-70000-98N-IF IE-70000-PC-IF-B EP-78240CW-R EP-78240GC-R EV-78012GK-R EV-9200GC-64 TGC-064SBW 78K/0 series common in-circuit emulator 78K/0 series common in-circuit emulator (for integrated debugger) 78K/0 series common break board
µPD78018F 78018FY subseries evaluation emulation board (VDD
Interface adapter cable when used host machine (for IE-78000R-A) Interface adapter when PC-9800 series (except notebook used host machine (for IE-78000-R-A) Interface adapter cable when PC-9800 series notebook used host machine (for IE-78000-R-A) Interface adapter when PC/ATis used host machine (for IE-78000-R-A) Emulation probe common µPD78244 subseries
µPD78018F subseries emulation probe
Socket mounted target system board created 64-pin plastic (GC-AB8 type) Conversion adapter mounted target system board made 64-pin plastic (GK-8A8 type) TGC-100SDW product from Tokyo Eletech Corp. (TEL (03) 5295-1661) When purchasing this product, please consult with sales offices. Tools removing µPD78P018FKK-S from EV-9200GC-64 78K/0 series common system simulator IE-78000-R-A integrated dubugger IE-78000-R screen debugger Device file common µPD78014 subseries
EV-9900 SM78K0 Notes ID78K0
Notes
SD78K/0 Notes DF78014
Notes
Real-Time
RX78K/0 Notes MX78K0 Notes 78K/0 series real-time 78K/0 series
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Fuzzy Inference Devleopment Support System
FE9000 Note 1/FE9200 Note FT9080 Note 1/FT9085 Note FI78K0 Notes FD78K0 Notes Fuzzy knowledge data creation tool Translator Fuzzy inference module Fuzzy inference debugger
Notes PC-9800 series (MS-DOSTM) based PC/AT compatible DOSTM/IBM DOSTM/MS-DOS) based HP9000 series 300(HP-UXTM) based HP9000 series 700(HP-UX) based, SPARCstation(SunOSTM) based, EWS4800 series (EWS-UX/V) based PC-9800 series (MS-DOS WindowsTM) based PC/AT compatible DOS/IBM DOS/MS-DOS Windows) based NEWS(NEWS-OSTM) based Remarks development tools manufactured third party, refer 78K/0 Series Selection Guide (U11126E). RA78K/0, CC78K/0, SM78K0, ID78K0, SD78K/0, RX78K/0 used combination with DF78014.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
APPENDIX RELATED DOCUMENTS
Device Related Documents
Document Name Document Japanese U10659J U12326J U10903J U10904J IEM-5594 IEA-715 IEA-718 English U10659E IEU-1372 IEA-1288 IEA-1289
µPD78018F, 78018FY Subseries User's Manual
78K/0 Series User's Manual Instruction 78K/0 Series Instruction Table 78K/0 Series Instruction
µPD78018F Subseries Special Function Register Table
78K/0 Series Application Note Fundamental Floating-Point Arithmetic Program
Development Tools Documents (User's Manual) (1/2)
Document Name RA78K Series Assembler Package Operation Language RA78K Series Structured Assembler Preprocessor RA78K0 Assembler Package Operation Assembly Language Structured Assembly Language CC78K Series Compiler Operation Language CC78K0 Compiler Operation Language CC78K/0 Compiler Application Note CC78K Series Library Source File PG-1500 PROM Programmer PG-1500 Controller PC-9800 Series (MS-DOS) Based PG-1500 Controller Series DOS) Based IE-78000-R E-78000-R-A IE-78000-R-BK IE-78014-R-EM-A EP-78240 EP-78012GK-R SM78K0 System Simulator Reference Programming Know-how Document Japanese EEU-809 EEU-815 EEU-817 U11802J U11801J U11789J EEU-656 EEU-655 U11517J U11518J EEA-618 U12322J U11940J EEU-704 EEU-5008 U11376J U10057J EEU-867 EEU-962 EEU-986 EEU-5012 U10181J English EEU-1399 EEU-1404 EEU-1402 U11802E U11801E U11789E EEU-1280 EEU-1284 U11517E U11518E EEA-1208 EEU-1335 EEU-1291 U10540E U11376E U10057E EEU-1427 U10418E EEU-1513 EEU-1538 U10181E
Caution
contents above related documents subject change without notice. latest documents should used designing, etc.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Development Tools Documents (User's Manual) (2/2)
Document Name SM78K Series System Simulator External Part User Open Interface Specifications Reference Reference Guide Introduction Reference Introduction Reference Document Japanese U10092J English U10092E
ID78K0 Integrated Debugger Based ID78K0 Integrated Debugger Based ID78K0 Integrated Debugger Windows Based SD78K/0 Screen Debugger PC-9800 Series (MS-DOS) Based SD78K/0 Screen Debugger PC/AT DOS) Based
U11151J U11539J U11649J EEU-852 U10952J EEU-5024 U11279J
U11539E U11649E U10539E EEU-1414 U11279E
Embedded Software Documents (User's Manual)
Document Name 78K/0 Series Real-Time Fundamental Installation 78K/0 Series MX78K0 Fuzzy Knowledge Data Creation Tool 78K/0, 78K/II, 87AD Series Fuzzy Inference Development Support System Translator 78K/0 Series Fuzzy Inference Development Suport System Fuzzy Inference Module 78K/0 Series Fuzzy Inference Development Support System Fuzzy Inference Debugger EEU-921 EEU-1458 EEU-858 EEU-1441 Fundamental Document Japanese U11537J U11536J U12257J EEU-829 EEU-862 English U11537E U11536E EEU-1438 EEU-1444
Other Documents
Document Name Package Manual Semiconductor Device Mounting Technology Manual Quality Grades Semiconductor Device Semiconductor Device Reliability/Quality Control System Electrostatic Discharge (ESD) Test Guide Quality Assurance Semiconductor Device Guide Products Related Microcomputer: Other Companies C11535J C11531J C10983J MEM-539 C11893J U11416J Document Japanese C10943X C10535E C11531E C10983E MEI-1202 English
Caution
contents above related documents subject change without notice. documents should used designing, etc.
latest
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
NOTES CMOS DEVICES
PRECAUTION AGAINST SEMICONDUCTORS
Note: Strong electric field, when exposed device, cause destruction gate oxide ultimately degrade device operation. Steps must taken stop generation static electricity much possible, quickly dissipate once, when occurred. Environmental control must adequate. When dry, humidifier should used. recommended avoid using insulators that easily build static electricity. Semiconductor devices must stored transported anti-static container, static shielding conductive material. test measurement tools including work bench floor should grounded. operator should grounded using wrist strap. Semiconductor devices must touched with bare hands. Similar precautions need taken boards with semiconductor devices
HANDLING UNUSED INPUT PINS CMOS
Note: connection CMOS device inputs cause malfunction. connection provided input pins, possible that internal input level generated noise, etc., hence causing malfunction. CMOS device behave differently than Bipolar NMOS devices. Input levels CMOS devices must fixed high using pull-up pull-down circuitry. Each unused should connected with resistor, considered have possibility being output pin. handling related unused pins must judged device device related specifications governing devices.
STATUS BEFORE INITIALIZATION DEVICES
Note: Power-on does necessarily define initial status device. Production process does define initial operation status device. Immediately after power source turned devices with reset function have been initialized. Hence, power-on does guarantee out-pin levels, settings contents registers. Device initialized until reset signal received. Reset operation must executed immediately after power-on devices having reset function.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Regional Information
Some information contained this document vary from country country. Before using product your application, please contact office your country obtain list authorized representatives distributors. They will verify: Device availability Ordering information Product release schedule Availability related technical literature Development environment specifications (for example, specifications third-party tools components, host computers, power plugs, supply voltages, forth) Network requirements addition, trademarks, registered trademarks, export restrictions, other legal issues also vary from country country.
Electronics Inc. (U.S.)
Santa Clara, California Tel: 408-588-6000 800-366-9782 Fax: 408-588-6130 800-729-9288
Electronics (Germany) GmbH
Benelux Office Eindhoven, Netherlands Tel: 040-2445845 Fax: 040-2444580
Electronics Hong Kong Ltd.
Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044
Electronics Hong Kong Ltd. Electronics (France) S.A.
Velizy-Villacoublay, France Tel: 01-30-67 Fax: 01-30-67 Seoul Branch Seoul, Korea Tel: 02-528-0303 Fax: 02-528-4411
Electronics (Germany) GmbH
Duesseldorf, Germany Tel: 0211-65 Fax: 0211-65
Electronics (France) S.A. Electronics (UK) Ltd.
Milton Keynes, Tel: 01908-691-133 Fax: 01908-670-290 Spain Office Madrid, Spain Tel: 01-504-2787 Fax: 01-504-2860
Electronics Singapore Pte. Ltd.
United Square, Singapore 1130 Tel: 65-253-8311 Fax: 65-250-3583
Electronics Taiwan Ltd. Electronics Italiana s.r.1.
Milano, Italy Tel: 02-66 Fax: 02-66
Electronics (Germany) GmbH
Scandinavia Office Taeby, Sweden Tel: 08-63 Fax: 08-63
Taipei, Taiwan Tel: 02-719-2377 Fax: 02-719-5951
Brasil S.A.
Cumbica-Guarulhos-SP, Brasil Tel: 011-6465-6810 Fax: 011-6465-6829
J98.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
IEBus trademarks Corporation. MS-DOS Windows either registered trademarks trademarks Microsoft Corporation United States and/or other countries. DOS, PC/AT, trademarks Corporation. HP9000 series 300, HP9000 series 700, HP-UX trademarks Hewlett-Packard Company. SPARCstation trademark SPARC International, Inc. SunOS trademark Microsystems, Inc. NEWS NEWS-OS trademarks Sony Corporation. related documents referred this publication include preliminary versions. However, preliminary versions marked such.
export this product from Japan regulated Japanese government. export this product prohibited without governmental license, need which must judged customer. export re-export this product from country other than Japan also prohibited without license from that country. Please call sales representative.
part this document copied reproduced form means without prior written consent Corporation. Corporation assumes responsibility errors which appear this document. Corporation does assume liability infringement patents, copyrights other intellectual property rights third parties arising from device described herein other liability arising from such device. license, either express, implied otherwise, granted under patents, copyrights other intellectual property rights Corporation others. While Corporation been making continuous effort enhance reliability semiconductor devices, possibility defects cannot eliminated entirely. minimize risks damage injury persons property arising from defect semiconductor device, customers must incorporate sufficient safety measures design, such redundancy, fire-containment, anti-failure features. devices classified into following three quality grades: "Standard", "Special", "Specific". Specific quality grade applies only devices developed based customer designated "quality assurance program" specific application. recommended applications device depend quality grade, indicated below. Customers must check quality grade each device before using particular application. Standard: Computers, office equipment, communications equipment, test measurement equipment, audio visual equipment, home electronic appliances, machine tools, personal electronic equipment industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment medical equipment (not specifically designed life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems medical equipment life support, etc. quality grade devices "Standard" unless otherwise specified NEC's Data Sheets Data Books. customers intend devices applications other than those specified Standard quality grade, they should contact sales representative advance. Anti-radioactive design implemented this product.
96.5

µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F 8-BIT S

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