OM4068 driver multiplex rates Product specification File under In

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OM4068 driver multiplex rates
Product specification File under Integrated Circuits, IC12 1998
Philips Semiconductors
Product specification
driver multiplex rates
FEATURES Single-chip controller/driver Static/duplex/triplex drive modes with 32/64/96 segments drive capability device Selectable backplane drive configuration: static backplane multiplexing Selectable display bias configuration drive: static, segment drivers Serial data input (word length bits) On-chip generation intermediate bias voltages fast serial interface CMOS compatible Compatible with 4-bit, 8-bit 16-bit cascaded large applications Logic supply voltage range (VDD VSS) Display supply voltage range (VLCD VSS) power consumption, suitable battery operated systems external components needed oscillator Manufactured silicon gate CMOS process. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME OM4068H(1) OM4068P OM4068U/5(2) OM4068U Notes Gull Wing package. details Chapter "Bonding locations". QFP44 DIP40 tray DESCRIPTION plastic quad flat package; leads (lead length mm); body 1.75 plastic dual in-line package; leads (600 mil) unsawn wafer chip tray APPLICATIONS Telecom equipment Portable instruments Alarm systems Automotive equipment. GENERAL DESCRIPTION
OM4068
OM4068 low-power CMOS driver, designed drive Liquid Crystal Displays (LCDs) with multiplex rates. generates drive signals static multiplexed containing three backplanes segment lines easily cascaded larger applications. necessary functions display provided single chip, including on-chip generation bias voltages, resulting minimum external components lower power consumption. 3-line structure enables serial data transfer with most inputs CMOS compatible.
VERSION SOT307-2 SOT129-1
1998
Philips Semiconductors
Product specification
driver multiplex rates
BLOCK DIAGRAM
OM4068
handbook, full pagewidth
SEG1 SEG32(1)
BACKPLANE OUTPUTS VOLTAGE SELECTOR (CONTROL LOGIC) VLCD BIAS VOLTAGE GENERATOR SHIFT REGISTER DISPLAY SEGMENT OUTPUTS
DISPLAY LATCH SCLK SDIN SDOUT
OM4068
POWER-ON RESET TIMING GENERATOR OSCILLATOR
MBK817
SEG1, SEG6, SEG15 SEG25 available DIP40 package.
Fig.1 Block diagram.
1998
Philips Semiconductors
Product specification
driver multiplex rates
PINNING notes SYMBOL QFP44 VLCD SDIN SCLK SDOUT SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 SEG21 SEG22 SEG23 SEG24 SEG25 SEG26 1998 DIP40 supply voltage positive supply voltage ground drive mode select input drive mode select input serial data input serial clock input serial clock enable serial data output backplane driver output backplane driver output backplane driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output DESCRIPTION
OM4068
Philips Semiconductors
Product specification
driver multiplex rates
OM4068
SYMBOL QFP44 SEG27 SEG28 SEG29 SEG30 SEG31 SEG32 Notes SEG1 SEG32 (LCD segment driver outputs) output multi-level signals segments. BP0, (LCD backplane driver outputs) output multi-level signals backplanes. VLCD (LCD power supply): power supply LCD. SDIN (serial data line): input data line. (serial clock line): input clock line. SDOUT (serial data output): output shift register allow serial cascading OM4068 with other devices. (serial clock enable): input enable/disable acquisition data input line. disabled, data serial accepted device. (display mode select inputs): inputs select drive configurations; static, duplex triplex. DIP40 segment driver output segment driver output segment driver output segment driver output segment driver output segment driver output DESCRIPTION
1998
Philips Semiconductors
Product specification
driver multiplex rates
OM4068
SEG29
SEG28
SEG27
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
SEG20
handbook, full pagewidth
SEG30 SEG31 SEG32 VLCD SDIN
SEG19
SEG18 SEG17 SEG16 SEG15 SEG14
OM4068H
SEG13 SEG12 SEG11 SEG10 SEG9 SEG8
SCLK
SDOUT
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
SEG7
MBK814
Fig.2 configuration (QFP44).
1998
Philips Semiconductors
Product specification
driver multiplex rates
OM4068
handbook, halfpage
SEG13 SEG14 SEG16 SEG17 SEG18 SEG19 SEG20 SEG21 SEG22
SEG12 SEG11 SEG10 SEG9 SEG8 SEG7 SEG5 SEG4 SEG3 SEG2
SEG23
OM4068P
SEG24 SEG26 SEG27 SEG28 SEG29 SEG30 SEG31 SEG32 VLCD
MBK815
SDOUT SCLK SDIN
Fig.3 configuration (DIP40).
1998
Philips Semiconductors
Product specification
driver multiplex rates
FUNCTIONAL DESCRIPTION OM4068 low-power driver designed interface with microprocessor/microcontroller wide variety LCDs. drive static multiplexed containing three backplanes segments. Table Selection display configurations NUMBER BACKPLANES DISPLAY SEGMENTS 7-SEGMENTS NUMERIC DIGITS INDICATOR SYMBOLS
OM4068
display configurations possible with OM4068 depend number active backplane outputs required; selection display configurations given Table typical system (MUX shown Fig.4.
MATRIX dots dots dots
handbook, full pagewidthV
SDIN SCLK HOST MICROPROCESSOR/ MICROCONTROLLER VLCD
segment drivers(1)
PANEL elements)
OM4068
backplanes
MBK818
SDOUT
segment drivers DIP40 package.
Fig.4 Typical system configuration.
host microprocessor/microcontroller maintains 3-line communication channel with OM4068. internal oscillator requires external components. appropriate intermediate biasing voltage multiplexed waveforms generated on-chip.
only other connections required complete system power supplies (VSS, VLCD) suitable capacitors decouple VLCD pins VSS.
1998
Philips Semiconductors
Product specification
driver multiplex rates
Power-on reset on-chip power-on reset block initializes chip after power-on power failures. OM4068 resets starting condition follows: backplane segment outputs (display off) shift registers latches 3-state SDOUT (allowing serial cascading) logic (with LOW) Power-down mode. Data transfers serial should avoided following power-on allow completion reset action. Power-down After power-on chip power-down mode long serial clock active. During power-down static currents switched internal oscillator, timing bias level generation) LCD-outputs 3-stated. power-on reset functions remain enabled. power-down mode disabled first rising edge serial clock SCLK. bias voltage generator intermediate bias voltages display generated on-chip. This removes need external resistive bias chain significantly reduces system power consumption. full-scale voltage equals VLCD VSS. optimum value depends threshold voltage (Vth) number bias levels. Fractional biasing voltages obtained from internal voltage divider three series resistors (1/3bias) connected between VLCD VSS. centre resistor switched circuit provide 1/2bias voltage level multiplex configuration. Table Drive mode selection
OM4068
bias levels depend multiplex rate selected automatically when display configuration selected using voltage selector voltage selector (control logic) coordinates multiplexing accordance with selected drive display configuration. operation voltage selector controlled input pins (see Table
DRIVE MODE test mode (not user accessible) static drive duplex drive triplex drive
multiplex rates three bias levels used including VLCD VSS. Four bias level used multiplex rate. various biasing configurations together with biasing characteristics functions VLCD resulting discrimination ratios (D), given Table practical value determinated equating Voff(rms) with defined threshold voltage (Vth), typically when exhibits approximately contrast. static mode suitable choice 3Vth.
1998
Philips Semiconductors
Product specification
driver multiplex rates
Table drive modes: summary characteristics NUMBER BACKPLANES LEVELS BIAS CONFIGURATION static
OM4068
DRIVE MODE Static
0.354 0.333
0.791 0.638
2.2236 1.915
drive mode waveforms static drive mode used when single backplane provided LCD. Backplane segment drive waveforms this mode shown Fig.5.
handbook, full pagewidth
Tframe VLCD VLCD VLCD (off) -VLCD VLCD (on) VLCD -VLCD
MBK819
BACKPLANE DRIVER OUTPUT
SEGMENTS
Fig.5 Static drive mode waveforms (VOP VLCD VSS).
1998
Philips Semiconductors
Product specification
driver multiplex rates
MULTIPLEX DRIVE MODE When backplanes provided LCD, multiplex mode applies, shown Fig.6.
OM4068
Tframe 1/2VLCD VLCD 1/2VLCD VLCD 1/2VLCD VLCD 1/2VLCD -1/2VLCD -VLCD VLCD 1/2VLCD -1/2VLCD -VLCD VLCD 1/2VLCD -1/2VLCD -VLCD VLCD 1/2VLCD -1/2VLCD -VLCD Tframe
VLCD 1/2VLCD -1/2VLCD -VLCD VLCD 1/2VLCD -1/2VLCD -VLCD VLCD 1/2VLCD -1/2VLCD -VLCD VLCD 1/2VLCD -1/2VLCD -VLCD
MBK820
VLCD 1/2VLCD
VLCD 1/2VLCD
VLCD 1/2VLCD
Tframe
BACKPLANE DRIVER OUTPUTS
SEGMENTS
Fig.6 Waveforms multiplex drive mode (VOP VLCD VSS).
MULTIPLEX DRIVE MODE When three backplanes provided LCD, multiplex mode applies, shown Fig.7.
1998
handbook, full pagewidth
VLCD
Philips Semiconductors
Product specification
driver multiplex rates
OM4068
handbook, full pagewidth
Tframe VLCD VLCD 2/3VLCD 1/3VLCD
Tframe VLCD 2/3VLCD -2/3VLCD -VLCD VLCD 2/3VLCD -2/3VLCD -VLCD VLCD 2/3VLCD -2/3VLCD -VLCD VLCD 2/3VLCD -2/3VLCD -VLCD VLCD 2/3VLCD -2/3VLCD -VLCD VLCD 2/3VLCD -2/3VLCD -VLCD VLCD 2/3VLCD -2/3VLCD -VLCD VLCD 2/3VLCD -2/3VLCD -VLCD
Tframe VLCD 2/3VLCD -2/3VLCD -VLCD VLCD 2/3VLCD -2/3VLCD -VLCD VLCD 2/3VLCD -2/3VLCD -VLCD VLCD 2/3VLCD -2/3VLCD -VLCD VLCD 2/3VLCD -2/3VLCD -VLCD VLCD 2/3VLCD -2/3VLCD -VLCD VLCD 2/3VLCD -2/3VLCD -VLCD VLCD 2/3VLCD -2/3VLCD -VLCD
Tframe
2/3VLCD -2/3VLCD -VLCD VLCD
VLCD 2/3VLCD 1/3VLCD
2/3VLCD -2/3VLCD -VLCD VLCD
VLCD 2/3VLCD 1/3VLCD
2/3VLCD -2/3VLCD -VLCD VLCD
VLCD 2/3VLCD 1/3VLCD
2/3VLCD -2/3VLCD -VLCD VLCD
VLCD 2/3VLCD 1/3VLCD
2/3VLCD -2/3VLCD -VLCD VLCD
VLCD 2/3VLCD 1/3VLCD
2/3VLCD -2/3VLCD -VLCD VLCD
VLCD 2/3VLCD 1/3VLCD
2/3VLCD -2/3VLCD -VLCD VLCD
VLCD 2/3VLCD 1/3VLCD
2/3VLCD -2/3VLCD -VLCD
VLCD 2/3VLCD 1/3VLCD
MBK821
VLCD 2/3VLCD 1/3VLCD
VLCD 2/3VLCD 1/3VLCD
BACKPLANE DRIVER OUTPUTS
SEGMENTS
Fig.7 Waveforms multiplex drive motive (VOP VLCD VSS).
1998
Philips Semiconductors
Product specification
driver multiplex rates
Oscillator internal logic multi-level drive signals OM4068 generated built-in oscillator. external components required. order minimize radio frequency interference, oscillator operates with symmetrical slew-rate limited capacitor charge/discharge. oscillator runs continuously once power down state after power-on been left.
OM4068
Interface microprocessor unit: serial interface three-line structure enables serial unidirectional data transfer with three lines serial data input line (SDIN), serial clock line (SCLK) data line enable (SCE). inputs CMOS compatible. These lines must always defined state VDD. Floating inputs could damage chip. bus, data transferred during each clock pulse. data SDIN line remains stable during whole clock period. Data changes arrive with falling edge serial clock SCLK (see Fig.8).
handbook, full pagewidth
SDIN SDOUT
SCLK data line stable; data valid change data allowed
MBK822
Fig.8 transfer bus.
Shift register Data present SDIN shifted into shift register with rising edge serial clock SCLK synchronous manner. shift register serves transfer display information from serial (display) latch while previous data displayed. shift register organized three 32-bit shift registers. Depending display driving mode selected (see Table one, three registers used cascaded resulting shift register length bits. Figure shows shift register organization with display data bits after shift operation completed. shift sequence begins with data finishes with data correspondence between data
numbers display segments shown Table Data from last stage register supplied SDOUT allow serial cascading OM4068 with other peripheral devices. Depending display driving mode selected, SDOUT corresponds register (see Fig.10). Data SDOUT shifted with falling edge SCLK clock. SDOUT therefore delayed 1/2SCLK cycle before applied SDIN next serial chain (see Fig.8). clock enable signal must HIGH order enable shift operation. SDOUT output latched with last data after returned HIGH (shift operation terminated). SDOUT 3-state mode when LOW.
1998
Philips Semiconductors
Product specification
driver multiplex rates
Display latch 96-bit display latch holds display data while corresponding multiplex signals generated. There one-to-one relationship between data display latch segment outputs. segment activated when corresponding data display latch HIGH. Display latches HOLD mode (SCE HIGH) during shift operation maintain display data constant. Data latched into display latch with internal frame clock. Thus there delay half frame before data latched after signal returns zero. Shift register configuration Timing
OM4068
timing OM4068 organizes internal data flow device. This includes transfer display data from shift register display segments outputs. timing also generates frame frequency which derived from clock frequency generated internal clock generator: fr(LCD) -2400
handbook, full pagewidth
96-bit shift register
SDIN
32-bit register
SDOUT
D32A driving mode: static; (M1, 32-bit register 32-bit register D32A D32B SDOUT
SDIN
driving mode: duplex (M1, SDIN 32-bit register D32A 32-bit register D32B 32-bit register D32C
MBK823
SDOUT
driving mode: triplex (M1,
Fig.9 Display data position shift register.
1998
Philips Semiconductors
Product specification
driver multiplex rates
OM4068
handbook, full pagewidth
SDIN
D32A
D32B
D32C
SCLK
SDOUT
MBK825
Fig.10 Shift register structure.
1998
Philips Semiconductors
Product specification
driver multiplex rates
Table Relationships between data numbers segment outputs DRIVING MODE STATIC D10A D11A D12A D13A D14A D15A D16A D17A D18A D19A D20A D21A D22A D23A D24A D25A D26A D27A D28A D29A D30A D31A D32A D10A D11A D12A D13A D14A D15A D16A D17A D18A D19A D20A D21A D22A D23A D24A D25A D26A D27A D28A D29A D30A D31A D32A DUPLEX D10B D11B D12B D13B D14B D15B D16B D17B D18B D19B D20B D21B D22B D23B D24B D25B D26B D27B D28B D29B D30B D31B D32B D10A D11A D12A D13A D14A D15A D16A D17A D18A D19A D20A D21A D22A D23A D24A D25A D26A D27A D28A D29A D30A D31A D32A TRIPLEX D10B D11B D12B D13B D14B D15B D16B D17B D18B D19B D20B D21B D22B D23B D24B D25B D26B D27B D28B D29B D30B D31B D32B
OM4068
SEGMENT NUMBER SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 SEG21 SEG22 SEG23 SEG24 SEG25 SEG26 SEG27 SEG28 SEG29 SEG30 SEG31 SEG32 Segment outputs
D10C D11C D12C D13C D14C D15C D16C D17C D18C D19C D20C D21C D22C D23C D24C D25C D26C D27C D28C D29C D30C D31C D32C
drive section includes segment outputs SEG1 SEG32 which should connected directly LCD. segment output signals generated accordance with multiplex backplane signals with data display latch. When less than segments required unused segment outputs should left open-circuit.
1998
Philips Semiconductors
Product specification
driver multiplex rates
Backplane outputs
OM4068
drive section includes three backplane outputs (BP1 BP3) which should connected directly LCD. backplane output signals generated accordance with selected drive mode. less than three backplane outputs required unused outputs should left open-circuit. multiplex drive mode, 1/2VLCD. static drive mode VSS. LIMITING VALUES accordance with Absolute Maximum Rating System (IEC 134). SYMBOL VLCD IDD, ISS, ILCD Ptot(pack) P/out Tamb Tstg PARAMETER supply voltage supply voltage input voltage (any input) output voltage (BP1, BP2, BP3, VLCD) input current output current VDD, VLCD current total power dissipation package power dissipation output operating ambient temperature storage temperature junction temperature electrostatic handling note note Notes Equivalent discharging capacitor series resistor (human body model). Equivalent discharging capacitor 0.75 series inductor (machine model). HANDLING Inputs outputs protected against electrostatic discharge normal handling. However, totally safe, desirable take normal precautions appropriate handling devices (see "Handling Devices"). CONDITIONS -0.5 -0.5 -0.5 -0.5 -2000 -150 MIN. MAX. +6.5 +7.5 VLCD +105 +150 +2000 +150 UNIT
1998
Philips Semiconductors
Product specification
driver multiplex rates
CHARACTERISTICS VLCD Tamb +105 unless otherwise specified. SYMBOL Supplies VLCD supply voltage supply voltage supply current power-down state; note normal mode; fosc intern; notes ILCD VLCD current power-down state; note normal mode; fosc intern; notes VPOR Logic R(o)seg R(o)back Vseg(bias)(tol) LOW-level input voltage HIGH-level input voltage LOW-level output current (SDOUT) HIGH-level output current (SDOUT) pull-up current leakage current note note note note 0.7VDD 0.04 -100 -100 0.15 power-on reset voltage level note PARAMETER CONDITIONS MIN. TYP.
OM4068
MAX.
UNIT
1.25
0.3VDD
Segment backplane outputs segment output resistance SEG1 SEG32 backplane output resistance bias tolerance SEG1 SEG32 +100 +100
Vback(bias)(tol) bias tolerance BP1, Notes
Power-down state. After power-on chip power-down state long serial clock activated. During power-down static currents switched except power-on reset block. Output SDOUT open-circuit; inputs VSS; inactive. Drive mode: static, duplex triplex. outputs open-circuit, typical, inputs VSS; inactive. Resets logic when VPOR. Resistance output terminal BP1, BP3) with load current outputs measured time. outputs open-circuits.
1998
Philips Semiconductors
Product specification
driver multiplex rates
CHARACTERISTICS VLCD Tamb +105 unless otherwise specified. SYMBOL ffr(LCD) fosc fSCLK tSCLKL tSCLKH tsu(D) th(D) PARAMETER frame frequency (internal clock) oscillator frequency (not available pin) MIN. TYP.
OM4068
MAX.
UNIT
timing characteristics: serial interface; note SCLK clock frequency SCLK clock period SCLK clock HIGH period data set-up time data hold time SCLK, SDIN rise time SCLK, SDIN fall time
tsu(en)(SDEH-SCLKH) enable set-up time (SDE HIGH SCLK HIGH) tsu(dis)(SCLKL-SDEL) disable set-up time (SCLK LOW) tPHL(SDOUT) Note SDOUT HIGH-to-LOW propagation delay
timing values valid within operating supply voltage ambient temperature range referenced with input voltage swing VDD.
handbook, full pagewidth
SDOUT tSCLKH tSCLKL tPHL(SDOUT)
SCLK th(D) SDIN tsu(en)(SDEH-SCLKH)
MBK824
tsu(D)
tsu(dis)(SCLKL-SDEL)
Fig.11 Serial data timing.
1998
Philips Semiconductors
Product specification
driver multiplex rates
BONDING LOCATIONS
OM4068
SEG30
SEG29
SEG28
SEG27
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
SEG20
handbook, full pagewidth
SEG31
SEG19
SEG18 SEG17 SEG16 SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG9 SEG8
SEG32 VLCD 2.01 SDIN
OM4068
SCLK
SDOUT
SEG1 SEG2 SEG3 SEG4
SEG5
SEG6 SEG7
2.03
MBK816
Dimensions Bonding dimensions:
Fig.12 Bonding locations.
1998
Philips Semiconductors
Product specification
driver multiplex rates
Table Bonding locations (dimensions µm). coordinates referenced bottom left corner chip (see Fig.12). 43.100 42.900 43.100 43.100 43.100 43.100 310.450 447.350 604.800 714.850 824.850 924.850 1024.850 1124.850 1224.850 1327.250 1432.450 1532.650 1783.600 1783.600 1783.600 1783.600 1783.600 1783.600 1783.600 1783.600 1783.600 1783.600 1783.600 1514.600 1370.550 1270.500 1170.500 1070.500 970.550 870.550 770.550 660.550 970.500 791.850 661.750 531.750 401.750 271.750 43.100 43.100 43.100 43.100 43.100 43.100 43.100 43.100 43.100 43.100 43.100 43.100 293.850 458.850 603.850 703.850 803.850 903.850 1003.850 1103.850 1203.850 1323.850 1453.850 1711.100 1711.100 1711.100 1711.100 1711.100 1711.100 1711.100 1711.100 1711.100 SYMBOL SEG28 SEG29 SEG30 SEG31 SEG32 VLCD Alignment marks 1769.6 1770.1 172.0 550.550 430.550 300.550 43.100 43.100 43.100
OM4068
SYMBOL SDIN SCLK SDOUT SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 SEG21 SEG22 SEG23 SEG24 SEG25 SEG26 SEG27 1998
1711.100 1711.100 1711.100 1460.050 1274.950 1158.700
1696.9 58.4 1705.2
Philips Semiconductors
Product specification
driver multiplex rates
PACKAGE OUTLINES QFP44: plastic quad flat package; leads (lead length mm); body 1.75
OM4068
SOT307-2
index detail
scale
DIMENSIONS original dimensions) UNIT max. 2.10 0.25 0.05 1.85 1.65 0.25 0.40 0.20 0.25 0.14 10.1 10.1 12.9 12.3 12.9 12.3 0.95 0.55 0.15 0.15
Note Plastic metal protrusions 0.25 maximum side included. OUTLINE VERSION SOT307-2 REFERENCES JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-02-04 97-08-01
1998
Philips Semiconductors
Product specification
driver multiplex rates
OM4068
DIP40: plastic dual in-line package; leads (600 mil)
SOT129-1
seating plane
index
scale
DIMENSIONS (inch dimensions derived from original dimensions) UNIT inches max. 0.19 min. 0.51 0.020 max. 0.16 1.70 1.14 0.067 0.045 0.53 0.38 0.021 0.015 0.36 0.23 0.014 0.009
2.54 0.10
15.24 0.60
3.60 3.05 0.14 0.12
15.80 15.24 0.62 0.60
17.42 15.90 0.69 0.63
0.254 0.01
max. 2.25 0.089
52.50 51.50 2.067 2.028
14.1 13.7 0.56 0.54
Note Plastic metal protrusions 0.25 maximum side included. OUTLINE VERSION SOT129-1 REFERENCES 051G08 JEDEC MO-015AJ EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-14
1998
Philips Semiconductors
Product specification
driver multiplex rates
SOLDERING Introduction There soldering method that ideal packages. Wave soldering often preferred when through-hole surface mounted components mixed printed-circuit board. However, wave soldering always suitable surface mounted ICs, printed-circuits with high population densities. these situations reflow soldering often used. This text gives very brief insight complex technology. more in-depth account soldering found "Data Handbook IC26; Integrated Circuit Packages" (order code 9398 90011). SOLDERING DIPPING WAVE maximum permissible temperature solder solder this temperature must contact with joint more than seconds. total contact time successive solder waves must exceed seconds. device mounted seating plane, temperature plastic body must exceed specified maximum storage temperature (Tstg max). printed-circuit board been pre-heated, forced cooling necessary immediately after soldering keep temperature within permissible limit. REPAIRING SOLDERED JOINTS Apply voltage soldering iron (less than lead(s) package, below seating plane more than above temperature soldering iron less than remain contact seconds. temperature between contact seconds. REFLOW SOLDERING Reflow soldering techniques suitable packages.
OM4068
choice heating method influenced larger plastic packages leads, more). infrared vapour phase heating used large packages absolutely (less than 0.1% moisture content weight), vaporization small amount moisture them cause cracking plastic body. details, refer Drypack information "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". Reflow soldering requires solder paste suspension fine solder particles, flux binding agent) applied printed-circuit board screen printing, stencilling pressure-syringe dispensing before package placement. Several methods exist reflowing; example, infrared/convection heating conveyor type oven. Throughput times (preheating, soldering cooling) vary between seconds depending heating method. Typical reflow peak temperatures range from WAVE SOLDERING Wave soldering recommended packages. This because likelihood solder bridging closely-spaced leads possibility incomplete solder penetration multi-lead devices. CAUTION Wave soldering applicable packages with pitch equal less than wave soldering cannot avoided, packages with pitch larger than following conditions must observed: double-wave turbulent wave with high upward pressure followed smooth laminar wave) soldering technique should used. footprint must angle board direction must incorporate solder thieves downstream side corners.
1998
Philips Semiconductors
Product specification
driver multiplex rates
During placement before soldering, package must fixed with droplet adhesive. adhesive applied screen printing, transfer syringe dispensing. package soldered after adhesive cured. Maximum permissible solder temperature maximum duration package immersion solder seconds, cooled less than within seconds. Typical dwell time seconds mildly-activated flux will eliminate need removal corrosive residues most applications. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values REPAIRING SOLDERED JOINTS
OM4068
component first soldering diagonallyopposite leads. only voltage soldering iron (less than applied flat part lead. Contact time must limited seconds When using dedicated tool, other leads soldered operation within seconds between
This data sheet contains target goal specifications product development. This data sheet contains preliminary data; supplementary data published later. This data sheet contains final product specifications.
Limiting values given accordance with Absolute Maximum Rating System (IEC 134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections specification implied. Exposure limiting values extended periods affect device reliability. Application information Where application information given, advisory does form part specification. LIFE SUPPORT APPLICATIONS These products designed life support appliances, devices, systems where malfunction these products reasonably expected result personal injury. Philips customers using selling these products such applications their risk agree fully indemnify Philips damages resulting from such improper sale.
1998
Philips Semiconductors
Product specification
driver multiplex rates
NOTES
OM4068
1998
Philips Semiconductors
Product specification
driver multiplex rates
NOTES
OM4068
1998
Philips Semiconductors worldwide company
Argentina: South America Australia: Waterloo Road, NORTH RYDE, 2113, Tel. 9805 4455, Fax. 9805 4466 Austria: Computerstr. A-1101 WIEN, P.O. 213, Tel. 1010, Fax. 1210 Belarus: Hotel Minsk Business Center, Bld. 1211, Volodarski Str. 220050 MINSK, Tel. +375 733, Fax. +375 Belgium: Netherlands Brazil: South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, James Bourchier Blvd., 1407 SOFIA, Tel. +359 211, Fax. +359 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. 7381 China/Hong Kong: Hong Kong Industrial Technology Centre, Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: South America Czech Republic: Austria Denmark: Prags Boulevard 1919, DK-2300 COPENHAGEN Tel. 2636, Fax. 0044 Finland: Sinikalliontie FIN-02630 ESPOO, Tel. +358 615800, Fax. +358 61580920 France: Carnot, BP317, 92156 SURESNES Cedex, Tel. 6161, Fax. 6427 Germany: D-20097 HAMBURG, Tel. Fax. Greece: 25th March Street, 17778 TAVROS/ATHENS, Tel. 4894 339/239, Fax. 4814 Hungary: Austria India: Philips INDIA Ltd, Band Building, floor, 254-D, Annie Besant Road, Worli, MUMBAI 025, Tel. 8541, Fax. 0966 Indonesia: Philips Development Corporation, Semiconductors Division, Gedung Philips, Buncit Raya Kav.99-100, JAKARTA 12510, Tel. 0040 ext. 2501, Fax. 0080 Ireland: Newstead, Clonskeagh, DUBLIN Tel. +353 7640 000, Fax. +353 7640 Israel: RAPAC Electronics, Kehilat Saloniki 18053, AVIV 61180, Tel. +972 0444, Fax. +972 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza Novembre 20124 MILANO, Tel. 6752 2531, Fax. 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. 3740 5130, Fax. 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. 1412, Fax. 1415 Malaysia: Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. 5214, Fax. 4880 Mexico: 5900 Gateway East, Suite 200, PASO, TEXAS 79905, Tel. +9-5 7381 Middle East: Italy Netherlands: Postbus 90050, 5600 EINDHOVEN, Bldg. Tel. 82785, Fax. 88399 Zealand: Wagener Place, C.P.O. 1041, AUCKLAND, Tel. 4160, Fax. 7811 Norway: Manglerud 0612, OSLO, Tel. 8000, Fax. 8341 Pakistan: Singapore Philippines: Philips Semiconductors Philippines Inc., Valero Salcedo Village, P.O. 2108 MCC, MAKATI, Metro MANILA, Tel. 6380, Fax. 3474 Poland: Lukiska 04-123 WARSZAWA, Tel. 2831, Fax. 2327 Portugal: Spain Romania: Italy Russia: Philips Russia, Usatcheva 35A, 119048 MOSCOW, Tel. 6918, Fax. 6919 Singapore: Lorong Payoh, SINGAPORE 319762, Tel. 2538, Fax. 6500 Slovakia: Austria Slovenia: Italy South Africa: S.A. PHILIPS Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. 7430 Johannesburg 2000, Tel. 5911, Fax. 5494 South America: Vicente Pinzon, 173, floor, 04547-130 PAULO, Brazil, Tel. 2333, Fax. 2382 Spain: Balmes 08007 BARCELONA, Tel. 6312, Fax. 4107 Sweden: Kottbygatan Akalla, S-16485 STOCKHOLM, Tel. 5985 2000, Fax. 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 Tel. 2741 Fax. 3263 Taiwan: Philips Semiconductors, Chien Rd., Sec. TAIPEI, Taiwan Tel. +886 2134 2865, Fax. +886 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. 4090, Fax. 0793 Turkey: Talatpasa Cad. 80640 Tel. 2770, Fax. 6707 Ukraine: PHILIPS UKRAINE, Patrice Lumumba str., Building Floor 252042 KIEV, Tel. +380 2776, Fax. +380 0461 United Kingdom: Philips Semiconductors Ltd., Bath Road, Hayes, MIDDLESEX 5BX, Tel. 5000, Fax. 8421 United States: East Arques Avenue, SUNNYVALE, 94088-3409, Tel. 7381 Uruguay: South America Vietnam: Singapore Yugoslavia: PHILIPS, Pasica 5/v, 11000 BEOGRAD, Tel. +381 344, Fax.+381 Internet:
other countries apply Philips Semiconductors, International Marketing Sales Communications, Building BE-p, P.O. 218, 5600 EINDHOVEN, Netherlands, Fax. 24825 Philips Electronics N.V. 1998
SCA60
rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights.
Printed Netherlands
415106/1200/01/pp28
Date release: 1998
Document order number:
9397 03802

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