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Quad 2-Input Data Selectors/Multiplexers MC54/74HC157A identical


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Quad 2-Input Data Selectors/Multiplexers
MC54/74HC157A identical pinout LS157. device inputs compatible with standard CMOS outputs; with pullup resistors, they compatible with LSTTL outputs. This device routes nibbles single port determined Select input. data presented outputs noninverted form. high level Output Enable input sets four outputs level. HC157A similar function HC257 which 3-state outputs. Output Drive Capability: LSTTL Loads Outputs Directly Interface CMOS, NMOS, Operating Voltage Range: Input Current: High Noise Immunity Characteristic CMOS Devices Compliance with Requirements Defined JEDEC Standard Chip Complexity: FETs 20.5 Equivalent Gates
MC54/74HC157A
SUFFIX CERAMIC PACKAGE CASE 620-10
SUFFIX PLASTIC PACKAGE CASE 648-08 SUFFIX SOIC PACKAGE CASE 751B-05 SUFFIX TSSOP PACKAGE CASE 948F-01
ORDERING INFORMATION MC54HCXXXAJ MC74HCXXXAN MC74HCXXXAD MC74HCXXXADT Ceramic Plastic SOIC TSSOP
LOGIC DIAGRAM
DATA OUTPUTS
NIBBLE INPUTS NIBBLE INPUTS
ASSIGNMENT
SELECT OUTPUT ENABLE
SELECT OUTPUT ENABLE
FUNCTION TABLE
Inputs Output Enable Select Outputs
don't care levels respective Data-Word Inputs.
2/97
Motorola, Inc. 1997
MC54/74HC157A
MAXIMUM RATINGS*
Symbol Parameter Value Unit Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Vout Output Voltage (Referenced GND) Input Current, Iout Output Current, Supply Current, Pins Power Dissipation Still Air, Plastic Ceramic SOIC Package TSSOP Package Storage Temperature Tstg
This device contains protection circuitry guard against damage high static voltages electric fields. However, precautions must taken avoid applications voltage higher than maximum rated voltages this high-impedance circuit. proper operation, Vout should constrained range (Vin Vout) VCC. Unused inputs must always tied appropriate logic voltage level (e.g., either VCC). Unused outputs must left open.
Lead Temperature, from Case Seconds (Plastic DIP, SOIC TSSOP Package) (Ceramic DIP)
Maximum Ratings those values beyond which damage device occur. Functional operation should restricted Recommended Operating Conditions. Derating Plastic DIP: mW/_C from 125_C Ceramic DIP: mW/_C from 100_ 125_C SOIC Package: mW/_C from 125_C TSSOP Package: mW/_C from 125_C high frequency heavy load considerations, Chapter Motorola High-Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter
Unit
Supply Voltage (Referenced GND) Input Voltage, Output Voltage (Referenced GND)
Vin, Vout
Operating Temperature, Package Types Input Rise Fall Time (Figure
1000
ELECTRICAL CHARACTERISTICS (Voltages Referenced GND)
Guaranteed Limit
Symbol
Parameter
Test Conditions
25_C 3.15 1.35
85_C 125_C
3.15 1.35 3.15 1.35
Unit
Minimum High-Level Input Voltage
Vout |Iout|
Maximum Low-Level Input Voltage
Vout |Iout|
Minimum High-Level Output Voltage
|Iout|
|Iout| |Iout| |Iout|
2.48 3.98 5.48
2.34 3.84 5.34
High-Speed CMOS Logic Data DL129
MC54/74HC157A
ELECTRICAL CHARACTERISTICS (Voltages Referenced GND)
Guaranteed Limit Symbol Parameter Test Conditions 25_C
85_C 125_C
0.33 0.33 0.33
Unit
Maximum Low-Level Output Voltage
|Iout|
Maximum Input Leakage Current Maximum Three-State Leakage Current Maximum Quiescent Supply Current (per Package)
|Iout| |Iout| |Iout|
0.26 0.26 0.26
Output High-Impedance State Vout Iout
NOTE: Information typical parametric values found Chapter Motorola High-Speed CMOS Data Book (DL129/D).
ELECTRICAL CHARACTERISTICS Input
Guaranteed Limit
Symbol tPLH, tPHL
Parameter
25_C
85_C 125_C
Unit
Maximum Propagation Delay, Input Output (Figures
tPLH, tPHL
Maximum Propagation Delay, Select Output (Figures
tPLH, tPHL
Maximum Propagation Delay, Output Enable Output (Figures
tTLH, tTHL
Maximum Output Transition Time, Output (Figures
Maximum Input Capacitance
NOTE: propagation delays with loads other than information typical parametric values, Chapter Motorola High- Speed CMOS Data Book (DL129/D). Typical 25°C,
Power Dissipation Capacitance Package)* (Per
Used determine no-load dynamic power consumption: load considerations, Chapter Motorola High-Speed CMOS Data Book (DL129/D).
High-Speed CMOS Logic Data DL129
MC54/74HC157A
DESCRIPTIONS
INPUTS (Pins Nibble inputs. data present these pins transferred outputs when Select input level Output Enable input level. data presented outputs noninverted form. (Pins Nibble inputs. data present these pins transferred outputs when Select input high level Output Enable input level. data presented outputs noninverted form. OUTPUTS (Pins Data outputs. selected input Nibble presented these outputs when Output Enable input level. data present these pins noninverted form. Output Enable input high level, outputs level. CONTROL INPUTS Select (Pin Nibble select. This input determines data word transferred outputs. level this input selects inputs high level selects inputs. Output Enable (Pin Output Enable input. level this input allows selected input data presented outputs. high level this input sets outputs level.
SWITCHING WAVEFORMS
INPUT tPLH OUTPUT tTLH tTHL tPHL SELECT tPLH OUTPUT tTLH tTHL tPHL
Figure HC157A
OUTPUT ENABLE tPHL OUTPUT tTHL
Figure versus Select, Noninverted
tPLH
tTLH
Figure HC157A
TEST POINT OUTPUT DEVICE UNDER TEST
Includes probe capacitance
Figure Test Circuit
High-Speed CMOS Logic Data DL129
MC54/74HC157A
EXPANDED LOGIC DIAGRAM
NIBBLE OUTPUTS OUTPUT ENABLE SELECT DATA OUTPUTS
High-Speed CMOS Logic Data DL129
MC54/74HC157A
OUTLINE DIMENSIONS
SUFFIX CERAMIC PACKAGE CASE 620-10 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEAD WHEN FORMED PARALLEL. NARROW 0.76 (0.030) WHERE LEAD ENTERS CERAMIC BODY. INCHES 0.750 0.785 0.240 0.295 0.200 0.015 0.020 0.050 0.055 0.065 0.100 0.008 0.015 0.125 0.170 0.300 0.020 0.040 MILLIMETERS 19.05 19.93 6.10 7.49 5.08 0.39 0.50 1.27 1.40 1.65 2.54 0.21 0.38 3.18 4.31 7.62 1.01 0.51
SEATING PLANE
0.25 (0.010)
0.25 (0.010)
SUFFIX PLASTIC PACKAGE CASE 648-08 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEADS WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. ROUNDED CORNERS OPTIONAL. INCHES MILLIMETERS 0.740 0.770 18.80 19.55 0.250 0.270 6.35 6.85 0.145 0.175 3.69 4.44 0.015 0.021 0.39 0.53 0.040 0.070 1.77 1.02 0.100 2.54 0.050 1.27 0.008 0.015 0.21 0.38 0.110 0.130 2.80 3.30 0.295 0.305 7.50 7.74 0.020 0.040 0.51 1.01
0.25 (0.010)
SEATING PLANE
SUFFIX PLASTIC SOIC PACKAGE CASE 751B-05 ISSUE
0.25 (0.010)
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. MILLIMETERS 9.80 10.00 4.00 3.80 1.75 1.35 0.49 0.35 1.25 0.40 1.27 0.25 0.19 0.25 0.10 6.20 5.80 0.50 0.25 INCHES 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.229 0.244 0.010 0.019
SEATING
PLANE
0.25 (0.010)
High-Speed CMOS Logic Data DL129
MC54/74HC157A
OUTLINE DIMENSIONS
SUFFIX PLASTIC TSSOP PACKAGE CASE 948F-01 ISSUE
0.10 (0.004) 0.15 (0.006)
IDENT.
SECTION
0.25 (0.010) 0.15 (0.006)
DETAIL
MILLIMETERS 4.90 5.10 4.30 4.50 1.20 0.05 0.15 0.50 0.75 0.65 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 INCHES 0.193 0.200 0.169 0.177 0.047 0.002 0.006 0.020 0.030 0.026 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252
0.10 (0.004) SEATING
PLANE
DETAIL
Motorola reserves right make changes without further notice products herein. Motorola makes warranty, representation guarantee regarding suitability products particular purpose, does Motorola assume liability arising application product circuit, specifically disclaims liability, including without limitation consequential incidental damages. "Typical" parameters which provided Motorola data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. Motorola does convey license under patent rights rights others. Motorola products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure Motorola product could create situation where personal injury death occur. Should Buyer purchase Motorola products such unintended unauthorized application, Buyer shall indemnify hold Motorola officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that Motorola negligent regarding design manufacture part. Motorola registered trademarks Motorola, Inc. Motorola, Inc. Equal Opportunity/Affirmative Action Employer. Mfax trademark Motorola, Inc. reach EUROPE Locations Listed: Motorola Literature Distribution; P.O. 5405, Denver, Colorado 80217. 303-675-2140 1-800-441-2447 JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 81-3-3521-8315
MfaxTM: RMFAX0@email.sps.mot.com TOUCHTONE 602-244-6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Ping Industrial Park, Canada ONLY 1-800-774-1848 Ting Road, N.T., Hong Kong. 852-26629298 INTERNET: http://www.mot.com/SPS/
High-Speed CMOS Logic Data DL129
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH. PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-.
MC74HC157A/D

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