Triacs logic level Glass passivated, sensitive gate triacs plasti

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Triacs logic level Glass passivated, sensitive gate triacs plasti

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Triacs logic level
Glass passivated, sensitive gate triacs plastic envelope suitable surface mounting, intended general purpose bidirectional switching phase control applications. These devices intended interfaced directly microcontrollers, logic integrated circuits other power gate trigger circuits.
BT134W series
QUICK REFERENCE DATA
SYMBOL VDRM IT(RMS) ITSM PARAMETER BT134WRepetitive peak off-state voltages on-state current Non-repetitive peak on-state current MAX. MAX. UNIT 500D 600D
PINNING SOT223
DESCRIPTION main terminal
CONFIGURATION
SYMBOL
main terminal gate main terminal
LIMITING VALUES
Limiting values accordance with Absolute Maximum System (IEC 134). SYMBOL VDRM IT(RMS) ITSM PARAMETER Repetitive peak off-state voltages on-state current Non-repetitive peak on-state current fusing Repetitive rate rise on-state current after triggering full sine wave; full sine wave; prior surge 16.7 dIG/dt A/µs GT2- GT2- CONDITIONS MIN. -500 5001 MAX. -600 6001 UNIT A/µs A/µs A/µs A/µs
dIT/dt
PG(AV) Tstg
Peak gate current Peak gate voltage Peak gate power Average gate power Storage temperature Operating junction temperature
over period
Although recommended, off-state voltages 800V applied without damage, triac switch on-state. rate rise current should exceed A/µs. August 1997 1.200
Triacs logic level
THERMAL RESISTANCES
SYMBOL j-sp PARAMETER Thermal resistance junction solder point Thermal resistance junction ambient CONDITIONS full half cycle mounted; minimum footprint mounted; area fig:14 MIN.
BT134W series
TYP.
MAX.
UNIT
STATIC CHARACTERISTICS
unless otherwise stated SYMBOL PARAMETER Gate trigger current CONDITIONS GT2- GT2- GT2- GT2- MIN. 0.25 TYP. MAX. UNIT
Latching current
Holding current On-state voltage Gate trigger voltage Off-state leakage current
VDRM(max);
DYNAMIC CHARACTERISTICS
unless otherwise stated SYMBOL dVD/dt PARAMETER Critical rate change off-state voltage Gate controlled turn-on time CONDITIONS VDRM(max); exponential waveform; VDRM(max); dIG/dt A/µs MIN. TYP. MAX. UNIT V/µs
August 1997
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Triacs logic level
BT134W series
Ptot
BT134W
Tsp(max)
IT(RMS)
BT134W
IT(RMS)
Fig.1. Maximum on-state dissipation, Ptot, versus on-state current, IT(RMS), where conduction angle.
BT134W limit time
Fig.4. Maximum permissible current IT(RMS) versus solder point temperature Tsp.
IT(RMS) BT134W
1000
ITSM
initial
quadrant
10us
100us
10ms
100ms
0.01
surge duration
Fig.2. Maximum permissible non-repetitive peak on-state current ITSM, versus pulse width sinusoidal currents, 20ms.
BT134W ITSM time
Fig.5. Maximum permissible repetitive on-state current IT(RMS), versus surge duration, sinusoidal currents, 108°C.
VGT(Tj) VGT(25
ITSM
BT136
initial
Number cycles 50Hz
1000
Fig.3. Maximum permissible non-repetitive peak on-state current ITSM, versus number cycles, sinusoidal currents,
Fig.6. Normalised gate trigger voltage VGT(Tj)/ VGT(25°C), versus junction temperature
August 1997
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Triacs logic level
BT134W series
IGT(Tj) IGT(25
BT136D GT2- GT2-
BT134W
0.21 Ohms
Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25°C), versus junction temperature
IL(Tj) IL(25
Fig.10. Typical maximum on-state characteristic.
TRIAC
j-sp (K/W)
BT134W
unidirectional bidirectional
0.01 10us
0.1ms
10ms
0.1s
Fig.8. Normalised latching current IL(Tj)/ IL(25°C), versus junction temperature
IH(Tj) IH(25C)
Fig.11. Transient thermal impedance j-sp, versus pulse width
dVD/dt (V/us)
TRIAC
1000
Fig.9. Normalised holding current IH(Tj)/ IH(25°C), versus junction temperature
Fig.12. Typical, critical rate rise off-state voltage, dVD/dt versus junction temperature
August 1997
1.200
Triacs logic level
MOUNTING INSTRUCTIONS
BT134W series
Dimensions
(3x)
Fig.13. soldering pattern surface mounting SOT223.
PRINTED CIRCUIT BOARD
Dimensions
Fig.14. thermal resistance power rating SOT223. PCB: epoxy glass (1.6 thick), copper laminate thick).
August 1997
1.200
Triacs logic level
MECHANICAL DATA
Dimensions Mass: 0.11
0.32 0.24
BT134W series
0.10 0.02
1.05 0.85
0.80 0.60
(4x)
Fig.15. SOT223 surface mounting package.
Notes further information, refer Philips publication SC18 Footprint Design Soldering Guidelines". Order code: 9397 00505. Epoxy meets UL94 1/8".
August 1997
1.200
Triacs logic level
DEFINITIONS
Data sheet status Objective specification Product specification Limiting values
BT134W series
This data sheet contains target goal specifications product development. This data sheet contains final product specifications.
Preliminary specification This data sheet contains preliminary data; supplementary data published later.
Limiting values given accordance with Absolute Maximum Rating System (IEC 134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections this specification implied. Exposure limiting values extended periods affect device reliability. Application information Where application information given, advisory does form part specification. Philips Electronics N.V. 1997 rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent other industrial intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products designed life support appliances, devices systems where malfunction these products reasonably expected result personal injury. Philips customers using selling these products such applications their risk agree fully indemnify Philips damages resulting from such improper sale.
August 1997
1.200

Triacs logic level Glass passivated, sensitive gate triacs plasti

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