October 1997 Revised August 2004 High-Speed CMOS Logic 8-Line Dec
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CD54/74HC138, CD54/74HCT138, CD54/74HC238, CD54/74HCT238
October 1997 Revised August 2004
High-Speed CMOS Logic 8-Line Decoder/ Demultiplexer Inverting Noninverting
Ordering Information
PART NUMBER CD54HC138F3A CD54HC238F3A CD54HCT138F3A CD54HCT238F3A CD74HC138E CD74HC138M CD74HC138MT CD74HC138M96 CD74HC238E CD74HC238M CD74HC238MT CD74HC238M96 CD74HC238NSR CD74HC238PW CD74HC238PWR CD74HC238PWT CD74HCT138E CD74HCT138M CD74HCT138MT CD74HCT138M96 CD74HCT238E CD74HCT238M CD74HCT238M96 TEMP. RANGE (oC) PACKAGE CERDIP CERDIP CERDIP CERDIP PDIP SOIC SOIC SOIC PDIP SOIC SOIC SOIC TSSOP TSSOP TSSOP PDIP SOIC SOIC SOIC PDIP SOIC SOIC
Features
Select Eight Data Outputs Active 138, Active High
/Title (CD74 HC138 CD74 HCT13 CD74 HC238 CD74 HCT23 /Subject (High Speed
Port Memory Selector Three Enable Inputs Simplify Cascading Typical Propagation Delay 25oC Fanout (Over Temperature Range) Standard Outputs LSTTL Loads Driver Outputs LSTTL Loads Wide Operating Temperature Range -55oC 125oC Balanced Propagation Delay Transition Times Significant Power Reduction Compared LSTTL Logic Types Operation High Noise Immunity: 30%, Types 4.5-V 5.5-V Operation Direct LSTTL Input Logic Compatibility, VIL= (Max), (Min) CMOS Input Compatibility, VOL,
Description
'HC138, 'HC238, 'HCT138, 'HCT238 high-speed silicon-gate CMOS decoders well suited memory address decoding data-routing applications. Both circuits feature power consumption usually associated with CMOS circuitry, have speeds comparable low-power Schottky logic. Both circuits have three binary select inputs (A0, A2). device enabled, these inputs determine which eight normally high outputs HC/HCT138 series which normally outputs HC/HCT238 series high. active active high enables (E1, provided ease cascading decoders. decoder's eight outputs drive low-power Schottky equivalent loads.
NOTE: When ordering, entire part number. suffixes denote tape reel. suffix denotes small-quantity reel 250.
CAUTION: These devices sensitive electrostatic discharge. Users should follow proper Handling Procedures. Copyright
2004, Texas Instruments Incorporated
CD54/74HC138, CD54/74HCT138, CD54/74HC238, CD54/74HCT238 Pinout
CD54HC138, CD54HCT138, CD54HC238, CD54HCT238 (CERDIP) CD74HC138, CD74HCT138, CD74HCT238 (PDIP, SOIC) CD74HC238 (PDIP, SOIC, SOP, TSSOP) VIEW
(Y7) (Y0) (Y1) (Y2) (Y3) (Y4) (Y5) (Y6)
Functional Diagram
HC/HCT HC/HCT
Signal names parentheses 'HC138 'HCT138. TRUTH TABLE 'HC138, 'HCT138 INPUTS ENABLE ADDRESS OUTPUTS
High Voltage Level, Voltage Level, Don't Care TRUTH TABLE 'HC238, 'HCT238 INPUTS ENABLE ADDRESS OUTPUTS
High Voltage Level, Voltage Level, Don't Care
CD54/74HC138, CD54/74HCT138, CD54/74HC238, CD54/74HCT238
Absolute Maximum Ratings
Supply Voltage, -0.5V Input Diode Current, -0.5V 0.5V .±20mA Output Diode Current, -0.5V 0.5V .±20mA Output Source Sink Current Output Pin, -0.5V 0.5V .±25mA Ground Current, IGND .±50mA
Thermal Information
Package Thermal Impedance, (see Note (PDIP) Package 67oC/W (SOIC) Package. 73oC/W (SOP) Package 64oC/W (TSSOP) Package 108oC/W Maximum Junction Temperature 150oC Maximum Storage Temperature Range .-65oC 150oC Maximum Lead Temperature (Soldering 10s) 300oC (SOIC Lead Tips Only)
Operating Conditions
Temperature Range (TA) -55oC 125oC Supply Voltage Range, Types Types .4.5V 5.5V Input Output Voltage, Input Rise Fall Time 1000ns (Max) 4.5V. 500ns (Max) 400ns (Max)
CAUTION: Stresses above those listed "Absolute Maximum Ratings" cause permanent damage device. This stress only rating, operation device these other conditions above those indicated operational sections this specification implied.
NOTE: package thermal impedance calculated accordance with JESD 51-7.
Electrical Specifications
TEST CONDITIONS PARAMETER TYPES High Level Input Voltage Level Input Voltage High Level Output Voltage CMOS Loads High Level Output Voltage Loads Level Output Voltage CMOS Loads Level Output Voltage Loads Input Leakage Current Quiescent Device Current -0.02 -0.02 -0.02 -5.2 0.02 0.02 0.02 3.15 3.98 5.48 1.35 0.26 0.26 ±0.1 3.15 3.84 5.34 1.35 0.33 0.33 3.15 1.35 SYMBOL (mA) 25oC -40oC 85oC -55oC 125oC UNITS
CD54/74HC138, CD54/74HCT138, CD54/74HC238, CD54/74HCT238
Electrical Specifications
(Continued) TEST CONDITIONS PARAMETER TYPES High Level Input Voltage Level Input Voltage High Level Output Voltage CMOS Loads High Level Output Voltage Loads Level Output Voltage CMOS Loads Level Output Voltage Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Input Pin: Unit Load NOTE: dual-supply systems, theoretical worst case 2.4V, 5.5V) specification 1.8mA. (Note -2.1 -0.02 SYMBOL (mA) 25oC -40oC 85oC -55oC 125oC UNITS
3.98
3.84
0.02
0.26
0.33
±0.1
Input Loading Table
INPUT A0-A2 UNIT LOADS 1.25
NOTE: Unit Load limit specified Electrical Table, e.g., 360µA 25oC.
Switching Specifications Input
TEST CONDITIONS 25oC -40oC 85oC -55oC 125oC UNITS
PARAMETER TYPES Propagation Delay Address Output
SYMBOL
tPLH, tPHL 50pF
15pF 50pF
CD54/74HC138, CD54/74HCT138, CD54/74HC238, CD54/74HCT238
Switching Specifications Input
(Continued) 25oC Output Transition Time (Figure tTLH, tTHL 50pF Power Dissipation Capacitance (Notes Input Capacitance TYPES Propagation Delay Address Output tPLH, tPHL 50pF 15pF Enable Output HC/HCT138 Enable Output HC/HCT238 Output Transition Time (Figure Power Dissipation Capacitance (Notes Input Capacitance NOTES: used determine dynamic power consumption, gate. VCC2 (CPD where Input Frequency, Output Load Capacitance, Supply Voltage. tPLH, tPHL 50pF tPLH, tPHL 15pF tTLH, tTHL 50pF 15pF 15pF -40oC 85oC -55oC 125oC UNITS
PARAMETER Enable Output HC/HCT138
SYMBOL
TEST CONDITIONS
tPLH, tPHL 50pF
Test Circuits Waveforms
INPUT tTLH tPHL tPLH INPUT tTHL 2.7V 1.3V 0.3V tTLH INVERTING OUTPUT tPHL tPLH 1.3V
tTHL
INVERTING OUTPUT
FIGURE TRANSITION TIMES PROPAGATION DELAY TIMES, COMBINATION LOGIC
FIGURE TRANSITION TIMES PROPAGATION DELAY TIMES, COMBINATION LOGIC
IMPORTANT NOTICE
Texas Instruments Incorporated subsidiaries (TI) reserve right make corrections, modifications, enhancements, improvements, other changes products services time discontinue product service without notice. Customers should obtain latest relevant information before placing orders should verify that such information current complete. products sold subject TI's terms conditions sale supplied time order acknowledgment. warrants performance hardware products specifications applicable time sale accordance with TI's standard warranty. Testing other quality control techniques used extent deems necessary support this warranty. Except where mandated government requirements, testing parameters each product necessarily performed. assumes liability applications assistance customer product design. Customers responsible their products applications using components. minimize risks associated with customer products applications, customers should provide adequate design operating safeguards. does warrant represent that license, either express implied, granted under patent right, copyright, mask work right, other intellectual property right relating combination, machine, process which products services used. Information published regarding third-party products services does constitute license from such products services warranty endorsement thereof. such information require license from third party under patents other intellectual property third party, license from under patents other intellectual property Reproduction information data books data sheets permissible only reproduction without alteration accompanied associated warranties, conditions, limitations, notices. Reproduction this information with alteration unfair deceptive business practice. responsible liable such altered documentation. Resale products services with statements different from beyond parameters stated that product service voids express implied warranties associated product service unfair deceptive business practice. responsible liable such statements. products authorized safety-critical applications (such life support) where failure product would reasonably expected cause severe personal injury death, unless officers parties have executed agreement specifically governing such use. Buyers represent that they have necessary expertise safety regulatory ramifications their applications, acknowledge agree that they solely responsible legal, regulatory safety-related requirements concerning their products products such safety-critical applications, notwithstanding applications-related information support that provided Further, Buyers must fully indemnify representatives against damages arising products such safety-critical applications. products neither designed intended military/aerospace applications environments unless products specifically designated military-grade "enhanced plastic." Only products designated military-grade meet military specifications. Buyers acknowledge agree that such products which designated military-grade solely Buyer's risk, that they solely responsible compliance with legal regulatory requirements connection with such use. products neither designed intended automotive applications environments unless specific products designated compliant with ISO/TS 16949 requirements. Buyers acknowledge agree that, they non-designated products automotive applications, will responsible failure meet such requirements. Following URLs where obtain information other Texas Instruments products application solutions: Products Amplifiers Data Converters Interface Logic Power Mgmt Microcontrollers Power Wireless amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti.com/lpw Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office 655303, Dallas, Texas 75265 Copyright 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
PACKAGING INFORMATION
Orderable Device 5962-8688401EA CD54HC138F CD54HC138F3A CD54HC238F3A CD54HCT138F CD54HCT138F3A CD54HCT238F3A CD74HC138E CD74HC138EE4 CD74HC138M CD74HC138M96 CD74HC138M96E4 CD74HC138M96G4 CD74HC138ME4 CD74HC138MG4 CD74HC138MT CD74HC138MTE4 CD74HC138MTG4 CD74HC238E CD74HC238EE4 CD74HC238M CD74HC238M96 CD74HC238M96E4 CD74HC238M96G4 CD74HC238ME4 CD74HC238MG4 CD74HC238MT CD74HC238MTE4 Status ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type CDIP CDIP CDIP CDIP CDIP CDIP CDIP PDIP PDIP SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC Package Drawing Pins Package Plan Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS Sb/Br) Lead/Ball Finish SNPB SNPB SNPB SNPB SNPB SNPB SNPB NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Peak Temp Type Type Type Type Type Type Type Type Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Type Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM
2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS Sb/Br)
2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS
Addendum-Page
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
Orderable Device
Status
Package Type SOIC TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP PDIP PDIP SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP SOIC SOIC SOIC
Package Drawing
Pins Package Plan Sb/Br) Green (RoHS Sb/Br)
Lead/Ball Finish
Peak Temp
CD74HC238MTG4 CD74HC238NSR CD74HC238NSRE4 CD74HC238PW CD74HC238PWE4 CD74HC238PWR CD74HC238PWRE4 CD74HC238PWT CD74HC238PWTE4 CD74HCT138E CD74HCT138EE4 CD74HCT138M CD74HCT138M96 CD74HCT138M96E4 CD74HCT138M96G4 CD74HCT138ME4 CD74HCT138MG4 CD74HCT138MT CD74HCT138MTE4 CD74HCT138MTG4 CD74HCT238E CD74HCT238EE4 CD74HCT238M CD74HCT238M96 CD74HCT238M96E4
ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU
Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Type Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Type Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br)
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS Sb/Br)
2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS Sb/Br)
2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br)
Addendum-Page
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
Orderable Device CD74HCT238M96G4 CD74HCT238ME4 CD74HCT238MG4 CD74HCT238PW CD74HCT238PWE4 CD74HCT238PWR CD74HCT238PWRE4
Status ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type SOIC SOIC SOIC TSSOP TSSOP TSSOP TSSOP
Package Drawing
Pins Package Plan 2500 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br)
Lead/Ball Finish NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU
Peak Temp Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br)
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
Addendum-Page
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Apr-2007
TAPE REEL INFORMATION
Pack Materials-Page
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Apr-2007
Device
Package Pins
Site
Reel Diameter (mm)
Reel Width (mm)
(mm)
(mm)
(mm)
(mm)
Pin1 (mm) Quadrant
CD74HC138M96 CD74HC238M96 CD74HC238NSR CD74HC238PWR CD74HCT138M96 CD74HCT238M96 CD74HCT238PWR
10.3 10.3 10.5 10.3 10.3
12.1 12.1 12.1 12.1
TAPE REEL INFORMATION
Device CD74HC138M96 CD74HC238M96 CD74HC238NSR CD74HC238PWR CD74HCT138M96 CD74HCT238M96 CD74HCT238PWR Package Pins Site Length (mm) 333.2 333.2 333.2 338.1 333.2 333.2 338.1 Width (mm) 333.2 333.2 333.2 340.5 333.2 333.2 340.5 Height (mm) 28.58 28.58 28.58 20.64 28.58 28.58 20.64
Pack Materials-Page
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Apr-2007
Pack Materials-Page
MECHANICAL DATA
MTSS001C JANUARY 1995 REVISED FEBRUARY 1999
(R-PDSO-G**)
PINS SHOWN
PLASTIC SMALL-OUTLINE PACKAGE
0,65
0,30 0,19
0,10
0,15 4,50 4,30 6,60 6,20 Gage Plane 0,25 0,75 0,50
Seating Plane 1,20 0,15 0,05 0,10
PINS
3,10
5,10
5,10
6,60
7,90
9,80
2,90
4,90
4,90
6,40
7,70
9,60
4040064/F 01/97 NOTES: linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion exceed 0,15. Falls within JEDEC MO-153
POST OFFICE 655303
DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated subsidiaries (TI) reserve right make corrections, modifications, enhancements, improvements, other changes products services time discontinue product service without notice. Customers should obtain latest relevant information before placing orders should verify that such information current complete. products sold subject TI's terms conditions sale supplied time order acknowledgment. warrants performance hardware products specifications applicable time sale accordance with TI's standard warranty. Testing other quality control techniques used extent deems necessary support this warranty. Except where mandated government requirements, testing parameters each product necessarily performed. assumes liability applications assistance customer product design. Customers responsible their products applications using components. minimize risks associated with customer products applications, customers should provide adequate design operating safeguards. does warrant represent that license, either express implied, granted under patent right, copyright, mask work right, other intellectual property right relating combination, machine, process which products services used. Information published regarding third-party products services does constitute license from such products services warranty endorsement thereof. such information require license from third party under patents other intellectual property third party, license from under patents other intellectual property Reproduction information data books data sheets permissible only reproduction without alteration accompanied associated warranties, conditions, limitations, notices. Reproduction this information with alteration unfair deceptive business practice. responsible liable such altered documentation. Resale products services with statements different from beyond parameters stated that product service voids express implied warranties associated product service unfair deceptive business practice. responsible liable such statements. products authorized safety-critical applications (such life support) where failure product would reasonably expected cause severe personal injury death, unless officers parties have executed agreement specifically governing such use. Buyers represent that they have necessary expertise safety regulatory ramifications their applications, acknowledge agree that they solely responsible legal, regulatory safety-related requirements concerning their products products such safety-critical applications, notwithstanding applications-related information support that provided Further, Buyers must fully indemnify representatives against damages arising products such safety-critical applications. products neither designed intended military/aerospace applications environments unless products specifically designated military-grade "enhanced plastic." Only products designated military-grade meet military specifications. Buyers acknowledge agree that such products which designated military-grade solely Buyer's risk, that they solely responsible compliance with legal regulatory requirements connection with such use. products neither designed intended automotive applications environments unless specific products designated compliant with ISO/TS 16949 requirements. Buyers acknowledge agree that, they non-designated products automotive applications, will responsible failure meet such requirements. Following URLs where obtain information other Texas Instruments products application solutions: Products Amplifiers Data Converters Interface Logic Power Mgmt Microcontrollers Power Wireless amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti.com/lpw Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office 655303, Dallas, Texas 75265 Copyright 2007, Texas Instruments Incorporated
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