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Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Paralle
Top Searches for this datasheet19-2097; 7/01 Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Parallel Outputs MAX1180 +3.3V, dual 10-bit, analog-to-digital converter (ADC) featuring fully-differential wideband track-and-hold (T/H) inputs, driving pipelined, ninestage ADCs. MAX1180 optimized low-power, high-dynamic performance applications imaging, instrumentation, digital communication applications. MAX1180 operates from single +2.7V +3.6V supply, consuming only 413mW, while delivering typical signal-to-noise ratio (SNR) 58.5dB input frequency 20MHz sampling rate 105Msps. driven input stages incorporate 400MHz (-3dB) input amplifiers. converters also operated with single-ended inputs. addition operating power, MAX1180 features 2.8mA sleep mode, well power-down mode conserve power during idle periods. internal +2.048V precision bandgap reference sets full-scale range ADC. flexible reference structure allows internal external reference, desired applications requiring increased accuracy different input voltage range. MAX1180 features parallel, CMOS-compatible three-state outputs. digital output format two's complement straight offset binary through single control pin. device provides separate output power supply +1.7V +3.6V flexible interfacing. MAX1180 available 7mm, 48pin TQFP package, specified extended industrial (-40°C +85°C) temperature range. Pin-compatible higher lower speed versions MAX1180 also available. Please refer MAX1181 data sheet 80Msps, MAX1182 data sheet 65Msps, MAX1183 data sheet 40Msps, MAX1184 data sheet 20Msps. addition these speed grades, this family includes 20Msps multiplexed output version (MAX1185), which digital data presented time-interleaved single, parallel 10-bit output port. Features Single +3.3V Operation Excellent Dynamic Performance: 58.5dB 20MHz 72dB SFDR 20MHz Flat within 202MHz 100MHz Power: 125mA (Normal Operation) 2.8mA (Sleep Mode) (Shutdown Mode) 0.02dB Gain 0.25° Phase Matching (typ) Wide ±1Vp-p Differential Analog Input Voltage Range 400MHz, -3dB Input Bandwidth On-Chip +2.048V Precision Bandgap Reference User-Selectable Output Format-Two's Complement Offset Binary 48-Pin TQFP Package with Exposed Improved Thermal Dissipation MAX1180 Ordering Information PART MAX1180ECM TEMP. RANGE -40°C +85°C PIN-PACKAGE TQFP-EP Configuration REFN REFP REFIN REFOUT INA+ INAVDD INBINB+ OGND OVDD OVDD OGND Applications High Resolution Imaging Channel Digitization Multichannel Undersampling Instrumentation Video Application MAX1180 Functional Diagram appears data sheet. Maxim Integrated Products SLEEP TQFP-EP pricing, delivery, ordering information, please contact Maxim/Dallas Direct! 1-888-629-4642, visit Maxim's website www.maxim-ic.com. Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Parallel Outputs MAX1180 ABSOLUTE MAXIMUM RATINGS VDD, OVDD .-0.3V +3.6V OGND GND.-0.3V +0.3V INA+, INA-, INB+, INB- .-0.3V REFIN, REFOUT, REFP, REFN, CLK, .-0.3V (VDD 0.3V) SLEEP, T/B, D9A-D0A, D9B-D0B OGND .-0.3V (OVDD 0.3V) Continuous Power Dissipation +70°C) 48-Pin TQFP (derate 12.5mW/°C above +70°C).1000mW Operating Temperature Range .-40°C +85°C Junction Temperature .+150°C Storage Temperature Range .-60°C +150°C Lead Temperature (soldering, 10s) .+300°C Stresses beyond those listed under "Absolute Maximum Ratings" cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated operational sections specifications implied. Exposure absolute maximum rating conditions extended periods affect device reliability. ELECTRICAL CHARACTERISTICS (VDD +3.3V, OVDD +2.5V; 0.1µF 1.0µF capacitors from REFP, REFN, GND; REFOUT connected REFIN through resistor, 2Vp-p (differential w.r.t. COM), 10pF digital outputs (Note fCLK 105.263MHz, TMIN TMAX, unless otherwise noted. Typical values +25°C.) PARAMETER ACCURACY Resolution Integral Nonlinearity Differential Nonlinearity Offset Error Gain Error ANALOG INPUT Differential Input Voltage Range Common-Mode Input Voltage Range Input Resistance Input Capacitance CONVERSION RATE Maximum Clock Frequency Data Latency DYNAMIC CHARACTERISTICS (fCLK 105.263MHz, 4096-point FFT) fINA 7.47MHz, +25°C Signal-to-Noise Ratio fINA 20MHz, +25°C fINA 50.078MHz (Note Signal-to-Noise Distortion harmonic) fINA 7.47MHz, +25°C SINAD fINA 20MHz, +25°C fINA 50.078MHz (Note Spurious-Free Dynamic Range fINA 7.47MHz, +25°C SFDR fINA 20MHz, +25°C fINA 50.078MHz, (Note fINA 7.47MHz Third-Harmonic Distortion fINA 20MHz fINA 50.078MHz (Note 54.7 58.5 58.2 58.1 57.6 fCLK Clock Cycles VDIFF Switched capacitor load Differential single-ended inputs ±1.0 VDD/2 7.47MHz 7.47MHz, missing codes guaranteed ±0.75 ±0.4 ±2.5 +1.5 ±1.7 Bits SYMBOL CONDITIONS UNITS Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Parallel Outputs MAX1180 ELECTRICAL CHARACTERISTICS (continued) (VDD +3.3V, OVDD +2.5V; 0.1µF 1.0µF capacitors from REFP, REFN, GND; REFOUT connected REFIN through resistor, 2Vp-p (differential w.r.t. COM), 10pF digital outputs (Note fCLK 105.263MHz, TMIN TMAX, unless otherwise noted. Typical values +25°C.) PARAMETER Intermodulation Distortion (first five odd-order IMDs) Total Harmonic Distortion (first five harmonics) Small-Signal Bandwidth Full-Power Bandwidth Aperture Delay Aperture Jitter Overdrive Recovery Time Differential Gain Differential Phase Output Noise INTERNAL REFERENCE Reference Output Voltage Reference Temperature Coefficient Load Regulation BUFFERED EXTERNAL REFERENCE (VREFIN +2.048V) REFIN Input Voltage Positive Reference Output Voltage Negative Reference Output Voltage Differential Reference Output Voltage Range REFIN Resistance Maximum REFP, Source Current Maximum REFP, Sink Current Maximum REFN Source Current Maximum REFN Sink Current VREFIN VREFP VREFN VREF RREFIN ISOURCE ISINK ISOURCE ISINK VREF VREFP VREFN 0.98 2.048 2.162 1.138 1.024 -250 1.07 REFOUT TCREF 2.048 1.25 ppm/°C mV/mA INA+ INA- INB+ INB- FPBW full-scale input SYMBOL CONDITIONS fINA 38.055MHz -6.5dB fINA 42.926MHz -6.5dB (Note fINA 7.47MHz, +25°C fINA 20MHz, +25°C fINA 50.078MHz, (Note Input -20dB differential inputs Input -0.5dB differential inputs ±0.25 psRMS degrees LSBRMS UNITS Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Parallel Outputs MAX1180 ELECTRICAL CHARACTERISTICS (continued) (VDD +3.3V, OVDD +2.5V; 0.1µF 1.0µF capacitors from REFP, REFN, GND; REFOUT connected REFIN through resistor, 2Vp-p (differential w.r.t. COM), 10pF digital outputs (Note fCLK 105.263MHz, TMIN TMAX, unless otherwise noted. Typical values +25°C.) PARAMETER SYMBOL RREFP, RREFN VREF VCOM VREFP VREFN CONDITIONS Measured between REFP REFN VREF VREFP VREFN UNITS UNBUFFERED EXTERNAL REFERENCE (VREFIN AGND, reference voltage applied REFP, REFN, REFP, REFN Input Resistance Differential Reference Input Voltage Range Input Voltage Range REFP Input Voltage REFN Input Voltage 1.024 ±10% VDD/2 ±10% VCOM+ VREF VCOM VREF OVDD OVDD OVDD (CLK) ISINK -200µA ISOURCE 200µA OVDD OVDD Operating, fINA 20MHz -0.5dB Analog Supply Current IVDD Sleep mode Shutdown, clock idle, OVDD OVDD DIGITAL INPUTS (CLK, SLEEP, T/B) Input High Threshold SLEEP, Input Threshold SLEEP, Input Hysteresis Input Leakage Input Capacitance Output Voltage Output Voltage High Three-State Leakage Current Three-State Output Capacitance POWER REQUIREMENTS Analog Supply Voltage Range Output Supply Voltage Range OVDD VHYST ILEAK COUT DIGITAL OUTPUTS (D9A-D0A, D9B-D0B) Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Parallel Outputs ELECTRICAL CHARACTERISTICS (continued) (VDD +3.3V, OVDD +2.5V; 0.1µF 1.0µF capacitors from REFP, REFN, GND; REFOUT connected REFIN through resistor, 2Vp-p (differential w.r.t. COM), 10pF digital outputs (Note fCLK 105.263MHz, TMIN TMAX, unless otherwise noted. Typical values +25°C.) PARAMETER SYMBOL CONDITIONS Operating, 15pF fINA 20MHz -0.5dB Output Supply Current IOVDD Sleep mode Shutdown, clock idle, OVDD Operating, fINA 20MHz -0.5dB Power Dissipation PDISS Sleep mode Shutdown, clock idle, OVDD Power-Supply Rejection Ratio TIMING CHARACTERISTICS Rise Output Data Valid Output Enable Time Output Disable Time Pulse Width High Pulse Width Wake-Up Time tENABLE tDISABLE tWAKE Figure (Note Figure Figure Figure clock period: 9.5ns Figure clock period: 9.5ns Wakeup from sleep mode (Note Wakeup from shutdown (Note fINA 20MHz -0.5dB fINA 20MHz -0.5dB fINA 20MHz -0.5dB 4.75 ±1.5 4.75 ±1.5 0.18 0.02 0.25 ±0.2 PSRR Offset Gain ±0.2 ±0.1 UNITS mV/V MAX1180 CHANNEL-TO-CHANNEL MATCHING Crosstalk Gain Matching Phase Matching degrees Note SNR, SINAD, THD, SFDR, based analog input voltage -0.5dB referenced +1.024V full-scale input voltage range. Note Intermodulation distortion total power intermodulation products relative individual carrier. This number better, referenced two-tone envelope. Note Digital outputs settle VIH, VIL. Parameter guaranteed design. Note With REFIN driven externally, REFP, COM, REFN left floating while powered down. Note Equivalent dynamic performance obtainable over full OVDD range with reduced Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Parallel Outputs MAX1180 Typical Operating Characteristics (VDD +3.3V, OVDD +2.5V, internal reference, differential input -0.5dB fCLK 105.0005678MHz, 10pF. +25°C, unless otherwise noted.) PLOT (8192-POINT RECORD, DIFFERENTIAL INPUT) MAX1180 toc01 PLOT (8192-POINT RECORD, DIFFERENTIAL INPUT) MAX1180 toc02 PLOT (8192-POINT RECORD, DIFFERENTIAL INPUT) AMPLITUDE (dB) -100 fINA 20.084947MHz fINB 25.006849MHz fCLK 105.00057MHz AINA -0.54dB MAX1180 toc03 AMPLITUDE (dB) -100 fINA 6.242099MHz fINB 7.523844MHz fCLK 105.00057MHz AINA -0.52dB AMPLITUDE (dB) -100 fINA 6.242099MHz fINB 7.523844MHz fCLK 105.00057MHz AINB -0.48dB ANALOG INPUT FREQUENCY (MHz) ANALOG INPUT FREQUENCY (MHz) ANALOG INPUT FREQUENCY (MHz) PLOT (8192-POINT RECORD, DIFFERENTIAL INPUT) AMPLITUDE (dB) -100 ANALOG INPUT FREQUENCY (MHz) MAX1180 toc04 PLOT (8192-POINT RECORD, DIFFERENTIAL INPUT) MAX1180 toc05 PLOT (8192-POINT RECORD, DIFFERENTIAL INPUT) AMPLITUDE (dB) -100 fINA 52.23259MHz fINB 57.050479MHz fCLK 105.00057MHz AINB -0.47dB MAX1180 toc06 fINA 20.084947MHz fINB 25.006849MHz fCLK 105.00057MHz AINA -0.54dB AMPLITUDE (dB) -100 fINA 52.23259MHz fINB 57.050479MHz fCLK 105.00057MHz AINA -0.47dB ANALOG INPUT FREQUENCY (MHz) ANALOG INPUT FREQUENCY (MHz) TWO-TONE PLOT (8192-POINT RECORD, DIFFERENTIAL INPUT) MAX1180 toc07 SIGNAL-TO-NOISE RATIO ANALOG INPUT FREQUENCY DIFFERENTIAL INPUT CONFIGURATION SINAD (dB) (dB) ANALOG INPUT FREQUENCY (MHz) MAX1180 toc08 SIGNAL-TO-NOISE DISTORTION ANALOG INPUT FREQUENCY DIFFERENTIAL INPUT CONFIGURATION MAX1180 toc09 AMPLITUDE (dB) -100 fIN1 ORDER ORDER fIN2 ORDER fINA 38.055015MHz fINB 41.925886MHz fCLK 105.00057MHz -6.5dB TWO-TONE ENVELOPE -0.51dB ANALOG INPUT FREQUENCY (MHz) ANALOG INPUT FREQUENCY (MHz) Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Parallel Outputs Typical Operating Characteristics (continued) (VDD +3.3V, OVDD +2.5V, internal reference, differential input -0.5dB fCLK 105.0005678MHz, 10pF. +25°C, unless otherwise noted.) TOTAL HARMONIC DISTORTION ANALOG INPUT FREQUENCY MAX1180 toc10 MAX1180 SPURIOUS-FREE DYNAMIC RANGE ANALOG INPUT FREQUENCY MAX1180 toc11 FULL-POWER INPUT BANDWIDTH ANALOG INPUT FREQUENCY, SINGLE-ENDED MAX1180 toc12 DIFFERENTIAL INPUT CONFIGURATION DIFFERENTIAL INPUT CONFIGURATION SFDR (dB) GAIN (dB) (dB) ANALOG INPUT FREQUENCY (MHz) ANALOG INPUT FREQUENCY (MHz) 1000 ANALOG INPUT FREQUENCY (MHz) SMALL-SIGNAL INPUT BANDWIDTH ANALOG INPUT FREQUENCY, SINGLE-ENDED 100mVp-p MAX1180 toc13 SIGNAL-TO-NOISE RATIO INPUT POWER (fIN 20.084947MHz) MAX1180 toc14 SIGNAL-TO-NOISE DISTORTION INPUT POWER (fIN 20.084947MHz) MAX1180 toc15 GAIN (dB) SINAD (dB) (dB) 1000 ANALOG INPUT FREQUENCY (MHz) INPUT POWER INPUT POWER TOTAL HARMONIC DISTORTION INPUT POWER (fIN 20.084947MHz) MAX1180 toc16 SPURIOUS-FREE DYNAMIC RANGE INPUT POWER (fIN 20.084947MHz) MAX1180 toc17 INTEGRAL NONLINEARITY (BEST ENDPOINT FIT) MAX1180 toc18 SFDR (dB) (LSB) (dB) -0.5 INPUT POWER INPUT POWER -1.0 1024 DIGITAL OUTPUT CODE Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Parallel Outputs MAX1180 Typical Operating Characteristics (continued) (VDD +3.3V, OVDD +2.5V, internal reference, differential input -0.5dB fCLK 105.0005678MHz, 10pF. +25°C, unless otherwise noted.) DIFFERENTIAL NONLINEARITY MAX1180 toc19 OFFSET ERROR TEMPERATURE, EXTERNAL REFERENCE (VREFIN +2.048V) MAX1180 toc20 GAIN ERROR TEMPERATURE, EXTERNAL REFERENCE (VREFIN +2.048V) MAX1180 toc21 0.50 OFFSET ERROR (%FS) 0.25 (LSB) GAIN ERROR (%FS) -0.5 -1.0 -0.25 -0.5 -0.50 1024 DIGITAL OUTPUT CODE -1.0 TEMPERATURE (°C) -1.5 TEMPERATURE (°C) ANALOG SUPPLY CURRENT ANALOG SUPPLY VOLTAGE MAX1180 toc22 ANALOG SUPPLY CURRENT TEMPERATURE MAX1180 toc23 ANALOG POWER-DOWN CURRENT ANALOG POWER SUPPLY OVDD MAX1180 toc24 IVDD (mA) IVDD (mA) IVDD (µA) 2.70 2.85 3.00 3.15 3.30 3.45 3.60 TEMPERATURE (°C) 2.70 2.85 3.00 3.15 3.30 3.45 3.60 SFDR, SNR, THD, SINAD CLOCK DUTY CYCLE MAX1180 toc25 INTERNAL REFERENCE VOLTAGE ANALOG SUPPLY VOLTAGE MAX1180 toc26 20.08495MHz SFDR, SNR, THD, SINAD (dB) SFDR 2.050 2.046 VREFOUT SINAD 2.042 2.038 2.034 CLOCK DUTY CYCLE 2.030 2.70 2.85 3.00 3.15 3.30 3.45 3.60 Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Parallel Outputs MAX1180 Typical Operating Characteristics (continued) (VDD +3.3V, OVDD +2.5V, internal reference, differential input -0.5dB fCLK 105.0005678MHz, 10pF. +25°C, unless otherwise noted.) INTERNAL REFERENCE VOLTAGE TEMPERATURE MAX1180 toc27 OUTPUT NOISE HISTOGRAM INPUT) 64676 MAX1180 toc28 2.065 7000 6000 5000 2.055 VREFOUT COUNTS 2.045 4000 3000 2000 2.035 2.025 1000 2.015 TEMPERATURE (°C) DIGITAL OUTPUT NOISE Description NAME INA+ INAINBINB+ FUNCTION Common-Mode Voltage Input/Output. Bypass with 0.1µF capacitor. Analog Supply Voltage. Bypass with capacitor combination 2.2µF parallel with 0.1µF. Analog Ground Channel Positive Analog Input. single-ended operation, connect signal source INA+. Channel Negative Analog Input. single-ended operation, connect INA- COM. Channel Negative Analog Input. single-ended operation, connect INB- COM. Channel Positive Analog Input. single-ended operation, connect signal source INB+. Converter Clock Input selects digital output format. High: Two's complement. Low: Straight offset binary. Sleep Mode Input. High: Deactivates ADCs, leaves reference bias circuit active. Low: Normal operation. Power-Down Input. High: Power-down mode Low: Normal operation Output Enable Input. High: Digital outputs disabled Low: Digital outputs enabled SLEEP Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Parallel Outputs MAX1180 Description (continued) NAME OGND OVDD REFOUT REFIN REFP REFN Three-State Digital Output, Channel Three-State Digital Output, Channel Three-State Digital Output, Channel Three-State Digital Output, Channel Three-State Digital Output, Channel Three-State Digital Output, Channel Three-State Digital Output, Channel Three-State Digital Output, Channel Three-State Digital Output, (LSB), Channel Output Driver Ground Output Driver Supply Voltage. Bypass OGND with capacitor combination 2.2µF parallel with 0.1µF. Three-State Digital Output, (LSB), Channel Three-State Digital Output, Channel Three-State Digital Output, Channel Three-State Digital Output, Channel Three-State Digital Output, Channel Three-State Digital Output, Channel Three-State Digital Output, Channel Three-State Digital Output, Channel Three-State Digital Output, Channel Three-State Digital Output, (MSB), Channel Internal Reference Voltage Output. connected REFIN through resistor resistor divider. Reference Input. VREFIN (VREFP VREFN). Bypass with >1nF capacitor. Positive Reference Input/Output. Conversion range ±(VREFP VREFN). Bypass with 0.1µF capacitor. Negative Reference Input/Output. Conversion range ±(VREFP VREFN). Bypass with 0.1µF capacitor. FUNCTION Three-State Digital Output, (MSB), Channel Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Parallel Outputs MAX1180 VOUT VOUT FLASH BITS FLASH BITS 2-BIT FLASH STAGE STAGE STAGE STAGE STAGE STAGE STAGE 2-BIT FLASH STAGE DIGITAL CORRECTION LOGIC D9A-D0A DIGITAL CORRECTION LOGIC D9B-D0B VINA VINB VINA INPUT VOLTAGE BETWEEN INA+ INA- (DIFFERENTIAL SINGLE-ENDED) VINB INPUT VOLTAGE BETWEEN INB+ INB- (DIFFERENTIAL SINGLE-ENDED) Figure Pipelined Architecture-Stage Blocks Detailed Description MAX1180 uses nine-stage, fully-differential pipelined architecture (Figure that allows highspeed conversion while minimizing power consumption. Samples taken inputs move progressively through pipeline stages every half clock cycle. Counting delay through output latch, clockcycle latency five clock cycles. 1.5-bit (two-comparator) flash ADCs convert heldinput voltages into digital code. digital-to-analog converters (DACs) convert digitized results back into analog voltages, which then subtracted from original held-input signals. resulting error signals then multiplied residues passed along next pipeline stages where process repeated until signals have been processed nine stages. Digital error correction compensates comparator offsets each these pipeline stages ensures missing codes. (C2a C2b) through switches S4b. common mode amplifier input, open simultaneously with sampling input waveform. Switches then opened before switches S3b, connect capacitors output amplifier, switch closed. resulting differential voltages held capacitors C2b. amplifiers used charge capacitors same values originally held C2b. These values then presented first-stage quantizers isolate pipelines from fast-changing inputs. wide input bandwidth amplifiers allow MAX1180 trackand-sample/hold analog inputs high frequencies Nyquist). Both inputs (INA+, INB+, INA-, INB-) driven either differentially single-ended. Match impedance INA+ INA-, well INB+ INB-, common-mode voltage midsupply (VDD/2) optimum performance. Input Track-and-Hold (T/H) Circuits Figure displays simplified functional diagram input track-and-hold (T/H) circuits both track-andhold mode. track mode, switches S2a, S2b, S4a, S4b, closed. fully-differential circuits sample input signals onto capacitors Analog Inputs Reference Configurations full-scale range MAX1180 determined internally generated voltage difference between REFP (VDD/2 VREFIN/4) REFN (VDD/2 REFIN /4).The full-scale range both on-chip Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Parallel Outputs MAX1180 INTERNAL BIAS INA+ INTERNAL BIAS HOLD INTERNAL BIAS INB+ INTERNAL BIAS TRACK HOLD TRACK INTERNAL NONOVERLAPPING CLOCK SIGNALS INA- INB- MAX1180 Figure MAX1180 Amplifiers ADCs adjustable through REFIN pin, which provided this purpose. REFOUT, REFP, (VDD/2), REFN internally buffered low-impedance outputs. MAX1180 provides three modes reference operation: Internal reference mode Buffered external reference mode Unbuffered external reference mode internal reference mode, connect internal reference output REFOUT REFIN through resistor (e.g., 10k) resistor divider, application Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Parallel Outputs MAX1180 CLOCK-CYCLE LATENCY ANALOG INPUT CLOCK INPUT DATA OUTPUT D9A-D0A DATA OUTPUT D9B-D0B Figure System Timing Diagram Table MAX1180 Output Codes Differential Inputs DIFFERENTIAL INPUT VOLTAGE* VREF 511/512 VREF 1/512 -VREF 1/512 -VREF 511/512 -VREF 512/512 DIFFERENTIAL INPUT +FULL SCALE 1LSB Bipolar Zero -FULL SCALE -FULL SCALE STRAIGHT OFFSET BINARY 1111 1111 0000 0001 0000 0000 1111 1111 0000 0001 0000 0000 TWO'S COMPLEMENT 1111 1111 0000 0001 0000 0000 1111 1111 0000 0001 0000 0000 *VREF VREFP VREFN requires reduced full-scale range. stability noise filtering purposes, bypass REFIN with >10nF capacitor GND. internal reference mode, REFOUT, COM, REFP, REFN become low-impedance outputs. buffered external reference mode, adjust reference voltage levels externally applying stable accurate voltage REFIN. this mode, COM, REFP, REFN become outputs. REFOUT left open connected REFIN through >10k resistor. unbuffered external reference mode, connect REFIN GND. This deactivates on-chip reference buffers REFP, COM, REFN. With their buffers shut down, these nodes become high impedance driven through separate external reference sources. Clock Input (CLK) MAX1180's input accepts CMOS-compatible clock signals. Since interstage conversion device depends repeatability rising falling edges external clock, clock with jitter fast rise fall times 2ns). particular, sampling occurs rising edge clock signal, requiring this edge provide lowest possible jitter. significant aperture jitter would limit performance on-chip ADCs follows: Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Parallel Outputs SNRdB log10 tAJ]), where represents analog input frequency time aperture jitter. Clock jitter especially critical undersampling applications. clock input should always considered analog input routed away from analog input other digital signal lines. MAX1180 clock input operates with voltage threshold VDD/2. Clock inputs with duty cycle other than 50%, must meet specifications high periods stated Electrical Characteristics. MAX1180 tENABLE OUTPUT D9A-D0A HIGH-Z tDISABLE HIGH-Z VALID DATA OUTPUT D9B-D0B HIGH-Z VALID DATA HIGH-Z Figure Output Timing Diagram System Timing Requirements Figure depicts relationship between clock input, analog input, data output. MAX1180 samples rising edge input clock. Output data channels valid next rising edge input clock. output data internal latency five clock cycles. Figure also determines relationship between input clock parameters valid output data channels disabled) current consumption reduced 2.8mA. enter full power-down mode, pull high. With simultaneously low, outputs latched last value prior power-down. Pulling high, forces digital outputs into high-impedance state. Applications Information Figure depicts typical application circuit containing single-ended differential converters. internal reference provides VDD/2 output voltage levelshifting purposes. input buffered then split voltage follower inverter. lowpass filter suppresses some wideband noise associated with high-speed operational amplifiers. user select RISO values optimize filter performance suit particular application. application Figure RISO placed before capacitive load prevent ringing oscillation. 22pF capacitor acts small bypassing capacitor. Digital Output Data, Output Data Format Selection (T/B), Output Enable (OE) digital outputs, D0A-D9A (Channel D0B-D9B (Channel TTL/CMOS logic-compatible. There five clock cycle latency between particular sample corresponding output data. output coding chosen either straight offset binary two's complement (Table controlled single (T/B). Pull select offset binary high activate two's complement output coding. capacitive load digital outputs D0A-D9A D0B-D9B should kept possible (<15pF), avoid large digital currents that could feed back into analog portion MAX1180, thereby degrading dynamic performance. Using buffers digital outputs ADCs further isolate digital outputs from heavy capacitive loads. further improve dynamic performance MAX1180 small-series resistors (e.g., 100), digital output paths, close MAX1180. Figure displays timing relationship between output enable data output valid, well powerdown/wake-up data output valid. Using Transformer Coupling transformer (Figure provides excellent solution convert single-ended source signal fully-differential signal, required MAX1180 optimum performance. Connecting center transformer provides VDD/2 level shift input. Although transformer shown, stepup transformer selected reduce drive requirements. reduced signal swing from input driver, such amp, also improve overall distortion. general, MAX1180 provides better SFDR with fully-differential input signals, than singleended drive, especially high input frequencies. differential input mode, even-order harmonics lower both inputs (INA+, INA- and/or INB+, INB-) bal- Power-Down (PD) Sleep (SLEEP) Modes MAX1180 offers power-save modes, sleep full power-down mode. sleep mode (SLEEP only reference bias circuit active (both ADCs Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Parallel Outputs MAX1180 0.1µF LOWPASS FILTER MAX4108 0.1µF INA+ RISO 22pF 0.1µF 0.1µF 0.1µF INPUT 0.1µF MAX4108 0.1µF MAX4108 INARISO 0.1µF 22pF LOWPASS FILTER MAX1180 0.1µF LOWPASS FILTER MAX4108 0.1µF INB+ RISO 22pF 0.1µF 0.1µF 0.1µF 0.1µF LOWPASS FILTER INBRISO 0.1µF 22pF INPUT MAX4108 0.1µF MAX4108 Figure Typical Application Single-Ended Differential Conversion Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Parallel Outputs INA+ 22pF 0.1µF N.C. 2.2µF 0.1µF MINICIRCUITS TT1-6 INA22pF MAX1180 INB+ 22pF 0.1µF N.C. 2.2µF 0.1µF lator followed subsequent up-conversion generate signal. result in-phase quadrature carrier component, where component degrees phase-shifted with respect inphase component. receiver, signal divided down into components, essentially representing modulation process reversed. Figure displays demodulation process performed analog domain, using dual-matched, +3V, 10-bit ADCs, MAX1180 MAX2451 quadrature demodulators, recover digitize baseband signals. Before being digitized MAX1180, mixed-down signal components filtered matched analog filters, such Nyquist PulseShaping filters which remove unwanted images from mixing process, enhances overall signalto-noise (SNR) performance, minimizes intersymbol interference. MAX1180 Grounding, Bypassing, Board Layout MAX1180 requires high-speed board layout design techniques. Locate bypass capacitors close device possible, preferably same side ADC, using surface-mount devices minimum inductance. Bypass VDD, REFP, REFN, with parallel 0.1µF ceramic capacitors 2.2µF bipolar capacitor GND. Follow same rules bypass digital supply (OVDD) OGND. Multilayer boards with separate ground power planes, produce highest level signal integrity. Consider split ground plane arranged match physical location analog ground (GND) digital output driver ground (OGND) ADCs package. ground planes should joined single point, such that noisy digital ground currents interfere with analog ground plane. ideal location this connection determined experimentally point along between ground planes, which produces optimum results. Make this connection with low-value, surface-mount resistor ferrite bead, direct short. Alternatively, ground pins could share same ground plane, ground plane sufficiently isolated from noisy, digital systems ground plane (e.g., downstream output buffer ground plane). Route high-speed digital signal traces away from sensitive analog traces either channel. Make sure isolate analog input lines each respective converter MINICIRCUITS TT1-6 INB22pF Figure Transformer-Coupled Input Drive anced, each inputs only require half signal swing compared single-ended mode. Single-Ended AC-Coupled Input Signal Figure shows AC-coupled, single-ended application. Amplifiers, like MAX4108, provide high-speed, high bandwidth, low-noise, distortion maintain integrity input signal. Typical Demodulation Application most frequently used modulation technique digital communications application Quadrature Amplitude Modulation (QAM). QAMs typically found spread-spectrum based systems. signal represents carrier frequency modulated both amplitude phase. transmitter, modulating baseband signal with quadrature outputs, local oscil- Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Parallel Outputs MAX1180 REFP MAX4108 0.1µF RISO INA+ 22pF REFN 0.1µF RISO INACIN 22pF REFP MAX1180 MAX4108 0.1µF RISO INB+ 22pF REFN 0.1µF RISO INBCIN 22pF Figure Using Single-Ended, AC-Coupled Input Drive MAX2451 INA+ INA0° MAX1180 INB+ INB- POST PROCESSING DOWNCONVERTER Figure Typical Application, Using MAX1180 Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Parallel Outputs MAX1180 Signal-to-Noise Ratio (SNR) ANALOG INPUT SAMPLED DATA (T/H) waveform perfectly reconstructed from digital samples, theoretical maximum ratio full-scale analog input (RMS value) quantization error (residual error). ideal, theoretical minimum analog-to-digital noise caused quantization error only results directly from ADCs resolution (N-Bits): SNRdB[max] 6.02dB 1.76dB reality, there other noise sources besides quantization noise; thermal noise, reference noise, clock jitter, etc. computed taking ratio signal noise, which includes spectral components minus fundamental, first five harmonics, offset. TRACK HOLD TRACK Figure Aperture Timing Signal-to-Noise Plus Distortion (SINAD) SINAD computed taking ratio signal spectral components minus fundamental offset. minimize channel-to-channel crosstalk. Keep signal lines short free degree turns. Static Parameter Definitions Integral Nonlinearity (INL) Integral nonlinearity deviation values actual transfer function from straight line. This straight line either best straight-line line drawn between endpoints transfer function, once offset gain errors have been nullified. static linearity parameters MAX1180 measured using best straight-line method. Effective Number Bits (ENOB) ENOB specifies dynamic performance specific input frequency sampling rate. ideal ADC's error consists quantization noise only. ENOB computed from: ENOB SINADdB 1.76dB 6.02dB Total Harmonic Distortion (THD) typically ratio first four harmonics input signal fundamental itself. This expressed log10 Differential Nonlinearity (DNL) Differential nonlinearity difference between actual step-width ideal value 1LSB. error specification less than 1LSB guarantees missing codes monotonic transfer function. Dynamic Parameter Definitions Aperture Jitter Figure depicts aperture jitter (tAJ), which sample-to-sample variation aperture delay. Aperture Delay Aperture delay (tAD) time defined between falling edge sampling clock instant when actual sample taken (Figure where fundamental amplitude, through amplitudes 2nd- through 5th-order harmonics. Spurious-Free Dynamic Range (SFDR) SFDR ratio expressed decibels amplitude fundamental (maximum signal component) value next largest spurious component, excluding offset. Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Parallel Outputs MAX1180 Intermodulation Distortion (IMD) two-tone ratio expressed decibels either input tone worst 3rd-order higher) intermodulation products. individual input tone levels -6.5dB full scale their envelope -0.5dB full scale. Chip Information TRANSISTOR COUNT: 10,811 PROCESS: CMOS Functional Diagram INA+ INAPIPELINE OUTPUT DRIVERS D9A-D0A OGND OVDD CONTROL INB+ INB- PIPELINE OUTPUT DRIVERS D9B-D0B REFERENCE MAX1180 REFOUT REFN REFP REFIN SLEEP Dual 10-Bit, 105Msps, +3.3V, Low-Power with Internal Reference Parallel Outputs MAX1180 Package Information 48L,TQFP.EPS Maxim cannot assume responsibility circuitry other than circuitry entirely embodied Maxim product. circuit patent licenses implied. Maxim reserves right change circuitry specifications without notice time. _Maxim Integrated Products, Gabriel Drive, Sunnyvale, 94086 408-737-7600 2001 Maxim Integrated Products Printed registered trademark Maxim Integrated Products. Other recent searchesUS1A - US1A US1A Datasheet US1M - US1M US1M Datasheet UPD780F0354 - UPD780F0354 UPD780F0354 Datasheet 78F0354Y - 78F0354Y 78F0354Y Datasheet uPD780F0354 - uPD780F0354 uPD780F0354 Datasheet 78F0354Y - 78F0354Y 78F0354Y Datasheet TDA52xx - TDA52xx TDA52xx Datasheet KRC118S - KRC118S KRC118S Datasheet CS4610 - CS4610 CS4610 Datasheet APH1608MGC - APH1608MGC APH1608MGC Datasheet 2SC3387 - 2SC3387 2SC3387 Datasheet 1N4565 - 1N4565 1N4565 Datasheet 1N4584A-1 - 1N4584A-1 1N4584A-1 Datasheet
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