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POST OFFICE 655303 DALLAS, TEXAS 75265 SN5472, SN7472 AND-GA
Top Searches for this datasheetSN5472, SN7472 AND-GATED MASTER-SLAVE FLIP-FLOPS WITH PRESET CLEAR POST OFFICE 655303 DALLAS, TEXAS 75265 SN5472, SN7472 AND-GATED MASTER-SLAVE FLIP-FLOPS WITH PRESET CLEAR POST OFFICE 655303 DALLAS, TEXAS 75265 SN5472, SN7472 AND-GATED MASTER-SLAVE FLIP-FLOPS WITH PRESET CLEAR POST OFFICE 655303 DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device SN5472J SN7472N SN7472N SN7472N3 SN7472N3 SNJ5472J SNJ5472J SNJ5472W SNJ5472W Status ACTIVE OBSOLETE OBSOLETE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE Package Type CDIP PDIP PDIP PDIP PDIP CDIP CDIP Package Drawing Pins Package Plan Lead/Ball Finish Call Call Call Call Call Call Call Call Call Peak Temp Type Call Call Call Call Type Type Type Type marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device. Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material) MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. 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