POST OFFICE 655303 DALLAS, TEXAS 75265 SN5473, SN54LS73A, SN

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POST OFFICE 655303 DALLAS, TEXAS 75265 SN5473, SN54LS73A, SN

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SN5473, SN54LS73A, SN7473, SN74LS73A DUAL FLIP-FLOPS WITH CLEAR
POST OFFICE 655303
DALLAS, TEXAS 75265
SN5473, SN54LS73A, SN7473, SN74LS73A DUAL FLIP-FLOPS WITH CLEAR
POST OFFICE 655303
DALLAS, TEXAS 75265
SN5473, SN54LS73A, SN7473, SN74LS73A DUAL FLIP-FLOPS WITH CLEAR
POST OFFICE 655303
DALLAS, TEXAS 75265
SN5473, SN54LS73A, SN7473, SN74LS73A DUAL FLIP-FLOPS WITH CLEAR
POST OFFICE 655303
DALLAS, TEXAS 75265
SN5473, SN54LS73A, SN7473, SN74LS73A DUAL FLIP-FLOPS WITH CLEAR
POST OFFICE 655303
DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2006
PACKAGING INFORMATION
Orderable Device 5962-9675101QCA 5962-9675101QDA 5962-9675101QDA 5962-9675101VCA 5962-9675101VCA 5962-9675101VDA 5962-9675101VDA SN54LS73AJ SN54LS73AJ SN7473N SN7473N SN7473N3 SN7473N3 SN74LS73AD SN74LS73AD SN74LS73ADE4 SN74LS73ADE4 SN74LS73ADR SN74LS73ADR SN74LS73ADRE4 SN74LS73ADRE4 SN74LS73AN SN74LS73AN SN74LS73ANE4 SN74LS73ANE4 SNJ54LS73AFD SNJ54LS73AFD SNJ54LS73AJ SNJ54LS73AJ SNJ54LS73AW SNJ54LS73AW
Status ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type CDIP CDIP CDIP CDIP CDIP PDIP PDIP PDIP PDIP SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP PDIP PDIP LCCC LCCC CDIP CDIP
Package Drawing
Pins Package Plan Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br)
Lead/Ball Finish Call Call Call Call Call Call Call Call Call Call Call Call Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Call Call Call Call Call Call
Peak Temp Type Type Type Type Type Type Type Type Type Call Call Call Call Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Type Type Type Type Type Type Type Type Type Type
2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS)
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect.
Addendum-Page
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2006
NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
Addendum-Page
MECHANICAL DATA
MLCC006B OCTOBER 1996
(S-CQCC-N**)
TERMINAL SHOWN
LEADLESS CERAMIC CHIP CARRIER
TERMINALS
0.342 (8,69) 0.442 (11,23) 0.640 (16,26) 0.739 (18,78) 0.938 (23,83) 1.141 (28,99) 0.358 (9,09) 0.458 (11,63) 0.660 (16,76) 0.761 (19,32) 0.962 (24,43) 1.165 (29,59) 0.307 (7,80) 0.406 (10,31) 0.495 (12,58) 0.495 (12,58) 0.850 (21,6) 1.047 (26,6)
0.358 (9,09) 0.458 (11,63) 0.560 (14,22) 0.560 (14,22) 0.858 (21,8) 1.063 (27,0)
0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25)
0.020 (0,51) 0.010 (0,25)
0.055 (1,40) 0.045 (1,14)
0.045 (1,14) 0.035 (0,89)
0.028 (0,71) 0.022 (0,54) 0.050 (1,27)
0.045 (1,14) 0.035 (0,89)
4040140 10/96 NOTES: linear dimensions inches (millimeters). This drawing subject change without notice. This package hermetically sealed with metal lid. terminals gold plated. Falls within JEDEC MS-004
POST OFFICE 655303
DALLAS, TEXAS 75265
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POST OFFICE 655303 DALLAS, TEXAS 75265 SN5473, SN54LS73A, SN

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