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State-of-the-Art EPIC-B BiCMOS Design Significantly Reduces Power Diss


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SN54ABT374, SN74ABT374A OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
State-of-the-Art EPIC-B BiCMOS Design Significantly Reduces Power Dissipation Latch-Up Performance Exceeds JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) 25°C High-Drive Outputs (-32-mA IOH, 64-mA IOL) Protection Exceeds 2000 MIL-STD-883, Method 3015; Exceeds Using Machine Model Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic Ceramic DIPs, Ceramic Flat Package
SN54ABT374 PACKAGE SN74ABT374A PACKAGE (TOP VIEW)
SN54ABT374 PACKAGE (TOP VIEW)
description
These 8-bit flip-flops feature 3-state outputs designed specifically driving highly capacitive relatively low-impedance loads. They particularly suitable implementing buffer registers, ports, bidirectional drivers, working registers. eight flip-flops SN54ABT374 SN74ABT374A edge-triggered D-type flip-flops. positive transition clock (CLK) input, outputs logic levels data inputs.
buffered output-enable (OE) input used place eight outputs either normal logic state (high logic levels) high-impedance state. high-impedance state, outputs neither load drive lines significantly. high-impedance state increased drive provide capability drive lines without need interface pullup components. does affect internal operations flip-flop. data retained data entered while outputs high-impedance state. ensure high-impedance state during power power down, should tied through pullup resistor; minimum value resistor determined current-sinking capability driver. SN54ABT374 characterized operation over full military temperature range -55°C 125°C. SN74ABT374A characterized operation from -40°C 85°C.
Please aware that important notice concerning availability, standard warranty, critical applications Texas Instruments semiconductor products disclaimers thereto appears this data sheet. EPIC-B trademark Texas Instruments Incorporated.
PRODUCTION DATA information current publication date. Products conform specifications terms Texas Instruments standard warranty. Production processing does necessarily include testing parameters.
Copyright 1997, Texas Instruments Incorporated
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SN54ABT374, SN74ABT374A OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
FUNCTION TABLE (each flip-flop) INPUTS OUTPUT
logic symbol
This symbol accordance with ANSI/IEEE 91-1984 Publication 617-12.
logic diagram (positive logic)
Seven Other Channels
POST OFFICE 655303
DALLAS, TEXAS 75265
SN54ABT374, SN74ABT374A OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, -0.5 Input voltage range, (see Note -0.5 Voltage range applied output high power-off state, -0.5 Current into output state, SN54ABT374 SN74ABT374A Input clamp current, Output clamp current, Package thermal impedance, (see Note package 115°C/W package 97°C/W package 67°C/W package 128°C/W Storage temperature range, Tstg -65°C 150°C
Stresses beyond those listed under "absolute maximum ratings" cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated under "recommended operating conditions" implied. Exposure absolute-maximum-rated conditions extended periods affect device reliability. NOTES: input output negative-voltage ratings exceeded input output clamp-current ratings observed. package thermal impedance calculated accordance with EIA/JEDEC JESD51, except through-hole packages, which trace length zero.
recommended operating conditions (see Note
SN54ABT374 Supply voltage High-level input voltage Low-level input voltage Input voltage High-level output current Low-level output current Input transition rise fall rate Outputs enabled SN74ABT374A UNIT ns/V
Operating free-air temperature NOTE Unused inputs must held high prevent them from floating.
POST OFFICE 655303
DALLAS, TEXAS 75265
SN54ABT374, SN74ABT374A OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER Vhys IOZH IOZL Ioff ICEX TEST CONDITIONS Outputs high Outputs high input Other inputs Outputs Outputs disabled -100 ±100 -180 -180 ±100 -180 0.55 0.55* 0.55 0.55 25°C -1.2 SN54ABT374 -1.2 SN74ABT374A -1.2 UNIT
products compliant MIL-PRF-38535, this parameter does apply. typical values This data sheet limit vary among suppliers. more than output should tested time, duration test should exceed second. This increase supply current each input that specified voltage level rather than GND.
timing requirements over recommended ranges supply voltage operating free-air temperature (unless otherwise noted) (see Figure
SN54ABT374 25°C fclock Clock frequency Pulse duration Setup time before Hold time after high Data high Data Data high UNIT
POST OFFICE 655303
DALLAS, TEXAS 75265
SN54ABT374, SN74ABT374A OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
timing requirements over recommended ranges supply voltage operating free-air temperature (unless otherwise noted) (see Figure
SN74ABT374A 25°C fclock Clock frequency Pulse duration Setup time before high Data high Data Data high UNIT
Hold time after This data sheet limit vary among suppliers.
switching characteristics over recommended ranges supply voltage operating free-air temperature, (unless otherwise noted) (see Figure
SN54ABT374 PARAMETER FROM (INPUT) (OUTPUT) 25°C fmax tPLH tPHL tPZH tPZL tPHZ tPLZ UNIT
switching characteristics over recommended ranges supply voltage operating free-air temperature, (unless otherwise noted) (see Figure
SN74ABT374A PARAMETER FROM (INPUT) (OUTPUT) 25°C fmax tPLH tPHL tPZH tPZL tPHZ tPLZ UNIT
This data sheet limit vary among suppliers.
POST OFFICE 655303
DALLAS, TEXAS 75265
SN54ABT374, SN74ABT374A OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
PARAMETER MEASUREMENT INFORMATION
Open TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Open
From Output Under Test (see Note
LOAD CIRCUIT Input VOLTAGE WAVEFORMS PULSE DURATION
Timing Input Data Input VOLTAGE WAVEFORMS SETUP HOLD TIMES Output Control tPZL Output Waveform (see Note Output Waveform Open (see Note tPZH VOLTAGE WAVEFORMS ENABLE DISABLE TIMES LOW- HIGH-LEVEL ENABLING tPLZ tPHZ
Input tPLH Output tPHL tPHL tPLH Output VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING NONINVERTING OUTPUTS
NOTES: includes probe capacitance. Waveform output with internal conditions such that output except when disabled output control. Waveform output with internal conditions such that output high except when disabled output control. input pulses supplied generators having following characteristics: MHz, outputs measured time with transition measurement.
Figure Load Circuit Voltage Waveforms
POST OFFICE 655303
DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2006
PACKAGING INFORMATION
Orderable Device 5962-9314901Q2A 5962-9314901QRA 5962-9314901QSA SN74ABT374ADBLE SN74ABT374ADBR SN74ABT374ADBRE4 SN74ABT374ADW SN74ABT374ADWE4 SN74ABT374ADWR SN74ABT374ADWRE4 SN74ABT374AN SN74ABT374ANE4 SN74ABT374ANSR SN74ABT374ANSRE4 SN74ABT374APW SN74ABT374APWE4 SN74ABT374APWLE SN74ABT374APWR SN74ABT374APWRE4 SNJ54ABT374FK SNJ54ABT374J SNJ54ABT374W
Status ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type LCCC CDIP SSOP SSOP SSOP SOIC SOIC SOIC SOIC PDIP PDIP TSSOP TSSOP TSSOP TSSOP TSSOP LCCC CDIP
Package Drawing
Pins Package Plan 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br)
Lead/Ball Finish Call Call Call Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Call NIPDAU NIPDAU Call Call Call
Peak Temp Type Type Type Call Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Type Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call Level-1-260C-UNLIM Level-1-260C-UNLIM Type Type Type
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS)
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br)
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered
Addendum-Page
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2006
high temperatures, Pb-Free products suitable specified lead-free processes. Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
Addendum-Page
MECHANICAL DATA
MLCC006B OCTOBER 1996
(S-CQCC-N**)
TERMINAL SHOWN
LEADLESS CERAMIC CHIP CARRIER
TERMINALS
0.342 (8,69) 0.442 (11,23) 0.640 (16,26) 0.739 (18,78) 0.938 (23,83) 1.141 (28,99) 0.358 (9,09) 0.458 (11,63) 0.660 (16,76) 0.761 (19,32) 0.962 (24,43) 1.165 (29,59) 0.307 (7,80) 0.406 (10,31) 0.495 (12,58) 0.495 (12,58) 0.850 (21,6) 1.047 (26,6)
0.358 (9,09) 0.458 (11,63) 0.560 (14,22) 0.560 (14,22) 0.858 (21,8) 1.063 (27,0)
0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25)
0.020 (0,51) 0.010 (0,25)
0.055 (1,40) 0.045 (1,14)
0.045 (1,14) 0.035 (0,89)
0.028 (0,71) 0.022 (0,54) 0.050 (1,27)
0.045 (1,14) 0.035 (0,89)
4040140 10/96 NOTES: linear dimensions inches (millimeters). This drawing subject change without notice. This package hermetically sealed with metal lid. terminals gold plated. Falls within JEDEC MS-004
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MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001
(R-PDSO-G**)
PINS SHOWN 0,65 0,38 0,22 0,15
PLASTIC SMALL-OUTLINE
0,25 0,09 5,60 5,00 8,20 7,40
Gage Plane 0,25 0,95 0,55
Seating Plane 2,00 0,05 0,10
PINS
6,50
6,50
7,50
8,50
10,50
10,50
12,90
5,90
5,90
6,90
7,90
9,90
9,90
12,30 4040065 12/01
NOTES:
linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion exceed 0,15. Falls within JEDEC MO-150
POST OFFICE 655303
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MECHANICAL DATA
MTSS001C JANUARY 1995 REVISED FEBRUARY 1999
(R-PDSO-G**)
PINS SHOWN
PLASTIC SMALL-OUTLINE PACKAGE
0,65
0,30 0,19
0,10
0,15 4,50 4,30 6,60 6,20 Gage Plane 0,25 0,75 0,50
Seating Plane 1,20 0,15 0,05 0,10
PINS
3,10
5,10
5,10
6,60
7,90
9,80
2,90
4,90
4,90
6,40
7,70
9,60
4040064/F 01/97 NOTES: linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion exceed 0,15. Falls within JEDEC MO-153
POST OFFICE 655303
DALLAS, TEXAS 75265
IMPORTANT NOTICE Texas Instruments Incorporated subsidiaries (TI) reserve right make corrections, modifications, enhancements, improvements, other changes products services time discontinue product service without notice. Customers should obtain latest relevant information before placing orders should verify that such information current complete. products sold subject TI's terms conditions sale supplied time order acknowledgment. warrants performance hardware products specifications applicable time sale accordance with TI's standard warranty. Testing other quality control techniques used extent deems necessary support this warranty. Except where mandated government requirements, testing parameters each product necessarily performed. assumes liability applications assistance customer product design. Customers responsible their products applications using components. minimize risks associated with customer products applications, customers should provide adequate design operating safeguards. does warrant represent that license, either express implied, granted under patent right, copyright, mask work right, other intellectual property right relating combination, machine, process which products services used. Information published regarding third-party products services does constitute license from such products services warranty endorsement thereof. such information require license from third party under patents other intellectual property third party, license from under patents other intellectual property Reproduction information data books data sheets permissible only reproduction without alteration accompanied associated warranties, conditions, limitations, notices. Reproduction this information with alteration unfair deceptive business practice. responsible liable such altered documentation. Resale products services with statements different from beyond parameters stated that product service voids express implied warranties associated product service unfair deceptive business practice. responsible liable such statements. Following URLs where obtain information other Texas Instruments products application solutions: Products Amplifiers Data Converters Interface Logic Power Mgmt Microcontrollers amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video Imaging Wireless Mailing Address: Texas Instruments Post Office 655303 Dallas, Texas 75265 Copyright 2006, Texas Instruments Incorporated www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless

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