ASIC High-Function, Low-Power Applications TC260 Family TC26

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ASIC High-Function, Low-Power Applications TC260 Family TC26

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0.14 CMOS ASIC TC260 Family
ASIC High-Function, Low-Power Applications
TC260 Family
TC260 family System-Level Integration (SLI) ASICs designed applications needing highest performance with smallest size lowest power. family includes TC260C cell-based best density TC260E embedded arrays fast turnaround time. Using highly sophisticated transistor design, TC260 achieves effective channel length 0.12 (0.14 µm-drawn), with kgates mm2. Toshiba TC260 technology faster than previous generation technology, also cuts power dissipation while increasing logic density times. Toshiba offers types embedded DRAM, targeted high bandwidth, other latency with SRAM-like ease use. embedded DRAM cores based Toshiba leading trench capacitor technology, which permits mixing logic DRAM without compromising logic performance. Toshiba library includes full line MIPS-based RISC, cores that serve multimedia, networking, communications, data processing, computing, digital consumer electronics mobile applications. Toshiba delivers proven cell libraries, design methodologies tools help reduce design time iterations. Encompassing Toshiba tool suite hardware/software coverification, hierarchical layout, near-zero clock skew management, etc.
Features TC260 Family
Ultra-High Density Ultra-Low Power
Fabricated using 0.14 µm-drawn (Leff=0.12 CMOS process levels metal, TC260 provides three major advantages over previous 0.25-µm TC240 technology: x3.4 improvement logic density power savings gate reduction gate delay
TC240C
TC260C
Density
Embedded DRAM
Embedded DRAM offers significant advantage over off-chip memory solutions that stems from flexibility choosing wide memory buses lower power dissipation lower capacitance on-chip connections. Since embedded DRAM cores based Toshiba leading trench capacitor technology, logic performance degraded.
TC240C
TOSHIBA TOSHIBA TOSHIBA TOSHIBA TOSHIBA
TC260C
Power Savings
TOSHIBA
High-Speed High-Density SRAM Cells
TC260 family offers types SRAM cells. high-speed type high MHz; high-density type requires approximately chip real estate conventional SRAMs.
TC240C
TC260C
Faster
SPEED
SPEED
General Product Specifications
Gate Length Power Supply Gate Delay (F/O=1, CIVX2 Cell) Gate Density Power Dissipation CMOS process, 6-layer (Core); 3.3V (I/O) (standard type), (high-speed type) types transistors available with different threshold voltages. kgates/mm2 (TC260C cell-based ICs) nW/MHz/gate (CIVXL cell)
Low-Power Technology Front-End Back-End Optimizations
With ever growing complexity deep-submicron designs, need low-power design increasingly acute. Clock gating common power reduction technique. Toshiba design methodologies automate process inserting clock gating logic design. embrace clock gating front early RTL. Additionally, during physical layout, Toshiba circuit optimization tool, PNO, employs unique techniques create lowest power implementation permitted timing constraints design. best results, cell libraries contain several functionally-equivalent cells differing drive strength, allowing optimal tuning performance power.
Effectiveness Clock Gating
Effectiveness
Clock Gating
Before
After
Before
After
DRAM Cores Application-Specific
Toshiba supports ever-growing selection cores. These range from general cells such RISC processors DRAMs through application-specific Protocol Control
Type (High-bandwidth SDRAM) Maximum clock rate: Maximum data rate: GB/s Random access cycle: Size: Type (Fast-access SDRAM with SRAM-like easy use) Latency: cycles Random access cycle: Size:
System RISC IEEE1394, IEEE1284, PCI, USB,
IrDA, PCMCIA High-Performance PCI, AGP, USB, LVDS Multimedia JPEG, MPEG, Smart MediaNetworking Ethernet Controller Analog cores ADC, DAC, Memory DRAM, SRAM, Benefits Embedded DRAM Cores Flexibility configuring DRAM cells based application requirements; high bandwidth wide fast memory buses; faster access time than discrete DRAM components; lower power dissipation lower-
capacitance on-chip connections; lower switching noise data between memory logic. TC260 offers types DRAM cores, type high bandwidth type latency.
Packaging
Toshiba comprehensive packaging options include electrically enhanced, 4-layer EPBGAs (352 pins), high-performance, high-pin-count PBGA[FC]s (>800 pins), chip-scale PFBGAs with <15mm body size (109 pins) fine-pitch TBGAs (256 pins). Toshiba also supports wide range cost/performance requirements with QFPs having pins.
Tools
ease burden designing multi-million-gate ASICs, Toshiba supports many industry-standard tools logic synthesis, sign-off simulation, static timing analysis, design-for-test, formal verification, floorplanning emulation. Such back-end features near-zero clock skew management, multi-layer routing timing/ power optimization designed minimize layout-related design iterations order help reduce development time improve market responsiveness.
OVERSEAS SUBSIDIARIES AFFILIATES
Toshiba America Electronic Components, Inc.
Headquarters-Irvine,
9775 Toledo Way, Irvine, 92618, U.S.A. Tel: (949)455-2000 Fax: (949)859-3963
990426(B)
Toshiba Electronics Europe GmbH
Head Office
Hansaallee 181, D-40549 Germany Tel: (0211)5296-0 Fax: (0211)5296-400
Toshiba Electronics Philippines, Inc.
26th Floor, Citibank Tower, Valero Street, Makati, Manila, Philippines Tel: (02)750-5510 Fax: (02)750-5511
Toshiba Electronics Asia, Ltd.
Hong Kong Head Office
Level Glory Insurance Building, Grand Century Place, No.193, Prince Edward Road West, Mong Kok, Kowloon, Hong Kong Tel: 2375-6111 Fax: 2375-0969
Boulder,
3100 Arapahoe Avenue, Ste. 500, Boulder, 80303, U.S.A. Tel: (303)442-3801 Fax: (303)442-7216
Office
Hofmannstrasse D-81378, Germany Tel: (089)748595-0 Fax: (089)748595-42
Boynton Beach, FL(Orlando)
11924 Forest Hill Blvd., Ste. 22-337, Boynton Beach, 33414, U.S.A. Tel: (561)374-6193 Fax: (561)374-6194
Toshiba Electronics France SARL
Immeuble Robert Schumann Rome, F-93561, Rosny-Sous-Bois, Cedex, France Tel: (1)48-12-48-12 Fax: (1)48-94-51-15
Beijing Office
714, Beijing Fortune Building, No.5 Dong Huan Bei-Lu, Chao Yang District, Beijing, 100004, China Tel: (010)6590-8795 Fax: (010)6590-8791
Deerfield, IL(Chicago)
Pkwy., North, Suite 500, Deerfield, 60015-2547, U.S.A. Tel: (847)945-1500 Fax: (847)945-1044
Toshiba Electronics Italiana S.R.L.
Centro Direzionale Colleoni Palazzo Perseo Ingr. 2-Piano Paracelso n.12, 1-20041 Agrate Brianza Milan, Italy Tel: (039)68701 Fax:(039)6870205
Chengdu Office
Unit 18th Floor, Times Plaza, Wenwu Road, Xinhua Avenue, Chengdu, 610017, China Tel: (028)675-1773 Fax: (028)675-1065
Duluth, GA(Atlanta)
3700 Crestwood Parkway, Ste. 460, Duluth, 30096, U.S.A. Tel: (770)931-3363 Fax: (770)931-7602
Toshiba Electronics S.A.
Parque Empresarial Fernando Edificio Europa, Planta, ES-28831 Madrid, Spain Tel: (91)660-6700 Fax:(91)660-6799
Shenzhen Office
3010-3012, Office Tower Shun Hing Square, Wang Commercial Centre, ShenNan East Road, Shenzhen, 518008, China Tel: (0755)246-1582 Fax: (0755)246-1581
Edison,
2035 Lincoln Hwy. Ste. #3000, Edison 08817, U.S.A. Tel: (732)248-8070 Fax: (732)248-8030
Toshiba Electronics(UK) Limited
Riverside Way, Camberley Surrey, GU15 3YA, U.K. Tel: (01276)69-4600 Fax: (01276)69-4800
Orange County,
Venture Plaza, #500 Irvine, 92618, U.S.A. Tel: (949)453-0224 Fax: (949)453-0125
Toshiba Electronics Korea Corporation
Seoul Head Office
14/F, B/D, 257-7 Yangjae-Dong, Seocho-ku, Seoul, Korea Tel: (02)589-4334 Fax: (02)589-4302
Toshiba Electronics Scandinavia
Floor S-161 Bromma, Sweden Tel: (08)704-0900 Fax: (08)80-8459
Portland,
1700 167th Place, #240, Beaverton, 97006, U.S.A. Tel: (503)629-0818 Fax: (503)629-0827
Kumi Office
6/F, Ssangyong Investment Securities B/D, Songjung-Dong, Kumi City Kyeongbuk, Korea Tel: (82)546-456-7613 Fax: (82)546-456-7617
Richardson, TX(Dallas)
East Campbell Rd., Suite 650, Richardson, 75081, U.S.A. Tel: (972)480-0470 Fax: (972)235-4114
Toshiba Electronics Asia (Singapore) Pte. Ltd.
Singapore Head Office
438B Alexandra Road, #06-08/12 Alexandra Technopark, Singapore 119968 Tel: (278)5252 Fax: (271)5155, (270)6056
Jose Engineering Center,
1060 Rincon Circle, Jose, 95131, U.S.A. Tel: (408)526-2400 Fax:(408)526-2410
Toshiba Technology Development (Shanghai) Co., Ltd.
23F, Shanghai Senmao International Building, Cheng East Road, Pudong Area, Shanghai, 200120, China Tel: (021)6841-0666 Fax: (021)6841-5002
Bangkok Office
Bangkadi Industrial Park, Tivanon Rd., Bangkadi Amphur Muang Pathumthani, Bangkok, 12000, Thailand Tel: (02)501-1635 Fax: (02)501-1638
Wakefield, MA(Boston)
Edgewater Place, Suite #360, Wakefield, 01880-6229, U.S.A. Tel: (781)224-0074 Fax: (781)224-1095
Tsurong Xiamen Xiangyu Trading Co., Ltd.
Xiamen Bonded Goods Market Building, Xiamen, Fujian, 361006, China Tel: (0592)562-3798 Fax: (0592)562-3799
Toshiba Electronics Trading (Malaysia)Sdn. Bhd.
Kuala Lumpur Head Office
Suite W1203, Wisma Consplant, No.2, Jalan 16/4, Subang Jaya, 47500 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: (3)731-6311 Fax: (3)731-6307
Toshiba Electronics Taiwan Corporation
Taipei Head Office
17F, Union Enterprise Plaza Bldg. Sheng East Rd., Section 0446 Taipei, Taiwan R.O.C. Tel: (02)514-9988 Fax: (02)514-7892
Penang Office
Suite 13-1, 13th Floor, Menard Penang Garden, 42-A, Jalan Sultan Ahmad Shah, Penang, Malaysia Tel: 4-226-8523 Fax: 4-226-8515
Kaohsiung Office
16F-A, Chung-Cheng Bldg., Chung-Cheng 3Rd., 80027, Kaohsiung, Taiwan R.O.C. Tel: (07)222-0826 Fax: (07)223-0046
information contained herein subject change without notice. information contained herein presented only guide applications products. responsibility assumed TOSHIBA infringements patents other rights third parties which result from use. license granted implication otherwise under patent patent rights TOSHIBA others. TOSHIBA continually working improve quality reliability products. Nevertheless, semiconductor devices general malfunction fail their inherent electrical sensitivity vulnerability physical stress. responsibility buyer, when utilizing TOSHIBA products, observe standards safety, avoid situations which malfunction failure TOSHIBA product could cause loss human life, bodily injury damage property. developing your designs, please ensure that TOSHIBA products used within specified operating ranges forth most recent products specifications. Also, please keep mind precautions conditions forth TOSHIBA Semiconductor Reliability Handbook. products described this document include products subject foreign exchange foreign trade laws.
Electronic Devices Sales Marketing Group
1-1, Shibaura 1-chome, Minato-ku, Tokyo, 105-8001, Japan Tel: (03)3457-3405 Fax: (03)5444-9431
©1999 TOSHIBA CORPORATION Printed Japan

ASIC High-Function, Low-Power Applications TC260 Family TC26

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