NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Samples | Ordering |
| AD9861-80EBZ | Analog Devices | 10-Bit Mixed-Signal Front-End (MxFE®)Processor; Package: EVALUATION BOARDS; No of Pins: -; Temperature Range: Industrial | 
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| AD9868-EBZ | Analog Devices | Broadband Modem Mixed-Signal Front End; Package: EVALUATION BOARDS; No of Pins: -; Temperature Range: Industrial |
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| AD9869-EBZ | Analog Devices | Broadband Modem Mixed-Signal Front End; Package: EVALUATION BOARDS; No of Pins: -; Temperature Range: Industrial |
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| AD9861-50EBZ | Analog Devices | 10-Bit Mixed-Signal Front-End (MxFE®)Processor; Package: EVALUATION BOARDS; No of Pins: -; Temperature Range: Industrial |
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| PCF8591T,512 | NXP Semiconductors | 8-bit A/D and D/A converter, SOT162-1 Package, Standard Marking, Tube Dry Pack |
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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: A DIVISION OF AVX CORPORATION DATA PACKAGE 0402 NTC THERMISTORS TPC Avenue du Colonel Prat 21850 Saint-Apollinaire FRANCE DATA PACKAGE 0402 NTC THERMISTORS a division of AVX , RESULTS 8 2/8 DATA PACKAGE 0402 NTC THERMISTORS a division of AVX corporation 1 - DATA , NB23RC0473 NB23RC0473 47K 4400 NB23RC0683 NB23RC0683 68K 4400 NB23RC0104 NB23RC0104 100K 4400 3/8 DATA PACKAGE , temperature Preheat zone Time 4/8 DATA PACKAGE 0402 NTC THERMISTORS a division of AVX ... | Original |
8 pages, |
datasheet abstract |
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| Abstract: Active-low chip select, controlled by DIO8 VSS Ground Data Package Format Any access to the , The data package is sent based on MSB to LSB fashion. The first byte of the package is constructed , each mode. Table 3 Data Package Format in Different Modes Mode Data Package Format (HEX , sheet for more detail. Data Package Format Any access to the external SRAM must be in a complete form that includes a command byte, three-byte address and data byte(s). The data package is sent based ... | Original |
9 pages, |
teridian metering software user N256S0818HDA ADM51 71M653X 71M6534 71M6533 71M6531 24032 FM25H20 71M653X abstract |
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| Abstract: 1N4938 1N4938 DO-35 DO-35 Glass Package (nominal dimensions) DATA PACKAGE DATA PACKAGE LL4938 LL4938 LL-34/35 LL-34/35 MINI-MELF SMD Package (DO-213AA DO-213AA) (nominal dimensions) Copyright 2001 Rev. 0.02, 2001-05-15 , current data, consult MICROSEMI's website: http://www.microsemi.com ABSOLUTE MAXIMUM RATINGS AT 25º C , ma, RL = 100 Ohms, C = 3 Pf ELECTRICAL ELECTRICAL PRODUCT PRELIMINARY DATA Information contained in this document is pre-production data, and is proprietary to Microsemi Corp. It may not be ... | Original |
4 pages, |
LL4938 DO-213AA 1N4938UR-1 1N4938-1 1N4938 JAN 1N4938 1N4938 abstract |
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| Abstract: : 09-138 XR5486EID-F XR5486EID-F GENERAL INFORMATION CHIP DATA PACKAGE DATA FAB: EPISIL ASSEMBLY: Unisem LOCATION: TECHNOLOGY: PROCESS: Taiwan LOCATION: PACKAGE: PKG. DIMENSION : (mm , INFORMATION CHIP DATA PACKAGE DATA FAB: EPISIL ASSEMBLY: Unisem LOCATION: TECHNOLOGY , ) ADDITIONAL DATA Hensen Wong JEDEC 020D MOISTURE SENSITIVITY: Level 2 QUAL FILE#: 09-138 , Sumitomo 6600A Gold 1.3 FAMILY FAILURE RATE DATA BASED ON 1000 HOURS OF OP-LIFE @ 125°C Total Sample ... | Original |
5 pages, |
JESD22-78 JESD22 A114 100PF XR5488EID-F transistor A114 JESD22-A114 XR5486EID-F XR5486EID-F abstract |
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| Abstract: Report #: 09-142 GENERAL INFORMATION CHIP DATA PACKAGE DATA FAB: Episil ASSEMBLY: Unisem LOCATION: TECHNOLOGY: PROCESS: Taiwan 2u CMOS EPI-1X-SC2MAH-A LOCATION: PACKAGE , ) FAMILY FAILURE RATE DATA Reliability Manager-Max Keyashian 1874 0 6.3 158,730,100 REQUESTER , Device Failures: FITS at 55 °C: Ea=0.7eV/C.L.= 60% MTBF (Hrs): ADDITIONAL DATA No Copper , TEST (HBM) LATCH-UP TEST OP- LIFE Package: 100 Lds LQFP Military or Industry Standard ... | Original |
3 pages, |
A114 JESD22-A114 transistor A114 100PF JESD A114 JESD22-A108 G700* sumitomo jedec jesd22-a108 g700l SP508CF-L SP508CF-L abstract |
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| Abstract: LED B: indicates Ethernet network activity. It will be illuminated on every data package receive , Ethernet controller ENC28J60 ENC28J60 that exchanges data with microcontrollers via a standard Serial Peripheral Interface (SPI) at a data rate of up to 10 Mbit/s. The board also features a single-line 10-pin connector ... | Original |
3 pages, |
MIKRO ENC28J60 datasheet abstract |
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| Abstract: Receiver Mechanical Specification: Part Number Application: Part Number Data Package Rate , F e a t u r e s: A p p l i c a t i o n s: · Small package · Surface mount design · Differential AC coupled output · -19dBm sensitivity · 4000 ohm differential transimpedance typical · Qualified in accordance with TR-NWT-000468 TR-NWT-000468 · 10Gbs/s short, intermediate and long reach systems · SONET/SDH and datacom systems Typical Receiver Eye 100uA photo current D e s c r i p t i o n s ... | Original |
2 pages, |
OPR10G10S-1RSC1 OC192 TR-NWT-000468 TR-NWT-000468 abstract |
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| Abstract: 380D30 380D30 UV-LED 5.0 mm round Technical Data Package Dimension [mm] DESCRIPTION Type Dice Material Light Color Lens Color Lens Dimension UV-LED 380D30 380D30 GaN UV Water Clear UV Resistent 5 mm Absolute Maximum Ratings at Ta = 25 °C MAX 30 5 100 Topr: -30 - +80 Topr: -30 - +100 PARAMETER DC Forword Current Reverse Voltage Power Dissipatin Operation Temperature Storage Temperature UNIT mA V mW °C °C Lead Soldering (MAX. 5 Seconds, 1.6 mm from body ) Temperature 260 °C Electrical ... | Original |
2 pages, |
UV led diode "UV led" 5mm UV-LED 5mm uv led datasheet 380D30 380D30 abstract |
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| Abstract: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.3 Data Writing Package . . , . . . . 16 5.3 Data Reading Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , Configuration Data Package (for writing and reading) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , counter In the above I2C stop code, the PackCount is the counter of the data package, and is discussed , sent in the next package goes to the CR1; then the next data goes to the CR2; and so on, not needing ... | Original |
19 pages, |
TMS320C5000 TLV320AIC20 TLV320AIC12 TLV320AIC1103 C5416 AIC12 SLAA173 cr6B TLV320AIC1103/ TLV320AIC12/ TLV320AIC20/ SLAA173 abstract |
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| Abstract: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package , 1 Plastic Package Dimensional Data · Table 2 LLP Dimensional Data · Table 3 Plastic Package Thermal Data · · Table 4 Micro SMD Thermal Data Table 5 LLP Thermal Data Package Dimensional Data TABLE 1. Plastic Package Dimensional Data Body Size Package Type Mkt Dwg Small Outline , 630 www.national.com Plastic Package Dimensional/Thermal Data August 2004 Plastic Package ... | Original |
14 pages, |
TF11B transistor BC 635 transistor BD 512 P03j MS-026-bcd MS-013 MO-229-WGED-3 TRANSISTOR BD 437 jedec MS-012-AC BD 669 TRANSISTOR BC 413 TRANSISTOR BC 137 T03A MO-220-WGGD-2 datasheet abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| SMD Tape & Reel Data - Package Outlines Numbering SMD Tape & Reel Data Package - Wafer-Level Chip-Scale Package -based form, or by phone. All Maxim data sheets are available instantly from the web . Automatic e-mail notification of newly released data sheets is available via our EE www.datasheetarchive.com/files/maxim/0000/support.htm |
Maxim | 04/04/2001 | 13.23 Kb | HTM | support.htm |
| QPL Space-Level Data Package The following data is provided for space-level orders: At no charge -ray films SCD and -MLS Space-Level Data Package All of the above are included in the unit price National - Tech for Space 96 - Optional Services & Data Please enable Javascript in your browser. Optional Services & Data Sourcing Sourcing is available at optional cost for space-level products. Source must be identified at the time of order and can be performed at www.datasheetarchive.com/files/national/htm/nsc00788-v4.htm |
National | 16/09/1998 | 5.22 Kb | HTM | nsc00788-v4.htm |
| 80960RN 80960RN 80960RN 80960RN I/O Processor Data Sheet 80960RN 80960RN 80960RN 80960RN I/O Processor Data Sheet This is the Advance Information data sheet for the 80960RN 80960RN 80960RN 80960RN processor. This data sheet contains a functional overview, mechanical data (package signal locations and simulated thermal characteristics), targeted electrical specifications (simulated), and bus functional waveforms. Detailed functional descriptions other than parametric performance is published in the i960 www.datasheetarchive.com/files/intel/technologies/design/iio/datashts/273157.htm |
Intel | 01/05/1999 | 2.45 Kb | HTM | 273157.htm |
| 80960RM 80960RM 80960RM 80960RM I/O Processor Data Sheet 80960RM 80960RM 80960RM 80960RM I/O Processor Data Sheet This is the Advance Information data sheet for the 80960RM 80960RM 80960RM 80960RM processor. This data sheet contains a functional overview, mechanical data (package signal locations and simulated thermal characteristics), targeted electrical specifications (simulated), and bus functional waveforms. Detailed functional descriptions other than parametric performance is published in the i960 www.datasheetarchive.com/files/intel/technologies/design/iio/datashts/273156.htm |
Intel | 01/05/1999 | 2.46 Kb | HTM | 273156.htm |
| 80960RN 80960RN 80960RN 80960RN I/O Processor Data Sheet 80960RN 80960RN 80960RN 80960RN I/O Processor Data Sheet This is the Advance Information data sheet for the 80960RN 80960RN 80960RN 80960RN processor. This data sheet contains a functional overview, mechanical data (package signal locations and simulated thermal characteristics), targeted electrical specifications (simulated), and bus functional waveforms. Detailed functional descriptions other than parametric performance is published in the i960 www.datasheetarchive.com/files/intel/design/iio/datashts/273157-v1.htm |
Intel | 01/02/1999 | 2.45 Kb | HTM | 273157-v1.htm |
| 80960RN 80960RN 80960RN 80960RN I/O Processor Data Sheet 80960RN 80960RN 80960RN 80960RN I/O Processor Data Sheet This is the Advance Information data sheet for the 80960RN 80960RN 80960RN 80960RN processor. This data sheet contains a functional overview, mechanical data (package signal locations and simulated thermal characteristics), targeted electrical specifications (simulated), and bus functional waveforms. Detailed functional descriptions other than parametric performance is published in the i960 www.datasheetarchive.com/files/intel/design/iio/datashts/273157.htm |
Intel | 03/11/1998 | 2.47 Kb | HTM | 273157.htm |
| i960® VH Embedded-PCI Processor Datasheet i960® VH Embedded-PCI Processor Datasheet This is the Advance Information data sheet for the Intel i960® VH embedded-PCI Processor. This data sheet contains a functional overview, mechanical data (package signal locations and simulated thermal characteristics), targeted electrical specifications (simulated), and bus functional waveforms. Detailed functional descriptions other than parametric www.datasheetarchive.com/files/intel/netpatch/design/iio/datashts/273179.htm |
Intel | 11/02/1999 | 2.5 Kb | HTM | 273179.htm |
| i960® VH Embedded-PCI Processor Datasheet i960® VH Embedded-PCI Processor Datasheet This is the Advance Information data sheet for the Intel i960® VH embedded-PCI Processor. This data sheet contains a functional overview, mechanical data (package signal locations and simulated thermal characteristics), targeted electrical specifications (simulated), and bus functional waveforms. Detailed functional descriptions other than parametric www.datasheetarchive.com/files/intel/design/iio/datashts/273179.htm |
Intel | 30/10/1998 | 2.52 Kb | HTM | 273179.htm |
| i960® VH Embedded-PCI Processor Datasheet i960® VH Embedded-PCI Processor Datasheet This is the Advance Information data sheet for the Intel i960® VH embedded-PCI Processor. This data sheet contains a functional overview, mechanical data (package signal locations and simulated thermal characteristics), targeted electrical specifications (simulated), and bus functional waveforms. Detailed functional descriptions other than parametric www.datasheetarchive.com/files/intel/products one/design/iio/datashts/273179.htm |
Intel | 30/04/1999 | 2.51 Kb | HTM | 273179.htm |
| i960(R) RP I/O Processor i960(R) RP I/O Processor This data sheet contains ADVANCE INFORMATION about Intel's i960 RP processor, including a functional overview, mechanical data (package signal locations and simulated thermal characteristics), targeted electrical specifications (simulated), and bus functional waveforms. Detailed functional descriptions other than parametric performance are published in the i960 RP Microprocessor User www.datasheetarchive.com/files/intel/design/i960/datashts/272737-v6.htm |
Intel | 10/02/1998 | 2.41 Kb | HTM | 272737-v6.htm |