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A Division of Samtec, we have brought together some of the brightest minds in the signal integrity field, with a combined Electrical Engineering, EMC, package, board, enclosure and system design experience of over 175 years - Manufacture Electronic Components
Advanced Packaging &, IC-to-Board Services, System Engineering, Signal / Power Integrity, Electromagnetic Modeling, Thermal Management, & more.
|DATASHEET||PDF or ZIP|
|Teraspeed SI Training - VIEW BROCHURE||Teraspeed SI Training : VIEW BROCHURE (PDF)|
|IC2B Solutions Guide - View Ic-to-board Design Guide||IC2B Solutions Guide : view ic-to-board design guide (PDF)|