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Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices. - semiconductor packaging, electronic assembly solutions

Advanced Packaging Local Reflow, Advanced Packaging Mass Reflow, Advanced SMT, Ball Bonder, Wafer Level Bonder, Wedge Bonder, Bonding Tools, Wedge Bond Consumables, Dicing Blades, AutoOLP, KNet Plus, AutoOLP 2013, MES / NPI, & more.

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KS CONNECTS 2016 Issue03 - KSConnects 2016 Issue03 Cover.jpg - K&S Connects KS CONNECTS 2016 Issue03 : K&S Connects (PDF)
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