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FlipChip International

In addition to offering the industry’s broadest assortment of wafer bumping options, FlipChip has maintained an aggressive program to develop and generate intellectual property for future implementation at FlipChip-Phoenix and in our Asian factory locations. - assortment of wafer bumping options

Bumping, Design, Die Services, & more.

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SOT23 3L - Package Options SOT23 3L : Package Options (PDF)
SOT23 5L - Package Options SOT23 5L : Package Options (PDF)
SOT23 6L-TSOP 6L - Package Options SOT23 6L-TSOP 6L : SOT23 6L (PDF)
SOT143 4L - Package Options SOT143 4L : Package Options (PDF)
SC59 3L - Package Options SC59 3L : SC59 (PDF)
MSOP 8L - Package Options MSOP 8L : Package Options (PDF)
MSOP 10L - Package Options MSOP 10L : Package Options (PDF)
TSSOP 8L - Package Options TSSOP 8L : TSSOP (PDF)
SOIC 8L - Package Options SOIC 8L : Package Options (PDF)
SOIC 18L - Package Options SOIC 18L : Package Options (PDF)
SOIC 28L - Package Options SOIC 28L : Package Options (PDF)
HSOP 8L - Package Options HSOP 8L : HSOP (PDF)
QSOP 16L - Package Options QSOP 16L : QSOP (PDF)
PDIP 8L - Package Options PDIP 8L : PDIP (PDF)
PLCC 28L - Package Options PLCC 28L : Package Options (PDF)
PLCC 44L - Package Options PLCC 44L : Package Options (PDF)
TDFN 6L - TDFN 6L (0.75) - Package Options TDFN 6L : TDFN 6L (0.75) (PDF)
TDFN 8L - Package Options TDFN 8L : Package Options (PDF)
DFN 8L - Package Options DFN 8L : Package Options (PDF)
TDFN 10L - TDFN 10L (0.75) - Package Options TDFN 10L : TDFN 10L (0.75) (PDF)
TQFN 20L - TQFN 20L (0.75) - Package Options TQFN 20L : TQFN 20L (0.75) (PDF)
TQFN 16L - TQFN 16L (0.75) - Package Options TQFN 16L : TQFN 16L (0.75) (PDF)
TQFN 40L - TQFN 40L (0.75) - Package Options TQFN 40L : TQFN 40L (0.75) (PDF)
TQFN 48L - TQFN 48L (0.75) - Package Options TQFN 48L : TQFN 48L (0.75) (PDF)
FlipChip International Is Attending The MagnaChip Semiconductor Corporation Foundry Technology Symposium Press-release-FlipChip-International-at-Magnachip-Symposium-5-9-14 : FlipChip International is attending the MagnaChip Semiconductor Corporation Foundry Technology Symposium (PDF)
Press-Release-Nanium-FCI - FlipChip International And NANIUM S.A. Announce License, Sales And Marketing Agreements For 300mm Wafer Level Packaging Services. - News/Events Press-Release-Nanium-FCI : FlipChip International and NANIUM S.A. Announce License, Sales and Marketing Agreements for 300mm Wafer Level Packaging Services. (PDF)
ChipsetT Ultra Thin 3D Packages - News/Events FlipChip Fujikura Announce ChipletT ChipsetT : ChipsetT Ultra Thin 3D Packages (PDF)
Fujikura FCI NewsRelease - FlipChip International And Fujikura Forge Partnership For Advanced Semiconductor Packaging Technologies - News/Events Fujikura FCI NewsRelease : FlipChip International and Fujikura Forge Partnership for Advanced Semiconductor Packaging Technologies (PDF)
FlipChip International Announces Next Generation Adaptable NANOPillar™ Bumping Technology For Lead-free Fine Pitch Flip Chip And 3D Packaging Applications. - News/Events CU PILLAR - NANOPILLAR PRESS RELEASE - 11-06-09 : FlipChip International Announces Next Generation Adaptable NANOPillar™ Bumping Technology for Lead-free Fine Pitch Flip Chip and 3D Packaging Applications. (PDF)
FCI - ICI PR - FlipChip International And IC Interconnect Announce U.S. Sales And Marketing Agreement For Wafer Level Packaging Services. - News/Events FCI - ICI PR : FlipChip International and IC Interconnect Announce U.S. Sales and Marketing Agreement for Wafer Level Packaging Services. (PDF)
FCI Announces 300mm Strategic Partnership With SMIC. - News/Events FCI-SMIC-FCMS Partnership Release : FCI announces 300mm Strategic Partnership with SMIC. (PDF)
FCI-Hermes European - Hermes European Embedded Die Consortia Selects FCI's EDC&#8482 Technology - News/Events FCI-Hermes European : Hermes European Embedded Die Consortia Selects FCI's EDC&#8482 Technology (PDF)
Unisem-FCI Press Release - Unisem And FCI Sign Licensing Agreement For Wafer Bumping And Wafer Level Packaging Technologies - News/Events Unisem-FCI Press Release : Unisem and FCI Sign Licensing Agreement For Wafer Bumping and Wafer Level Packaging Technologies (PDF)
EDC Press Release - FCI’s EDC&#8482 Enables Embedded Die Packaging - News/Events EDC Press Release : FCI’s EDC&#8482 Enables Embedded Die Packaging (PDF)
FCI Announces Expansion Of DSD Fab To 3 Million Die Weekly Capacity - News/Events FlipChip International-DSD Division News : FCI announces Expansion of DSD Fab to 3 Million Die Weekly Capacity (PDF)
FCI Appoints David McComb Vice President Sales And Marketing - News/Events Dave McComb-Press Release Final : FCI appoints David McComb Vice President Sales and Marketing (PDF)

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