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Our goal is aimed at consistently supplying our customers with high quality printed circuit boards that are delivered on time, every time. We will achieve this through an “attitude of continuous improvement”, which involves consistent processing, total employee involvement, and anticipating future customer needs, while maintaining a safe and healthy environment. - printed circuit boards
Multilayer up to 16 Layers, Fine Lines and SMT Pitch, Board thickness 0.008 to 0.250, Carbon Ink Contacts, Oversized Multilayer Boards, Ball Grid Array (BGA) Patterns, Blind and Buried Vias, Peelable/Water Soluble Masks, Plated Slots and Edges, Epoxy Via Plug, Blind Buried Vias, Control Impedance, FR-4 & S1170 equivalent to HI –Temp FR-4, Roger, Taconic, Arlon, Polyimide, Teflon, Solder Mask Over Bare Copper (SMOBC), Hot Air Leveled Solder, Electroless nickel/gold (including bondable gold), Electroless White Tin, Electroless Silver, Screenable Silver and Carbon, Heavy copper layers, & more.
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|Quality-System-Manual-rev-M - Axon Download - Quality Manual||Quality-System-Manual-rev-M : Axon Download - Quality Manual (PDF)|
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