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August Technology

Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. - Microelectronic devices manufacturer

Semiconductor, LED, Flat Panel Display, Data Storage, Compound Semi, R&D, & more.

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Rudolph-profile2017 Rudolph-profile2017 (PDF)
Apps Flyer - Probe Card Test And Analysis Apps Flyer : Probe Card Test and Analysis (PDF)
Apps Flyer - Advanced Packaging Lithography Apps Flyer : Advanced Packaging Lithography (PDF)
Apps Flyer - Thin Film Metrology Apps Flyer : Thin Film Metrology (PDF)
Apps Flyer - Process Control Software Apps Flyer : Process Control Software (PDF)
Apps Flyer - Yield Management Software Apps Flyer : Yield Management Software (PDF)
Apps Flyer - Defect Inspection Apps Flyer : Defect Inspection (PDF)
NP Contacts NP Contacts (PDF)
Rudolph-profile2017 - Manufacturing Rudolph-profile2017 : Manufacturing (PDF)
Download The White Paper - Through Silicon Via Process Characterization By Integrated Inspection/Metrology Solutions In Visible And Infrared Domain Paper 3262 Abstract 2663 0 LETI TSV Final : Download the white paper (PDF)
Download The Full Article - Defect Detection Drives To Greater Depths SI Defect Detection Drives To Greater Depths 2009 : Download the full article (PDF)
Download The White Paper - Laser Dark-field Illumination System Modeling For Semiconductor Inspection Applications Laser DF Illumination System Modeling 2011 : Download the white paper (PDF)
Download The Application Note - All-Surface Inspection For 3D-interconnects And TSV Manufacturing All-surface Inspection For 3D-interconnects And TSV - App : Download the application note (PDF)
Download The Whtie Paper - Whole Wafer Macro CD Metrology Whole Wafer Macro CD Metrology : Download the whtie paper (PDF)
Read The Full Article - Improving The Accuracy Of Bump Height And Coplanarity Measurement SST True Bump Height Article Dec 2016 : Read the full article (PDF)
Download The Full Article - Controlling Measurements Of WLP In High Mix, High Volume Manufacturing Controlling Measurements Of WLP STATS SST July 2015 : Download the full article (PDF)
Read The Full Article - 3D Inspection Challenges Of Copper Pillar Bumps 3D Inspection Challenges Of Copper Pillar Bumps (CSR 2014) : Read the full article  (PDF)
Noteworthy Growth - Bosch Selects Rudolph For Dynamic Semiconductor Inspection Solutions PR Ranking MEMSplayers YOLE March2015 : noteworthy growth (PDF)
Download The White Paper - Use Of Wafer Backside Inspection And SPR To Address Systemic Tool And Process Issues 022410 Use Of Backside Insp And SPR Rudolph And IBM : Download the white paper (PDF)
Download The White Paper - The Impact Of Backside Particle Contamination 022009 Impact Of Backside Particle Contamination : Download the white paper (PDF)
Download The White Paper - Edge Defectivity For Immersion Lithography 022009 Edge Defectivity For Immersion : Download the white paper (PDF)
Download The White Paper - Correlation Of Wafer Backside Defects To Photolithography Hot Spots Using Advanced Macro Inspection 031306 Correlation Of Backside Defects To Hot Spots : Download the white paper (PDF)
Pages From SST Jan ROB-2 - Read The Full Article - Productivity Data Is Essential To Success In 2014 Pages From SST Jan ROB-2 : Read the full article (PDF)
Full Article - Reducing The Cost Of Probe Card Test And Repair Reduce The Cost Of Probe Card Test And Repair CSR Feb 2015 : full article (PDF)
Download The Full Article - Probing Questions For Rudolph Technologies Probing Question Chip Scale Review 2010 : Download the full article (PDF)
Download The Full Article - Optimizing Test Cell Performance With Probe Card And Probe Mark Analysis Optimizing Test Cell Performance James WDPI 2010 : Download the full article (PDF)
Download The Full Article - Probe Mark Analysis - A Critical Window On Actual Probe Card Performance Probe Mark Analysis - Window On Actual Performance : Download the full article (PDF)
Read The Full Article - Think Outside The Box For Advanced Packaging Think Outside The Box For Advanced Packaging (Silicon Semi 2014) : Read the full article  (PDF)
Read The Full Article - Performance Of Optimized Lithography Tools And Materials In Advanced Packaging Applications Chip-Scale-Review Sept-Oct Interactive : Read the full article (PDF)
Apps Flyer - Probe Card Test And Analysis Products Apps Flyer : Probe Card Test and Analysis Products (PDF)
Apps Flyer - Advanced Packaging Lithography Products Apps Flyer : Advanced Packaging Lithography Products (PDF)
Apps Flyer - Thin Film Metrology Products Apps Flyer : Thin Film Metrology Products (PDF)
Apps Flyer - Yield Management Software Products Apps Flyer : Yield Management Software Products (PDF)
Apps Flyer - Process Control Software Products Apps Flyer : Process Control Software Products (PDF)
Apps Flyer - Defect Inspection Products Apps Flyer : Defect Inspection Products (PDF)
S04 01 Davis SWTW2011 - Read The Full Article - Testing Probe Cards That Contain Complex Circuitry S04 01 Davis SWTW2011 : Read the full article (PDF)
Read The Full Article. - In-line Process Monitoring Of Advanced Packaging Processes Using Focused Beam Ellipsometry In-line Monitoring Of Adv Pkg Processes Using Fbe CSR June 2015 : Read the full article. (PDF)
Read The Full Article - RF MEMS Metrology Using Picosecond Ultrasonics RF MEMS Metrology Using Picosecond Ultrasonics MicroMatters Sept 2015 : Read the full article (PDF)
Read The Full Article - In-Line High-K/Metal Gate Monitoring Using Picosecond Ultrasonics In-line HKMG Monitoring Using Picosecond Ultrasonics SST May 2014 : Read the full article (PDF)
Read The Full Article. - Controlling Bumping Processes With Picosecond Ultrasonic Metrology Controlling Bumping Processes With Picosecond Ultrasonic Metrology CSR 2013 : Read the full article.  (PDF)
Download the Full Article - In-Die Vs. Scribe-Line Copper CMP Monitoring In-Die Vs Scribe-Line Copper CMP Monitoring (SI, 2009) : Download the full article (PDF)
In-die Cu Thickness - Download The White Paper - In-die Cu Thickness Monitoring Of Memory Chip In-die Cu Thickness : Download the white paper (PDF)
Download The White Paper - Characterization Of Copper Line Array Erosion With Picosecond Ultrasonics Characterization Of Copper Line Array Erosion With Picosecond Ultrasonics : Download the white paper (PDF)
Download The White Paper - Characterizing CMP Processes With Picosecond Ultrasonic Metrology Characterizing CMP Processes With Picosecond Ultrasonic Metrology : Download the white paper (PDF)
Download The White Paper - Measuring The Young’s Modulus Of Ultralow-K Materials With The Non-Destructive Picosecond Ultrasonic Measuring Youngs Modulus Of Ultralow-K : Download the white paper (PDF)
Download The Full Article - How CD-SEMs Complement Scatterometry How CD-SEMs Complement Scatterometry (SI, 2009) : Download the full article (PDF)
Download The White Paper - Sensitivity And Performance Estimates For Ellipsometry For OCD Applications Sensitivity And Performance Estimates 2008 : Download the white paper (PDF)
Download The White Paper - Characterization Of Sub-50nm Line Array Structures With Multiple Wavelength Scatterometry Characterization Of Sub-50 Nm Line Array : Download the white paper (PDF)
Download The White Paper - Characterization Of The Poly Gate ACI Structure With Multiple Wavelength Scatterometry Characterization Of The Poly Gate ACI Structure : Download the white paper (PDF)
Use Of Spatial Pattern 08 - Download The White Paper - Use Of SPR For Enhancing The Resolution And Identification Of Rogue Tools In Manufacturing Use Of Spatial Pattern 08 : Download the white paper (PDF)
Article - When Fault Finding Works When Fault Finding Works SiliconSemi Aug 2014 : article (PDF)
Download The Presentation - Efficiency And Yield Improvement With Factory-wide PV Process Control Software Efficiency And Yield Improvements With PV Process Control Software : Download the presentation (PDF)
Download The White Paper - See-through-silicon Inspection Application Studies Based On Traditional Silicon Imager See-through-silicon Inspection 2011 : Download the white paper (PDF)
Download The White Paper - Use Of Automated EBR Metrology Inspection To Optimize The Edge Bead Process 031907 Automated EBR Metrology - RTEC And NSC : Download the white paper (PDF)
Download The White Paper - Advanced Macro Inspection Provides Data To Address Blister Defects 032806 Advanced Macro Inspection Provides Data To Address Blister Defects - August And TI : Download the white paper (PDF)
SONUS Intro SST Oct 2014 - Read The Full Article - Rudolph Introduces New Acoustic Metrology And Defect Inspection Technology For 3DIC And Advanced Packaging Applications SONUS Intro SST Oct 2014 : Read the full article (PDF)
Download The Full Article - Equipment Makers Say Tools Are Ready For Initial Volumes Of 2.5D/3DIC Production Equipment Makers Say Tools Are Ready For 2.5D And 3DIC Production : Download the full article (PDF)
Download The Full Article - Mobile Data Access, New Tracking Abilities Enhance Factory Software Mobile Data, Tracking Abilities Enhance Factory Software Solar Industry : Download the full article (PDF)
Download The Case Study - E-Ton Solar Reduces Production Costs Using Discover Solar Software Discover Solar E-Ton Case Study : Download the case study (PDF)
Download the Full Article - Efficiency And Yield Improvements With Fab-wide Process Management Software Process Management Software Global Solar Tech : Download the full article (PDF)
Download The Full Article - Keeping Tabs On Factories: Essential Capabilities For Process Control Software PV Process Control Software Solar Industry 2011 : Download the full article (PDF)
Download the Full Article - Factory Tools Of The Trade Help Pinpoint Problems, Manage PV Production PV Production Management Solar Industry Mag 2011 : Download the full article (PDF)
Pvi 1106 Automation Testing - Download The Full Article - It’s A Control Thing Pvi 1106 Automation Testing : Download the full article (PDF)
Download The Full Article - Realising Process Potential Solar Realising Process Potential 2010 : Download the full article (PDF)
Download The Full Article - PV Fab Plants Slowly Embracing Production Line Software PV Embraces Production Line Software : Download the full article (PDF)
Download The Full Article - Automated Macro Inspection Serves The Chinese Customer (Chinese Language) SI Automated Macro Insp Serves Chinese Customer Article June 2007 : Download the full article (PDF)

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