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ASE Group

The ASE Group is the world’s largest provider of independent semiconductor manufacturing services in assembly and test. The group develops and offers complete turnkey solutions covering IC packaging, design and production of interconnect materials, front-end engineering test, wafer probing and final test, as well as electronic manufacturing services through USI, Inc. As global leader, ASE provides a complete scope of services for the semiconductor market, driven by superior technologies, breakthrough innovations, and advanced development programs. Semiconductors are the basic building blocks used to create electronic products and systems. Increasingly we are moving towards more sophisticated semiconductor applications, driven by market demands for faster, smarter, portable and integrated electronic products. In such products, the tiny semiconductor chip is constantly being pushed to greater limits. Semiconductor manufacturing consists of many processes - design of the integrated circuit (IC), preliminary testing of the viability of the design, wafer fabrication, packaging and final testing of the IC. - Semiconductor manufacturing services

Assembly Offerings, Test Service Offerings, Material Offerings, Tray Service Offerings, Substrate Design Service, Characterization Services, eServices, & more.

DATASHEET PDF or ZIP
Lead Frame Delamination Improvement - No Ag Plating On Side Wall Of LF Technology Disclosure P080410002 : Lead Frame Delamination Improvement - No Ag Plating on Side Wall of LF (PDF)
Probe Bump Structure Technology Disclosure P071231001 : Probe Bump Structure (PDF)
New Stacked-die Structure Development Technology Disclosure P080118002 : New Stacked-die Structure Development (PDF)
SiliCom September Issue - Cover Story - SiliCom: Exclusive Interview With Mr Jason Chang, Chairman Of ASE Group Silicommag Interview Chairman 09042015 : SiliCom September Issue - Cover Story (PDF)
中文版:日月光與博世Bosch Sensortec共同開發先進微機電元件 - ASE Collaborates On Leading MEMS Device With Bosch Sensortec GmbH NR ASE Bosch MEMS CN Final 20140826 : 中文版:日月光與博世Bosch Sensortec共同開發先進微機電元件 (PDF)
ASEKS PressRelease 20140804 - 中文版:日月光昆山廠營運一切正常 - ASE Kunshan Facility - Production Lines Continue Operation Normally ASEKS PressRelease 20140804 : 中文版:日月光昆山廠營運一切正常 (PDF)
中文版:日月光榮登富比世雜誌2014亞洲50大企業 - ASE Makes The List On Forbes Asia Fabulous 50 Companies 2014 ASE ForbesFab 50 CN Final 20140829 : 中文版:日月光榮登富比世雜誌2014亞洲50大企業 (PDF)
ASEKH PressRelease 20140804 - 中文版:日月光高雄廠營運正常 - ASE Kaohsiung Facility - Production Lines Continue Operation Normally ASEKH PressRelease 20140804 : 中文版:日月光高雄廠營運正常 (PDF)
中文版:日月光與華亞科技攜手合作拓展系統級封裝技術(SiP) - ASE Expands System-in-Package Business Model Through Industry Partnership With Inotera ASE Inotera SiP CN 20140407 Final : 中文版:日月光與華亞科技攜手合作拓展系統級封裝技術(SiP) (PDF)
Lead Frame Delamination Improvement - No Ag Plating On Side Wall Of LF Technology Disclosure P080410002 : Lead Frame Delamination Improvement - No Ag Plating on Side Wall of LF (PDF)
Probe Bump Structure Technology Disclosure P071231001 : Probe Bump Structure (PDF)
New Stacked-die Structure Development Technology Disclosure P080118002 : New Stacked-die Structure Development (PDF)
SiliCom 九月號 - 封面故事 - SiliCom: 日月光董事長張虔生專訪 Silicommag Interview Chairman 09042015 : SiliCom 九月號 - 封面故事 (PDF)
Lead Frame Delamination Improvement - No Ag Plating On Side Wall Of LF - Technology Technology Disclosure P080410002 : Lead Frame Delamination Improvement - No Ag Plating on Side Wall of LF (PDF)
Probe Bump Structure - Technology Technology Disclosure P071231001 : Probe Bump Structure (PDF)
New Stacked-die Structure Development - Technology Technology Disclosure P080118002 : New Stacked-die Structure Development (PDF)
Lead Frame Delamination Improvement - No Ag Plating On Side Wall Of LF - 技術 Technology Disclosure P080410002 : Lead Frame Delamination Improvement - No Ag Plating on Side Wall of LF (PDF)
Probe Bump Structure - 技術 Technology Disclosure P071231001 : Probe Bump Structure (PDF)
New Stacked-die Structure Development - 技術 Technology Disclosure P080118002 : New Stacked-die Structure Development (PDF)

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