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Ardent Concepts
Ardent Concepts was founded in 2003 by Gordon Vinther & Steve Cleveland to meet the challenges and demands presented by engineers seeking to create the world’s fastest, highest performing electronic systems. Ardent’s Intellectual Property has enabled the creation of high-performance electronic interface products that provide exceptional signal integrity and design flexibility in a cost-effective package - electronic interface products
High Speed Multicoax Assemblies, Connectors, Sockets, & more.
| DATASHEET | PDF or ZIP |
|---|---|
| TR-AppNote-v4 - Application Note | TR-AppNote-v4 : Application Note (PDF) |
| TR Datasheet | TR Datasheet (PDF) |
| QuickLink-Datasheet-1 - QUICKLINK Coaxial Connector | QuickLink-Datasheet-1 : QUICKLINK Coaxial Connector (PDF) |
| TR Datasheet - Technology | TR Datasheet : Technology (PDF) |
| Technical Drawing - TR Blind Mate Test Head Interface | FXBM-28X4-2.54-24KM-1-SMD-REV-1-4 : Technical Drawing (PDF) |
| CA-Series-Datasheet01242017 - Brochure - Board To Board Specificiations | CA-Series-Datasheet01242017 : Brochure (PDF) |
| Read About An Industry Leader And Their View Of Ardent’s High Performing LGA Connectors - Chip To Chip Connectors | WMED Low Power IO Tutorial - Bryan Casper : Read about an industry leader and their view of Ardent’s high performing LGA Connectors (PDF) |
| IPAMP16X2-REV-A - IC Footprint Probe Drawing - IC Footprint Probe 4×2 | IPAMP16X2-REV-A : IC Footprint Probe Drawing (PDF) |
| FPAMP16X2-REV-A - IC Footprint Probe Footprint - IC Footprint Probe 4×2 | FPAMP16X2-REV-A : IC Footprint Probe Footprint (PDF) |
| IPAMP16X2-REV-A - IC Footprint Probe Drawing - IC Footprint Probe 2×2 | IPAMP16X2-REV-A : IC Footprint Probe Drawing (PDF) |
| ICFP-Datasheet - IC Footprint Probe 4×2 | ICFP-Datasheet : IC Footprint Probe 4×2 (PDF) |
| FPAMP16X2-REV-A - IC Footprint Probe Footprint - IC Footprint Probe 2×2 | FPAMP16X2-REV-A : IC Footprint Probe Footprint (PDF) |
| ICFP-Datasheet - IC Footprint Probe 2×2 | ICFP-Datasheet : IC Footprint Probe 2×2 (PDF) |
| TR16X2-2.54-XXXX-1-REV-A - Connector Drawing - TR70 16×2 | TR16X2-2.54-XXXX-1-REV-A : Connector Drawing (PDF) |
| FP16X2-2.54-SL-1-REV-C - Stripline Footprint Drawing - TR70 16×2 | FP16X2-2.54-SL-1-REV-C : Stripline Footprint Drawing (PDF) |
| FP16X2-2.54-MS-1-REV-C - Microstrip Footprint Drawing - TR70 16×2 | FP16X2-2.54-MS-1-REV-C : Microstrip Footprint Drawing (PDF) |
| TRT-8X1-1.27-06-1-REV-A - Connector Drawing - TR For Superconducting Applications | TRT-8X1-1.27-06-1-REV-A : Connector Drawing (PDF) |
| CR-Datasheet - Technology | CR-Datasheet : Technology (PDF) |
| SC-Datasheet - Technology | SC-Datasheet : Technology (PDF) |
| CR-Datasheet - CR – GHz Sockets For BGA/ LGA/ Board To Board | CR-Datasheet : CR – GHz Sockets for BGA/ LGA/ Board to Board (PDF) |
| RC05-01-Sales Model Drawing - View Drawing - SP – Spring Probe Interface | RC05-01-Sales Model Drawing : View Drawing (PDF) |
| RCSpringProbe3 - Brochure - SP – Spring Probe Interface | RCSpringProbe3 : Brochure (PDF) |
| RC04-01-sample-connector - Drawing - SP – Spring Probe Interface | RC04-01-sample-connector : Drawing (PDF) |
| RC04-01-Sales-Model-Drawing - SP – Spring Probe Interface | RC04-01-Sales-Model-Drawing : Drawing (PDF) |
| RC05-01-sample-connector - Drawing - SP – Spring Probe Interface | RC05-01-sample-connector : Drawing (PDF) |
| RC05-01-Sales-Model-Drawing - SP – Spring Probe Interface | RC05-01-Sales-Model-Drawing : Drawing (PDF) |
| RC08-02-Sample-connector - Drawing - SP – Spring Probe Interface | RC08-02-Sample-connector : Drawing (PDF) |
| RC08-02-Sales-Model-Drawing - SP – Spring Probe Interface | RC08-02-Sales-Model-Drawing : Drawing (PDF) |
| RC10-05-Sample-Connector-w-CE - Drawing - SP – Spring Probe Interface | RC10-05-Sample-Connector-w-CE : Drawing (PDF) |
| CROSS-SECTION - Drawing - SP – Spring Probe Interface | CROSS-SECTION : Drawing (PDF) |
| Drawing - SP – Spring Probe Interface | RC12-06-X-Section-Specification : Drawing (PDF) |
| SC-Datasheet - SC – ATE Test: MEMS/ Flex/ Chipscale | SC-Datasheet : SC – ATE Test: MEMS/ Flex/ Chipscale (PDF) |
| Semiconductor Industry Case Study – Top Side Interconnect Solution - Semiconductors | Intel-Top-Side-Interconnect-Formatted-Case-Study-FINAL1 : Semiconductor Industry Case Study – Top Side Interconnect Solution (PDF) |
| ACI SC WP - ATE Test Sockets - Semiconductors | ACI SC WP : ATE Test sockets (PDF) |
| ConnectR-Brochure | ConnectR-Brochure : Brochure (PDF) |
| RCSpringProbe1 - Brochure | RCSpringProbe1 : Brochure (PDF) |
| RCScrub R - Brochure | RCScrub R : Brochure (PDF) |
| 50x50 U1 Mounting Spec - Chip To Board Connectors | 50x50 U1 Mounting Spec : Chip to Board Connectors (PDF) |
| View Drawing - Board To Board Specificiations | Board-to-board-connector Drawing : View Drawing (PDF) |
| Space-drawing - View Drawing - RC Space Transformer Interposer | Space-drawing : View Drawing (PDF) |
| Chip To Chip Connector Case Study – Topside Interconnect - Chip To Chip Connectors | Intel-Top-Side-Interconnect-Formatted-Case-Study-FINAL : Chip to Chip Connector Case Study – Topside Interconnect (PDF) |
| BGASocketFootprint - COTS Connectors | BGASocketFootprint : COTS Connectors (PDF) |
| Bga Socket Drawing - COTS Connectors | Bga Socket Drawing : COTS Connectors (PDF) |
| FP190CR1001 - COTS Connectors | FP190CR1001 : COTS Connectors (PDF) |
| CA190CR1001 - COTS Connectors | CA190CR1001 : COTS Connectors (PDF) |
| COTS Connectors | 128 Pin Board To Board Connector Drawing : COTS Connectors (PDF) |
| Replacing Pogo Pins For A High Performance BGA Test Socket Solution. - Test Sockets – BGA/LGA | Ardent-Case-Study-BGA-test-socket-bc : Replacing Pogo Pins for a High Performance BGA Test Socket Solution. (PDF) |
| High Performance FPGA Characterization Sockets. - Test Sockets – BGA/LGA | Ardent-Case-Study-BGA-test-socket-Alt : High Performance fPGA Characterization Sockets. (PDF) |
| RCSpringProbe - Test Sockets – BGA/LGA | RCSpringProbe : Test Sockets – BGA/LGA (PDF) |
| ScrubR WP - Ardent’s White Paper - Test Sockets – QFN/QFP | ScrubR WP : Ardent’s white paper (PDF) |
| Flex To Board Drawing - View Drawing - Test Sockets – High Speed Flex Devices | Flex To Board Drawing : View Drawing (PDF) |
| Flex To Board Connector - Test Sockets – High Speed Flex Devices | Flex To Board Connector : Test Sockets – High Speed Flex Devices (PDF) |
| Optical Engine Sockets | WMED-low-power-IO-tutorial-Bryan-Casper : Optical Engine Sockets (PDF) |
Disclaimer: downloads are archived from 3rd party sources. We offer no guarantees, or warranties with this data or associated files.