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Part Manufacturer Description Datasheet BUY
LTC3854IMSE#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC3854IMSE#PBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC3854EMSE#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC3854IDDB#TRMPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC3854IDDB#PBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC3854EDDB#PBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy

ceramic capacitor footprint 0402 dimension -singlelayer

Catalog Datasheet MFG & Type PDF Document Tags

E197536

Abstract: 0603SFF , High-Current-Rated and Slow-Blow Chip Fuses Dimension in inches (mm) Mark 0402 (1005) 0603 (1608) 1206 , and possible coating breach. Figure 1 Glass/Ceramic Substrate Multiple Fuse Elements , diffusing into the surrounding ceramic substrate. In the glass coated design, the element diffusion takes , fuse's monolithic, multilayer design provides the highest hold current in the smallest footprint , Recommended Pad Layout for Fast-Acting Chip Fuses 0402 (1005mm) Fast-Acting Chip Fuses Shape and
Tyco Electronics
Original

smd fuse marking code 15 0.75A 1206

Abstract: 1206SFP Dimension in inches (mm) Mark E1 0402 (1005) 0.069 ± 0.004 (1.75 ± 0.10) F 0.138 ± 0.002 (3.50 ± 0.05) W , 1206/0603/0402 60 9 11.4 8 W1 Dimension Description Hub outer diameter Reel inside width Reel , design indicates a clean separation with the fuse element evenly diffusing into the surrounding ceramic , /Ceramic Substrate Multiple Fuse Elements Substrate Material Single Fuse Glass Element Coating , ceramic body with end cap fuse. Figure 3 Glass fiber enforced epoxy body Straight wire element
Tyco Electronics
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2410 smd fuse 1.5A

Abstract: smd fuse Construction body material Termination material Fuse element Ceramic (1206/0603/0402); Fiberglass/Epoxy , Reel Specifications for All Fuses Dimension in inches (mm) Mark 0402 (1005) 0603 (1608) 1206 , diameter Dimension (mm) Mark 1206/0603/0402 2410 B 60 60.2 Reel inside width W1 , ceramic substrate. In the glass coated design, the element diffusion takes place in a small portion of , Glass/Ceramic Substrate Multiple Fuse Elements Multi-layer Design Substrate Material
Tyco Electronics
Original

0603SFV125F/32-2

Abstract: Construction body material Termination material Ceramic (1206/0603/0402); Fiberglass/Epoxy (2410) Silver , RoHS Compliant, ELV Compliant HF Halogen Free Dimension in inches (mm) Mark 0402 (1005 , surrounding y diffusing into the surrounding u n o o i ceramic substrate. In the glass coated design , /Ceramic Glass/Ceramic C c Substrate Substrate s e Multiple Fuse Multiple t Elements Elements , achieved on lead free completely and no end cap falling off risk comparing with traditional ceramic body
TE Connectivity
Original

usb/PAL 0073 pioneer

Abstract: DIODE smd marking s4 82a lowest capacitance â'¢ ChipSESD devices â'" Bi-directional, silicon-based devices in 0201 and 0402
TE Connectivity
Original

smd diode marking code t056

Abstract: xf075 capacitor to fail in a short-circuit mode. Applications that need this type of protection include hard
Tyco Electronics
Original

EIA 549 Class 130B transformer

Abstract: mcf 300.04 Operating temperature: -55°C to +125°C 0402 CASE SIZE, VOLTAGE: 16 VDC CDR STYLE SMT MULTILAYER CERAMIC , CAPACITORS Find Datasheets Online CERAMIC CAPACITORS MULTILAYER CERAMIC CAPACITORS - 0.5pF TO 82 , SIZE, VOLTAGE: 10V MULTILAYER CERAMIC CAPACITORS - 0.5pF TO 82,000pF (CONT.) 0603 CASE SIZE, VOLTAGE , 0201 CASE SIZE, VOLTAGE: 25V G G G G 0402 CASE SIZE, VOLTAGE: 10V G G G 0402 CASE SIZE, VOLTAGE: 16V G G G G G G 0402 CASE SIZE, VOLTAGE: 25V G 0402 CASE SIZE, VOLTAGE: 50V G G G G G G G G G G G G G
Element14 Catalog
Original

maxim 8770

Abstract: e600 flip chip ceramic ball grid array (FC-CBGA) MPC8641 and MPC8641D Integrated Host Processor Hardware
Freescale Semiconductor
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MPC8641DEC maxim 8770 e600 MC8641 PC16550D SSTL-18

PC8641

Abstract: microprocessor boundary scan · Available as 1023 pin Hi-CTE flip chip ceramic land grid (FC-CLGA) and ceramic ball grid
e2v semiconductors
Original
PC8641 PC8641D microprocessor VH 73 600MH F-91572 0893C

eTSEC GMII Initial

Abstract: the RMII Consortium Specification boundary scan · Available as 1023 pin Hi-CTE flip chip ceramic land grid (FC-CLGA) and ceramic ball grid
e2v semiconductors
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eTSEC GMII Initial the RMII Consortium Specification 0893B

smo 365

Abstract: eTSEC GMII Initial PC16550D IEEE 1149.1-compliant, JTAG boundary scan Available as 1023 pin Hi-CTE flip chip ceramic land grid (FC-CLGA) and ceramic ball grid array (FC-CBGA) MPC8641 and MPC8641D PowerPCTM Integrated Processor
Freescale Semiconductor
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smo 365 land pattern 0.75 solder ball freescale MPC8641 and MPC8641D Integrated Host Processor

MPC8641

Abstract: MPC8641D PC16550D IEEE 1149.1-compliant, JTAG boundary scan Available as 1023 pin Hi-CTE flip chip ceramic ball grid
Freescale Semiconductor
Original
Abstract: PC16550D IEEE 1149.1TM-compliant, JTAG boundary scan Available as 1023 pin Hi-CTE flip chip ceramic ball Freescale Semiconductor
Original
MPC8640DEC MPC8640 MPC8640D

PC8640

Abstract: openpic · IEEE 1149.1-compliant, JTAG boundary scan · Available as 1023 pin Hi-CTE flip chip ceramic ball
e2v semiconductors
Original
PC8640 openpic PC8640D 0948C

pci slot pinout

Abstract: PC8640 1023 pin Hi-CTE flip chip ceramic ball grid array (FC-CBGA) 3. Electrical Characteristics This
e2v semiconductors
Original
pci slot pinout e2v GTX 120 0948E

MPC8640D

Abstract: MPC8640 as 1023 pin Hi-CTE flip chip ceramic ball grid array (FC-CBGA) MPC8640 and MPC8640D Integrated
Freescale Semiconductor
Original
powerpc dhrystone mips MPC8640D MIPS
Abstract: boundary scan Available as 1023 pin Hi-CTE flip chip ceramic ball grid array (FC-CBGA) MPC8640 and Freescale Semiconductor
Original

maxim 8770

Abstract: NKT 275 transistor 1023 pin Hi-CTE flip chip ceramic ball grid array (FC-CBGA) Electrical Characteristics This
Freescale Semiconductor
Original
NKT 275 transistor AM1 marking Thermagon GHz MC8641Dxx1000NX PWB 826 service manual 5006

MPC8640

Abstract: MPC8640D 1023 pin Hi-CTE flip chip ceramic ball grid array (FC-CBGA) Electrical Characteristics This
Freescale Semiconductor
Original
novatech mcs 206 8640 E600 AM3 Processor Functional Data Sheet digital pressure circuit diagram mpx marking T30 PCI-Express 2.0 X8 connector Pinout

MPC8640DEC

Abstract: MPC8640 PC16550D IEEE 1149.1-compliant, JTAG boundary scan Available as 1023 pin Hi-CTE flip chip ceramic ball grid
Freescale Semiconductor
Original
MPC8640DECS01AD
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