NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Samples | Ordering |
| 1435027-5 | TE Connectivity / AMP | Fiber Optic Cable Assemblies; C/A MPO TRUNK 62.5, 72FIB ( AMP ) | 
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| 2-1435027-5 | TE Connectivity / AMP | Fiber Optic Cable Assemblies; C/A MPO TRUNK 62.5, 72FIB ( AMP ) |
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| 1-1435027-5 | TE Connectivity / AMP | Fiber Optic Cable Assemblies; C/A MPO TRUNK 62.5, 72FIB ( AMP ) |
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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: ) Rejection( 50.275 - 70) Passband Amplitude Ripple Passband Phase Ripple Passband GD Ripple Absolute , Max. 30 39.025 50.275 0.6 5 75 Units. MHz dB MHz MHz MHz dB dB dB dB deg p-p ns p-p us deg C ppm / deg C Rev 1.0 02-May-01 Page 1 of 2 44.1 MHz Filter for CATV ... | Original |
2 pages, |
SF0044BA01954T c 50275 SF0044BA01954T abstract |
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| Abstract: ( 50.275 - 70) Passband Amplitude Ripple Passband Phase Ripple Passband GD Ripple Absolute Delay , 26.50 30 dB 38.80 39.025 MHz 49.025 49.40 MHz 37.775 38.20 MHz 50.10 50.275 dB 45 55 dB 45 55 dB 0.3 0.6 dB 3 5 deg p-p 40 75 ns p-p 2.9 us 25 ºC -80 ppm / º C 128 Lithium ... | Original |
2 pages, |
SF0044BA01954T c 50275 SF0044BA01954T abstract |
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| Abstract: 37.775 38.18 - Upper 50 dB point MHz - 50.19 50.275 Phase Ripple deg - , Out-of-band Rejection dB 40 53 - - - - °C YZ LiNbO3 - 25 - Substrate ... | Original |
1 pages, |
c 50275 datasheet abstract |
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| Abstract: 2SD400P-2 LKT-120 â- 0 U 3 c o «> 1 « Absolute Maximum Ratii)gs/Ta-25°C Electrical Characteristics/Ta=25°C J2 Type Number c 00 o » Applications S 8 O 3 O g vn,„ vâ„¢> Vkbo I, P, T, lenii max Ikiiii max !>KK thrr fj , Power Amp - G, AL 25 ÃŽ25 (100Q) 6 600m t720m 85 20 25/1 4 25/1 1 0.2 - 50-275 1 0.2 ÃŽ0.75 - - 2SD72 2SD72 ... | OCR Scan |
1 pages, |
T0220AB 2SD186 2SD30 2SD313 2SD314 2SD331 2SD353 2sd400 LM 301 AL c 50275 2SD72 2SD68 2SD67 25D40 2SD348 2SD30 abstract |
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| Abstract: (Max.) â- OL mA (Min.) C Devices M Devices C Devices M Devices C Devices M Devices C/M Devices C , Issue Date: June 1987 This Material Copyrighted By Its Respective Manufacturer E cu < Q. c Ã-L â- «t CM CS TJ C (0 * co o BLOCK DIAGRAMS AmPAL20L10 AmPAL20L10 AmPAL20R4 AmPAL20R4 LD001160 LD001160 •PAL is a registered , BLOCK DIAGRAMS (Cont'd.) AmPAL20L8 AmPAL20L8 < Q. CM « TJ C « , t CM M "O c « ... | OCR Scan |
24 pages, |
c 50275 20L8 20L10 AmPAL20L8 datasheet abstract |
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| Abstract: · 0.9MHz (min) · · ( ) fo, fo/2, fo/4, fo/8, fo/16, fo/32, fo/64 · - 40°C +85°C · , Ã-Ã--4 Chip form -4 PAD A, M, QFlip Chip Bonding B, N, RWire BondingType I C, P, SWire , 5027Ã-4 Ã- Ã- - - - 5027Ã-5 - - Ã- - - 5027Ã-6 Ã- - Ã- - - , 5027Ã-B 50 65 - Ã- - - - - - Ã- Ã- 5027Ã-C 65 85 Ã- Ã- - - , 0.5 V DD + 0.5 V VOUT - 0.5 V DD + 0.5 V TSTG - 65 + 150 °C ... | Original |
22 pages, |
WF5027 CF5027 5027R 5027C3 5027B 5027SF c 5027-r 5027-r c 5027s 5027C WF5027 abstract |
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| Abstract: · 0.9MHz (min) · · ( ) fo, fo/2, fo/4, fo/8, fo/16, fo/32, fo/64 · - 40°C +85°C · , PAD A, MFlip Chip Bonding B, NWire BondingType I C, PWire BondingType II SEIKO NPC CORPORATION , - 5027Ã-3 - Ã- - - - 5027Ã-4 Ã- Ã- - - - 5027Ã-5 - - Ã- , - Ã- Ã- 5027Ã-C 65 85 Ã- Ã- - - Ã- - Ã- - Ã- 5027Ã-D 85 110 , V TSTG - 65 + 150 °C I OUT Q ± 20 mA *1. "VDD " (VDD ... | Original |
22 pages, |
WF5027 c 50275 c 5027 5027B 5027 CF5027 5027C3 d 5027 5027C DUTY50 5027B abstract |
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| Abstract: ) 2 Rev 1.2 2002/11/6 AVM3324C AVM3324C 8. (STS1STS2MODE/STS3) STS1 STS2 a) b) c) d , ) b) c) c) d) d) e) e) LED 6HZ 0> f) LED 3HZ 1> LED 6HZ g) 2/4 2> LED 3HZ h) 11/41 , : STS2: a>stop high_pulse b>stop low_pulse c>busy high_active d>both melody ch1 & ch2 on at first , >busy low_active STS3: a>stop high_pulse b>stop low_pulse c>busy high_active d>busy low_active , ch1 & ch2 on at first 1/4 or 1/8 beat a>stop high_pulse b>stop low_pulse c>busy high_active d ... | Original |
12 pages, |
M1-M16 c 50275 AVM3324C 16114 AVM3324C abstract |
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| Abstract: Selectable by version: fO, fO/2, fO/4, fO/8, fO/16, fO/32, fO/64 -40 to 85°C operating temperature range , Bonding B, N: for Wire Bonding (type I) C, P: for Wire Bonding (type II) SEIKO NPC CORPORATION -2 , 5027Ã-4 Ã- Ã-    5027Ã-5   Ã-   5027Ã-6 Ã-  Ã-   , 50 to 65  Ã-      Ã- Ã- 5027Ã-C 65 to 85 Ã- Ã-   Ã- , 0.5 V Storage temperature range TSTG Wafer form -65 to +150 °C Output current ... | Original |
21 pages, |
c 50275 WF5027 5027B 5027 5027A d 5027 CF5027 datasheet abstract |
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| Abstract: /32, fO/64 -40 to 85°C operating temperature range Standby function · High impedance in standby , Pad layout type A, M, Q: for Flip Chip Bonding B, N, R: for Wire Bonding (type I) C, P, S: for Wire , 5027Ã-5   Ã-   5027Ã-6 Ã-  Ã-   5027Ã-7  Ã- Ã-   ,  Ã- Ã- 5027Ã-C 65 to 85 Ã- Ã-   Ã-  Ã-  Ã- 5027Ã-D 85 to , °C Output current IOUT Q pin ± 20 mA Recommended Operating Conditions For ... | Original |
21 pages, |
WF5027 5027-r 5027A 5027B 5027s c 5027-r 5027 c 50275 c 5027s CF5027 WF5027 abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| 280E5C120E391 :01044B00FBB5 01044B00FBB5 01044B00FBB5 01044B00FBB5 :01044C00228D : :10045D00C 0001000000088B0541C5010000000001608F :10016F002E001809022E0001010060320904000060 :10017F 10017F 10017F 10017F AF000000000D10000000000D20000000000DE9 AF000000000D10000000000D20000000000DE9 AF000000000D10000000000D20000000000DE9 AF000000000D10000000000D20000000000DE9 :0101BF00201F 0101BF00201F 0101BF00201F 0101BF00201F : : : :0F0130001091BD75D28075A90675A88080FE223A 0F0130001091BD75D28075A90675A88080FE223A 0F0130001091BD75D28075A90675A88080FE223A 0F0130001091BD75D28075A90675A88080FE223A : :1001D1003395E08F37AF05EFF 1001D1003395E08F37AF05EFF 1001D1003395E08F37AF05EFF 1001D1003395E08F37AF05EFF www.datasheetarchive.com/download/5318892-169042ZC/fs.zip (C54X_1.HEX) |
Infineon | 14/08/1998 | 166.95 Kb | ZIP | fs.zip |
| .0mil) Draw"* G04 Disc: OuterDia=0.0100* %ADD10C, 0.0100*% G04 D11 : "Ellipse X1.0mil Y1.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0010* %ADD11C, 0.0010*% G04 D12 : "Ellipse X12.0mil Y12.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0120* %ADD12C, 0 .0130* %ADD13C, 0.0130*% G04 D14 : "Ellipse X14.0mil Y14.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0140* %ADD14C, 0.0140*% G04 D15 : "Ellipse X15.0mil Y15.0mil H0.0mil 0.0deg (0.0mil www.datasheetarchive.com/download/1727695-393089ZC/105-00250-r1%20gerbers.zip (WEIGHT SCALE V2.TOP) |
Microchip | 09/11/2011 | 191.2 Kb | ZIP | 105-00250-r1%20gerbers.zip |
| configured for 4 - 20 mA = 0/800°C. Basic reconfiguration procedures are listed in 55000 uV) KAYE 140 or equivalent 0°C ice-point cell (Optional . 4. Refer to Figure 5-2 . Attach two insulated copper wires to the 502A-K T/C recommended for pickup rejection). Note: Microvolt source + to T/C Pos, Microvolt source - to T/C Neg. 5. Attach two www.datasheetarchive.com/files/omega/newport/manuals/500/502a-k3.htm |
Omega | 31/03/2000 | 199.09 Kb | HTM | 502a-k3.htm |
| .0mil) Draw"* G04 Disc: OuterDia=0.0100* %ADD10C, 0.0100*% G04 D11 : "Ellipse X1.0mil Y1.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0010* %ADD11C, 0.0010*% G04 D12 : "Ellipse X12.0mil Y12.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0120* %ADD12C, 0 .0130* %ADD13C, 0.0130*% G04 D14 : "Ellipse X14.0mil Y14.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0140* %ADD14C, 0.0140*% G04 D15 : "Ellipse X15.0mil Y15.0mil H0.0mil 0.0deg (0.0mil www.datasheetarchive.com/download/1727695-393089ZC/105-00250-r1%20gerbers.zip (WEIGHT SCALE V2.TSM) |
Microchip | 09/11/2011 | 191.2 Kb | ZIP | 105-00250-r1%20gerbers.zip |
| .0mil) Draw"* G04 Disc: OuterDia=0.0100* %ADD10C, 0.0100*% G04 D11 : "Ellipse X1.0mil Y1.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0010* %ADD11C, 0.0010*% G04 D12 : "Ellipse X12.0mil Y12.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0120* %ADD12C, 0 .0130* %ADD13C, 0.0130*% G04 D14 : "Ellipse X14.0mil Y14.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0140* %ADD14C, 0.0140*% G04 D15 : "Ellipse X15.0mil Y15.0mil H0.0mil 0.0deg (0.0mil www.datasheetarchive.com/download/1727695-393089ZC/105-00250-r1%20gerbers.zip (WEIGHT SCALE V2.TSP) |
Microchip | 09/11/2011 | 191.2 Kb | ZIP | 105-00250-r1%20gerbers.zip |
| = 50+27.5 V 1.48 = 90.7 5 C ex3: Ilim = 56mA, Rfeed = 400 W , Tamb = 50 5 C Pd = 1200mW Supposing l l = 1cm heat sink on PCB and 0.5m/s air flow: Rthj-a = 27.5 5 C/W -> Tj = 50+27.5 V 1.20 = 83 5 current only is sensed for Ring-Trip detection. c)Balanced (see Fig. 19). The ringing signals injected on = T and K1 = K 2 = K and the formulas are simplified: c) VM= V V [1-e K ] / [1+e K ] d) Vm = -V V [1-e K ] / [1+e K ] = -VM From c) comes the value of K: K = Ln[(V-VM) / (V+VM)] Given the ringing www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/1753-v1.htm |
STMicroelectronics | 02/04/1999 | 47.74 Kb | HTM | 1753-v1.htm |
| /W -> Tj = 50+27.5 V 1.48 = 90.7 5 C ex3: Ilim = 56mA, Rfeed = 400 W , Tamb = 50 5 C Pd = 1200 = 50+27.5 V 1.20 = 83 5 C 0 Rl 2000 D94TL091 D94TL091 D94TL091 D94TL091 0.0 PSL (W) 3.0 Ilim=55mA Rfeed=800 W Rp = 50 V ZTR= 7K + (41K//2 41K//2 41K//2 41K//2.3nF) c)ZL =900 W + 2.12 m F (USA) Rp=62 W In network ZAC* that can replace the original one is shown in fig. 5. Calculation of ZAC*: ZAC= R + C = 38.8K + 42.4nF ZAC( w )= (1+j w RC) / j w C w = 2 p f The Bode diagram (see Fig. 6 www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/1753.htm |
STMicroelectronics | 20/10/2000 | 51.8 Kb | HTM | 1753.htm |
| = 1cm heat sink on PCB and 0.5m/s air flow: Rthj-a = 27.5 5 C/W -> Tj = 50+27.5 V 1 = 50+27.5 V 1.20 = 83 5 C 0 Rl 2000 D94TL091 D94TL091 D94TL091 D94TL091 0.0 PSL (W) 3.0 Ilim=55m V ZTR= 7K + (41K//2 41K//2 41K//2 41K//2.3nF) c)ZL =900 W + 2.12 m F (USA) Rp=62 W ZAC*: ZAC= R + C = 38.8K + 42.4nF ZAC( w )= (1+j w RC) / j w C w = 2 p f . APPLICATION NOTE 5/23 ZAC* = R1 + (R2// C1) ZAC*( w )=(R1+j w C1R1R2+R2)/ (1+j w C1R2) w www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/1753-v2.htm |
STMicroelectronics | 25/05/2000 | 49.6 Kb | HTM | 1753-v2.htm |
| .0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0100* %ADD10C, 0.0100*% G04 D11 : "Ellipse X1.0mil Y1.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0010* %ADD11C, 0 .0118* %ADD12C, 0.0118*% G04 D13 : "Ellipse X15.0mil Y15.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0150* %ADD13C, 0.0150*% G04 D14 : "Ellipse X17.5mil Y17.5mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0175* %ADD14C, 0.0175*% G04 D15 : "Ellipse X19.7mil Y19 www.datasheetarchive.com/download/27078194-393093ZC/105-00318-r1%20gerbers.zip (102-00318-R1.TSP) |
Microchip | 19/11/2010 | 169.23 Kb | ZIP | 105-00318-r1%20gerbers.zip |
| : OuterDia=0.0100* %ADD10C, 0.0100*% G04 D11 : "Ellipse X1.0mil Y1.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0010* %ADD11C, 0.0010*% G04 D12 : "Ellipse X11.8mil Y11.8mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0118* %ADD12C, 0.0118*% G04 D13 : "Ellipse X15.0mil Y15.0mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 Disc: OuterDia=0.0150* %ADD13C, 0.0150*% G .0175* %ADD14C, 0.0175*% G04 D15 : "Ellipse X19.7mil Y19.7mil H0.0mil 0.0deg (0.0mil,0.0mil) Draw"* G04 www.datasheetarchive.com/download/27078194-393093ZC/105-00318-r1%20gerbers.zip (102-00318-R1.ASY) |
Microchip | 19/11/2010 | 169.23 Kb | ZIP | 105-00318-r1%20gerbers.zip |