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Part Manufacturer Description Datasheet BUY
X9520B20I-A Intersil Corporation DIGITAL POTENTIOMETER, PBGA20, BGA-20 visit Intersil
X9520B20I-B Intersil Corporation DIGITAL POTENTIOMETER, PBGA20, BGA-20 visit Intersil
DRA622CIZKKQ1 Texas Instruments 640-BGA visit Texas Instruments
DRA622CIZKKRQ1 Texas Instruments 640-BGA visit Texas Instruments
HSP50216KI Intersil Corporation TELECOM, CELLULAR, BASEBAND CIRCUIT, PBGA196, 12 x 12, BGA-196 visit Intersil
TMS320C28343ZEPQ Texas Instruments Delfino Microcontroller 256-BGA visit Texas Instruments

bga Shipping Trays

Catalog Datasheet MFG & Type PDF Document Tags

strapack s-669

Abstract: Sivaron S 669 devices without carriers between trays Dry-packing J-lead, QFP, and BGA devices Shipping J-lead, QFP , tray is required as a cover. Shipping J-Lead, QFP & BGA Devices in Boxes When shipping trays , or BGA devices without carriers, see "Trays for QFP & BGA Devices without Carriers" on page 7 and , Stopper Black Foam Trays for QFP & BGA Devices without Carriers To hold QFP devices without carriers or BGA devices, use only Alteraapproved trays-full-sized Peak Plastic Corporation trays and 1/3
Altera
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daewon tray

Abstract: Daewon T0809050 BGA trays no higher than seven trays ï'  (for example, six trays containing devices and one cover tray). â  Shipping trays used for shipment of QFP and BGA (including FBGA, and lidless FBGA , without carriers, QFP devices that have been extracted from carriers, and BGA devices only in trays , directly into trays. f For more information about handling QFP or BGA devices without carriers, refer to , , Foam, and Devices in a Tube Stopper Stopper Black Foam Trays for QFP, BGA, FBGA, and Lidless
Altera
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ADV0505

Abstract: FBGA-484 CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The new Daewon tray dimensions are comparable to the existing Peak trays and have been fully qualified by Altera. However, Daewon and Peak trays cannot be stacked together and should be handled separately. Each Altera shipping
Altera
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FBGA256 12C-0707-E19 12F-1111-119 12Y-3535-419 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga UBGA49 UBGA169/FBGA100 FBGA144 FBGA324 FBGA484

56mm carrier tape

Abstract: 28 pin ic TM 1628 Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Packing for Jewel , Packing Methods and Labels INTRODUCTION The world of shipping and handling is a hostile one in which , product for shipment and what labels are applied to the shipping boxes. All AMD packing methods are , tubes · Tray boxes for trays · Reel boxes for tape-and-reel carriers, including surftape Q-PACK boxes , have successfully passed all international shipping stress tests, thus, product is often shipped in a
Advanced Micro Devices
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56mm carrier tape 28 pin ic TM 1628

intel packaging databook

Abstract: Side Brazed Ceramic Dual-In-Line Packages 10.43 10.43 16.07 23.3 84 1.980 2.170 2.670 x x x x Shipping Media: Trays , . Footprint (Inches) 1.780 UV Erasable Shipping Media: x Trays Comments / Footnotes Through , Max. Footprint (Inches) 0.640 Shipping Media Tubes x Tape & Reel x Trays x , Weight (gm) 1.15 Max. Footprint (Inches) 0.642 Shipping Media: Tape & Reel x Trays , copper signal traces in the package. In BGA & PGA packages, copper has been applied to provide a
Intel
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intel packaging databook Side Brazed Ceramic Dual-In-Line Packages Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom

JEDEC TRAY DIMENSIONS

Abstract: JEDEC tray standard 0.487 Section A-A [Dimensions in Inches] 240822-3 10.1.3 A5786-01 Trays Shipping trays , of plastic shipping trays, employs several handicapped agencies and reduces environmental waste , remaining shelf life. 10.5.2 Shipping Boxes and Cartons Intel products are placed in tubes or trays , Transport Media and Packing 10.1 Transport Media 10.1.1 10 Tubes Plastic shipping and , Environmental provides all shipping arrangements at no charge to the customer. Phone: 0500 34 10 40 Fax
Intel
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JEDEC TRAY DIMENSIONS JEDEC tray standard tray bga MIL-STD-81705 transport media and packing JEDEC TRAY PGA MATERIALS

MIL-STD-81705

Abstract: JEDEC TRAY PLCC TRANSPORT MEDIA AND PACKING 10.1.3. Trays Shipping trays are built in compliance with JEDEC thick and , of plastic shipping trays, employs several handicapped agencies and reduces environmental waste , remaining shelf life. 10.5.2. Shipping Boxes and Cartons Intel products are placed in tubes or trays, or , . Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an , CONFIDENTIAL (until publication date) 2 TRANSPORT MEDIA AND PACKING Table 10-1. PLCC Shipping Tube
Intel
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JEDEC TRAY PLCC tsop Shipping Trays INTEL PLCC 68 dimensions PLCC JEDEC tray PLCC 44 intel package dimensions AZ 2535 CH10WIP

Kostat tray

Abstract: KS-8308 . Figure 7.1 Trays protect product during shipping and handling and are suitable for product presentation , Chapter 7 Trays Tray Suppliers per Package Type (Continued) Package Plastic Ball Grid Array (BGA , u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray , Revision A (3/1/03) 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to , . Trays are also suitable for product presentation to board assembly equipment. As standard practice
Advanced Micro Devices
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Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing

EIA and EIAJ standards 783

Abstract: EIA standards 783 isolation during shipping, handling, or processing. Trays are stacked and bound together to form standard , requires the following materials: · Stick magazines (shipping tubes), trays, tape and reel · , shipment to end users. The methods employed are linked to the device level for shipping configuration keys , shipping configurations. This application report documents TI's three main shipping methods and typical , . . . . . . . 5 Stick Magazine (Shipping Tube) ­ Primary Component Container . . . . . . . . . . .
Texas Instruments
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SZZA021B EIA and EIAJ standards 783 EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray

MQFP Shipping Trays

Abstract: TSOP32 Package 0.487 Section A-A [Dimensions in Inches] 240822-3 10.1.3 A5786-01 Trays Shipping trays , program offer a nominal cash reimbursement but it lowers the cost of plastic shipping trays, employs , Transport Media and Packing 10.1 Transport Media 10.1.1 10 Tubes Plastic shipping and , Environmental provides all shipping arrangements at no charge to the customer. Phone: 0500 34 10 40 Fax , Shipping Tube Dimensions (In Inches) Lead Type Cross Section (W x H) Outside Dimensions Wall
Intel
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MQFP Shipping Trays TSOP32 Package 28F320B3 bga Shipping Trays D 2498 peak tray

CBG064-052A

Abstract: csp process flow diagram reel or JEDEC trays with appropriate shipping material and shipped. 2.3 The Easy BGA and Intel , 1.60 Shipping Media Desiccant Pack 1 All products available in Tape & reel or Trays Refer to , types of shipping media, tape and reel (T/R) and JEDEC trays. 4.2 Shipping Media Shipping media is , Orientation JEDEC Trays 16 4.2.4 CSP Shipping Media Orientation CSP shipping media orientation is , . 2.3 The Easy BGA and Intel® Stacked-CSP Process Flow
Intel
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CBG064-052A csp process flow diagram CBG064 reballing BGA Solder Ball 0.35mm collapse 28F160C18

BGA PACKAGE TOP MARK intel

Abstract: 144 bga Preliminary Mechanical and Shipping Media Information for Easy BGA Packages May 2000 Document , Molded Thin JEDEC Tray Parameters for Easy BGA Packages . 5 Shipping Media and Socket , are in millimeters 5 Easy BGA Mechanical Specification 3.4 Shipping Media and Socket Ordering Information for Easy BGA Package 3.4.1 Ordering Information Shipping media and off-board , respective owners. Easy BGA Mechanical Specification Contents 1.0 Easy BGA Package Drawing and
Intel
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28F160F3 12B-1013-G13 BGA PACKAGE TOP MARK intel 144 bga BGA package tray 64 BGA PACKAGE TOP MARK US048641 RD33708SW RD33716SW

EIA and EIAJ standards 783

Abstract: JEDEC tray standard dimension . Single-Stick-Magazine Shipping Tube · Trays ­ The IC shipping tray contains the components during , require component lead isolation during shipping, handling, or processing. Trays are stacked and bound , shipment to end users. The methods employed are linked to the device level for shipping configuration keys , shipping configurations. This application report documents TI's three main shipping methods and typical , . . . . . . . 5 Stick Magazine (Shipping Tubes) ­ Primary Component Container . . . . . . . . . . .
Texas Instruments
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JEDEC tray standard dimension abstract for water level indicator EIA-481-x JEDEC Matrix Tray outlines QFP Shipping Trays BGA and QFP Package SZZA021A

A7647

Abstract: A7647-01 X Weight (grams) Max. Footprint (mm) nominal Shipping Media Trays Desiccant Comments , Package Shipping Media PPGA shipping trays are compliant to JEDEC standards. All external dimensions of , Package 13.5.2.1 FC-PGA package shipping media FCPGA shipping trays are of JEDEC style and may be , shipping trays, the seating plane has been adjusted to accommodate these packages within the top and , material. Shipping trays are no longer color coded by particular product. Color standardization by process
Intel
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A7647 A7647-01 A7190-01 socket s1 REFLOW socket 615-PIN PERFORMANCE CHARACTERISTICS OF IC PACKAGES A5775-01

JEDEC Matrix Tray outlines

Abstract: ti packing label require component lead isolation during shipping, handling, or processing. Trays are stacked and bound , requires the following materials: · Stick magazines (shipping tubes), trays, tape and reel · , shipment to end users. The methods employed are linked to the device level for shipping configuration keys , shipping configurations. This application report documents TI's three main shipping methods and typical , . . . . . . . 5 Stick Magazine (Shipping Tube) - Primary Component Container . . . . . . . . . . .
Texas Instruments
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ti packing label dck3 tray bga 64 EIA-468 label location dbv4 ti dck3 SZZA021C

trays

Abstract: PEAK TRAY bga S PEC I FI C AT I ON SHE E T Matrix Trays Matrix T r ay s UltraLiteâ"¢ designs Available Now , Trays conform to JEDEC standards and are available in a number of tray types including Pin Grid Array , reduces weight, shipping and handling costs, and waste in packaging throughout the entire supply chain , Matrix Trays with unique features including: HOTâ"¢ (high operating temperature) trays to address the , of package styles available include: BGA, QFN, QFP, LQFP, PQFP, TSCP and PGA. Available in a number
Peak International
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trays QFN Shipping Trays

intel 04195

Abstract: uBGA device MARKing intel Diagram 4.4.2 Shipping Labels The µBGA package is packed into T/R and trays, then sealed in , 4.0 4.1 THE µBGA* PACKAGE SHIPPING MEDIA, HANDLING, AND DEVICE MARKINGS Shipping Media , : 4.2 Shipping Media 4.2.1 Tape and Reel The µBGA package shipped in Tape and Reel (T/R , high volume method for shipping the µBGA package from Intel to customers. Shipping Media Selection As the industry moves into smaller packages with more features, the shipping media is constantly
Intel
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intel 04195 uBGA device MARKing intel BGA package tray 40 x 40 T1234567 F800B3 04195 JES22-A112

Intel reflow soldering profile BGA

Abstract: A5832 . For tray dimensions please refer to Chapter 10 of this data book. The JEDEC style shipping trays are , different types of shipping trays. Intel will pay all shipping costs associated with the return. 14.6.2 , the user of Intel BGA products obtain a product data sheet that shows the tape and reel shipping , Ball Grid Array (BGA) Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has , mount. Normally, because of the larger ball pitch (typically 1.27 mm) of a BGA over a QFP or PQFP, the
Intel
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Intel reflow soldering profile BGA A5832 JEDEC bga 63 tray Intel BGA pcb warpage in ipc standard Intel reflow soldering profile BGA LEAD FREE

camtex trays

Abstract: MIL-I-8835A stacks of 2 to 7 trays for storage. Follow these guidelines when you strap trays together for shipping , . Shipping J-Lead & QFP Devices in Boxes When shipping trays or tubes of devices, use only boxes that have , prevent trays or tubes from shifting position during shipping. Boxes should contain enough filler material , devices Shipping J-lead and QFP devices in boxes Handling J-Lead Devices To protect device leads and , transferred. Storing & Shipping J-Lead Devices Store and ship J-lead devices in tubes sealed with stoppers
Altera
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camtex trays MIL-I-8835A PLCC 84 PINS

camtex trays

Abstract: MIL-I-8835A storage. Follow these guidelines when you strap trays together for shipping: s s s s s Use , J-Lead & QFP Devices in Boxes When shipping trays or tubes of devices, use only boxes that have , contents and prevent trays or tubes from shifting position during shipping. Boxes should contain enough , QFP devices Dry-packing J-lead and QFP devices Shipping J-lead and QFP devices in boxes To , stored, shipped, and transferred. Storing & Shipping J-Lead Devices Store and ship J-lead devices in
Altera
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TQFP Shipping Trays exposed QFP 144 ND07071 MIL-B-81705C ND-1414-1 Drypacked Devices
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