NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: CUSTOMER ADVISORY ADV0505 ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The new Daewon tray dimensions are comparable to the existing Peak trays and have been fully qualified by Altera. However, Daewon and Peak trays cannot be stacked together and should be handled separately. Each Altera shipping ... | Original |
2 pages, |
altera bga trays daewon 1420 bga Shipping Trays fbga100 dimension fbga100 Shipping Trays 1f1-1717-a19 FBGA672 33 x 33 DAEWON tray FBGA256 BGA652 QFP Shipping Trays 12C-0707-E19 ADV0505 ADV0505 abstract |
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| Abstract: Device Marking Diagram 4.4.2 Shipping Labels The uBGA package is packed into T/R and trays, then , 4.0 4.1 THE uBGA* PACKAGE SHIPPING MEDIA, HANDLING, AND DEVICE MARKINGS Shipping Media , : 4.2 Shipping Media 4.2.1 Tape and Reel The uBGA package shipped in Tape and Reel (T/R , high volume method for shipping the uBGA package from Intel to customers. Shipping Media Selection As the industry moves into smaller packages with more features, the shipping media is constantly ... | Original |
8 pages, |
Shipping Trays Material Handling Systems JEDEC tray standard 13 28F800B3 28F160B3 28F008S3 uBGA device MARKing intel F800B3 BGA package tray 40 x 40 datasheet abstract |
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| Abstract: . Figure 7.1 Trays protect product during shipping and handling and are suitable for product presentation , Chapter 7 Trays Tray Suppliers per Package Type (Continued) Package Plastic Ball Grid Array (BGA , u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray , Revision A (3/1/03) 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to , Trays are also suitable for product presentation to board assembly equipment. As standard practice ... | Original |
7 pages, |
kostat bga 17 mm tray datasheet bga amd 638 pin bga Shipping Trays DAEWON tray 48 daewon bga daewon tray AMD Package BGA package tray 64 DAEWON tray drawing KS-8505 Kostat tray camtex trays datasheet abstract |
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| Abstract: Preliminary Mechanical and Shipping Media Information for Easy BGA Packages May 2000 Document , Molded Thin JEDEC Tray Parameters for Easy BGA Packages . 5 Shipping Media and Socket , are in millimeters 5 Easy BGA Mechanical Specification 3.4 Shipping Media and Socket Ordering Information for Easy BGA Package 3.4.1 Ordering Information Shipping media and off-board , respective owners. Easy BGA Mechanical Specification Contents 1.0 Easy BGA Package Drawing and ... | Original |
10 pages, |
BGA package tray 64 BGA PACKAGE TOP MARK 28F160F3 144 bga BGA PACKAGE TOP MARK intel datasheet abstract |
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| Abstract: devices without carriers between trays Dry-packing J-lead, QFP, and BGA devices Shipping J-lead, QFP , tray is required as a cover. Shipping J-Lead, QFP & BGA Devices in Boxes When shipping trays , or BGA devices without carriers, see "Trays for QFP & BGA Devices without Carriers" on page 7 and , Stoppers, Foam & Devices in a Tube Stopper Stopper Black Foam Trays for QFP & BGA Devices without , (i.e., 4 trays containing devices and 1 cover tray). Stack plastic quad flat pack (PQFP) and BGA trays ... | Original |
16 pages, |
bga Shipping Trays bga trays desiccant powder exposed QFP 144 J-Lead, QFP ceramic MIL-D-3464 8835a ND07071 PQFP 176 J-Lead MIL-B-81705C QFP Shipping Trays s-669 strapping machine PEAK TRAY bga datasheet abstract |
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| Abstract: isolation during shipping, handling, or processing. Trays are stacked and bound together to form standard , are five full trays and one cover tray (5 + 1), and ten full trays and one cover tray (10 + 1) (see , requires the following materials: ╥ Stick magazines (shipping tubes), trays, tape and reel ╥ , shipment to end users. The methods employed are linked to the device level for shipping configuration , shipping configurations. This application report documents TI's three main shipping methods and typical ... | Original |
29 pages, |
tsop tray matrix outline bga Shipping Trays EIA-468-B EIA-481-2 EIA-481-3 A112-A ic shipping tray JEDEC tray standard dimension kirk key PEAK tray drawing tray matrix bga ti packing label SZZA021B SZZA021B SZZA021B abstract |
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| Abstract: require component lead isolation during shipping, handling, or processing. Trays are stacked and bound , and one cover tray (5 + 1), and ten full trays and one cover tray (10 + 1) (see Figure 5). Customers , : ╥ Stick magazines (shipping tubes), trays, tape and reel ╥ Desiccant ╥ , shipment to end users. The methods employed are linked to the device level for shipping configuration , shipping configurations. This application report documents TI's three main shipping methods and typical ... | Original |
29 pages, |
tsop tray matrix outline EIA and EIAJ standards 783 EIA-468-B EIA-481-2 EIA-481-3 A112-A EIA-783 QFN tray ti dck3 tray matrix bga EIA-481-x dbv4 EIA standards 783 SZZA021C SZZA021C abstract |
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| Abstract: Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Packing for Jewel , Packing Methods and Labels INTRODUCTION The world of shipping and handling is a hostile one in which , product for shipment and what labels are applied to the shipping boxes. All AMD packing methods are , tubes · Tray boxes for trays · Reel boxes for tape-and-reel carriers, including surftape Q-PACK boxes , have successfully passed all international shipping stress tests, thus, product is often shipped in a ... | Original |
11 pages, |
56mm carrier tape datasheet abstract |
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| Abstract: Single-Stick-Magazine Shipping Tube ╥ Trays ╜ The IC shipping tray contains the components during , TQFP packages) and require component lead isolation during shipping, handling, or processing. Trays , shipment to end users. The methods employed are linked to the device level for shipping configuration , shipping configurations. This application report documents TI's three main shipping methods and typical , . . . . . . . 5 Stick Magazine (Shipping Tubes) ╜ Primary Component Container . . . . . . . . . . . ... | Original |
29 pages, |
kirk key QFP 64 Cavity package TSOP package tray tsop Shipping Trays transistor outline X packing TQFP Shipping Trays Semiconductor Packing Methodology Semiconductor nsr JEDEC Matrix Tray outlines EIA-468-B BGA and QFP Package EIA 481 TSSOP SZZA021A SZZA021A abstract |
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| Abstract: dry-packing devices: s s s s s s Shipping J-Lead & QFP Devices in Boxes When shipping trays , QFP devices Dry-packing J-lead and QFP devices Shipping J-lead and QFP devices in boxes To , stored, shipped, and transferred. Storing & Shipping J-Lead Devices Store and ship J-lead devices in , Shipping Tube Conductive Production Tube D C B C B A A Conductive Production Tube , 0.035 0.150 20.00 20.25 84 684 A Shipping Length Production Length 1.300 ... | Original |
13 pages, |
ND07071 MIL-B-81705C Drypacked Devices TQFP Shipping Trays QFP Shipping Trays MIL-I-8835A exposed QFP 144 camtex trays datasheet abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| Manufacturing Advantage Tips for the uBGA* Package - Shipping, Handling, & Marking uBGA* Package uBGA Package: Shipping Media, Handling, & Device Marking The uBGA Shipping, Handling, & Marking Underfill (the uBGA package absorbs the CTE mismatch www.datasheetarchive.com/files/intel/design/quality/ubga/shipping-v1.htm |
Intel | 30/04/1998 | 10.8 Kb | HTM | shipping-v1.htm |
| Manufacturing Advantage Tips for the uBGA* Package - Shipping, Handling, & Marking uBGA* Package uBGA Package: Shipping Media, Handling, & Device Marking The uBGA Shipping, Handling, & Marking Underfill (the uBGA package absorbs the CTE mismatch www.datasheetarchive.com/files/intel/design/quality/ubga/shipping.htm |
Intel | 01/08/1998 | 10.8 Kb | HTM | shipping.htm |
| Web uBGA* Package Mechanical Specification and Media Information Flash Packaging Web Page mechanical drawings, dimensions, pinouts, and shipping media information. This tool will link you to the Flash memory component packaging data web page where the uBGA* Package Mechanical Specification and Package dimensions Product signal to ball assignments Shipping media information (tape/reel, trays, samples, ordering Info.) File Attachments: Supported Device Detail Matrix www.datasheetarchive.com/files/intel/design/flcomp/devtools/4a7ce1a6.htm |
Intel | 05/02/1998 | 4.18 Kb | HTM | 4a7ce1a6.htm |
| Web uBGA* Package Mechanical Specification and Media Information Flash Packaging Web Page mechanical drawings, dimensions, pinouts, and shipping media information. This tool will link you to the Flash memory component packaging data web page where the uBGA* Package Mechanical Specification and Package dimensions Product signal to ball assignments Shipping media information (tape/reel, trays, samples, ordering Info.) File Attachments: Supported Device Detail Matrix www.datasheetarchive.com/files/intel/design/flcomp/devtools/4a7ca1a6.htm |
Intel | 05/02/1998 | 4.12 Kb | HTM | 4a7ca1a6.htm |
| Web u, BGA* Package Mechanical Specification and Media Information Flash Packaging Web Page mechanical drawings, dimensions, pinouts, and shipping media information. This tool will link you to the Intel® Flash memory component packaging data web page where the µBGA* Package : Mechanical drawings Package dimensions Product signal to ball assignments Shipping media information (tape/reel, trays, samples, ordering Info.) File Attachments: Supported Device www.datasheetarchive.com/files/intel/design/flcomp/devtools/4f61e_1a.htm |
Intel | 13/05/1998 | 3.96 Kb | HTM | 4f61e_1a.htm |
| programmer Handles tape and reel, tube and tray shipping media (input and output) File Attachments trays of ICs into the input section of the unit. Or, conversely, place up to four input tubes into the bent leads Program Intel Flash memory in 32, 40, 48, &56L TSOP, uBGA, SSOP, and PSOP User - TSOP-40 TSOP-40 TSOP-40 TSOP-40 ld 28F004SC 28F004SC 28F004SC 28F004SC - TSOP-40 TSOP-40 TSOP-40 TSOP-40 ld 28F008S3 28F008S3 28F008S3 28F008S3 - PSOP-44 PSOP-44 PSOP-44 PSOP-44 ld 28F008S3 28F008S3 28F008S3 28F008S3 - TSOP-40 TSOP-40 TSOP-40 TSOP-40 ld 28F008S3 28F008S3 28F008S3 28F008S3 - uBGA-40 ball 28F008S5 28F008S5 28F008S5 28F008S5 - PSOP-44 PSOP-44 PSOP-44 PSOP-44 ld 28F008S5 28F008S5 28F008S5 28F008S5 - TSOP-40 TSOP-40 TSOP-40 TSOP-40 ld 28F008S5 28F008S5 28F008S5 28F008S5 - uBGA-40 ball 28F008SA/SA-L 28F008SA/SA-L 28F008SA/SA-L 28F008SA/SA-L - PSOP www.datasheetarchive.com/files/intel/design/flcomp/devtools/4d3861a6.htm |
Intel | 05/02/1998 | 5.63 Kb | HTM | 4d3861a6.htm |
| uBGA* Packaging for Intel Flash Memory Devices uBGA* Packaging for Intel Flash Memory Devices Product Description Product Highlights introduced a new and innovative uBGA* packaging technology for flash memory devices. The uBGA package small form factor, the uBGA package is designed for all space-constrained applications that require factor in the industry, Intel's uBGA packaging is easy to use. For quicker time to market, the product www.datasheetarchive.com/files/intel/design/flcomp/prodbref/297844.htm |
Intel | 01/08/1998 | 12.99 Kb | HTM | 297844.htm |
| uBGA* packaging for Intel Flash memory devices Intel has introduced a new and innovative uBGA* packaging technology for flash memory devices. The uBGA its very small form factor, the uBGA package is designed for all space-constrained applications that factor in the industry, Intel's uBGA packaging is easy to use. For quicker time to market, the product consumer demand for products that depend upon shrinking technology, Intel's uBGA packaging offers www.datasheetarchive.com/files/intel/design/flcomp/prodbref/297844-v1.htm |
Intel | 04/02/1999 | 22.68 Kb | HTM | 297844-v1.htm |
| uBGA* packaging for Intel Flash memory devices Intel has introduced a new and innovative uBGA* packaging technology for flash memory devices. The uBGA its very small form factor, the uBGA package is designed for all space-constrained applications that factor in the industry, Intel's uBGA packaging is easy to use. For quicker time to market, the product consumer demand for products that depend upon shrinking technology, Intel's uBGA packaging offers www.datasheetarchive.com/files/intel/products one/design/flcomp/prodbref/297844.htm |
Intel | 30/04/1999 | 23.05 Kb | HTM | 297844.htm |
| programmer Handles tape and reel, tube and tray shipping media (input and output) File Attachments trays of ICs into the input section of the unit. Or, conversely, place up to four input tubes into the bent leads Program Intel Flash memory in 32, 40, 48, &56L TSOP, uBGA, SSOP, and PSOP User - TSOP-56 TSOP-56 TSOP-56 TSOP-56 ld 28F320J5 28F320J5 28F320J5 28F320J5 - uBGA-56 ball 28F640J5 28F640J5 28F640J5 28F640J5 - SSOP-56 SSOP-56 SSOP-56 SSOP-56 ld 28F640J5 28F640J5 28F640J5 28F640J5 - uBGA-56 ball www.datasheetarchive.com/files/intel/design/flcomp/devtools/52d72_1a.htm |
Intel | 13/05/1998 | 4.71 Kb | HTM | 52d72_1a.htm |