ZXLD1350EV6 ZXLD1350EV2 ZDB362R1 ZLLS1000 ZXLD1350 TS16949 D-81541

The ZXLD1350EV6 is a derivative of eval board ZXLD1350EV2 without on-board test pins and LEDS and jumpers. It uses the

ZXLD1350EV6 ZXLD1350EV6 Eval Board Brief The ZXLD1350EV6 ZXLD1350EV6 is a derivative of eval board ZXLD1350EV2 ZXLD1350EV2 without on-board test pins and LEDS and jumpers. It uses the unpopulated PCB, ZDB362R1 ZDB362R1. The ZXLD1350EV6 ZXLD1350EV6 uses the same `core driver circuit' (inside a white line marked box) as in eval board ZXLD1350EV2 ZXLD1350EV2 with minor modification: The modification is additional pads are added to the `core driver circuit' to allow wire connection to the supply input VCC (+VIN), ground GND, anode(AN), cathode(K) of LED and ADJ (AJ) connection. These added pad locations are indicated in the figure 1. The circuit diagram for ZXLD1350EV6 ZXLD1350EV6 is given in figure 2. C2 L1 U1 R2 K C3 SD1 C1 R1 RS AJ G An Vcc ZDB362R1 ZDB362R1 Figure 1: ZXLD1350EV6 ZXLD1350EV6 Driver circuit with pads for external wire connection: Topside copper and silk screen. The component placement and layout is the same as in ZXLD1350EV2 ZXLD1350EV2 with a minor track change. VCC (+VIN) track has been changed to connect the wire close to the sense resistor RS, and no longer has a track run underneath R2 and C2. As a comparison, in ZXLD1350EV2 ZXLD1350EV2, this is tracked back to +VIN test pin underneath the R2 and C2. ZXLD1350EV6 ZXLD1350EV6 User Guide Iss1 1/3 25-05-07 VCC (+VIN) RS LED An C2 C1 1uF/50V 1uF/50V SD1 ZLLS1000 ZLLS1000 4 5 G (GND) AJ (ADJ) VIN 2 GND C3 10nF R1 3 ZXLD1350 ZXLD1350 LED K L1 100uH ISENSE LX 1 ADJ Not fitted U1 Figure 2: ZXLD1350EV6 ZXLD1350EV6 Eval board circuit diagram The user manual of ZXLD1350EV2 ZXLD1350EV2 for driver circuit functionality and the connection point functionalities are still valid for this board. Wires connected to the connection pads are as follows: Supply input, VCC (+VCC): Red Ground, G (GND): Black LED Anode, An: Yellow LED cathode, K: Green Adjust pad AJ is same as the ADJ test pin in ZXLD1350EV2 ZXLD1350EV2 eval board. R1 is not fitted and therefore AJ connection pad is not connected to pin 3 of U1 (ZXLD1350 ZXLD1350 device) in figure 2. ZXLD1350EV6 ZXLD1350EV6 User Guide Iss1 2/3 25-05-07 Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user's application and meets with the user's requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex' terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. Quality of product Zetex is an ISO 9001 and TS16949 TS16949 certified semiconductor manufacturer. To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels. ESD (Electrostatic discharge) Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time. Devices suspected of being affected should be replaced. Green compliance Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of hazardous substances and/or emissions. All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with WEEE and ELV directives. Product status key: "Preview" "Active" "Last time buy (LTB)" "Not recommended for new designs" "Obsolete" Datasheet status key: "Draft version" "Provisional version" "Issue" Future device intended for production at some point. Samples may be available Product status recommended for new designs Device will be discontinued and last time buy period and delivery is in effect Device is still in production to support existing designs and production Production has been discontinued This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. Europe Americas Asia Pacific Corporate Headquarters Zetex GmbH Kustermann-park Balanstraße 59 D-81541 D-81541 München Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Zetex Inc 700 Veterans Memorial Highway Hauppauge, NY 11788 USA Zetex (Asia Ltd) 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Zetex Semiconductors plc Zetex Technology Park, Chadderton Oldham, OL9 9LL United Kingdom Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com Telephone (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com ZXLD1350EV6 ZXLD1350EV6 User Guide Iss1 3/3 25-05-07