NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
XP06401 XP6401 2SB0709A 2SB709A - Datasheet Archive
XP06401 (XP6401) Silicon PNP epitaxial planer transistor Unit: mm For general amplification 1 6 2 5 3 Two elements incorporated
Composite Transistors XP06401 XP06401 (XP6401 XP6401) Silicon PNP epitaxial planer transistor Unit: mm For general amplification 1 6 2 5 3 Two elements incorporated into one package. Reduction of the mounting area and assembly cost by one half. 4 0 to 0.1 2SB0709A 2SB0709A(2SB709A 2SB709A) × 2 elements 0.12 0.02 0.9±0.1 G 0.7±0.1 I Basic Part Number of Element +0.05 0.2 G 2.0±0.1 G 0.425 0.65 I Features 1.25±0.1 0.65 0.425 0.2±0.05 2.1±0.1 I Absolute Maximum Ratings Parameter (Ta=25°C) Symbol Ratings Unit Collector to base voltage VCBO 60 V Collector to emitter voltage Rating Emitter to base voltage of element Collector current VCEO 50 7 V IC 100 mA Peak collector current ICP 200 mA Total power dissipation PT 150 mW Overall Junction temperature Tj 150 °C Tstg 55 to +150 °C 4 : Collector (Tr2) 5 : Base (Tr1) 6 : Collector (Tr1) EIAJ : SC88 SMini Type Package (6pin) V VEBO 1 : Emitter (Tr1) 2 : Emitter (Tr2) 3 : Base (Tr2) 0.2±0.1 Storage temperature Marking Symbol: 5O Internal Connection 1 Parameter Collector to base voltage 6 5 2 3 I Electrical Characteristics Tr1 Tr2 4 (Ta=25°C) Symbol Conditions min typ max Unit VCBO IC = 10µA, IE = 0 60 V Collector to emitter voltage VCEO IC = 2mA, IB = 0 50 V Emitter to base voltage VEBO IE = 10µA, IC = 0 7 V Collector cutoff current ICBO VCB = 20V, IE = 0 0.1 µA ICEO VCE = 10V, IB = 0 100 µA Forward current transfer ratio VCE = 10V, IC = 2mA 160 hFE (small/large)*1 VCE = 10V, IC = 2mA 0.5 Collector to emitter saturation voltage VCE(sat) IC = 100mA, IB = 10mA Transition frequency fT VCB = 10V, IE = 1mA, f = 200MHz 80 MHz Collector output capacitance *1 hFE Forward current transfer hFE ratio 460 Cob VCB = 10V, IE = 0, f = 1MHz 2.7 pF 0.99 0.3 0.5 V Ratio between 2 elements Note.) The Part number in the Parenthesis shows conventional part number. 1 Composite Transistors XP06401 XP06401 PT - Ta IC - VCE 250 IC - I B 60 60 200 150 100 50 250µA 40 200µA 30 150µA 20 100µA 10 0 0 20 40 60 20 10 0 0 2 4 6 8 10 12 14 16 18 0 100 Collector to emitter voltage VCE (V) IB - VBE IC - VBE Collector current IC (mA) 200 150 100 25°C 160 120 80 40 50 Collector to emitter saturation voltage VCE(sat) (V) 25°C Ta=75°C 400 VCE(sat) - IC VCE=5V 200 250 300 10 VCE=5V Ta=25°C 300 200 Base current IB (µA) 240 350 IC/IB=10 3 1 25°C Ta=75°C 25°C 0.3 0.1 0.03 0.01 0.003 0 0 0.4 0.8 1.2 0 1.6 0.4 1.2 1.6 Base to emitter voltage VBE Base to emitter voltage VBE (V) hFE - IC 400 Ta=75°C 25°C 25°C 200 100 10 30 100 300 1000 140 120 100 80 60 40 Collector current IC (mA) 0 0.1 30 100 300 1000 Cob - VCB 20 3 10 8 VCB=10V Ta=25°C Transition frequency fT (MHz) 500 3 Collector current IC (mA) 160 VCE=10V 0 1 0.001 1 2.0 (V) fT - I E 600 300 0.8 Collector output capacitance Cob (pF) 0 Forward current transfer ratio hFE 30 0 80 100 120 140 160 400 2 40 50µA Ambient temperature Ta (°C) Base current IB (µA) VCE=5V Ta=25°C 50 Collector current IC (mA) 50 Collector current IC (mA) Total power dissipation PT (mW) Ta=25°C IB=300µA 0.3 1 3 10 30 Emitter current IE (mA) 100 f=1MHz IE=0 Ta=25°C 7 6 5 4 3 2 1 0 1 2 3 5 10 20 30 50 100 Collector to base voltage VCB (V) Composite Transistors XP06401 XP06401 NF - IE NF - IE 20 6 VCB=5V f=1kHz Rg=2k Ta=25°C VCB=5V Rg=50k Ta=25°C 300 200 hfe 16 4 3 2 100 14 12 Parameter h Noise figure NF (dB) Noise figure NF (dB) 5 18 h Parameter - IE f=100Hz 10 1kHz 8 50 20 10 10kHz 6 5 4 0 0.01 0.03 0.1 0.3 1 3 10 Emitter current IE (mA) hie (k) 3 2 1 hoe (µS) 30 2 0 0.1 0.2 0.3 0.5 1 2 3 5 Emitter current IE (mA) 10 1 0.1 VCE=5V f=270Hz Ta=25°C hre (×104) 0.2 0.3 0.5 1 2 3 5 10 Emitter current IE (mA) h Parameter - VCE 300 200 hfe IE=2mA f=270Hz Ta=25°C Parameter h 100 50 30 20 hoe (µS) 10 5 3 hre (×104) hie (k) 2 1 1 2 3 5 10 20 30 50 100 Collector to emitter voltage VCE (V) 3 Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: · Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. · Any applications other than the standard applications intended. (4) The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) When using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be reprinted or reproduced by any means without written permission from our company. Please read the following notes before using the datasheets A. These materials are intended as a reference to assist customers with the selection of Panasonic semiconductor products best suited to their applications. Due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. Customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material. C. These materials are solely intended for a customer's individual use. Therefore, without the prior written approval of Panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited. 2001 MAR