NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
XP05543 2SC3904 - Datasheet Archive
XP05543 Silicon NPN epitaxial planer transistor Unit: mm For amplification of the low frequency 1.25±0.1 2.0±0.1 2
Composite Transistors XP05543 XP05543 Silicon NPN epitaxial planer transistor Unit: mm For amplification of the low frequency 1.25±0.1 2.0±0.1 2 5 3 High transition frequency fT. Two elements incorporated into one package. 6 4 Absolute Maximum Ratings Parameter (Ta=25°C) Symbol Ratings Unit Collector to base voltage VCBO 15 V Rating Collector to emitter voltage of Emitter to base voltage element Collector current VCEO 10 1 : Emitter (Tr1) 2 : Base (Tr1) 3 : Base (Tr2) V VEBO 2 Total power dissipation Storage temperature °C 55 to +150 Tstg mW 150 Tj °C Marking Symbol: EZ Internal Connection 1 3 Tr1 nt in Symbol is Tr2 6 5 4 (Ta=25°C) co Parameter Collector cutoff current +0.05 4 : Collector (Tr2) 5 : Emitter (Tr2) 6 : Collector (Tr1) EIAJ : SC88 SMini Type Package (6pin) 2 Electrical Characteristics 0.2±0.1 mA 150 PT Overall Junction temperature V 65 IC 0.12 0.02 2SC3904 2SC3904 × 2 elements 0 to 0.1 0.9±0.1 Basic Part Number of Element 0.7±0.1 0.2 1 ue pl d in an c se ed lud pl vi an m m es si tf ed ain ai fo ol t n l ht low disc dis ena ten low tp in o co n an in :// g nt n ce c g pa U in tin t e fo na RL ue ue ype typ ur so a d t d e Pr od ty ni bo yp p c. u e e uc ne t l d tl ife t/s ate cy c/ st en in cl e fo st rm ag at e. io n. 0.65 Features 0.425 0.65 M Di ain sc te on na tin nc ue e/ d 0.425 0.2±0.05 2.1±0.1 Conditions ICBO min typ VCB = 10V, IE = 0 IEBO VEB = 1V, IC = 0 hFE VCE = 8V, IC = 20mA 50 120 Transition frequency fT VCE = 8V, IC = 15mA, f = 1.5GHz 7.0 Cob VCB = 10V, IE = 0, f = 1MHz Unit 1 µA 1 µA 8.0 Collector output capacitance max /D Emitter cutoff current M ai nt en an ce Forward current transfer ratio 0.6 300 GHz 1 pF | S21 VCE = 8V, IC = 15mA, f = 1.5GHz 9 dB Power gain GUM VCE = 8V, IC = 15mA, f = 1.5GHz 10 dB Noise figure NF VCE = 8V, IC = 7mA, f = 1.5GHz 2.2 Pl ea Forward transfer gain |2 7 3.0 dB 1 Composite Transistors XP05543 XP05543 PT - Ta IC - VCE 200 IC - VBE 30 120 100 80 60 40 20 200µA 15 150µA 10 100µA 5 120 50µA Ta=75°C 25°C 60 40 20 0 40 60 80 100 120 140 160 0 0 2 25°C 1 3 10 30 120 25°C 80 25°C 40 0 0.1 100 1 3 10 30 0 3 10 6 4 2 3 1 30 100 6 Collector to base voltage VCB (V) 100 VCE=8V f=1.5GHz Ta=25°C 5 8 6 4 0 0.1 30 NF - IC VCE=8V f=1.5GHz Ta=25°C 10 10 Collector current IC (mA) 4 3 2 1 2 0.2 1.2 8 100 Noise figure NF (dB) 0.4 1.0 0 0.3 12 Power gain GUM (dB) 0.6 0.8 10 GUM - IC 0.8 0.6 VCE=8V f=1.5GHz Ta=25°C Collector current IC (mA) f=1MHz IE=0 Ta=25°C 1 0.4 fT - IC Ta=75°C 160 Cob - VCB 1.0 0.2 Base to emitter voltage VBE (V) 12 200 Collector current IC (mA) 1.2 0 12 VCE=8V Forward current transfer ratio hFE Ta=75°C 0.01 0.3 10 hFE - IC 1 0.001 0.1 8 240 IC/IB=10 25°C 6 Collector to emitter voltage VCE (V) VCE(sat) - IC 10 0.1 4 Transition frequency fT (GHz) 20 Ambient temperature Ta (°C) Collector to emitter saturation voltage VCE(sat) (V) 25°C 80 20 0 Collector output capacitance Cob (pF) 100 Collector current IC (mA) 140 0 2 VCE=8V IB=250µA 25 160 Collector current IC (mA) Total power dissipation PT (mW) Ta=25°C 180 0.3 1 3 10 30 Collector current IC (mA) 100 0 0.1 0.3 1 3 10 30 Collector current IC (mA) 100 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805