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LM4995SD/NOPB Texas Instruments 1.3W Audio Power Amplifier 8-WSON visit Texas Instruments Buy
TCA9517DSGR Texas Instruments SPECIALTY INTERFACE CIRCUIT, PDSO8, PLASTIC, WSON-8 visit Texas Instruments
LM4953SD/NOPB Texas Instruments 1 CHANNEL, AUDIO AMPLIFIER, PDSO14, WSON-14 visit Texas Instruments
LM25115SD Texas Instruments 2.5A SWITCHING CONTROLLER, PDSO16, WSON-16 visit Texas Instruments
LM25115SDX Texas Instruments 2.5A SWITCHING CONTROLLER, PDSO16, WSON-16 visit Texas Instruments
LMR10530XSD/NOPB Texas Instruments 5.5V, 3A 3MHz Step-Down Regulator in WSON Package 10-WSON -40 to 125 visit Texas Instruments Buy

WSON* 8x6mm

Catalog Datasheet MFG & Type PDF Document Tags

winband

Abstract: W25X40BV , SOIC8 208mil, SOIC16 300mil, WSON 6X5mm,PDIP8 300mll SOIC8 208mil,SOIC16 300mil,WSON 6X5mm, WSON 8X6mm, PDIP8 300mll SOIC8 1 SOmll, SOIC8 208mil, SOIC16 300mil, WSON 6X5mm, WSON 8X6mm SOIC8 208mil, SOIC16 300mll, WSON 8X6mm,PDIP8 300mll SOIC8 208mil, SOIC16 300mll, WSON 8X6mm, PDIP8 300mll SOIC16 300mil, WSON , , WSON 8X6mm EOL Recommend W25Q32BV Y W25X32AV 32M-bit (4MB) 16,384 pages, 4KB sectors, 64KB blocks, Dual output 2.7V- 3.6V -40 to +85 100MHz (200MHz Dual-SPI) SOIC8 208mil, S01C16 300mil, WSON 6X5mm, WSON 8X6mm
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winband W25X40BV W25Q408W w25x40v W651GG2JB WSON* 8x6mm
Abstract: (JM) - 8 contact WSON (8x6mm) (JL) - 24 balls BGA (6x8mm) (JG) - All Pb-free packages are RoHS , 8-pin WSON (8x6mm) EL EA HOLD#(IO3) N O T R 16-Pin SOIC 300mil 24 - Ball , PRELIMINARY INFORMATION IS25CQ256 PACKAGE MECHANICAL EL EA SE D JL- 8-WSON ( 8x6 mm ) N , -pin 300mil SOP JL = 8-pin WSON (6x8mm) JG = 24-ball Ball Grid Array (6 x 8 mm) (Call Factory) R , Quad I/O 256 = 256 Megabit (32768K x 8) Package 16-pin 300mil SOP IS25CQ256-JLLI 8-pin WSON Integrated Silicon Solution
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IS25CQ256-JMLI IS25CQ256-JGLI 24-BGA IS25CQ256-JMLA1 IS25CQ256-JLLA1 IS25CQ256-JGLA1
Abstract: contact WSON (6x5mm) (JK) - 8 contact WSON (8x6mm) (JL) - 24 balls BGA (8x6mm) (JG) - All Pb-free , ) 5 SI (SO0) 8-pin WSON 6x5mm 8-pin WSON 8x6mm EL EA 8-pin SOIC 208mil 8-Pin SOIC 8 , .- www.issi.com Rev. 0A 3 IS25CQ064 R EL EA SE D 8-WSON (6x5 mm ) T Notice: This , EL EA SE D 8-WSON ( 8x6 mm ) T Notice: This package canâ'™t contact to metal trace , SOIC 300mil 8 pins SOP 208mil IS25CQ064-JKLI 8 Pin WSON (5x6 mm) IS25CQ064-JLLI 8 Pin WSON Integrated Silicon Solution
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104MH 160/200MH IS25CQ064-JGLI IS25CQ064-JMLA1 IS25CQ064-JBLA1 IS25CQ064-JKLA1

MX25L6406E

Abstract: MX25L6445E 16-SOP(300mil) 8-WSON(6x5mm) 16-SOP(300mil) 8-SOP(209mil) 8-WSON(8x6mm) 16-SOP(300mil) 8-SOP(209mil) 8-WSON(8x6mm) -40~85 °C -40~85°C -40~85°C Voltage Operation Temperature Sector
Macronix International
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MX25L6406E MX25L6405D MX25L6445E AN-069 MX25L6445 mxic mx25l6406e data mx25L6406E
Abstract: -MIL . 5 4. PAD CONFIGURATION WSON 8X6-MM . 5 5. PIN DESCRIPTION SOIC 208-MIL, WSON 8X6-MM , . 38 12.1 12.2 8-Contact 8x6mm WSON (Package Code ZE , â'" 8-pin SOIC 208-mil â'" 8-pad WSON 8x6-mm â'" 16-pin SOIC 300-mil ï'· Software and Hardware , 1a. W25X64BV Pin Assignments, 8-pin SOIC 208-mil (Package Code SS) 4. PAD CONFIGURATION WSON 8X6-MM Winbond Electronics
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64M-BIT W25Q64BV 300-MIL

W25Q64

Abstract: 3017h -MIL . 5 PAD CONFIGURATION WSON 8X6-MM , -MIL . 6 PIN DESCRIPTION SOIC 208-MIL, PDIP 300-MIL, WSON 8X6-MM , ) . 40 8-Contact 8x6mm WSON (Package Code ZE , Space Efficient Packaging ­ 8-pin SOIC 208-mil ­ 8-pad WSON 8x6-mm ­ 8-pin PDIP 300-mil ­ 16-pin SOIC , , 8-pin SOIC 208-mil (Package Code SS) 4. PAD CONFIGURATION WSON 8X6-MM Figure 1b. W25X64BV Pad
Winbond Electronics
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W25Q64 3017h W25X64BVSFIG TRAY DIMENSIONS SOIC16 WINBOND W25X64BV

w25q32b

Abstract: W25X32BV operating range Space Efficient Packaging ­ 8-pin SOIC 208-mil ­ 8-pad WSON 6x5mm (1) ­ 8-pad WSON 8x6mm ­ 16-pin SOIC 300-mil Note 1: WSON-8 8x6mm is a special order package, please contact Winbond for , -MIL . 5 PAD CONFIGURATION WSON 6X5-MM / WSON 8X6-MM . 5 PIN DESCRIPTION SOIC 208-MIL, WSON 6X5-MM, WSON 8X6-MM . 5 , ) . 39 8-Contact 8x6mm WSON (Package Code ZE
Winbond Electronics
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W25X32BV w25q32b 208mH 32M-BIT

25X64VFIG

Abstract: 25X64VIG . 4 PIN CONFIGURATION WSON 8X6-MM , ) .39 8-Contact 8x6mm WSON (Package Code ZE , -pin SOIC 300-mil ­ 8-pad WSON 8x6-mm -4 - W25X64 3 PIN CONFIGURATION WSON 8X6-MM Figure 1b. W25X64 Pad Assignments, 8-pad WSON 8x6-mm (Package Code ZE) 4 PIN CONFIGURATION PDIP 300 , these packages before designing to this specification. W25X64 is offered in an 8x6-mm WSON (package code
Winbond Electronics
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25X64VIG 25X64VFIG 25x64vf WINBOND W25X64 25X64 W25X64V 25X64VAIZ

25X32VSIG

Abstract: 25X32VFIG -MIL. 5 PIN CONFIGURATION WSON 8X6-MM , ) . 40 8-Contact 8x6mm WSON (Package Code ZE , 208-mil ­ 8-pin PDIP 300-mil ­ 16-pin SOIC 300-mil ­ 8-pad WSON 8x6-mm -4- W25X32 3 PIN , CONFIGURATION WSON 8X6-MM Figure 1b. W25X32 Pad Assignments, 8-pad WSON 8x6-mm (Package Code ZE) -5- , code SS), 8x6-mm WSON (package code ZE), 16-pin plastic 300-mil width SOIC (package code SF) and 300
Winbond Electronics
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25X32VSIG 25X32VFIG 25x32vs WINBOND W25X32 25x32v W25X32VSFIG 25X32VAIZ

25q64

Abstract: 25Q64BVAIG -MIL . 6 4. PAD CONFIGURATION WSON 8X6-MM , -MIL . 7 6. PIN DESCRIPTION SOIC 208-MIL, PDIP 300-MIL AND WSON 8X6-MM , ). 56 13.3 8-Contact 8x6mm WSON (Package Code ZE , 208-mil ­ 8-pin PDIP 300-mil ­ 8-pad WSON 8x6-mm ­ 16-pin SOIC 300-mil ­ Contact Winbond for KGD , Pin Assignments, 8-pin SOIC 208-mil (Package Code SS) 4. PAD CONFIGURATION WSON 8X6-MM /CS 1
Winbond Electronics
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25q64 25Q64BVAIG 25q64bv Winbond 25q64BVAIG W25Q64BVSSIG W25Q64BVZEIG

25X32AVSIG

Abstract: FEATURES10 -MIL . 5 PAD CONFIGURATION WSON 6X5-MM & 8X6-MM . 5 PIN DESCRIPTION SOIC 208-MIL, WSON 6X5-MM, WSON 8X6-MM , ). 41 8-Contact 8x6mm WSON (Package Code ZE , -pin SOIC 208-mil ­ 16-pin SOIC 300-mil ­ 8-pad WSON 6x5-mm (1) ­ 8-pad WSON 8x6-mm Note 1 ­ Special , -mil (Package Code SS) 4 PAD CONFIGURATION WSON 6X5-MM & 8X6-MM Figure 1b. W25X32A Pad Assignments, 8
Winbond Electronics
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25X32AVSIG FEATURES10

w25q128

Abstract: 25Q128BVFG . 5 3. PAD CONFIGURATION WSON 8X6-MM . 6 4. PAD DESCRIPTION WSON 8X6-MM , . 68 11.1 11.2 12. 8-Pad WSON 8x6mm (Package Code E , , 2010 Preliminary - Revision D W25Q128BV 3. PAD CONFIGURATION WSON 8X6-MM /CS 1 8 VCC , ) Figure 1a. W25Q128BV Pad Assignments, 8-pad WSON 8x6-mm (Package Code E) 4. PAD DESCRIPTION WSON 8X6-MM
Winbond Electronics
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w25q128 25Q128BVFG W25Q128BVFIG w25q128bveig 25Q128 25Q128BVEG 128M-BIT
Abstract: . 6 3.1 3.2 Pad Description WSON 8x6-mm , ) . 8 3.6 4. Pad Configuration WSON 8x6-mm , ) . 69 9.4 10. 8-Pad WSON 8x6-mm (Package Code E , Packaging â'" 8-pad WSON 8x6-mm â'" 16-pin SOIC 300-mil â'" 24-ball TFBGA 5X5-mm & 8X6-mm â'" Contact , W25Q128BV 3. PACKAGE TYPES AND PIN CONFIGURATIONS W25Q128BV is offered in an 8-pad WSON 8x6-mm (package Winbond Electronics
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W25Q128BV

Abstract: 25Q128BVFG . 6 3.1 3.2 3.3 3.4 3.5 3.6 4. 4.1 4.2 4.3 4.4 4.5 5. 6. Pad Configuration WSON 8x6-mm . 6 Pad Description WSON 8x6-mm , . 66 8-Pad WSON 8x6-mm (Package Code E , Space Efficient Packaging ­ As few as 8 clocks to address memory ­ 8-pad WSON 8x6-mm ­ Allows true XIP , is offered in an 8-pad WSON 8x6-mm (package code E), a 16-pin SOIC 300-mil (package code F) and two
Winbond Electronics
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JESD216 25q12 A-1512 marking m7 FF00FFH W25Q

W25X128

Abstract: W25Q40 2.7V- 3.6V -40 to +85 75MHz (150MHz Dual-SPD 50IC16 300mil, WSON 8X6mm, PDIP8 300mil P Y , /64 KB blocks, Dual SPI -40 to 1-85 80MHz (160MHz Dual-SPI) SOIC8 208mll, SOIC16 300mll, WSON 8X6mm , . Optional 8-contact WSON and 8-pin DIP packages may also be available. Please contact Winbond for further , (200MHz Dual-SPI) SOIC8 1 SOmil. WSON 6X5mm, PDIP8 300mll P Y W25X10AL IM-bit (128KB) 512 pages, 4KB sectors, 64KB blocks, Dual output 2.3V - 3-6V -40 to +85 50MHz (100MHz Dual-SPI) SOIC8 150mil,WSON 6X5mm
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W25X128 W25Q40 W25Q16BW W25X80BV W25016BV winbond* W25Q

w25q256

Abstract: W25Q256FV ) to reset. No command will be accepted during the reset period. For the WSON-8 and TFBGA package types , . 6 3.1 3.2 3.3 3.4 3.5 3.6 4. 4.1 4.2 4.3 4.4 4.5 4.6 5. 6. Pad Configuration WSON 8x6-mm . 6 Pad Description WSON 8x6-mm , . 87 -3- W25Q256FV 10.1 10.2 10.3 10.4 11. 12. 11.1 8-Pad WSON 8x6-mm (Package Code E , Non-volatile Status Register Bits · Space Efficient Packaging ­ 8-pad WSON 8x6-mm ­ 16-pin SOIC 300
Winbond Electronics
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w25q256 25Q256 W25Q256FVE 25q256fvfg W25Q256F W25Q256FVEI 256M-BIT

IS25LQ016B

Abstract: -pin VSOP 208mil - JK = 8-pin WSON 6x5mm - JL = 8-pin WSON 8x6mm - JG= 24-TFBGA (call factory) - KGD , ) . 54 10.5 8-Contact Ultra-Thin Small Outline No-Lead (WSON) Package (JK). 55 10.6 8-Contact Ultra-Thin Small Outline No-Lead (WSON) Package 8x6mm (JL) . 56 10.7 24-Ball Thin Profile Fine Pitch BGA 8x6mm (JG) (1 , # (IO2) 2 4 5 SI (IO0) SI (IO0) 8-pin WSON 6x5mm (Package: JK) 8-pin WSON 8x6mm (Package
Integrated Silicon Solution
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IS25LQ016B IS25LQ080/016/032B 8/16/32M-BIT IS25LQ032B IS25LQ080B 52MB/S

W25Q128BV

Abstract: 25q128bvfg . 6 3.1 3.2 3.3 3.4 3.5 3.6 4. 4.1 4.2 4.3 4.4 4.5 5. 6. Pad Configuration WSON 8x6-mm . 6 Pad Description WSON 8x6-mm , . 68 8-Pad WSON 8x6-mm (Package Code E , offered in an 8-pad WSON 8x6-mm (package code E), a 16-pin SOIC 300-mil (package code F) and a 24-ball 8x6-mm , illustrated at the end of this datasheet. 3.1 Pad Configuration WSON 8x6-mm Top View /CS DO (IO1) /WP
Winbond Electronics
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25Q128BVCP P 721 FFE000 W25Q128BVEAG 128-mega 40FF00h

25Q128BVFG

Abstract: W25Q128 . 5 PAD CONFIGURATION WSON 8X6-MM . 6 PIN DESCRIPTION WSON 8X6-MM , . 64 8-Contact 8x6mm WSON (Package Code E , Non-volatile Status Register Bits Space Efficient Packaging ­ 8-pad WSON 8x6-mm ­ 16-pin SOIC 300-mil ­ , Revision B W25Q128BV 3. PAD CONFIGURATION WSON 8X6-MM Figure 1b. W25Q128BV Pad Assignments, 8
Winbond Electronics
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w25q128b W25Q128BVE WINBOND W25q128 380KB W25Q128BVF 7F000
Abstract: . 5 3. PAD CONFIGURATION WSON 8X6-MM . 6 4. PIN DESCRIPTION WSON 8X6-MM , . 65 11.1 11.2 12. 8-Contact 8x6mm WSON (Package Code E , '" Outperforms X16 Parallel Flash ï'· Space Efficient Packaging â'" 8-pad WSON 8x6-mm â'" 16-pin SOIC 300 , 8X6-MM Figure 1b. W25Q128BV Pad Assignments, 8-pad WSON 8x6-mm (Package Code E) 4. PIN Winbond Electronics
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