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AE-Q44-W79 Phyton Inc ADPT DIP40/QFP44 NUVOTON/WINBOND visit Digikey Buy
AE-Q48-W79-3 Phyton Inc ADPT DIP40/QFP48 NUVOTON/WINBOND visit Digikey Buy
ACC-005 LAIRD PLC Bluetooth / 802.15.1 Modules & Development Tools Winbond CODEC visit Digikey Buy
W25Q16CLSVIG Winbond Electronics Corp Flash, 16MX1, PDSO8, 0.150 INCH, GREEN, VSOP-8 visit Digikey Buy
W9812G6KH-6I Winbond Electronics Corp Synchronous DRAM, 8MX16, 5ns, CMOS, PDSO54, TSOP2-54 visit Digikey Buy
W9412G6KH-4 Winbond Electronics Corp DDR DRAM, 8MX16, 0.65ns, CMOS, PDSO66, 0.400 INCH, ROHS COMPLIANT, TSOP2-66 visit Digikey Buy

WINBOND 25X16AVSIG

Catalog Datasheet MFG & Type PDF Document Tags

25X16AVSIG

Abstract: 25X16AVSIG in SOIC-8 SN (SOIC8 150mil) is a special order package, please contact Winbond for ordering information. -4- , all package types had been finalized. Contact Winbond to confirm availability of these packages before , Winbond Serial Flash Device ID Instruction W25X16A (ID7-ID0) ABh, 90h 14h (ID15-ID0) 9Fh 3015h , (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh) and the Device ID are shifted out , instruction code "9Fh". The JEDEC assigned Manufacturer ID byte for Winbond (EFh) and two Device ID bytes
Winbond Electronics
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25X16AVSIG 25X16AVSIG in SOIC-8 WINBOND 25X16AVSIG 25x16av winbond 25X16AVAIZ 25X16AVS 16M-BIT 150-MIL 208-MIL 300-MIL 150/208-MIL 100MH

25X16AVSIG

Abstract: 25x16a ) . 43 14.5 16-Pin SOIC 300-mil (Winbond Package Code SF , package types had been finalized. Contact Winbond to confirm availability of these packages before , Identification MANUFACTURER ID (M7-M0) Winbond Serial Flash EFh Device ID (ID7-ID0) (ID15-ID0 , . After which, the Manufacturer ID for Winbond (EFh) and the Device ID are shifted out on the falling , instruction code "9Fh". The JEDEC assigned Manufacturer ID byte for Winbond (EFh) and two Device ID bytes
Winbond Electronics
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25x16a 25x16 25X16AVAIZ 25x16avfig W25X16AVSSIG SOIC 8 MARKING CODE D8H

winbond 25x16

Abstract: 25X16AVSIG ) . 45 14.6 16-Pin SOIC 300-mil (Winbond Package Code SF , types had been finalized. Contact Winbond to confirm availability of these packages before designing to , (M7-M0) Winbond Serial Flash EFH Device ID (ID7-ID0) (ID15-ID0) Instruction ABh, 90h
Winbond Electronics
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W25X32 W25X64 winbond 25x16 25X32VSIG 25x16vsig WINBOND W25X32 25x16vaiz W25X16 32M-BIT 64M-BIT
Abstract: ) . 45 14.6 16-Pin SOIC 300-mil (Winbond Package Code SF , the time this datasheet was published not all package types had been finalized. Contact Winbond to , Manufacturer and Device Identification MANUFACTURER ID (M7-M0) Winbond Serial Flash EFH Device ID Winbond Electronics
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25x16vsig

Abstract: WINBOND 25x16vsig ) . 44 16-Pin SOIC 300-mil (Winbond Package Code SF , been finalized. Contact Winbond to confirm availability of these packages before designing to this , Winbond Serial Flash Device ID Instruction W25X16/16A W25X32 W25X64 (ID7-ID0) ABh, 90h 14h 15h 16h , -bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh) and the Device ID are , assigned Manufacturer ID byte for Winbond
Winbond Electronics
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WINBOND 25x16vsig 25X64VFIG 25x32 25X32VFIG 25x32vs 25X16VS