VSP1221 SLES012A 12-BIT 21-MSPS DAC01 DAC02 SD14-SD10 CLK18 SD15-SD10 01000000J - Datasheet Archive

 

www.ti.com SLES012A ­ SEPTEMBER 2001 ­ REVISED JULY 2004 12-BIT, 21-MSPS, ULTRALOW-POWER CCD SIGNAL PROCESSOR FEATURES

 

VSP1221 VSP1221 www.ti.com SLES012A SLES012A ­ SEPTEMBER 2001 ­ REVISED JULY 2004 12-BIT 12-BIT, 21-MSPS 21-MSPS, ULTRALOW-POWER CCD SIGNAL PROCESSOR FEATURES · · · · · · APPLICATIONS · · Digital Still Camera Digital Video Camera DESCRIPTION The VSP1221 VSP1221 is a highly-integrated mixed-signal IC used for signal conditioning and analog-to-digital conversion at the output of a CCD array. The IC has a correlated double sampler (CDS) and an analog programmable-gain amplifier (PGA) stage followed by an analog-to-digital converter (ADC) and a digital PGA stage. The CDS is used to sample the CCD signal and is followed by the analog PGA stage. The ADC is a12-bit, 21-MSPS 21-MSPS pipelined ADC. The digital PGA provides further amplification. PACKAGE (TOP VIEW) OE AVSS AVDD REFM REFP ISET · PIN ASSIGNMENTS SCLK SDIN SLOAD SCKP STBY RESET · 12-Bit, 21-MSPS 21-MSPS, Analog-to-Digital Converter Low Power: 70 mW Minimum Power-Down Mode: 4 mW Low Input-Referred Noise: 75-dB SNR Typical at 0-dB Gain Novel Optical-Black (OB) Calibration Low-Aperture Delay Single 3-V Supply Operation DNL: 19 ns Good performance if 10 ns < tCCD_SHD < 19 ns Poor performance if tCCD_SHD < 15 ns 5 ns 15 35 ns 1.75 3 ns 5 7 ns ns 15 ns VSP1221 VSP1221 www.ti.com SLES012A SLES012A ­ SEPTEMBER 2001 ­ REVISED JULY 2004 SERIAL INTERFACE TIMING Standard Functionality, SCKP (Pin 45) = High (Sample Data on Rising Edge of SCLK), Operation = Write tSLOADS tSLOADH SLOAD tWSCLK tWSCLK tSCLK SCLK tDH tDS SDIN MSB LSB 16 Bits Figure 3. Serial Interface Timing for Write, SCKP = High Standard Functionality, SCKP (Pin 45) = Low (Sample Data on Falling Edge of SCLK), Operation = Write tSLOADS tSLOADH SLOAD tWSCLK tWSCLK tSCLK SCLK tDH tDS SDIN MSB LSB 16 Bits Figure 4. Serial Interface Timing for Write, SCKP = Low SERIAL INTERFACE TIMING FOR WRITE, SCKP = LOW PARAMETERS tSCLK SCLK period tWSCLK SCLK high or low width tSLOADS MIN TYP MAX UNIT 25 ns 12.5 ns SLOAD to SCLK setup time 5 ns tSLOADH SCLK to SLOAD hold time 2 ns tDS Data setup time 5 ns tDH Data hold time 2 ns 7 VSP1221 VSP1221 www.ti.com SLES012A SLES012A ­ SEPTEMBER 2001 ­ REVISED JULY 2004 Standard Functionality, SCKP (Pin 45) = High, Operation = Read tSLOADS tSLOADH SLOAD CLK CLK 1 2 CLK CLK 6 7 CLK CLK CLK CLK 16 17 18 19 CLK CLK 23 24 CLK 32 SCLK A4 A3 A2 A1 A0 (Address) D9­D0 LSB DATA_REQUEST (16 Bits) SDO MSB ¡ ¡ ¡ ¡ ¡¡¡¡ MSB ¡ ¡ ¡ ¡ ¡ ¡¡¡¡¡ SDIN D15­D10 D9­D0 LSB (Data) DATA_SEND (16 Bits) Figure 5. Serial Interface Timing for Read, SCKP = High Device register values can be read back serially from the SDO pin (pin 1). For serial data read, user first sends a 16 bit DATA_REQUEST on the SDIN pin (pin 47). The format is as follows: DATA_REQUEST on SDIN SD15 SD14-SD10 SD14-SD10 SD9-SD0 1 Required register address Don't Care Although the length of DATA_REQUEST is 16 bits, the ten LSBs are don't cares. Also, note that SD15 (RD/WR) should be 1 for register read (see the serial data format section). The register address portion of DATA_REQUEST is decoded and the register data value (DATA_SEND) is available on the SDO pin at the rising edge of CLK18 CLK18 (see Figure 5) if SLOAD is low at that time. If SLOAD is high at that time, then DATA_SEND is available when SLOAD goes low again. The format of DATA_SEND is as follows: DATA_SEND on SDO SD15-SD10 SD15-SD10 SD9-SD0 Don't Care Required register data Although the length of DATA_SEND is 16 bits, the six MSBs are don't cares. 8 VSP1221 VSP1221 www.ti.com SLES012A SLES012A ­ SEPTEMBER 2001 ­ REVISED JULY 2004 SDO Timing SCLK tSHOLD tSOD MSB SDO LSB 16 Bits Figure 6. Serial Interface Timing Between SCLK and SDO SERIAL INTERFACE TIMING BETWEEN SCLK AND SDO (1) PARAMETERS tSHOLD Data output hold time tSOD MIN TYP MAX Data output delay (1) 5 UNIT ns 13 ns Data output transition occurs at the falling edge of SCLK; so data should be sampled at the rising edge of SCLK. Since the SDO pin is multiplexed with the D0 pin, OE (pin 42) should be low. Standard Functionality, SCKP (Pin 45) = Low, Operation = Read tSLOADS tSLOADH SLOAD CLK CLK 1 2 CLK CLK 6 7 CLK CLK CLK CLK 16 17 18 19 CLK CLK 23 24 CLK 32 SCLK A4 A3 A2 A1 A0 (Address) DATA_REQUEST (16 Bits) SDO D9­D0 LSB MSB ¡ ¡ ¡ ¡ ¡¡¡¡ MSB ¡ ¡ ¡ ¡ ¡ ¡¡¡¡¡ SDIN D15­D10 D9­D0 LSB (Data) DATA_SEND (16 Bits) Figure 7. Serial Interface Timing for Read, SCKP = Low The SDO timing is the same as before, except that data should be sampled at the falling edge of SCLK. 9 VSP1221 VSP1221 www.ti.com SLES012A SLES012A ­ SEPTEMBER 2001 ­ REVISED JULY 2004 SERIAL DATA FORMAT Standard Functionality The serial data is always grouped in 16-bit blocks with the following format. Multiple 16-bit blocks can be send through the SDIN pin (pin 47) keeping SLOAD (pin 46) low. SD15 MSB SD14 SD13 SD12 SD11 SD10 SD9 SD8 SD7 SD6 RD/WR (1) A4 A3 A2 A1 A0 D9 D8 D7 SD5 D6 (1) SD3 SD2 SD1 SD0 LSB D5 Register Address SD4 D4 D3 D2 D1 D0 Register Data RD/WR = 0, Write into registers, RD/WR = 1, Read from registers REGISTER DESCRIPTION REGISTER ADDRESS (2) REGISTER NAME REGISTER FUNCTION A4 A1 A0 0 0 0 0 Control register Mode control 0 0 0 0 1 PGA register Gain control 0 0 0 1 0 User DAC1 register User DAC1 control 0 0 0 1 1 User DAC2 register User DAC2 control 0 0 1 0 0 Reserved Reserved 0 0 1 0 1 Reserved Reserved 0 0 1 1 0 OB register OB level control 0 0 1 1 1 Blanking register Blanking output control 0 1 0 0 0 Signal polarity register Clock signal polarity control 0 1 0 0 1 Timing register 1 ADCCLK 0 10 A2 0 (2) A3 1 0 1 0 Timing register 2 SHP The register values are updated as soon as the register is written. It may take 0 to 9 ADCCLK cycles for it to have effect on the device. VSP1221 VSP1221 www.ti.com SLES012A SLES012A ­ SEPTEMBER 2001 ­ REVISED JULY 2004 Control Register SD15 MSB SD14 SD1 3 SD12 SD1 1 SD10 SD9 SD8 SD7 SD6 RD/W R 0 0 0 0 0 STBYZ CLAMPPIN OB Reserved SD5 SD4 SD3 Reserved Address SD2 SD1 SD0 LSB Reserved Reserved RTSY Data BIT NAME DEFAULT VALUE SD0 RTSY 0 RTSY = 0, no change RTSY = 1, reset all register bits to their default settings SD1 RESERVED 0 Reserved SD2 RESERVED 0 Reserved SD3-SD5 RESERVED All 0 Reserved SD6 RESERVED X Reserved SD7 OB 1 OB = 0, optical-black calibration disable (1) OB = 1, optical-black calibration enable SD8 CLAMPPIN (2) 1 CLAMPPIN = 1, disable clamping on PIN (pin 31), connect PIN directly to ground. CLAMPPIN = 0, enable clamping on PIN (pin 31), connect PIN to ground via capacitor. SD9 STBYZ 1 STBYZ = 0, device in power-down mode (software power down) STBYZ = 1, no change (1) (2) DESCRIPTION Under this condition, the previous value of black level remains unchanged. See the CCD input section. Programmable-Gain Amplifier (PGA) Register SD15 MSB SD14 SD13 RD/WR 0 0 SD12 SD11 SD10 SD9 0 0 1 SD8 SD7 MSB BIT NAME GAIN SD4 SD3 SD2 SD1 SD0 LSB LSB Data DEFAULT VALUE All 0 SD5 GAIN Address SD0-DS9 SD6 DESCRIPTION Programmable-gain control Gain step = 0.05 dB Minimum gain = 0 dB Maximum gain = 36 dB Code Gain 0000000000 0 dB 0000000001 0.05 dB . . . 1011001111 35.95 dB 1011010000 36 dB Higher codes 36 dB 11 VSP1221 VSP1221 www.ti.com SLES012A SLES012A ­ SEPTEMBER 2001 ­ REVISED JULY 2004 User DAC1 Register SD15 MSB SD14 SD13 SD12 SD11 SD10 SD9 SD8 SD7 RD/WR 0 0 0 1 0 Reserved PDZ1 MSB LSB SD6 NAME SD4 SD3 SD2 SD1 SD0 LSB DACIN1 Address BIT SD5 Data DEFAULT VALUE DESCRIPTION SD0-DS7 DACIN1 SD8 PDZ1 All 0 0 Eight-bit digital input to DAC1 PDZ1 = 0, DAC1 in power-down mode PDZ1 = 1, DAC1 in functional mode SD9 Reserved 0 Reserved User DAC2 Register SD15 MSB SD14 SD13 RD/WR 0 0 SD12 SD11 SD10 SD9 SD8 SD7 0 1 1 Reserved PDZ2 MSB Address BIT NAME SD6 SD5 SD4 SD3 SD2 SD1 DACIN2 SD0 LSB LSB Data DEFAULT VALUE DESCRIPTION SD0-DS7 DACIN2 All 0 Eight-bit digital input to DAC2 SD8 PDZ2 0 PDZ1 = 0, DAC2 in power-down mode PDZ1 = 1, DAC2 in functional mode SD9 Reserved 0 Reserved OB Register SD15 MSB SD14 SD13 SD12 SD11 SD10 RD/WR 0 0 1 1 0 SD9 SD8 Reserved SD7 BIT NAME OBLEVEL DEFAULT VALUE 01000000J 01000000J (64 LSBs) OB Level LSB 00000001 1 LSB . . 11111110 254 11111111 255 12 All 0 LSBs LSBs Reserved SD3 OBLEVEL DESCRIPTION OB reference level 00000000 0 Reserved SD4 Data Code SD8-SD9 SD5 MSB Address SD0-DS9 SD6 SD2 SD1 SD0 LSB LSB VSP1221 VSP1221 www.ti.com SLES012A SLES012A ­ SEPTEMBER 2001 ­ REVISED JULY 2004 Blanking Register SD15 MSB SD14 SD13 SD12 SD11 SD10 SD9 RD/WR 0 0 1 1 1 MSB SD8 SD7 SD6 SD5 SD0DS9 NAME SD2 SD1 SD0 LSB LSB Data DEFAULT VALUE BLKGVAL SD3 BLKGVAL Address BIT SD4 DESCRIPTION All 0 Output data when BLKG (pin 19) is low Code Output data (blanking level) 0000000000 0 LSB 0000000001 1 LSB 1111111110 1022 LSBs 1111111111 1023 LSBs . . SD8SD9 Reserved All 0 Reserved Signal Polarity Register (1) SD15 MSB SD14 SD13 RD/WR 0 1 SD12 SD11 SD10 0 0 SD9 0 SD8 SD7 SD3 SD2 SD1 SD0 LSB ADCZ OBZ BLZ CLZ SD5 Reserved Address (1) SD4 SPDZ SD6 Data For this register to take effect, bit SD4 of timing register 1 must be 0. BIT NAME DEFAULT VALUE DESCRIPTION SD0 CLZ 0 CLZ = 0, CLPDM (pin 23) = active low CLZ = 1, CLPDM (pin 23) = active high SD1 BLZ 0 BLZ = 0, BLKG (pin 19) = active low BLZ = 1, BLKG (pin 19) = active high SD2 OBZ 0 OBZ = 0, CLPOB (pin 20) = active low OBZ = 1, CLPOB (pin 20) = active high SD3 ADCZ 0 ADCZ = 0, ADCCLK (pin 16) = active low ADCZ = 1, ADCCLK (pin 16) = active high SD4 SPDZ 0 SPDZ = 0, SHP (pin 21) = active low, SHD (pin 22) = active low SPDZ = 1, SHP (pin 21) = active high, SHD (pin 22) = active high SD5-SD9 Reserved All 0 Reserved 13 VSP1221 VSP1221 www.ti.com SLES012A SLES012A ­ SEPTEMBER 2001 ­ REVISED JULY 2004 Timing Register 1 SD15 MSB SD14 SD13 SD12 SD11 SD10 RD/WR 0 1 0 0 1 SD9 SD8 SD7 BIT SD3 SD2 SD1 SD0 LSB MSB ADCDELAY LSB SD5 Reserved Address SD0-SD3 SD4 BYPZ SD6 Data NAME DEFAULT VALUE ADCDELAY All 0 DESCRIPTION Delay ADC clock by programmed value Delay step = 0.8 ns Code Delay 0000 0 0001 0.8 ns . . 1110 1111 SD4 BYPZ SD5-SD9 Reserved (1) 11.2 ns 12 ns BYPZ = 0, signal polarity and programmable delay enable (1) BYPZ = 1, signal polarity and programmable delay disable 1 All 0 Reserved When BYPZ = 0, the internal delays of SHP and SHD increases approximately by 3 ns. Timing Register 2 (2) SD15 MSB SD14 SD13 SD12 SD11 SD10 RD/WR 0 1 0 1 0 SD9 SD8 Reserved SD7 SD6 SD5 SD4 SD3 SD2 SD1 SD0 LSB MSB SHDDELAY LSB MSB SHPDELAY LSB Address (2) Data For this register to take effect, bit SD4 of timing register 1 must be 0 (see the timing register 1 section. BIT SD0-SD3 NAME SHPDELAY DEFAULT VALUE All 0 DESCRIPTION Delay SHP clock by programmed value Delay step = 0.8 ns Code Delay 0000 0 0001 0.8 ns . 1110 SD4-SD7 SHDDELAY All 0 11.2 ns 1111 12 ns Delay SHD clock by programmed value Delay step = 0.8 ns Code Delay 0000 0 0001 0.8 ns . 1110 SD8-SD9 14 Reserved All 0 11.2 ns 1111 12 ns Reserved VSP1221 VSP1221 www.ti.com SLES012A SLES012A ­ SEPTEMBER 2001 ­ REVISED JULY 2004 PRINCIPLES OF OPERATION INTRODUCTION The principle functions of the VSP1221 VSP1221 are described below. The sections discussed are: · CDS · ADC · PGA · Voltage and current reference · Serial interface · Timing ­ SHP, SHD, AND ADCCLK ­ CLPDM ­ BLKG ­ CLPOB ­ OE ­ RESET · Optical-black calibration · Standby mode · General-purpose DAC Before describing the individual blocks, a simplified block diagram of the VSP1221 VSP1221 is shown in Figure 8. CLPOB OB Reference OB DAC OB Calibration Circuit Analog CCD Input CDS Digital 12-Bit ADC PGA PGA Latch 12-Bit Output CIN CLPDM Gain Code SHP SHD BLKG Gain Code ADCCLK OE Input Clamp Figure 8. Simplified Block Diagram of the VSP1221 VSP1221 CDS The output signal from the CCD is fed to the correlated double sampler (CDS) through off-chip coupling capacitor Cin (a 0.22-µF capacitor is recommended for Cin). The CCD signal is sampled twice during one pixel period: at the reference level (SHP) and at the data level (SHD). Subtracting these two samples extracts the pixel value and reduces the reset noise and other low-frequency noises that are present at the output of the CCD signal. ADC The output analog signal from the analog PGA stage is passed to the 12-bit analog-to-digital converter (ADC). The ADC employs a three-stage pipelined architecture to achieve high-throughput and low-power consumption. Fully-differential implementation and digital-error correction ensures 12-bit resolution. 15 VSP1221 VSP1221 SLES012A SLES012A ­ SEPTEMBER 2001 ­ REVISED JULY 2004 www.ti.com PRINCIPLES OF OPERATION (continued) PGA VSP1221 VSP1221 has a programmable gain amplifier (PGA) which is composed of analog and digital stages. The total gain range is 0 dB-36 dB in 0.05-dB steps. The gain can be adjusted by programming the PGA register through the serial port, see the programmable gain amplifier (PGA) register section. VOLTAGE REFERENCE All the reference voltages and the bias currents used by the device are created by an internal bandgap circuit. Connecting an external 100-k resistor from ISET (pin 37) to ground provides the bias current. The voltage at the ISET pin is 1 V and the reference current is 10 µA (1 V/100 k). The reference voltages for the ADC are REFP (2.05 V) and REFM (0.75 V). They are available on pins 38 and 39, respectively. The full-scale range of the ADC is twice the difference between REFP and REFM. Pins REFP and REFM should be heavily decoupled with appropriate capacitors (1 µF recommended). SERIAL INTERFACE Standard Functionality A simple three-wire (SCLK, SDIN, and SLOAD) serial interface is provided to allow writing/reading the internal registers of the VSP1221 VSP1221. The serial data SDIN (pin 47) is 16 bits long. The MSB (most significant bit) is set to 0 for writing to and to 1 for reading from the internal registers. Following this, there are five address bits for accessing and ten data bits for writing to the particular registers. During a read operation, data from the particular register is available on SDO (pin 1). To enable serial read/write, SLOAD (pin 46) should be pulled low. Sending blocks of 16-bit data to SDIN can program multiple registers. The polarity of the serial clock (SCLK, pin 48) can be controlled by SCKP (pin 45). For serial interface timing see the serial data format section; for serial data format and description of the internal registers see the register description section. TIMING A description of the different timing signals of the VSP1221 VSP1221 follows. The timing diagram in the sample and conversion timing section has additional information. Note that the polarity of SHP/SHD, ADCCLK, CLPDM, BLKG, and CLPOB can be programmed to be active low or active high (see the signal polarity register section). The timing diagram in the timing specifications section is based on active-low polarity. SHP, SHD, and ADCCLK SHP/SHD are used for correlated double sampling of the CCD signal. Sample reference (SHP) is used to sample the reference level of the CCD signal, and sample data (SHD) is used to sample the data level. The ADC clock (ADCCLK) is used to latch the output of the ADC to the external pins. SHP, SHD, and ADCCLK are used to generate internal timing signals using the on-chip timing generator for proper synchronization of different blocks. SHP, SHD, and ADCCLK can be internally delayed by programming the timing registers through the serial port (see the timing register 1 and timing register 2 sections. The following is recommended to get the best performance: SHP and SHD must first be aligned based on the CCD signal and timing shown in Figure 2 (tDSHP and tDSHD). It is observed that if output data switches at the instant of sampling (tDSHP), the device noise performance degrades. The data switches a few ns after the rising edge of ADCCLK (tOD). To improve performance, ADCCLK can be varied within the tADC_SHDrange. CLPDM The CCD signal is capacitively coupled to the VSP1221 VSP1221 because the dc level of the CCD signal is usually too high and might damage the chip. The purpose of the CLPDM signal is to clamp the ac-coupling capacitor Cin to establish the proper dc bias for the CDS. The dc bias for the CDS is set to the clamp voltage, which is around 800 mV below the supply voltage. The clamp voltage can be decoupled with an external capacitor at CLREF (pin 28). This helps in charging the ac-coupling capacitor Cin faster, since the charge will be provided by the decoupling capacitor. The recommended value for the decoupling capacitor is 1 µF. The dummy pixel clamp (CLPDM) signal is usually available during the dummy pixels of the CCD and is applied at the line rate of the CCD sensor. 16 www.ti.com VSP1221 VSP1221 SLES012A SLES012A ­ SEPTEMBER 2001 ­ REVISED JULY 2004 PRINCIPLES OF OPERATION (continued) BLKG Some CCDs have large transient output signals during blanking intervals. Such signals might drive the VSP1221 VSP1221 into saturation and can cause long recovery times. To prevent this, the VSP1221 VSP1221 has an input-blanking function which disconnects the CCD input from the CDS when it receives the blanking (BLKG) signal. Additionally, the output from the VSP1221 VSP1221 during blanking will be equal to the value programmed in the blanking register. The blanking level can be adjusted by programming the blanking register through the serial port (see the blanking register section). CLPOB The optical-black clamp (CLPOB) pulse is used for optical-black calibration (explained in the optical-black calibration section). The CLPOB pulse is given to the device during optical-black pixels of the CCD. OE Output enable (OE) is used to latch the output data to the output pins. When OE is low, data is latched to the output pins (D0-D11 D0-D11); when it is high, the output is 3-state. RESET When the reset (RESET) signal is pulled low (hardware reset), all the internal registers are reset to their default values. In addition, the device also has a software-reset option that allows setting the RTSY bit in the control register through the serial port (see the control register section). See the control register section for the default values of the internal registers. In addition to resetting the registers, hardware reset also resets the output of the OB DAC to zero. However, to exactly reset the OB DAC to zero, RESET must be kept low for approximately 600 ns. OPTICAL-BLACK CALIBRATION Optical-black calibration (OB) is used to clamp the CCD black level to the user-defined OB reference level. In CCDs, thermally generated electrons produce a significant amount of charge even at room temperature. So, even in the absence of light (black level), thermal electrons generate a considerable amount of current in CCDs. Thus, the CCD black level carries a residual signal, also known as the CCD offset, which is typically in the order of 50 mV. This residual signal reduces the effective dynamic range of the CCD input, resulting in a degradation of image quality. An offset voltage must be subtracted from the CCD black level so that the difference between the CCD black level and the offset voltage is equal to the reference OB level programmed by the user. The reference OB level is much lower than the CCD black level, so that the effective dynamic range of the CCD input increases and the image quality improves. The offset voltage has to be determined based on the CCD black level. There are certain CCD pixels which are not exposed to light (optical-black pixels) and the CCD signal corresponding to these pixels represent the CCD black level. Thus, the offset voltage is determined during the optical-black pixels, and the offset voltage is kept constant and is subtracted from the CCD input to cancel the CCD offset during normal image pixels. OB calibration in the VSP1221 VSP1221 is done in a closed feedback loop. The difference between the CCD black level and the offset voltage is compared with the user-defined OB reference level at the output of the digital PGA stage. The error is fed to an OB calibration circuit which generates a step proportional to the error and a sign based on the sign of the error. The step and the sign are then given to the OB DAC, which generates an analog voltage that updates the offset voltage at the input of the CDS. If the error is positive, the offset voltage is increased; if the error is negative, the offset voltage is decreased. This continues in a closed feedback loop until the difference between the CCD black level and the offset voltage converges to the OB reference level. The OB calibration circuit has been designed so that a 100-mV CCD black level converges to zeroreference OB level within 500-750 pixel clocks. Convergence time increases with an increase in gain. Convergence is faster if the CCD black level is smaller than 100 mV. A plot of the convergence time as a function of the PGA gain is shown in the performance plots section. Since the feedback loop includes the CDS, the PGA, and the ADC, it also cancels any offset introduced by these blocks. The OB reference level can be adjusted by programming the OB register through the serial port (see the OB register section). 17 VSP1221 VSP1221 SLES012A SLES012A ­ SEPTEMBER 2001 ­ REVISED JULY 2004 www.ti.com PRINCIPLES OF OPERATION (continued) STANDBY (POWER-DOWN MODE) To save power, the VSP1221 VSP1221 can be put into standby mode (power-down mode) both through hardware and software. Pulling the STBY signal low puts the device into standby mode (hardware power-down). In this mode, the reference is pulled down, all the functional blocks are disabled, the output is all zero, and the power dissipation is zero. The power-up time is of the order of 10 ms. Software power down can be exercised by resetting the STBYZ bit in the control register through the serial port (see the control register section). This is similar to hardware power down, except that the reference is not pulled down. Hence, the power dissipation is around 4 mW and the power-up time is of the order of 10 µs. The user can still program all the internal registers during both hardware and software power down. GENERAL PURPOSE DAC The VSP1221 VSP1221 has two 8-bit general-purpose digital-to-analog converters (DACs) that can be used for external analog settings. The output voltage of each DAC can be independently set and has a range of 0 V to the supply voltage with eight-bit resolution. The digital input to the DACs can be set by programming the User DAC1 and User DAC2 registers through the serial port (see the User DAC1 register and User DAC2 register sections). When not used in the system, the DACs can be put in standby mode by programming the above-mentioned registers. The DACs are, by default, in standby mode. The average power consumed by each DAC is approximately 1 mW. 18 VSP1221 VSP1221 www.ti.com SLES012A SLES012A ­ SEPTEMBER 2001 ­ REVISED JULY 2004 APPLICATION INFORMATION 3V 100 k 48 47 46 45 44 43 42 41 40 39 38 37 1 36 2 35 3 34 4 33 32 5 6 31 VSP1221 VSP1221 CFG2 SHD 25 13 14 15 16 17 18 19 20 21 22 23 24 CLPDM 26 12 SHP 27 11 BLKG 10 CLPOB 28 CFG1 9 DVDD 8 29 DVSS 30 ADCCLK 7 DIVDD DIVSS D0/SDO D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 0.1 µF DACO2 AVSS DACO1 AVDD TP2 0.22 µF Buffer PIN DIN TP1 0.22 µF CLREF AVDD 1 µF AVSS VSS 0.1 µF CLAMP SR SV OBCLP BLKG ADCCLK 0.1 µF CCDOUT ICX205 ICX205 (CCD) RG H1 H2 V1 V2A V2B V3 SUB 1µF REFP ISET REFM AVSS AVDD OE STBY RESET SCKP SLOAD SCLK SDIN 1µF 0.1 µF CXD2460 CXD2460 (Timing Generator) 0.1 µF Data Serial Interface Signal Processor Block PIXEL CLOCK LINE CLOCK FRAME CLOCK Figure 9. Application Diagram of the VSP1221 VSP1221 NOTE: The application circuits shown are typical examples of the operation of the devices. Texas Instruments cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third-pary patents and other rights due to the same. CCD INPUT The CCD output may need an off-chip external buffer in order to drive the input capacitive load of the VSP1221 VSP1221. The buffer output is applied to DIN (pin 30) through an ac-coupling capacitor. It is advisable to connect PIN (pin 31) to the buffer ground through a similar ac-coupling capacitor for the following reason: since the input stage of the VSP1221 VSP1221 is differential, the input to the CDS is the voltage difference between DIN and PIN. Hence, if the noise path for DIN and PIN are similar, the noise can be effectively cancelled. This is not the case if the noise paths are different. However, PIN can also be connected directly to ground.In this case, bit SD8 (CLAMPPIN) of the control register should be 1 (see the control register section). If PIN is connected to an ac-coupling capacitor, it is recommended to set bit SD8 (CLAMPPIN) of the control register to 0 so that the ac-coupling capacitor is charged to a fixed clamp voltage. The recommended value for the ac coupling capacitor is 0.22 µF. 19 VSP1221 VSP1221 SLES012A SLES012A ­ SEPTEMBER 2001 ­ REVISED JULY 2004 www.ti.com APPLICATION INFORMATION (continued) REFERENCE DECOUPLING Pins REFP (pin 38) and REFM (pin 39) should be connected to ground by means of decoupling capacitors. A 1-µF ceramic capacitor is recommended for reference decoupling. For better high-frequency decoupling, 0.1 µF ceramic capacitors may be used in parallel. The decoupling capacitors should be placed as close as possible to the reference pins. CLAMP DECOUPLING To decouple the clamp voltage, a 1-µF ceramic capacitor may be connected to CLREF (pin 28). See the CLPDMsection for further details. INTERNAL BIAS CURRENT SETTING To set the internal bias current, ISET (pin 37) should be connected to ground through a 100-k resistor. However, no capacitor should be connected to the ISET pin. POWER SUPPLY, GROUNDING, AND DEVICE DECOUPLING The VSP1221 VSP1221 has several power-supply pins. Each major internal analog block has a dedicated AVDD supply pin (pins 27, 33, and 40). The DVDD supply pin (pin 17) powers all internal digital circuitry. Both AVDD and DVDD work with 3-V power supplies. DIVDD and DIGND (pins 13 and 14) supply power to the output digital driver (D0-D11 D0-D11). DIVDD is independent of DVDD and can be operated from 1.8 V to 3.3 V. This allows the outputs to interface with digital ASICs requiring different supply voltages General design practices should apply to the PCB to limit high-frequency transients and noise that are fed back into the supply lines. This requires adequate bypassing of the supply pins. In the case of power supply decoupling, 0.1-µF ceramic capacitors are sufficient to keep the impedance low over a wide frequency range. Since their effectiveness depends largely on the proximity to the individual supply pin, all decoupling capacitors should be placed as close as possible to the supply pins. To reduce high-frequency and noise coupling, it is highly recommended to short the digital and analog grounds immediately outside the package. This can be accomplished by running a low-impedance line under the package between pins DVSS and AVSS. DATA OUTPUT It is recommended to keep the capacitive loading on the output data lines as low as possible (typically less than 15 pF). Larger capacitive loads demand higher charging-current surges, which can feed back into the analog portion of the VSP1221 VSP1221 and affect its performance. If the data lines are long, it is advisable to use external buffers or latches, which also provides the added benefit of isolating the VSP1221 VSP1221 from any digital noise that may couple back. In addition, resistors in series with each data line helps in minimizing the surge current. Typical resistor values are 40-50 . 20 VSP1221 VSP1221 www.ti.com SLES012A SLES012A ­ SEPTEMBER 2001 ­ REVISED JULY 2004 APPLICATION INFORMATION (continued) Optical Black Pixels Dummy Pixels Active Image Pixels N N+1 DIN (CCD IN) SHP SHD CLPOB BLKG CLPDM ADCCLK D0­D11 N-9 N-8 N-7 12 Clocks 12 Clocks OB Calibration Cycle A. OB Calibration latency is 12 clocks. So, OB update starts 12 clocks after CLPOB is pulled low and stops 12 clocks after CLPOB is pulled high. B. If active image pixels are located immediately after CLPOB goes high, the OB update will affect the adjacent 12 pixels. C. The device clocks are stopped during BLKG and CLPDM. Therefore, if these signals appear immediately after CLPOB goes high, the OB calibration update for the subsequent 12 clocks will stop. So, its recommended to delay BLKG and CLPDM by at least 12 pixels after CLPOB goes high. Figure 10. System Timing Diagram Example 21 VSP1221 VSP1221 www.ti.com SLES012A SLES012A ­ SEPTEMBER 2001 ­ REVISED JULY 2004 APPLICATION INFORMATION (continued) PERFORMANCE PLOTS INPUT-REFERRED NOISE vs GAIN RMS OUTPUT-REFERRED NOISE vs GAIN 180 20 RMS Output-Referred Noise - LSB Input-Referred Noise - µV 160 140 120 100 80 16 12 8 4 60 0 0 4 8 12 16 20 24 28 32 0 36 4 8 12 Gain - dB Figure 11. 36 32 28 PGA Act Gain - dB 20 Figure 12. PGA ACT GAIN vs REGISTER VALUE 24 20 16 12 8 4 0 1 101 201 301 401 501 PGA Gain Register Value Figure 13. 22 16 Gain - dB 601 701 24 28 32 36 VSP1221 VSP1221 www.ti.com SLES012A SLES012A ­ SEPTEMBER 2001 ­ REVISED JULY 2004 APPLICATION INFORMATION (continued) INL GRAPH 2 1.5 LSB 1 0.5 0 -0.5 -1 -1.5 0 1000 2000 3000 4000 3000 4000 Figure 14. DNL GRAPH 0.8 0.6 0.4 LSB 0.2 0 -0.2 -0.4 -0.6 -0.8 0 1000 2000 Figure 15. 23 VSP1221 VSP1221 www.ti.com SLES012A SLES012A ­ SEPTEMBER 2001 ­ REVISED JULY 2004 APPLICATION INFORMATION (continued) POWER CONSUMPTION vs FREQUENCY OPTICAL-BLACK-VALUE CONVERGENCE vs NUMBER OF ADCCLKs 800 Optical-Black-Value Convergence - LSB 900 80 Power Consumption - mW 85 75 70 65 60 55 50 45 600 500 400 300 200 100 0 40 5 12.5 f - Frequency - MHz Figure 16. 24 700 20 1 201 401 601 801 1001 Number of ADC Clocks Figure 17. 1201 PACKAGE OPTION ADDENDUM www.ti.com 26-Feb-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty VSP1221PFB VSP1221PFB NRND TQFP PFB 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR VSP1221PFBG4 VSP1221PFBG4 NRND TQFP PFB 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MTQF019A MTQF019A ­ JANUARY 1995 ­ REVISED JANUARY 1998 PFB (S-PQFP-G48 S-PQFP-G48) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 36 0,08 M 25 37 24 48 13 0,13 NOM 1 12 5,50 TYP 7,20 SQ 6,80 9,20 SQ 8,80 Gage Plane 0,25 0,05 MIN 0°­ 7° 1,05 0,95 Seating Plane 0,75 0,45 0,08 1,20 MAX 4073176 / B 10/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Falls within JEDEC MS-026 MS-026 POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DLP® Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2009, Texas Instruments Incorporated