NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: Package Diagram 28-Lead (300-Mil) Molded SOJ V21 Package Diagram 28-Lead (400-Mil) Molded SOJ V28 , CY7C1007B CY7C1007B is available in a standard 300-mil-wide SOJ. Logic Block Diagram Pin Configuration SOJ Top , Package Name V28 V28 V28 V28 V28 V28 V28 V28 V28 V28 Package Type 28-Lead (400-Mil) Molded ... | Original |
8 pages, |
CY7C107B CY7C1007B 1CY7C107B 1CY7C107B abstract |
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| Abstract: Package Diagram Plastic Small Outline J - Bend 20-Lead (300-Mil) Molded SOJ V5 24-Lead (300-Mil) Molded SOJ V13 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 28-Lead (400-Mil) Molded SOJ V28 2 Package Diagram 32-Lead (300-Mil) Molded SOJ V32 32-Lead (400-Mil) Molded SOJ V33 3 Package Diagram 44-Lead (400-Mil) Molded SOJ V34 36-Lead (400-Mil) Molded SOJ 4 ... | Original |
4 pages, |
Molded SOJ V34 datasheet abstract |
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| Abstract: Package Diagram Plastic Small Outline J - Bend 20-Lead (300-Mil) Molded SOJ V5 51-85029-A 24-Lead (300-Mil) Molded SOJ V13 51-85030-A 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 51-85031-B 51-85031-B 28-Lead (400-Mil) Molded SOJ V28 51-85032-A 2 Package Diagram 32-Lead (300-Mil) Molded SOJ V32 51-85041-A 32-Lead (400-Mil) Molded SOJ V33 51-85033-A 3 Package Diagram 44-Lead (400-Mil) Molded SOJ V34 51-85082-B 51-85082-B 36-Lead (400-Mil) Molded SOJ V36 ... | Original |
4 pages, |
V36 Package V32 Package V28 Package SOJ 24 85031 51-85082-B 51-85041-A soj 36 datasheet abstract |
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| Abstract: Package Diagram Plastic Small Outline J - Bend 20-Lead (300-Mil) Molded SOJ V5 24-Lead (300-Mil) Molded SOJ V13 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 28-Lead (400-Mil) Molded SOJ V28 2 Package Diagram 32-Lead (300-Mil) Molded SOJ V32 32-Lead (400-Mil) Molded SOJ V33 3 Package Diagram 44-Lead (400-Mil) Molded SOJ V34 36-Lead (400-Mil) Molded SOJ V36 4 ... | Original |
4 pages, |
V32 Package Molded SOJ V34 diode in 400 -400mil SOJ 24 V28 Package soj 36 datasheet abstract |
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| Abstract: Package Diagram Plastic Small Outline J - Bend 20-Lead (300-Mil) Molded SOJ V5 51-85029-A 24-Lead (300-Mil) Molded SOJ V13 51-85030-A 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 51-85031-B 51-85031-B 28-Lead (400-Mil) Molded SOJ V28 51-85032-A 2 Package Diagram 32-Lead (300-Mil) Molded SOJ V32 51-85041-A 32-Lead (400-Mil) Molded SOJ V33 51-85033-*B 3 Package Diagram 44-Lead (400-Mil) Molded SOJ V34 51-85082-B 51-85082-B 36-Lead (400-Mil) Molded SOJ V36 ... | Original |
4 pages, |
datasheet abstract |
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| Abstract: RODUCT B RIEF Block Diagram AFE V2.1 DFE-Q V2.1 DSP LIU U Protocol Processing Unit , General Purpose I/Os Ordering Code Type Package Sales Code Availability PEF 24911 H V2.1 , P RODUCT B RIEF IEC4-Q PEF 24911 V2.1 (DFE-Q) & PEF 24902 V2.1 (AFE) ISDN , (-40°C to +85°C) JTAG boundary scan P-MQFP-64 P-MQFP-64 package Part of the Infineon system solution , Features of the DFE-Q PEF 24911 V2.1 compared to V1.x Applications Max. IOM®-2 data rate 4 Mbit ... | Original |
2 pages, |
H6850 datasheet abstract |
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| Abstract: 3. Packing Type PSB 21525 N V2.1 PSB 21525 H V2.1 PSB 21525 F V2.1 PSF 21525 H V2.1 Ordering Code Q67100-H6672 Q67100-H6672 Q67100-H6671 Q67100-H6671 Q67100-H6733 Q67100-H6733 Q67233-H1032 Q67233-H1032 Package P-LCC-44 P-LCC-44 P-MQFP-44 P-MQFP-44 P-TQFP-44 P-TQFP-44 P-MQFP-44 P-MQFP-44 4. Product status Product PSB 21525 N/H/F PSF 21525 H 5. Diagram DIP21525 DIP21525.DOC Step , Manual 11/95 Delta Sheet V2.1 2/96 Delta Sheet (PSF 21525) 5/97 7. Development Tooling , package 8. Applications 8/97 Type of material T2152-5V10-M1-7600 T2152-5V10-M1-7600 Copy Copy Ordering number ... | Original |
2 pages, |
HSCX 82525 hdlc H659 TE 2161 datasheet abstract |
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| Abstract: 32-bit ARM9 MCU with embedded FlexRay v2.1 controller SJA2510 SJA2510 Take control of fast, reliable , running at up to 80 MHz Ã' 32-bit multi-layer AHB-lite bus Ã' 2-channel FlexRay v2.1 communications , Ã' Automotive qualified (AEC-Q100 AEC-Q100 Grade I) Ã' LQFP100 LQFP100, LQFP128 LQFP128 and LQFP144 LQFP144 package options Key benefits Ã' Fully compliant with FlexRay Protocol Specification v2.1 Ã' More usable memory and reduced , FlexRay v2.1 certified solutions Ã' Wide range of development environments , communication drivers ... | Original |
2 pages, |
TJA1080 LQFP144 LQFP128 LQFP100 ARM968E-S AEC-Q100 SJA2510 SJA2510 abstract |
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| Abstract: Diagram AFE V2.1 DFE-T V2.1 LIU U Protocol Processing Unit DSP 4B3T Encoder DAC U , Type Package Availability PEF 24901 H V2.1 P-MQFP-64 P-MQFP-64 Development PEB/F 24902 H V2.1 , P P RELIMINARY R O D U C T B R I E F IEC4-T PEF 24901 V2.1 (DFE-T) PEF 24902 V2.1 (AFE) ISDN Echocancellation Circuit 4-Channel for 4B3T Line Code The widely used ISDN 4-channel , P-MQFP-64 P-MQFP-64 package Part of the Infineon System Solution ISDN Add-On Features of the DFE-T PEF 24901 ... | Original |
2 pages, |
1TR220 datasheet abstract |
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| Abstract: parallelograms and EW balance Block Diagram 324 b^32Ã-S2 0G14407 0G14407 471 Panasonic Powered by ICminer.com , package at Ta=70°C. M Recommended Operating Range (Ta=25 tO Parameter Symbol Range Operating supply , 2.7 V V18-, 1.9 2.3 2.7 V Vl9- 1 1.9 2.3 2.7 V V20-I V20-I 1.9 2.3 2.7 V V21-, 1.9 2.3 2.7 V V22-I V22-I , quantity ¿le t V22 = open, at V21 = 5V-0V change -2.7 -2.1 -1.5 V Corner correction amount ¿3e c V21 =open , 8V V,a=2.5V - 0.3 0.5 Vp-p Standard RAMP output e R-TYP Vcc = 12V At V17, V2o, V21 =open - 0.3 0.5 ... | OCR Scan |
3 pages, |
diagram TA 306 8 pin ic AN5766K AN5766K abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| . Package Availability, Models, Samples & Pricing Part Number Package Status Models Samples & Electronic Orders Budgetary Pricing Std Pack Size Package Marking Type # pins SPICE IBIS Quantity $US each CLINK5V21BT-66 evaluation board Not recommended for new designs (as of 22-Jul-98) N/A N/A N Datasheet Package Availability, Models, Samples & Pricing Parametric Table for low EMI PLL requires no external components Low profile 48-lead TSSOP package Rising edge www.datasheetarchive.com/files/national/htm/nsc03802-v2.htm |
National | 28/06/2001 | 15.77 Kb | HTM | nsc03802-v2.htm |
| . Package Availability, Models, Samples & Pricing Part Number Package Status Models Samples & Electronic Orders Budgetary Pricing Std Pack Size Package Marking Type # pins SPICE IBIS Quantity $US each CLINK5V21BT-66 evaluation board Not recommended for new designs (as of 22-Jul-98) N/A N/A . N Generic P/N 90CR213 90CR213 90CR213 90CR213 Contents General Description Features Datasheet Package TSSOP package Rising edge data strobe Compatible with TIA/EIA-644 TIA/EIA-644 TIA/EIA-644 TIA/EIA-644 LVDS Standard www.datasheetarchive.com/files/national/htm/nsc02665-v2.htm |
National | 14/09/2000 | 15.37 Kb | HTM | nsc02665-v2.htm |
| have trouble printing, see Printing Problems . Package Availability, Models, Samples & Pricing Part Number Package Status Models Samples & Electronic Orders Budgetary Pricing Std Pack Size Package Marking Type # pins SPICE IBIS Quantity $US each CLINK5V21BT-66 evaluation board Not Contents General Description Features Datasheet Package Availability, Models, Samples TSSOP package Rising edge data strobe Compatible with TIA/EIA-644 TIA/EIA-644 TIA/EIA-644 TIA/EIA-644 LVDS Standard www.datasheetarchive.com/files/national/htm/nsc02304-v1.htm |
National | 13/08/1999 | 12.93 Kb | HTM | nsc02304-v1.htm |
| file(s). If you have trouble printing, see Printing Problems . Package Availability, Models, Samples & Pricing Part Number Package Status Models Samples & Electronic Orders Budgetary Pricing Std Pack Size Package Marking Type # pins SPICE IBIS Quantity $US each CLINK3V21BT-66 evaluation Generic P/N 90CR215 90CR215 90CR215 90CR215 Contents General Description Features Datasheet Package Low profile 48-lead TSSOP package Rising edge data strobe Compatible with TIA/EIA-644 TIA/EIA-644 TIA/EIA-644 TIA/EIA-644 LVDS www.datasheetarchive.com/files/national/htm/nsc02306-v1.htm |
National | 13/08/1999 | 13.58 Kb | HTM | nsc02306-v1.htm |
| . Max. Unit V S Supply Voltage 10.8 12 13.2 V I S Supply Current (V IN = 0, V C = 0.5V) 21 28 mA V REF 8199-01.EPS PIN CONNECTIONS DIP8 (Plastic Package) ORDER CODE : TDA8199 TDA8199 TDA8199 TDA8199 n STEREO CIRCUIT n DC VOLUME . I VOLUME CONTROL V . I 1 2 7 3 TDA8199 TDA8199 TDA8199 TDA8199 8199-02.EPS BLOCK DIAGRAM DESCRIPTION The TDA8199 TDA8199 TDA8199 TDA8199 is a monolithic integrated circuit in DIP8 package intented for TV applications. 1/4 ABSOLUTE MAXIMUM RATINGS APPLICATION DIAGRAM TDA8199 TDA8199 TDA8199 TDA8199 3/4 Information furnished is believed to be accurate and reliable. However, SGS www.datasheetarchive.com/files/stmicroelectronics/books/ascii/docs/1246.htm |
STMicroelectronics | 25/05/2000 | 7.59 Kb | HTM | 1246.htm |
| .8 12 13.2 V I S Supply Current (V IN = 0, V C = 0.5V) 21 28 mA V REF Reference C REF +V S LEFT INPUT 8199-01.EPS PIN CONNECTIONS DIP8 (Plastic Package) ORDER CONTROL V . I 1 2 7 3 TDA8199 TDA8199 TDA8199 TDA8199 8199-02.EPS BLOCK DIAGRAM DESCRIPTION The TDA8199 TDA8199 TDA8199 TDA8199 is a monolithic integrated circuit in DIP8 package intented for TV applications. 1/4 ABSOLUTE -07.EPS APPLICATION DIAGRAM TDA8199 TDA8199 TDA8199 TDA8199 3/4 Information furnished is believed to be accurate and www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/1246-v1.htm |
STMicroelectronics | 25/05/2000 | 7.18 Kb | HTM | 1246-v1.htm |
| Supply Voltage 10.8 12 13.2 V I S Supply Current (V IN = 0, V C = 0.5V) 21 28 mA V REF Reference Voltage DIP8 (Plastic Package) ORDER CODE : TDA8199 TDA8199 TDA8199 TDA8199 n STEREO CIRCUIT n DC VOLUME CONTROL n 12dB MAXIMUM GAIN 2 7 3 TDA8199 TDA8199 TDA8199 TDA8199 8199-02.EPS BLOCK DIAGRAM DESCRIPTION The TDA8199 TDA8199 TDA8199 TDA8199 is a monolithic integrated circuit in DIP8 package intented for TV applications. 1/4 ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value APPLICATION DIAGRAM TDA8199 TDA8199 TDA8199 TDA8199 3/4 Information furnished is believed to be accurate and reliable. However, SGS www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/1246-v2.htm |
STMicroelectronics | 14/06/1999 | 5.36 Kb | HTM | 1246-v2.htm |
| Supply Voltage 10.8 12 13.2 V I S Supply Current (V IN = 0, V C = 0.5V) 21 28 mA V REF Reference Voltage DIP8 (Plastic Package) ORDER CODE : TDA8199 TDA8199 TDA8199 TDA8199 n STEREO CIRCUIT n DC VOLUME CONTROL n 12dB MAXIMUM GAIN 2 7 3 TDA8199 TDA8199 TDA8199 TDA8199 8199-02.EPS BLOCK DIAGRAM DESCRIPTION The TDA8199 TDA8199 TDA8199 TDA8199 is a monolithic integrated circuit in DIP8 package intented for TV applications. 1/4 ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value APPLICATION DIAGRAM TDA8199 TDA8199 TDA8199 TDA8199 3/4 Information furnished is believed to be accurate and reliable. However, SGS www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/1246.htm |
STMicroelectronics | 02/04/1999 | 5.4 Kb | HTM | 1246.htm |
| Voltages 5V/25V part 5V/21V part 5V/12.5V part 5V/12V part 5V/12V part 5V/12V part 5V/12V 45 - 95 ns System performance Package available Older ceramic packages Latest generation ceramic and plastic packages Board space, volume Density 16 Kbit to 1 Mbit 1, 2, 8 and 16 higher density is achievable and low cost plastic packages can be used. Flash devices are housed in a variety of packages. Table 2 compares the features of the M2716F M2716F M2716F M2716F, the M2732AF M2732AF M2732AF M2732AF and the www.datasheetarchive.com/files/intel/products/design/specenvn/mil_mem1.htm |
Intel | 23/10/1996 | 24.12 Kb | HTM | mil_mem1.htm |
| Time V DD = 300 V I D = 4.5 A R G = 4.7 W V GS = 10 V 21 32 30 45 ns ns (di DESCRIPTION The Max220 TM package is a new high volume power package exibiting the same footprint as the industry standard TO-220, but designed to accomodate much larger silicon chips, normally supplied in bigger packages. The increased die capacity makes the respect to larger packages. APPLICATIONS n HIGH www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/4866-v1.htm |
STMicroelectronics | 02/04/1999 | 7.17 Kb | HTM | 4866-v1.htm |