500 MILLION PARTS FROM 12000 MANUFACTURERS

Datasheet Archive - Datasheet Search Engine

 

Direct from the Manufacturer

Part Manufacturer Description PDF Samples Ordering
946-A4V-2D-2C0-85E Honeywell Sensing and Control POSITION, LINEAR SENSOR-ULTRASONIC pdf Buy
946-A4V-2D-001-175E Honeywell Sensing and Control POSITION, LINEAR SENSOR-ULTRASONIC pdf Buy
946-A4V-2D-2C0-65E Honeywell Sensing and Control POSITION, LINEAR SENSOR-ULTRASONIC pdf Buy

Ultrasonic soldering circuit

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: the circuit with considering this point 3. Precautions for Soldering (1) In the case of flow , ) Solvent cleaning: Solvent temperature 45t or less Immersion for 3 minor less (2) Ultrasonic cleaning: The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output , confirm that doesnt occur any defect before starting the ultrasonic cleaning. (3) Applicable solvent , in actual using condition. 2. Precautions for Circuit design (1) The LED used in the Photocoupler ... OCR Scan
datasheet

2 pages,
78.9 Kb

ultrasonic circuit infrared lamp 80Seconds Ultrasonic soldering circuit ed03p ED-03P013 TEXT
datasheet frame
Abstract: Soldering Keep the following points in mind when soldering the capacitor by means of jet soldering or dip soldering: (a) Temporarily fixing resin Because chip tantalum capacitors are larger and subject to more , patterns on a printed circuit board may adversely affect the solderability. Pattern design (b) b a , in a short time. Component layout If many types of chip components are mounted on a printed circuit board that is to be soldered by means of jet soldering, solderability may not be uniform over the entire ... NEC / TOKIN
Original
datasheet

3 pages,
22.31 Kb

tokin multilayer ceramic capacitor TEXT
datasheet frame
Abstract: parts on the circuit such as shortening and opening,provide with proper means for preventing excessive , substances (ODS) under the Montreal Protocol is used in manufacturing process of Electronic Circuit , . Application or circuit diagram; noise suppression, resonance, etc. 6. Operating condition : pulse, frequency , on other components and circuit operation of device when the capacitor becomes short-circuited or open. There is an affect on the capacitor, when the other component or the circuit works irregularly ... Panasonic
Original
datasheet

14 pages,
125.82 Kb

ECQE4224KF Ultrasonic cleaner ECQP Series washing machine electric circuit VARISTOR etc 333 ECQP panasonic washing machine waveform output matsushita capacitor ECQE ULF 500vs panasonic ECQB Z ecq-ut ECQUV panasonic washing machine circuits ecqut Flux ULF 500VS Ultrasonic cleaner circuit diagram wiring diagram of sharp washing machine washing machine wiring diagram TEXT
datasheet frame
Abstract: Circuit 3. Radiation The ultrasonic sensor is installed on a table. Then, the relationship between , for continuously transmitting ultrasonic waves. Fig.13 is a pre-amp circuit that amplifies the ultrasonic receiving signal. Fig.14 is an ultrasonic pulse transmitting circuit. Vcc=12V Id=15mA 6 , Circuit 100k 8 11 MA40S4S MA40S4S 0.1 8 4 30k 5 PulseTransmission Circuit Ultrasonic , before ordering. Ultrasonic Sensor Application Manual Murata Manufacturing Co., Ltd ... muRata
Original
datasheet

17 pages,
1400.22 Kb

MA40E7R ultrasonic 40khz sensor test circuit application of ultrasonic sound waves ultrasonic sensor 200khz ultrasonic sensor 40khz murata ma400a1 ultrasonic sensor 40khz sine wave ultrasonic distance circuit design TLR312 Distance measurement MA40S4S car intrusion ultrasonic sensor ultrasonic car parking sensor MA40S4S MA40S4R Ultrasonic Piezoelectric murata MA40MF14-5B rain alarm CIRCUIT using IC 555 TEXT
datasheet frame
Abstract: a danger of 1. Unused terminals The No. 3 terminal is used with the circuit inside the relay , ) 2. Short across terminals Do not short circuit between terminals when relay is energized, since , Emax. Load Add a clamp diode to the load Load Add a CR snubber circuit to the load 2) Even if spike voltages generated at the load are limited with a clamp diode if the circuit wires are , products (e.g., MOS transistors and bipolar transistors), avoid ultrasonic cleansing if at all possible ... Panasonic
Original
datasheet

7 pages,
184.43 Kb

AQY21 AQW21 AQV112KL AQV10 AQY221 AQY221N3V AQY225R2 5 pin relay ic 2803 PCB layout Ultrasonic SWITCH AQV21 AQV252G AQV255GS photovoltaic mosfet driver ic a 4503 8 PIN AQY225R2V 2803 relay driver ic AQY212G2S TEXT
datasheet frame
Abstract: of other parts on the circuit such as shortening and opening, provide with proper means for , effects on other surrounding electronic circuit components and devices that would possibly cause damage. Proper safety measures should be taken using fail-safe protective circuit designs to help prevent other , , lighting fixture, etc 5. Application or circuit diagram; noise suppression, resonance, etc. 6. Operating , . Safety : There is an affect on other components and circuit operation of device when the capacitor ... Panasonic
Original
datasheet

14 pages,
379.24 Kb

TEXT
datasheet frame
Abstract: Ultrasonic Ceramic Sensors Ultrasonic Ceramic Sensors (Ultrasonic Ceramic Transducers) Type: U/H/S/Q/G Ultrasonic Ceramic Sensor consisting of a disc type/a bimorph type piezoelectric ceramic vibrator is a sensor for transmitting and receiving ultrasonic wave in the air. n Features l l , Precautions for Safety (See Page 231) Ultrasonic wave transmitter and receiver for; l Proximity switch for , meter. n Explanation of Part Numbers E F R Ultrasonic Ceramic Sensors n Ratings and ... Panasonic
Original
datasheet

5 pages,
619.41 Kb

ultrasonic water level sensor circuit diagram ultrasonic level sensor EFRRHB40K5 for garage door opener remote ultrasonic 100 khz transmitter Ultrasonic Ceramic Transducers ultrasonic distance circuit design ultrasonic parking Sensor ULTRASONIC parking system ultrasonic sensor for water meter 40 khz ultrasonic sensor 40 khz ultrasonic transmitter circuit diagram of sound sensor TEXT
datasheet frame
Abstract: Ultrasonic Ceramic Sensors Ultrasonic Ceramic Sensors (Ultrasonic Ceramic Transducers) Type: U/H/S/Q/G Ultrasonic Ceramic Sensor consisting of a disc type/a bimorph type piezoelectric ceramic vibrator is a sensor for transmitting and receiving ultrasonic wave in the air. s Features q q , ) Excellent temperature and humidity durability Small in size s Recommended Applications Ultrasonic wave , ) s Explanation of Part Numbers E F R Ultrasonic Ceramic Sensors s Ratings and ... Original
datasheet

5 pages,
597.59 Kb

EFRTQB40K5 piezoelectric receiver on automatic door opener system ultrasonic liquid level sensor circuit 40 khz ultrasonic receiver EFR-RSB40K ultrasonic receiver impedance ultrasonic 100 khz transmitter ultrasonic amplifier circuit diagram 20 kHz ultrasonic transmitter disc Piezoelectric Sensor circuit diagram of door alarm system ULTRASONIC parking system 40 khz ultrasonic sensor ultrasonic water level sensor EFR* ultrasonic ultrasonic distance circuit design circuit diagram ultrasonic level sensor TEXT
datasheet frame
Abstract: overheat protection circuit may operate to shut down output. However please avoid keeping such condition , instrument must be grounded. · Also the soldering dip basin must be grounded. (3) Use a soldering dip , cleaning. Ultrasonic cleaning : The influence to device by ultrasonic cleaning is different by the size of cleaning bath, ultrasonic power @ Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl , external area of the safety operation area shown by the derating curve, the overheat protection circuit may ... OCR Scan
datasheet

20 pages,
688.52 Kb

ultrasonic cleaning driving circuit T0-220 RCA4000 TEXT
datasheet frame
Abstract: reflow soldering. (The conditions under which the capacitor should be soldered with a soldering iron are explained in (2) Using a Soldering Iron. Because the capacitor is not designed to be soldered by means of laser beam soldering, VPS, or flow soldering, the conditions for these soldering methods are not explained in this document. (1) Reflow Soldering Keep the following points in mind when soldering the capacitor in a soldering oven with a hot plate: (a) Pattern design (in accordance with IEC1188 IEC1188) X G ... NEC / TOKIN
Original
datasheet

6 pages,
22.58 Kb

Ultrasonic soldering power Ultrasonic soldering circuit TEXT
datasheet frame

Archived Files

Abstract Saved from Date Saved File Size Type Download
qualification.2. When soldering iron is used, solder with the temperature at the tip of soldering iron: 260°C±10°C, the time of soldering : 3 seconds max. ,the power of soldering iron : 30W max. When it is soldered with soldering iron to the stem of the lead type, solder on 1 corner with the temperature at the tip of soldering iron : 350°C±10°C, the time of soldering : 5 seconds max., the power of soldering iron : 30W max.3. Notice that the allowed time of soldering with soldering iron
/datasheets/files/murata/products/data/a04x/p35e75f.txt
Murata 11/10/1996 2.29 Kb TXT p35e75f.txt
gold were used on the external lead part of the frame it would contaminate the circuit board soldering , this ball is then pressed on to the bonding pad and vibrated rapidly (in the ultrasonic range), causing simpler ultrasonic method, where the wire is sim- ply pressed onto the surface of the chip then vi- brated essential that wire bonds be secure throughout the lifetime of the circuit. To ensure that bonds are centers - wider than is usual - to suit high current circuits where wide circuit board tracks are used.
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/1736.htm
STMicroelectronics 20/10/2000 9.59 Kb HTM 1736.htm
because of gold were used on the external lead part of the frame it would contaminate the circuit board soldering bath, leading to possible reliability problems. Figure 2: After the wire bonding operation the , this ball is then pressed on to the bonding pad and vibrated rapidly (in the ultrasonic range), causing simpler ultrasonic method, where the wire is sim- ply pressed onto the surface of the chip then vi- brated essential that wire bonds be secure throughout the lifetime of the circuit. To ensure that bonds are
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/1736-v1.htm
STMicroelectronics 02/04/1999 7.58 Kb HTM 1736-v1.htm
because of gold were used on the external lead part of the frame it would contaminate the circuit board soldering bath, leading to possible reliability problems. Figure 2: After the wire bonding operation the , this ball is then pressed on to the bonding pad and vibrated rapidly (in the ultrasonic range), causing simpler ultrasonic method, where the wire is sim- ply pressed onto the surface of the chip then vi- brated essential that wire bonds be secure throughout the lifetime of the circuit. To ensure that bonds are
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/1736-v2.htm
STMicroelectronics 14/06/1999 7.54 Kb HTM 1736-v2.htm
used on the external lead part of the frame it would contaminate the circuit board soldering bath wire, this ball is then pressed on to the bonding pad and vibrated rapidly (in the ultrasonic range the simpler ultrasonic method, where the wire is sim- ply pressed onto the surface of the chip then therefore it is essential that wire bonds be secure throughout the lifetime of the circuit. To ensure that circuit board tracks are used. The metal frame de- sign of such packages reflects the care taken to
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/1736-v3.htm
STMicroelectronics 25/05/2000 9.4 Kb HTM 1736-v3.htm
devices which will be assembled on a printed circuit board without any special or additionnal process description - Recommended storage and shipping instructions - Soldering assembly recommendations - User SOLDERING ASSEMBLY RECOMMENDATIONS PCB pad design Non Solder Mask Defined Micro via under bump allowed PCB clean flux. ST's recommendations for Flip-Chip CSP board mounting are illustrated on the soldering sec max Time (min) 1 to 35C/s 2 to 55C/s 0 2 4 Fig. 6: Recommended soldering reflow profile for
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/7272.htm
STMicroelectronics 20/10/2000 18.62 Kb HTM 7272.htm
mount devices which will be assembled on a printed circuit board without any special or additionnal labelling description - Recommended storage and shipping instructions - Soldering assembly recommendations recommends the PCB design guidelines listed in table 1. SOLDERING ASSEMBLY RECOMMENDATIONS PCB pad design recommendations for Flip-Chip CSP board mounting are illustrated on the soldering reflow profile shown in figure to 35C/s 2 to 55C/s 0 2 4 Fig. 6: Recommended soldering reflow profile for Flip-Chip CSP mounting
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/7272-v1.htm
STMicroelectronics 18/08/2000 18.26 Kb HTM 7272-v1.htm
: Implementing Ultrasonic Ranging AN598 AN598 Description: Plastic Packaging and the Effects of Surface Mount Soldering Techniques Description: Totalizer for Designing for Dollars Simple Circuit Entries DD0046 DD0046 Description: A Simple Programmable Timer with Time Correction Circuit DD1003 DD1003 , Inverting Debounce Circuit DD2004 DD2004 Description
/datasheets/files/microchip/mchipweb/1010/appnote/listing/index.htm
Microchip 05/03/1998 154.02 Kb HTM index.htm
products to the payphone industry, TEK also specializes in circuit board, cable harness, wave soldering and Analog circuit interfacing to microcontrollers, PCB layout, FPGA design.   , detection, etc. Analog Circuits and Signal Processing, Mixed-signal circuit design, Systems' Control. We than forty circuit boards. Examples: Chinese railway systems route indicators; energy management equipment, Lightmeter, IR Communication Link, Ultra-Sonic Toothbrush, Data Aqusition and Network Interface
/datasheets/files/microchip/mchipweb/1010/consult/country/usa/neast/index.htm
Microchip 15/05/1998 96.23 Kb HTM index.htm
MONITORING SOLVE DASHED ENSURING TACHOMETER SIMULTANEOUSLY VALUES FIXED EFFECTIVE USED BACK DIVERSE CIRCUIT INDIVIDUAL DEGREE SIMULTANEOUSLY SIGNIFICANT REMEMBER SUBSTANTIALLY VALUES USED BACK CIRCUIT PRESENTS USEFUL SURPASSING FIXED VALUES EFFECTIVE STORED USED BACK FOLLOW CIRCUIT USEFUL RESETS OHMS GIVEN VALUE FACTORING EFFECTIVE CIRCUIT PRESENTS USEFUL PRODUCED 25MHZ 25MHZ OHMS REVERSE VALUE GIVES CONSIDERABLY USES ZERO GATE DEVOTED REGARDLESS DEVELOPING APPLICABLE APPROACH VALUES SIGNALS USED AMPLIFY READER CIRCUIT FORM
/datasheets/files/linear/lview3/parts-v1.edb
Linear 08/10/1998 5000.33 Kb EDB parts-v1.edb