NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: the circuit with considering this point 3. Precautions for Soldering (1) In the case of flow , ) Solvent cleaning: Solvent temperature 45t or less Immersion for 3 minor less (2) Ultrasonic cleaning: The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output , confirm that doesnt occur any defect before starting the ultrasonic cleaning. (3) Applicable solvent , in actual using condition. 2. Precautions for Circuit design (1) The LED used in the Photocoupler ... | OCR Scan |
2 pages, |
ultrasonic circuit infrared lamp 80Seconds Ultrasonic soldering circuit ed03p ED-03P013 ED-03P013 abstract |
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| Abstract: circuit, the equipment's required reliability must be considered and appropriate voltage derating must be performed. Leakage current can be increased by heat and mechanical stress of soldering. Turning on , Electrolytic Capacitor cannot be used as a non-polar unit. 7. Soldering 7.1. Pre-heating To obtain optimal reliability, lowering the heat shock during the soldering process is favorable. Capacitors should be pre-heated at 130-160°C for approximately 60 seconds. 7.2. Soldering The body of the capacitor should not ... | Original |
1 pages, |
NON POLAR capacitor NON POLAR electrolytic capacitor datasheet abstract |
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| Abstract: Soldering " shall not be applied to the Ceramic Resonators (Chip Type). 2.2"Ultrasonic Cleaning" and , 0.1 wt.% or less. 3.6 Post Soldering Cleaning (1) Application of ultrasonic cleaning is , circuit against deteriorations and failures of the Ceramic Resonators. 1.2 Operating Temperature Ranges , and the circuit design. Note: VRefer to "Standard Test Circuit Diagram" in the Catalog or the , acompanied by suprious resonances. Hence in the circuit, spurious oscillations or stop of oscillation may ... | Original |
2 pages, |
resonators "Ceramic Resonators" Ultrasonic welding circuit Ultrasonic welding circuit diagram datasheet abstract |
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| Abstract: the result of large leakage current or short circuit. It is recommended the following be taken into consideration when designing the circuit. 1. Circuit design (1) Failure rate The failure rate depends upon , ) PCB Processing Recommended Land Patterns and Reflow Soldering Conditions: Per NTP Specification , , brush cleaning, shower cleaning, vapor cleaning, and ultrasonic cleaning) If cleaning is carried out , ) Cleaning time . 5 minutes max. Ultrasonic cleaning This cleaning method is extremely ... | Original |
5 pages, |
tantalum capacitor soldering datasheet abstract |
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| Abstract: -6.2±1.0- ò -H io J TR4Ã--12 -Soldering Dot UNIT:mm Waitrony Ultrasonic Transducer TR40-12 TR40-12 Sound , Waitrony Ultrasonic Transducer TR40-12 TR40-12 1. General Description The T40-12 T40-12 and R40-12 R40-12 are matched pair ultrasonic transmitter and receiver respectively operated at 40kHz center frequency with 012.6mm , Operating Temperature Topr -30 - +80 °C Storage Temperature *2 Tstg -40 - +90 °C Soldering Temperature *3 , 30 40 50 Frequency (kHz) Equivalent Circuit R L fj Hh Cb Directivity Diagram Angular ... | OCR Scan |
2 pages, |
ultrasonic transducer circuit r40 16 ultrasonic 40KHZ ULTRASONIC transducers 40khz ultrasonic transducer receiver 40KHZ ULTRASONIC car alarm R4016 T40 12 ultrasonic 40KHz Ultrasonic pair circuit diagram of transducer T40-16 ultrasonic transducer piezoelectric transducer 40khz TR40-12 T40-12 TR40-12 abstract |
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| Abstract: Ultrasonic Ceramic Sensors Ultrasonic Ceramic Sensors (Ultrasonic Ceramic Transducers) Type: U/H/S/Q Ultrasonic Ceramic Sensor consisting of a disc type/a bimorph type piezoelectric ceramic vibrator is a sensor for transmitting and receiving ultrasonic wave in the air. s Features q q q q , Applicable to multi-function remote control system because of its wide bandwidth Ultrasonic wave , Design No. Nominal Product Code EFR Applications Type Ultrasonic R For ... | Original |
5 pages, |
ultrasonic sensor ultrasonic range meter EFRTQB40K5 EFRTUB25K5 ultrasonic amplifier circuit diagram ultrasonic liquid level sensor circuit construction of ultrasonic transmitter disc Piezoelectric Sensor ultrasonic transducers EFRTSB40K5 ultrasonic receiver diagram Ultrasonic transmitter receiver datasheet abstract |
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| Abstract: process before soldering. If stress is given during processing, It may cause non-lighting failure. To be fixed d j 3 .ASSEMBLY ON PC BOARD 3-1) In case of soldering on PCB, If the operation is done with stress, it may cause non-lighting failure during soldering or using. n n L 3-2) Therefore please , PRODUCTS Visual Light Emitting Diodes TYPE SLI-343 SLI-343 Series PAGE / 4. SOLDERING (Sn-3Ag-0.5Cu) 4-1 ) Please make soldering rapidly under the following temperature and time conditions. 4-2) Please avoid ... | OCR Scan |
2 pages, |
TSZ221U-04 TSZ22111 SLI-343 C125 SLI-343 abstract |
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| Abstract: (1) Soldering conditions (soldering temperature and soldering time) (2) Leakage currentÂtoÂvoltage , considerably depending on the conditions of usage (ambient temperature, applied voltage, circuit resistance). , function of circuit resistance (/V) 9 TCFG series Tantalum capacitors (5) External temperature , dielectric and cause a short circuit. Notes: 1. Please be aware that when case size is changed, maximum , ) Ultrasonic cleaning Carry out cleaning under the mildest conditions possible. The internal element of a ... | Original |
12 pages, |
Tantalum SR SERIES electrolytic capacitors c series transistor equivalent table Semiconductor Technology ultrasonic Temperature FUSE datasheet abstract |
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| Abstract: process before soldering. If stress is given during processing, It may cause non-lighting failure. To be fixed 3.ASSEMBLY ON PC BOARD 3-1) In case of soldering on PCB, if the operation is done with stress, it may cause non-lighting failure during soldering or using. Ã- 3-2) Therefore , SLA580 SLA580 Serise 4.SOLDERINGSn-3Ag-0.5Cu 4-1) Please make soldering rapidly under the following temperature and time conditions. 4-2) Please avoid stress to LED lamp during soldering. 4-3) Recommendable ... | Original |
2 pages, |
SLA580 SLA580 abstract |
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| Abstract: processing position, and process the reverse side of LED body. Please process before soldering. If stress , BOARD 3-1) In case of soldering on PCB, If the operation is done with stress, it may cause non-lighting failure during soldering or using. Ã- 3-2) Therefore please design holes of PCB suitable for , Series 4.SOLDERINGSn-3Ag-0.5Cu 4-1) Please make soldering rapidly under the following temperature and time conditions. 4-2) Please avoid stress to LED lamp during soldering. 4-3) Recommendable soldering ... | Original |
2 pages, |
SLI-343 125MAX SLI-343 abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
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| . Even if it endures during a short time, it causes dagradation of qualification.2. When soldering iron is used, solder with the temperature at the tip of soldering iron: 260°C±10°C, the time of soldering : 3 seconds max. ,the power of soldering iron : 30W max. When it is soldered with soldering iron to the stem of the lead type, solder on 1 corner with the temperature at the tip of soldering iron : 350°C±10°C, the time of soldering : 5 seconds max., the power of soldering iron www.datasheetarchive.com/files/murata/products/data/a04x/p35e75f.txt |
Murata | 11/10/1996 | 2.29 Kb | TXT | p35e75f.txt |
| The component may be damaged if excess mechanical stress is applied. Please do not apply excess mechanical stress to the component and lead terminals at soldering. Conformal coating of the should be evaluated to confirm stable electrical characteristics are maintained. Ultrasonic stop oscillation may occur under unmatched circuit conditions. In case of the balk component, dry heating treatment (130 (degree C) for 5 hours min.)is regared before reflow soldering. Then, the www.datasheetarchive.com/files/murata/products/data/a07x/e82g1503.txt |
Murata | 22/07/1997 | 0.88 Kb | TXT | e82g1503.txt |
| gold were used on the external lead part of the frame it would contaminate the circuit board soldering - grated circuits (ICs) capable of replacing relays, driving directly lamps, motors and solenoids. These . Figure 1: Part of an almost completed strip of integrated circuits utilizing the new mixed bonding , this ball is then pressed on to the bonding pad and vibrated rapidly (in the ultrasonic range), causing simpler ultrasonic method, where the wire is sim- ply pressed onto the surface of the chip then vi- brated www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/1736-v1.htm |
STMicroelectronics | 02/04/1999 | 7.58 Kb | HTM | 1736-v1.htm |
| gold were used on the external lead part of the frame it would contaminate the circuit board soldering - grated circuits (ICs) capable of replacing relays, driving directly lamps, motors and solenoids. These . Figure 1: Part of an almost completed strip of integrated circuits utilizing the new mixed bonding , this ball is then pressed on to the bonding pad and vibrated rapidly (in the ultrasonic range), causing simpler ultrasonic method, where the wire is sim- ply pressed onto the surface of the chip then vi- brated www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/1736-v2.htm |
STMicroelectronics | 14/06/1999 | 7.54 Kb | HTM | 1736-v2.htm |
| contaminate the circuit board soldering bath, leading to possible reliability problems. Figure 2: After the availability of high power inte- grated circuits (ICs) capable of replacing relays, driving of an almost completed strip of integrated circuits utilizing the new mixed bonding technol- ogy bonding pad and vibrated rapidly (in the ultrasonic range), causing the gold ball and silicon surface to weld together. The thicker aluminum wires are bonded using the simpler ultrasonic method www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/1736-v3.htm |
STMicroelectronics | 25/05/2000 | 9.4 Kb | HTM | 1736-v3.htm |
| used on the external lead part of the frame it would contaminate the circuit board soldering bath for vehicles is the availability of high power inte- grated circuits (ICs) capable of replacing almost completed strip of integrated circuits utilizing the new mixed bonding technol- ogy. The gold and wire, this ball is then pressed on to the bonding pad and vibrated rapidly (in the ultrasonic range the simpler ultrasonic method, where the wire is sim- ply pressed onto the surface of the chip then www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/1736.htm |
STMicroelectronics | 20/10/2000 | 9.59 Kb | HTM | 1736.htm |
| considered as new surface mount devices which will be assembled on a printed circuit board without any specifications and labelling description - Recommended storage and shipping instructions - Soldering assembly the PCB design guidelines listed in table 1. SOLDERING ASSEMBLY RECOMMENDATIONS PCB pad design Non -Chip CSP board mounting are illustrated on the soldering reflow profile shown in figure 6 below to 55C/s 0 2 4 Fig. 6: Recommended soldering reflow profile for Flip-Chip CSP mounting on PCB www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/7272.htm |
STMicroelectronics | 20/10/2000 | 18.62 Kb | HTM | 7272.htm |
| assembled on a printed circuit board without any special or additionnal process steps required. In - Recommended storage and shipping instructions - Soldering assembly recommendations - User responsability Microelectronics recommends the PCB design guidelines listed in table 1. SOLDERING ASSEMBLY RECOMMENDATIONS soldering reflow profile shown in figure 6 below. recommended (N2 or N2H2) Recommended:Tpeak = 2305C 2305C 2305C 2305C : Recommended soldering reflow profile for Flip-Chip CSP mounting on PCB APPLICATION NOTE 7 /8 Dwell time www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/7272-v1.htm |
STMicroelectronics | 18/08/2000 | 18.26 Kb | HTM | 7272-v1.htm |
| and a new mixed bonding technology. Bipolar technology has been adopted for these circuits - rather on the external leads, which could contami- nate soldering baths, causing reliability problems on vibrated rapidly (in the ultrasonic range), causing the gold ball and silicon surface to weld together. The thicker aluminum wires are bonded using the simpler ultrasonic method, where the wire is sim -icing heater. All of these inte- grated circuits are available today. Pure bipolar technology is used only www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/1667.htm |
STMicroelectronics | 20/10/2000 | 16.18 Kb | HTM | 1667.htm |
| technology. Bipolar technology has been adopted for these circuits - rather than the "BCD" mixed bipolar economy and partly to avoid gold on the external leads, which could contami- nate soldering baths, causing and vibrated rapidly (in the ultrasonic range), causing the gold ball and silicon surface to weld together. The thicker aluminum wires are bonded using the simpler ultrasonic method, where the wire is sim de-icing heater. All of these inte- grated circuits are available today. Pure bipolar technology is www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/1667-v1.htm |
STMicroelectronics | 02/04/1999 | 14 Kb | HTM | 1667-v1.htm |