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Ultrasonic soldering circuit

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Abstract: the circuit with considering this point 3. Precautions for Soldering (1) In the case of flow , ) Solvent cleaning: Solvent temperature 45t or less Immersion for 3 minor less (2) Ultrasonic cleaning: The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output , confirm that doesnt occur any defect before starting the ultrasonic cleaning. (3) Applicable solvent , in actual using condition. 2. Precautions for Circuit design (1) The LED used in the Photocoupler ... OCR Scan
datasheet

2 pages,
78.9 Kb

ultrasonic circuit infrared lamp 80Seconds Ultrasonic soldering circuit ed03p ED-03P013 ED-03P013 abstract
datasheet frame
Abstract: reflow soldering. (The conditions under which the capacitor should be soldered with a soldering iron are explained in (2) Using a Soldering Iron. Because the capacitor is not designed to be soldered by means of laser beam soldering, VPS, or flow soldering, the conditions for these soldering methods are not explained in this document. (1) Reflow Soldering Keep the following points in mind when soldering the capacitor in a soldering oven with a hot plate: (a) Pattern design (in accordance with IEC1188 IEC1188) X G ... Original
datasheet

6 pages,
22.58 Kb

Ultrasonic soldering power Ultrasonic soldering circuit datasheet abstract
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Abstract: Ultrasonic Ceramic Sensors Ultrasonic Ceramic Sensors (Ultrasonic Ceramic Transducers) Type: U/H/S/Q/G Ultrasonic Ceramic Sensor consisting of a disc type/a bimorph type piezoelectric ceramic vibrator is a sensor for transmitting and receiving ultrasonic wave in the air. s Features q q , ) Excellent temperature and humidity durability Small in size s Recommended Applications Ultrasonic wave , ) s Explanation of Part Numbers E F R Ultrasonic Ceramic Sensors s Ratings and ... Original
datasheet

5 pages,
597.59 Kb

EFRTQB40K5 EFRTGB38K1 ultrasonic amplifier circuit diagram ultrasonic distance meter diagram Ultrasonic Distance proximity sensor 40 khz ultrasonic sensor ultrasonic receiver impedance Ultrasonic soldering circuit EFR* ultrasonic 40 khz ultrasonic receiver 20 kHz ultrasonic transmitter datasheet abstract
datasheet frame
Abstract: Ultrasonic Ceramic Sensors Ultrasonic Ceramic Sensors (Ultrasonic Ceramic Transducers) Type: U/H/S/Q/G Ultrasonic Ceramic Sensor consisting of a disc type/a bimorph type piezoelectric ceramic vibrator is a sensor for transmitting and receiving ultrasonic wave in the air. n Features l l , Precautions for Safety (See Page 231) Ultrasonic wave transmitter and receiver for; l Proximity switch for , meter. n Explanation of Part Numbers E F R Ultrasonic Ceramic Sensors n Ratings and ... Original
datasheet

5 pages,
619.41 Kb

ultrasonic water level sensor 40 khz ultrasonic transmitter circuit diagram of sound sensor circuit diagram ultrasonic level sensor EFRRHB40K5 for garage door opener remote ultrasonic 100 khz transmitter Ultrasonic Ceramic Transducers ultrasonic parking Sensor ULTRASONIC parking system ultrasonic sensor for water meter datasheet abstract
datasheet frame
Abstract: circuit, the equipment's required reliability must be considered and appropriate voltage derating must be performed. Leakage current can be increased by heat and mechanical stress of soldering. Turning on , Electrolytic Capacitor cannot be used as a non-polar unit. 7. Soldering 7.1. Pre-heating To obtain optimal reliability, lowering the heat shock during the soldering process is favorable. Capacitors should be pre-heated at 130-160°C for approximately 60 seconds. 7.2. Soldering The body of the capacitor should not ... Original
datasheet

1 pages,
39.42 Kb

NON POLAR capacitor NON POLAR electrolytic capacitor datasheet abstract
datasheet frame
Abstract: High Voltage Ceramic Capacitors Notice s Notice (Soldering and Mounting) Cleaning (ultrasonic cleaning) To perform ultrasonic cleaning, observe the following conditions. Rinse bath capacity : Output of , our · Please read rating and ! CAUTION storage, operating, rating, soldering, mounting and handling , Excessive ultrasonic cleaning may lead to fatigue destruction of the lead wires. s Notice (Rating , product in a strict time constant circuit. 2. DEB/DEC series (Temp. Char. B, E, F) Capacitors have an ... Original
datasheet

1 pages,
19.13 Kb

datasheet abstract
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Abstract: Soldering " shall not be applied to the Ceramic Resonators (Chip Type). 2.2"Ultrasonic Cleaning" and , 0.1 wt.% or less. 3.6 Post Soldering Cleaning (1) Application of ultrasonic cleaning is , circuit against deteriorations and failures of the Ceramic Resonators. 1.2 Operating Temperature Ranges , and the circuit design. Note: VRefer to "Standard Test Circuit Diagram" in the Catalog or the , acompanied by suprious resonances. Hence in the circuit, spurious oscillations or stop of oscillation may ... Original
datasheet

2 pages,
84.05 Kb

resonators "Ceramic Resonators" Ultrasonic welding circuit Ultrasonic welding circuit diagram datasheet abstract
datasheet frame
Abstract: Soldering Keep the following points in mind when soldering the capacitor by means of jet soldering or dip soldering: (a) Temporarily fixing resin Because chip tantalum capacitors are larger and subject to more , patterns on a printed circuit board may adversely affect the solderability. Pattern design (b) b a , in a short time. Component layout If many types of chip components are mounted on a printed circuit board that is to be soldered by means of jet soldering, solderability may not be uniform over the entire ... Original
datasheet

3 pages,
22.31 Kb

datasheet abstract
datasheet frame
Abstract: the result of large leakage current or short circuit. It is recommended the following be taken into consideration when designing the circuit. 1. Circuit design (1) Failure rate The failure rate depends upon , ) PCB Processing Recommended Land Patterns and Reflow Soldering Conditions: Per NTP Specification , , brush cleaning, shower cleaning, vapor cleaning, and ultrasonic cleaning) If cleaning is carried out , ) Cleaning time . 5 minutes max. Ultrasonic cleaning This cleaning method is extremely ... Original
datasheet

5 pages,
638.07 Kb

tantalum capacitor soldering Ultrasonic soldering circuit datasheet abstract
datasheet frame
Abstract: -6.2±1.0- ò -H io J TR4--12 -Soldering Dot UNIT:mm Waitrony Ultrasonic Transducer TR40-12 TR40-12 Sound , Waitrony Ultrasonic Transducer TR40-12 TR40-12 1. General Description The T40-12 T40-12 and R40-12 R40-12 are matched pair ultrasonic transmitter and receiver respectively operated at 40kHz center frequency with 012.6mm , Operating Temperature Topr -30 - +80 °C Storage Temperature *2 Tstg -40 - +90 °C Soldering Temperature *3 , 30 40 50 Frequency (kHz) Equivalent Circuit R L fj Hh Cb Directivity Diagram Angular ... OCR Scan
datasheet

2 pages,
123.06 Kb

40khz ultrasonic transducer receiver ultrasonic 40 khz transducer r40 16 ultrasonic circuit diagram of transducer 40KHZ ULTRASONIC car alarm R4016 40KHz Ultrasonic pair T40 12 ultrasonic T40-16 ultrasonic transducer 40 khz ultrasonic transducer piezoelectric transducer 40khz TR40-12 TR40-12 abstract
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Over 1.1 million files (1986-2014): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer.
 
Even if it endures during a short time, it causes dagradation of qualification.2. When soldering iron is used, solder with the temperature at the tip of soldering iron: 260°C±10°C, the time of soldering : 3 seconds max. ,the power of soldering iron : 30W max. When it is soldered with soldering iron to the stem of the lead type, solder on 1 corner with the temperature at the tip of soldering iron : 350°C±10°C, the time of soldering : 5 seconds max., the power of soldering iron
www.datasheetarchive.com/files/murata/products/data/a04x/p35e75f.txt
Murata 11/10/1996 2.29 Kb TXT p35e75f.txt
part of the frame it would contaminate the circuit board soldering bath, leading to possible , this ball is then pressed on to the bonding pad and vibrated rapidly (in the ultrasonic range using the simpler ultrasonic method, where the wire is sim- ply pressed onto the surface of the chip motive ICs therefore it is essential that wire bonds be secure throughout the lifetime of the circuit high current circuits where wide circuit board tracks are used. The metal frame de- sign of such
www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/1736-v3.htm
STMicroelectronics 25/05/2000 9.4 Kb HTM 1736-v3.htm
used on the external lead part of the frame it would contaminate the circuit board soldering bath wire, this ball is then pressed on to the bonding pad and vibrated rapidly (in the ultrasonic range the simpler ultrasonic method, where the wire is sim- ply pressed onto the surface of the chip then therefore it is essential that wire bonds be secure throughout the lifetime of the circuit. To ensure that circuit board tracks are used. The metal frame de- sign of such packages reflects the care taken to
www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/1736.htm
STMicroelectronics 20/10/2000 9.59 Kb HTM 1736.htm
external lead part of the frame it would contaminate the circuit board soldering bath, leading to possible the bonding pad and vibrated rapidly (in the ultrasonic range), causing the gold ball and silicon surface to weld together. The thicker aluminum wires are bonded using the simpler ultrasonic method, where secure throughout the lifetime of the circuit. To ensure that bonds are correctly executed some parts are usual - to suit high current circuits where wide circuit board tracks are used. The metal frame de- sign
www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/1736-v1.htm
STMicroelectronics 02/04/1999 7.58 Kb HTM 1736-v1.htm
external lead part of the frame it would contaminate the circuit board soldering bath, leading to possible the bonding pad and vibrated rapidly (in the ultrasonic range), causing the gold ball and silicon surface to weld together. The thicker aluminum wires are bonded using the simpler ultrasonic method, where secure throughout the lifetime of the circuit. To ensure that bonds are correctly executed some parts are usual - to suit high current circuits where wide circuit board tracks are used. The metal frame de- sign
www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/1736-v2.htm
STMicroelectronics 14/06/1999 7.54 Kb HTM 1736-v2.htm
considered as new surface mount devices which will be assembled on a printed circuit board without any specifications and labelling description - Recommended storage and shipping instructions - Soldering assembly design guidelines listed in table 1. SOLDERING ASSEMBLY RECOMMENDATIONS PCB pad design Non Solder Flip-Chip CSP board mounting are illustrated on the soldering reflow profile shown in figure 6 below. 35C/s 2 to 55C/s 0 2 4 Fig. 6: Recommended soldering reflow profile for Flip-Chip CSP mounting
www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/7272-v1.htm
STMicroelectronics 18/08/2000 18.26 Kb HTM 7272-v1.htm
will be assembled on a printed circuit board without any special or additionnal process steps description - Recommended storage and shipping instructions - Soldering assembly recommendations - User recommends the PCB design guidelines listed in table 1. SOLDERING ASSEMBLY RECOMMENDATIONS PCB pad design recommendations for Flip-Chip CSP board mounting are illustrated on the soldering reflow profile shown in figure to 35C/s 2 to 55C/s 0 2 4 Fig. 6: Recommended soldering reflow profile for Flip-Chip CSP mounting
www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/7272.htm
STMicroelectronics 20/10/2000 18.62 Kb HTM 7272.htm
the Effects of Surface Mount Soldering Techniques 8/26/1997 AN690 AN690 AN690 AN690 I²C™ Memory AN717 AN717 AN717 AN717 Building a 10-Bit Bridge Sensing Circuit Using the PIC16C6XX PIC16C6XX PIC16C6XX PIC16C6XX and MCP601Operational Amplifier AN594 AN594 AN594 AN594 Using the CCP Modules 8/26/1997 AN597 AN597 AN597 AN597 Implementing Ultrasonic Ranging 8/26
www.datasheetarchive.com/files/microchip/1010/suppdoc/appnote/product/picmicro/pic16/index-vx2.htm
Microchip 06/06/2002 136.3 Kb HTM index-vx2.htm
the Effects of Surface Mount Soldering Techniques 8/26/1997 AN690 AN690 AN690 AN690 I²C™ Memory AN717 AN717 AN717 AN717 Building a 10-Bit Bridge Sensing Circuit Using the PIC16C6XX PIC16C6XX PIC16C6XX PIC16C6XX and MCP601Operational Amplifier AN594 AN594 AN594 AN594 Using the CCP Modules 8/26/1997 AN597 AN597 AN597 AN597 Implementing Ultrasonic Ranging 8/26
www.datasheetarchive.com/files/microchip/1010/suppdoc/appnote/product/picmicro/pic16/index.htm
Microchip 06/06/2002 139.93 Kb HTM index.htm
, ultrasonic and optics. ADL can also arrange and coordinate overseas manufacturing for their clients for experience to handle a variety of technical issues, from simple software and circuit designs to complex , fabrication, stuffing, soldering, performance testing, and manufacturing support. I have many years /printed circuit boards and all documentation necessary for volume production. Recent experience
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Microchip 06/06/2002 87.16 Kb HTM index-vx2.htm