U2781B U2782B U2783B U2784B U2790B U2791B U2793B U2794B U2797B U2795B U2796B - Datasheet Archive

 

Data Book 1996 TELEFUNKEN Semiconductors TELEFUNKEN Semiconductors Contents General Information . . . . . . . . . . . . . . . . .

 

RF ICs for Wireless Communications Data Book 1996 TELEFUNKEN Semiconductors TELEFUNKEN Semiconductors Contents General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TEMIC's Commitment to the World of Telecommunication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IC Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I/Q Modulators and Demodulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Mixers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Up-Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PLLs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CT2 Chip Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Assembly Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Quality Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Packaging Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Dimensions in mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PLLs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . U2781B U2781B­FS: Frequency Synthesizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . U2782B U2782B­FS: 1100 MHz Twin PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . U2783B U2783B­FS: 1250 MHz / 400 MHz Twin PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . U2784B U2784B­BFS: 2200 MHz / 200 MHz Twin PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (De)-Modulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . U2790B U2790B: 1000 MHz Quadrature Modulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . U2791B U2791B: 1000 MHz Quadrature Demodulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . U2793B U2793B­FS: 300 MHz Quadrature Modulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . U2794B U2794B: 1000 MHz Quadrature Demodulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . U2797B U2797B: 1000 MHz Quadrature Modulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Mixers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . U2795B U2795B­FP: 2.5 GHZ Double­Balanced Mixer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . U2796B U2796B­FP: 2 GHz Single Balanced Mixer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Up-Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . U2891B U2891B: 2.5 GHz Quadrature Up­Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CT2 Chip Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . U2760B U2760B: CT2 RX/TX IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . U2783B U2783B­FS: 1250 MHz / 400 MHz Twin PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . U3770M U3770M: CT2 I/Q Modulator and Clock Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . U7001BG U7001BG: CT2 Front End IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Issue: 11.95 1 1 3 3 4 5 5 6 7 8 9 10 12 15 17 25 32 39 47 49 60 70 78 88 100 102 114 124 126 132 134 141 142 147 157 TELEFUNKEN Semiconductors TEMIC's Commitment to the World of Telecommunication The Semiconductor Division of TEMIC integrates the products, technologies and resources of leading semiconductor manufacturers into a unified organization conceived for today's worldwide electronics market. With a technology portfolio which includes bipolar, BICMOS, GaAs, CMOS and DMOS processes, TEMIC Semiconductors provides a unique set of components and solutions for the telecommunications industry. * * All basic electronic functions control and compute, memory, interfacing and power management are addressed by TEMIC. While each entity has its specific background and specialities, TEMIC will continuously develop the synergy between its set of technologies and products in order to offer innovative and effective solutions for communication networks as well as desktops or mobile terminals. Communication systems, whether using analog or digital transmission techniques, rely heavily on advanced semiconductor technologies for realization of the complex VLSI and low-power analog integrated circuits used within them. TEMIC is able to provide the process technologies, a strong application experience and the innovative design necessary to achieve maximum performance and integration goals while ensuring that minimum power consumption is obtained for optimum portable operation. From analog processing of the microphone signals right to the way through to the UHF antenna output (and, of course, for the return path to the earphone), TEMIC integration skills are in evidence. These also include DSP functions, control, displays and the human interface where high levels of very low-power integration are Issue: 11.95 achieved through use of advanced manufacturing processes provided by the TEMIC group. For even higher integration, TEMIC can provide subassemblies or multi-chip module, to reduce further the size, weight and power consumption of mobile communication equipment (as well as reducing cost and improving overall reliability). TEMIC is a leading producer of application-specific semiconductors for high-volume applications. Using bipolar, BICMOS and GaAs technologies, Telefunken Semiconductors develops and delivers a broad range of Application-Specific Standard Products (ASSPs) including integrated circuits as well as optoelectronic components and discrete components. Its portfolio of technologies and experience fits the present and upcoming needs of telecommunications well, from optoelectronic interface and drivers to fast analog and analog-digital signal processing up to RF. Fast switching and protection, high-frequency processing, analog-digital interfacing and infrared transmission are also part of TEMIC's offering for telecommunications. * Small size is achieved by SMD packaging, low-power technologies and high-level integration replacing many components and manual adjustments as well as characterizing outstanding features of the advanced product developments for battery-powered, portable communication devices. In this data book you will find TEMIC Telefunken Semiconductors ICs for RF telecommunications. These ICs are designed for different applications, e.g., GSM, DAMPS, DCS1800 DCS1800, PCS, PDC, CT0, CT1 and CT2. To simplify the search for the right device, please refer to the selection guide (see table 1). 1 2 Issue: 11.95 ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁ Á Á Á Á Á ÁÁ Á ÁÁ ÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á ÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á ÁÁÁ Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á Á ÁÁ Á Á Á Á Á Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁ Á ÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á ÁÁÁ Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á Á ÁÁ Á Á Á Á Á Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁ Á ÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁ Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁ Á Á Á Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á ÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á ÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁ Á ÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁ Á ÁÁ Á ÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á ÁÁ Á Á Á Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁ Á ÁÁ Á ÁÁÁ Á ÁÁ Á ÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁ Á ÁÁÁ Á ÁÁ Á Á Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á U2760B U2760B, CT2 RX/TX IC U2781B U2781B, 1.1 GHz PLL U2782B U2782B, 1.1 GHz Twin PLL U2783B U2783B, 1.1 GHz/ 400 MHz PLL U2784B U2784B, 2.2 GHz/ 400 MHz Twin PLL U2790B U2790B, 1000 MHz Modulator U2791B U2791B, 1000 MHz Demodulator U2793B U2793B, 300 MHz Modulator U2794B U2794B, 1000 MHz Demodulator U2795B U2795B, 2 GHz Mixer U2796B U2796B, 2.5 GHz Mixer U2797B U2797B, 1000 MHz Modulator U2891B U2891B, 2.5 GHz Up-Converter U3770M U3770M, I/Q Modulator U7001BG U7001BG, GaAs Front end x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x (D) AMPS IS-54 IS-54 GSM PDC DCS 1800 PCS 1900 CT1 CT2 DECT PHS CDPD Cellular Phones WiLan CATV HFC Wireless LAN Cordless Phones Table 1. Selection guide for RF ICs TELEFUNKEN Semiconductors TELEFUNKEN Semiconductors IC Overview TEMIC's strategy is to provide the customers with high performance and high-integrated solutions for wireless applications. Therefore, a chip set for mobile applications (e.g., cellular phones) is introduced first. This chip set consists of three different I/Q modulators, two demodulators, two mixers and four PLLs which can be selected to fit the customers needs appropriately. The basic block diagram of a mobile telephone RF part is shown in figure 1 and figure 2. Direct conversion Receive I/Q Demodulator U2791/94B U2791/94B BBin PLL U2781B U2781B Send I/Q Modulator U2790/97B U2790/97B BBout Figure 1. Direct conversion I/Q Modulators and Demodulators Due to the principle of I/Q modulation, the devices are suitable for all different kinds of modulation like e.g. QAM, MSK, GMSK, FSK, DQPSK. This includes applications in mobile phones, satellite and cable TV. TEMIC offers three I/Q modulators for RF communication for the frequency range from 30 ­ 1000 MHz. U2793B U2793B is the modulator for the IF in the 30 ­ 300 MHz range. It features a power consumption of 15 mA for an output power of 0 dBm and a sideband suppression of 45 dB at 150 Mhz. It is especially suited for designs that make use of high Q-series bandpass filters between the modulator and the up-conversion mixer. U2790B U2790B is the modulator which can be used for direct conversion in the frequency range from 100 to 1000 MHz. This circuit features a power consumption of 30 mA for an output level of -1 dBm at a sideband suppression of 40 dB at 900 MHz and 35 dB at 150 MHz. U2797B U2797B is the newest IC in the modulator family. It is based on the U2790B U2790B and features a higher baseband input impedance than U2790B U2790B and a smaller package (SSO20 SSO20). For a short overview, the main differences of the modulators are listed in table 2. Single conversion Mixer U2796B U2796B I/Q Demodulator U2791/94B U2791/94B BB in PLL U278xB Receive Send Mixer U2795B U2795B I/Q Modulator U2793/90/97B U2793/90/97B BB out Quadrature Up­Converter U2891B U2891B BB out or: U2791B U2791B is the I/Q demodulator for frequencies between 100 and 1000 MHz. The device features a power consumption of 28 mA, a double sideband noise figure of 12 dB and a third-order intercept point of 3 dBm. U2794B U2794B is a variation of U2791B U2791B. The minimum operation frequency is lowered to 70 MHz and the output DC offset is decreased below 5 mV. Therefore, higher amplification in the baseband part is possible. The main differences of the two quadrature demodulators are listed in table 3. In all TEMIC I/Q modulators and demodulators, a patended phase splitter and a 90° phase shift control loop are integrated. Therefore, no external components are needed for the phase shifting. Figure 2. Single conversion Issue: 11.95 3 TELEFUNKEN Semiconductors Table 2. Comparison of TEMIC quadrature modulators U2790B U2790B 100 to 1000 MHz Typically 30 mA Typically 3.2 kW Yes U2793B U2793B 30 to 300 MHz Typically 15 mA Typically > 100 kW No (external biasing circuit using the implemented reference voltage possible) SSO20 SSO20 package U2797B U2797B 100 to 1000 MHz Typically 30 mA Typically > 100 kW No (external biasing circuit using the implemented reference voltage possible) SSO20 SSO20 package Á Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á Á Á Á ÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ Á Á Á Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á LO frequency range Current consumption Baseband input Internal biasing of baseband inputs Package SO16 package Table 3. Comparison of TEMIC quadrature modulators Á Á ÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á LO frequency range RF frequency range Baseband output DC offset voltage Package and pinning U2791B U2791B 100 to 1000 MHz 100 to 1000 MHz Typically < 30 mV SSO20 SSO20 package, identical pinning as U2794B U2794B with exeption of Pin 15 = ground U2794B U2794B 70 to 1000 MHz 50 to 1000 MHz Typically < 5 mV SSO20 SSO20 package, identical pinning as U2791B U2791B with exeption of Pin 15 = LOXin (may be ac-grounded) Special Features Although the phase shift performance of the ICs is excellent, some I/Q modulators feature extra pins to optimize the phase shift externally in case that external components show phase inaccuracies. At the PC/PCX pins, a potentionmeter (see figure 3) can be connected which affects the phase control loop in the following way: the phase difference of the I and Q signal is below 90° if VS is turned towards PC or more than 90° when VS is turned towards PCX. The total control range with an 10 k potentio-meter is approximately ± 5°. These pins can also be used for software-controlled optimization of the phase performance, for example to compensate a non-constant group delay of a subsequent filter. to PCX pin to PC pin VS I BB in Modu­ lator IF out Q Figure 4. This simple and cheap technique enables the customer to save costs in the RF filter part; e.g. in a mobile phone application, the performance of a low-cost duplexer is sufficient and saves money. Mixers Figure 3. The chip set for RF telecom applications includes two mixers: U2795B U2795B is designed for up-conversion, U2796B U2796B is designed for down-conversion. A special feature of the U2793B U2793B (and also U2891B U2891B) is the possibility to connect a very narrow band LC filter just behind the I/Q modulation part via extra pins as shown in figure 4. U2795B U2795B is a double-balance mixer designed for up-conversion , but can also be used for down conversion. It can be operated from 50 MHz ­ 2.5 GHz, inputs and outputs 4 Issue: 11.95 TELEFUNKEN Semiconductors are single-ended. This mixer features an output compression point of -7 dBm, a third-order intercept point of -1 dBm ­ both of which are programmable ­ and a noise figure of 1 dB. U2795B U2795B works in a supply voltage range of 2.7 to 5.5 V, and is perfectly suited for dual-conversion applications or offset loop digital modulation designs. U2796B U2796B can be operated in the same supply-voltage range and in a frequency range of 0 to 2.0 GHz. It is a single-balanced mixer with a power consumption of 3.2 mA for a gain of 9 dB, third-order intercept point of -4 dB and a noise figure of 9 dB. Up-Converter The I/Q quadrature Up-Converter U2891B U2891B is an integration of TEMIC's U2793B U2793B modulator and the 2.5 GHz mixer. U2891B U2891B is a full 3 V solution in a shrink small outline package (SSO24 SSO24). The integrated I/Q modulator features a frequency range of 30 ­ 500 MHz at a current consumption of 14 mA. The LO frequency is internally regenerated and the patended phase shifter (with a 90° control loop) is also integrated. The mixer of U2891B U2891B can be operated up to 2.5 GHz at a current consumption of 11 mA. Of course U2891B U2891B has two separate power-down functions for modulator and mixer with a very low current consumption in sleep mode of < 1 µA. mum operating frequency of 1.1 GHz for both PLLs. The 64/65 prescaler is also integrated. The current consumption of U2782B U2782B is 11 mA. The Twin PLL U2783B U2783B integrates a PLL for frequencies up to 1.25 GHz and a PLL for the frequency range up to 400 MHz, the integrated prescaler factors are 64/65 and 32/33, respectively. The current consumption is about 10 mA. The highest frequency range is covered by the Twin PLL U2784B U2784B, featuring one PLL for 2.2 GHz and one PLL for 200 MHz. Here, the prescaler factors are 64/65 and 8/9 respectively. Due to the high maximum operating frequency, this device has the highest current consumption of 12 mA. The PLLs are programmed via the 3-wire bus with a clock rate up to 1 MHz. The charge pump current can be switched for each higher frequency PLL of the Twin PLLs by a factor of five to 1 mA. The two PLLs of the Twin PLLs can be powered up or down separately by hardware connectors. The main features of the PLLs are listed in table 4. The value of the phase noise at the phase comparator is calculated to -147 dBc/Hz to be compared to other ICs. The phase noise in the loop depends very much on the application and the used scaling factors. Therefore, the phase noise (PNc) can be calculated as follows: PNc = PNm ­ 20 PLLs The new telecom PLLs from TEMIC cover the frequency range of 200 MHz to 2.2 GHz. The single PLL U2781B U2781B features a frequency range up to 1.1 GHz at a current consumption of 5 mA. A programmable 64/65 or 128/129 prescaler is integrated. The Twin PLL U2782B U2782B doubles the functionality of U2781B U2781B and therefore features two PLLs with a maxi- log (Stot) PNm is the measured phase noise in the loop and Stot is the total scaling factor. An important feature of all telecom PLLs is the high input sensitivity of 20 mV/rms. Therefore, the VCO can be operated at a much lower level and the PLL still locks correctly. Using a lower VCO level reduces crosstalk problems. Table 4. TEMIC high-speed PLLs at a glance Type U2781B U2781B U2782B U2782B U2783B U2783B U2784B U2784B Issue: 11.95 Frequency Range PLL 1 PLL 2 1100 MHz 1100 MHz 1100 MHz 1250 MHz 400 MHz 2200 MHz 200 MHz Typical Current Consumption 5 mA 11 mA 10 mA 12 mA Package SSO20 SSO20 SSO20 SSO20 SSO20 SSO20 SSO20 SSO20 5 TELEFUNKEN Semiconductors Radio U7001BG U7001BG GaAs front end Baseband U2760B U2760B RX/TX transceiver U2783B U2783B Twin PLL AMD Am79C4xx Am79C4xx U3770M U3770M I/Q Mod. EEPROM rest telephone: ­ keypad ­ micro ­ earpiece ­ ringer ­ (line interface) ROM Key components of the CT2 chip set telephone Figure 5. CT2 Chip Set The CT2 chip set (see figure 5) was developed together with the French company Wavecom. The CT2 chip set consists of four ICs representing the complete RF part of the telephone and an AMD PhoXTM controller (Am79C4xx Am79C4xx). The design of the complete telephone (PCB and bill of material) was made by Wavecom. In contrast to the analog standards like CT1, CT2 offers the advantages of digital standards, e.g. high transmission quality and low susceptibility to eavesdropping. The four TEMIC ICs come in SSO or SO packages to save space. In the GaAs front end of U7001BG U7001BG, the antenna switch, the power amplifier and the low noise amplifier are integrated. In the receive mode, the device has a current consumption of only 4 mA and in the transmit mode of less than 39 mA. The power amplifier features the very high efficiency of 45%. The RX/TX IC U2760B U2760B, a bipolar monolithic silicon chip, includes the mixers, the VCOs (Voltage-Controlled Oscillators), the demodulator and the RSSI (Receive Signal Strength Indicator). One of the key features of this high integrated device is the low-current consumption of 23 mA and the simple external circuitry with very few components. The twin PLL (Phase Locked Loop) U2783B U2783B is also a bipolar silicon chip for frequencies up to 1250 MHz and 6 400 MHz for the two PLLs respectively. Both can be operated with one external reference frequency. The I/Q modulator U3770M U3770M is made by using a CMOS technology. It also generates the clock frequency of the system. Manufacturers of digital cordless phones can choose between two different approaches: 1. Customers can develop their own design based on the TEMIC CT2 chip set. They will be supported by TEMIC with samples and test boards. In this case, customers get the complete RF part of the cordless phone which can be operated at 3 V and is completely adjustment-free. The complete system integration, however, has to be done by the customers themselve. 2. Customers can use the full CT2 know-how of TEMIC and Wavecom. Wavecom can provide customers with the demo board (for the complete telephone) as well as the schematics, the bill of material and the software license. Wavecom can also support the full product integration and the transfer to production. In this case, customers get a complete phone with a stand-by time of 380 h and a talk time of 36 h. The size of the phone PCB is below 55 45 10 mm2. It can be operated with only two battery cells. The advantage of this approach is obvious: low risk, short time-to-market. Issue: 11.95 TELEFUNKEN Semiconductors 94 8626 300 5s 250 Lead Temperature 235 °.260 °C full line : typical dotted line : process limits second wave first wave Temperature (° C ) 200 ca. 2 K / s ca. 200 K / s 150 forced cooling 100 °.130 °C ca. 5 K / s 100 2 K/s 50 0 0 50 100 150 200 250 Time ( s ) Figure 6. Assembly Instructions TEMIC's RF ICs are all in SMD (Surface-Mount Device) packages. They can be mounted directly onto the surface of a printed circuit board. The main concern during assembly is the prevention of ESD (ElectroStatic Discharge) and overheating of the Issue: 11.95 device. The recommended maximum soldering temperatures and time-temperature profils are shown in figure 6. Note: Excessive heating of the device can cause malfunction. 7 TELEFUNKEN Semiconductors Quality Data With the extensive system of qualification, probing and final tests, TEMIC endeavors to supply customers with ICs which fulfill the specifications of the OEM industry. 2. Final test: ­ 100% of packaged products tested ­ 100% of function and specified parameters tested ­ Test window correlates with specified limits and specified temperature range of data 3. Lot release: ­ Electrical test 200 ­ 0 ­ Visual inspection/ mechanical defects 200 ­ 0 If you are interested in detailed information regarding the quality assurance of semiconductor components, please ask for the booklet `Quality and Reliability'. D Process control by SPC, FMEA and DOE. D All TEMIC facilities are ISO9001-approved D General flow of electrical test and lot release: 1. Wafer probing: ­ 100% of dice and wafers tested These precautions result in the delivery quality shown in figure 7. Improvement of all products 500 AOQ PPM 400 300 200 100 0 90 91 92 93 94 95 96 Year Figure 7. Worldwide electrical AOQ 8 Issue: 11.95 Issue: 11.95 9 ÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á Part Number U2760B U2760B­AFS U2760B U2760B­AFSG3 U2781B U2781B­AFS U2781B U2781B­AFSG3 U2782B U2782B­AFS U2783B U2783B­AFSG3 U2783B U2783B­AFS U2783B U2783B­AFSG3 U2784B U2784B­BFS U2784B U2784B­BFSG3 U2790B U2790B­BFP U2790B U2790B­BFPG3 U2791B U2791B­AFS U2791B U2791B­AFSG3 U2793B U2793B­AFS U2793B U2793B­AFSG3 U2794B U2794B­AFS U2794B U2794B­AFSG3 U2795B U2795B­CFP U2795B U2795B­CFPG3 U2796B U2796B­BFP U2796B U2796B­BFPG3 U2797B U2797B­AFS U2797B U2797B­AFSG3 U2891B U2891B­AFS U2891B U2891B­AFSG3 U3770M U3770M­AFP U3770M U3770M­AFPG3 U7001BG U7001BG­AFS U7001BG U7001BG­AFSG3 U6024BS U6024BS­AFP U832BS U832BS­AFP U832BS U832BS­AFPG3 Packaging rail reel rail reel rail reel rail reel rail reel rail reel rail reel rail reel rail reel rail reel rail reel rail reel rail reel rail reel rail reel rail rail reel Pcs per Rail/ Reel 60 4000 83 4000 83 4000 83 4000 83 4000 56 4000 83 4000 83 4000 83 4000 112 4000 112 4000 83 4000 69 4000 56 4000 83 4000 112 112 4000 B is mask version 2790 is the part number Min. Order Quantity 600 4000 830 4000 830 4000 830 4000 830 4000 560 4000 830 4000 830 4000 830 4000 1120 4000 1120 4000 830 4000 690 4000 560 4000 830 4000 1120 1120 4000 FS indicates the package U2790B-BFSG3 U2790B-BFSG3 U indicates IC G3 indicates the reel B indicates bipolar Structure of TEMIC's part numbers: Ordering Information TELEFUNKEN Semiconductors TELEFUNKEN Semiconductors Packaging Information P0 95 10538 D0 K0 P2 T E F D1 W B0 A0 Package g 0.3 P1 Punched Cavaty Material Carrier Tape Sizes A0 B0 K0 W T P0 P2 P1 D0 D1 E F SO8 6.4 ± 0.1 5.2 ± 0.1 2.1 ± 0.1 12 ± 0.3 0.3 max. 4 ± 0.1 2 ± 0.1 8 ± 0.1 1.5 ± 0.1 1.5 ± 0.1 1.75 ± 0.1 5.5 ± 0.05 Conductive SO16 6.4 ± 0.1 10.3 ± 0.1 2.1 ± 0.1 16 ± 0.3 0.3 max. 4 ± 0.1 2 ± 0.1 8 ± 0.1 1.5 ± 0.1 1.5 ± 0.1 1.75 ± 0.1 7.5 ± 0.05 Conductive SSO20 SSO20 6.6 ± 0.1 6.65 ± 0.1 1.5 ± 0.1 12 ± 0.3 0.3 max. 4 ± 0.1 2 ± 0.1 8 ± 0.1 1.5 ± 0.1 1.5 ± 0.1 1.75 ± 0.1 5.5 ± 0.05 Conductive SSO24 SSO24 6.6 ± 0.1 7.95 ± 0.1 1.5 ± 0.1 16 ± 0.3 0.3 max. 4 ± 0.1 2 ± 0.1 8 ± 0.1 1.5 ± 0.1 1.5 ± 0.1 1.75 ± 0.1 5.5 ± 0.05 Conductive SSO28 SSO28 6.6 ± 0.1 9.25 ± 0.1 1.5 ± 0.1 16 ± 0.3 0.3 max. 4 ± 0.1 2 ± 0.1 8 ± 0.1 1.5 ± 0.1 1.5 ± 0.1 1.75 ± 0.1 5.5 ± 0.05 Conductive 10 Issue: 11.95 TELEFUNKEN Semiconductors Packaging Information SO8 ­ 16, SSO20 SSO20 ­ 28 tape and reel W1 N 34.0 32.0 2.5 1.5 21.5 20.5 W2 12.90 12.75 95 10518 Version A B C D Issue: 11.95 Tape Width "W" 12 16 24 36 "N" 62 ± 1.5 60.5 to 77.5 100 ± 1.5 100 ± 1.5 "W1" 12.4 +2 / ­0 16.4 +2 / ­0 24.4 +2 / ­0 32.4 +2 / ­0 "W2 max." 18.4 22.4 30.4 38.4 11 TELEFUNKEN Semiconductors Dimensions in mm Package: SO8 ­ SO16 "L1" 5.2 4.8 "L" 3.7 1.4 0.4 0.2 0.25 0.10 1.27 3.8 6.15 5.85 "n" x 1.27 = "X" "n" technical drawings according to DIN specifications 1 2 Dimension L1 L1 L L 12 95 10865 Millimeters Package g SO8 SO16 SO8 SO16 Min. 4.85 9.85 4.90 9.90 Max. 5.00 10.00 4.90 9.90 Issue: 11.95 TELEFUNKEN Semiconductors Dimensions in mm Package: SSO20 SSO20 ­ 28 "L1" 5.7 5.3 "L" 4.5 4.3 0.575 1.30 0.15 0.15 0.05 0.25 0.65 6.6 6.3 "X" "n" technical drawings according to DIN specifications 95 10859 Dimension L1 L1 L1 L L L Issue: 11.95 Millimeters Package g SSO20 SSO20 SSO24 SSO24 SSO28 SSO28 SSO20 SSO20 SSO24 SSO24 SSO28 SSO28 Min. 6.50 7.80 9.10 6.50 7.80 9.01 Max. 6.75 8.05 9.35 6.70 8.00 9.03 13